Statistically-Aware SRAM Memory Array Design Evelyn Grossara, Michele Stucchi, Karen Maexa and Wim Dehaenea
a
IMEC , Leuven, Belgium Also at Department of Electrical Engineering (ESAT) , Katholieke Universiteit Leuven, Belgium
[email protected]
ISQED 2006 San Jose, CA, USA
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Outline Introduction Statistically-Aware Optimization Modeling the distributions of the performance parameters Statistical sensitivities Results
Conclusions
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Introduction Parametric variations affect device [Asenov, ESSCIRC’04] performance S G variations in D the number and position of dopants
Device performance variations affect yield High frequency High standby leakage current Low frequency Low standby leakage current
Icrit ∆ Id,sub
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∆ Vth
significant parameter variations (∆ Vth , ∆ Id,sub ) from device to Evelyndevice Grossar-TAD-meeting
Distributions of frequency and standby leakage current (Isb) in microprocessors (0.18um) [Borkar, DAC’04] 3
Outline Introduction Statistically-Aware Optimization Modeling the distributions of the performance parameters Statistical sensitivities Results
Conclusions
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Statistically-Aware Optimization Statistically-Aware optimization of circuits = use statistical information on the variation of transistor parameters during circuit optimization in terms of speed, energy and yield For the SRAM cell: - explore trade-offs for optimized leakage power versus 1. delay constraint: Vdd
Read current of weakest PUP1 PUP2 SRAM cell mainly limits the 0 1 delay constraint PG1 VL VR PG2 (first order approximation) PDN1 PDN2 2. functionality constraints (read stability and write-ability) BLB
wl
wl
Vdd
Vdd
BL
gnd
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Performance parameters of SRAM cell: Read stability and write-ability Write-ability Vdd
Read Stability
SRAM cell is most vulnerable to noise during read operation V Vdd V inv1 +VnVdd wldd wl dd 1 VL
0 VR
inv2
-Vn+
VL
+Vn
Vn = 0 Vn = SNM
-Vn VR
SNM: maximum dc noise
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(Vn) (e.g. mismatches due to processing) that Evelyn Grossar-TAD-meeting
Vdd
d PG1
BL
Internal node voltage [V] Bit-line voltage Vbl [V]
BLB
VBLB dd Vd
1.5 1
Vdd ->0V
VVdd d
BL
0 1d
1 0 PUP1
PUP2
VL PDN1
VR
PG2
PDN2
VBL gnd Write-trip point = 0.606V
0.5 0 0
0.2
0.4 0.6 0.8 1 Bit-line voltage Vbl [V]
1.2
1.5
1.4
VL VR
1 0.5 0 0
0.2
0.4 0.6 0.8 1 Bit-line voltage Vbl [V]
1.2
1.4
Write-trip point: maximum Vbl at which cell changes state 6
Statistically-Aware Optimization of SRAM cell Use a constraint algorithm together with dual-Vth optimization algorithm to minimize the leakage power of the cell Constraint algorithm: selects SRAM cell design which fulfills the delay and functionality (read stability and write-ability) constraints Minimization of leakage power SRAM cell Vdd BLB
Vdd
0 wl
Vdd
0 PG1
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0 wl PUP1
PUP2
Vdd
1
VL PDN1
VR PG2 PDN2
gnd
BL
Vdd
only sub-threshold leakage current (Ids,sub ) is considered, due to Ids,sub ~ exp(Vth ) 7
Outline Introduction Statistically Aware Optimization Model distributions of performance parameters Statistical sensitivities Results
Conclusions
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Model distributions of performance parameters Vth variability propagation to performance parameters Distributions of performance in function of Vth 2 2 2 ∂ 2 SNM parameters ∂ SNM ∂ SNM 2 2 2 η SNM = SNM + 0.5∑ σ Vth σ Vth σ Vth , pgi + , pdni + , pupi , 2 2 2 e.g. SNM ∂ V ∂ V ∂ V i =1 th , pgi th , pdni th , pupi 2 2 ∂SNM 2 ∂ SNM ∂ SNM 2 2 2 =∑ σ Vth , pgi + σ Vth , pdni + σ Vth , pupi i =1 ∂Vth , pgi ∂Vth , pdni ∂Vth , pupi 2
varSNM
Asymmetrical behavior of the SRAM cell with respect to Vl 2and finternal nodes = f V(1r − F ) min( SNMhigh , SNMlow )
SNM
SNM
Meeting the≤design constraint SNM η SNM − 3 ∗constraint: σ SNM 98.987% of the total samples of the SNM distribution fulfills the design constraint © imec 2006
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Outline Introduction Statistically Aware Optimization Modeling the distributions of the performance parameters Statistical sensitivities Results
Conclusions
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Statistical sensitivities Statistical sensitivity
gives information about direction and magnitude in which the design parameter W has to move to improve the yield of the design, which depends on the Vth intra-die variations 100 49.5% fulfills
70 60
the SNM constraint of 120mV for W pg=190nm
40
80 SNM yield [%]
Frequency
50
30 20 10 0 0.09
0.1
0.11
0.12 0.13 SNM [V]
0.14 70
Wpg Wpup Wpdn
0.15
60
40
slope = statistical sensitivity
20
60
Frequency
0 1.9
29.8% fulfills the SNM constraint of 120mV for W pg = 200nm
50 40 30
2
2.1 2.2 Transistor Width [m]
2.3
2.4 -7 x 10
20 10 © imec 2006
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0.1
0.11
0.12 0.13 SNM [V]
0.14
0.15
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Outline Introduction Deterministic Method for SRAM Cell Optimization Stability, delay and leakage power definition Deterministic optimization approach Worst-Case optimization approach Results
Statistically Aware Optimization Modeling the distributions of the performance parameters Statistical sensitivities Results
Conclusions
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Results compared with worst-case design -3σ
worst-case design:
-3σ
<<-3σ
+ p1
p2
φ
-sets all Vth parameters (p1, p2) to their worst-case value with respect to performance parameter φ - overestimation of the underlying process variations - increased power consumption and area
130nm statistical design: 1.85
-9 x 10 SNM Target = 120mV, Vwrite Target=0.4Vdd
Standby leakage power [W]
1.8
worst case approach statistical optimization
1.75 1.7 1.65 1.6 ca.14% 1.55
ca. 12%
1.5 1.45 1 © imec 2006
significant % over-design is needed to fulfill the design targets with the worst-case approach Iread Target Actual Iread Area -
ca. 40% 1.2
1.4 Iread Target [A]
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1.6
1.8 -4 x 10
100uA 17% 27% 170uA 10% 11% - 14% degradation of leakage power SRAM cell results in 40% read current improvement
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Outline Statistically Aware Optimization Modeling the distributions of the performance parameters Statistical sensitivities Results
Conclusions
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Conclusions
The optimization is based on an algorithm using constraints and dual-Vth strategy: Including pdfs of the performance parameters Using statistical information to guide the optimization Results: - gain both in leakage power (11%) and area (27%) w.r.t worst-case design - trade-offs: improvements in read current (40%) of the cell can be obtained by degrading leakage power (14%)
Statistically aware circuit optimization proves to be advantageous at cell level to keep both leakage power consumption and area of the SRAM cell minimal
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Statistically Aware Optimization: Results (3)
3.5
6 x 10 Iread Target = 130uA, SNM Target = 120mV, Vwrite Target = 0.4Vdd
3
worst-case approach statistical approach
Frequency
2.5 mean = 178.41uW sigma = 0.140uW
2
mean = 192.26uW sigma = 0.130uW
1.5
Total standby leakage power distribution for an array matrix of 16kB SRAM is approximated by a Gaussian distribution.
1 0.5 0 1.7
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1.75
1.8 1.85 1.9 1.95 Total standby leakage power [W]
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2.05 -4 x 10
Central Limit Theorem states that the sum of independent identical distributions of any type approaches a normal distribution
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Statistically-Aware Optimization of SRAM cell (2) Compare with Worst-Case design approach: -3σ
<<-3σ
-3σ
+ p2
p1
φ
- sets all Vth parameters (p1, p2) to their worst-case valu with respect to the performance parameter φ - overestimation of the underlying process variations - increased power consumption and area Delay constraint of SRAM cell: Vdd BLB
wl
wl
Vdd
PUP1
PUP2
VL PDN1
VR
1 PG1
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PDN2
gnd
Vdd
PG2
BL
Read current of weakest SRAM cell mainly limits the delay constraint (first order approximation) 17