TABLE OF CONTENTS
Recap Printed circuit boards(PCBs) Designing of PCB Through Hole Technology and its limitations. Surface mount technology Common SMT packages SMT Components SMT Techniques Summary of SMT techniques Advantages of SMT Disadvantages of SMT Applications Refrences
RECAP Printed
circuit board(PCB).
Integrated
circuits
which are soldered on PCBs using through-hole technology.
PRINTED CIRCUIT BOARD Basic
component.
Before
PCBs point to point or wire wrap was
used. Provide
mechanical support and electrically
connect electronic components. Use
conductive pathways, or traces.
DESIGNING OF PCB
THROUGH-HOLE TECHNOLOGY Components
are inserted on PCB by making
holes. Loaded
on one side and soldered on other.
Soldered
through the leads of the components.
THROUGH-HOLE PCB
SURFACE MOUNT TECHNOLOGY Method
for constructing electronic circuits.
Components
are mounted directly onto the
surface. Electronic
devices so made are called surface-
mount devices or SMDs. Largely
replaced the through-hole technology
SURFACE MOUNT TECHNOLOGY Replaced An
the leads by castellation.
SMT component is usually smaller than its
through-hole. Components
on both sides of board.
DISADVANTAGES OF HT-TECHNOLOGY Unwanted
effects are more.
Drilling
may damage the PCB.
Electric
connections are weak.
Single Large
side usage. in size.
DISADVANTAGES OF HTTECHNOLOGY
COMMON SMT PACKAGES Three popular package: 0603(60
thou long,30 thou wide)
0805(80
thou long,05 thou wide)
1206(120
thou long,60 thou wide)
SMT COMPONENTS
SMT PCB
HOW TO SMT (TECHNIQUES) Fine
tip soldering Uses conventional soldering techniques on a much smaller scale Hot air reflow Uses soldering paste and hot air to reflow the soldering paste with components preset Oven reflow Uses soldering paste and reflows entire board
FINE TIP SOLDERING Conventional
equipment Causes eye strain Requires a steady hand
HOT AIR REFLOW Hot-Air
Rework Station Fine tip solder tools Desoldering tools Hot tweezers Hot air gun
OVEN REFLOW Typical
Large
Reflow oven and bulky
Expensive
$$$
OVEN REFLOW OVERVIEW After
applying solder paste and setting components, the board is inserted to be “cooked” End result is a perfectly soldered board for a fraction of the cost (no eye strain either).
OVEN REFLOW STEPS Apply Set
soldering paste
IC’s and components
Cook! Touch
up using soldering wick to
remove excess solder.
SUMMARY OF TECHNIQUES Fine
tip soldering is hard, but essential
sometimes Hot
air reflow is more convenient for
reworking of components Oven
reflow is great for creating a whole board
at once.
ADVANTAGES OF SMT Faster
for automatic machine to place.
Smaller Less
physical size.
parasitic effects.
Cheaper. Components
can be fitted to both sides of the
circuit board.
ADVANTAGES OF SMT Soldering
and de-soldering is easy.
Reusability. Modern
components are available in SMT
form. Less
loaded.
Failure
is minimum.
DISADVANTAGES OF SMT The
initial cost and time of setting up for
production is high. Mechanically The
weak.
manufacturing processes for SMT are
much more sophisticated than through-hole boards.
APPLICATIONS Designing Military Small
of hybrid components.
devices and LCCCs.
IC packages.
Robotics.
FUTURE
Most aims towards the future in SMT is geared towards:
To evolve solder, to create a newer, better alloy composition to improve performance. The capability to create PCBs smaller and lighter (eventually to the nano scale). Nanotechnology . Bright spot in the world of PCB.
REFRENCES
http://books.google.co.in/books?id=IcxDPA2U6esC&dq=su rface+mount+technology+principles&printsec=frontcover &source=bl&ots=r5hvHGF12s&sig=eSO_N60CRWxaFMybEr kog_3SKAE&hl=en&ei=qxyYSoqKFMONkQXJwMGxBQ&sa=X &oi=book_result&ct=result&resnum=4#v=onepage&q=&f= false www.geocities.com/vk3em/smtguide/SMT-GuideV1-3.PDF www.intel.com/Assets/PDF/pkginfo/ch_07.pdf http://en.wikipedia.org/wiki/Surface-mount_technology www.emeraldinsight.com/ssmt www.geocities.com/vk3em/smtguide/SMT-GuideV1-3.PDF http://en.wikipedia.org/wiki/Printed_circuit_board
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