Channel Quantization Models for NanoScale MOSFETs
A. Appaswamy, M. Bajaj*, R. Pandey, S. S. Fukay1 and K. V. R. M. Murali IBM Semiconductor Research and Development Center, Bangalore-54, India IBM Semiconductor Research and Development Center, Essex Junction, VT, USA *Email:
[email protected]
Motivation: Predictive Quantization Channel Quantization
Modeling
Modeling Channel Quantization: Implementation of MLDA Model Implementation of MLDA Model in TCAD Simulator
of
Channel
• Charge Confinement in 2D Channel Under Strong Inversion • Drastic Modification of Band Structure and Electron Distribution Channel
Quantum corrected density is formulated in terms of an equivalent quantum potential
gate source n+
SiO2 channel
Fermi Integral of order 1/2
drain
IBM proprietary device simulator FIELDAY is used for TCAD modeling.
n+
FIELDAY
Drift-Diffusion Equations:
p-type substrate
• Electro-thermal device simulator solves the 6 coupled PDEs using finite volume
SiO2 Metal
Electron Density Profile Electron Density
• Inversion Capacitance • Threshold Voltage (Vt) • Sub-Threshold Slope
Classical
Current Density Equation
Quantum Corrected
Distance from the interface
TCAD Simulation: MLDA Model Calibration for MOSCap PolySilicon
Triangular Wall Approximation (Analytical Solution)
Schrodinger Equation SiO2
Gate
tox = 2 nm
Substrate
E1 E0
Poisson Equation
Recombination Rate
Fast but typically not predictive – Need repeated calibration
Modeling Channel Quantization: SchrodingerPoisson Solution chrodinger-Poisson Solution Accurate solution using:
Generation Rate
method. • Solves for Carrier (hole and electron) mass and energy transport • Solves 1D, 2D and 3D semiconductor structures
Ef Depth Under Interface Electrical Potential
Numerical Self-Consistent Solution for Non-linear Potential Distribution
n-type MOS Capacitor
Electron Density Hole Density
Electron concentration as a function of depth under interface
Donor Concentration Acceptor Concentration
• Accurate and Predictive • Convergence Issues • Computationally Intensive – ‘Slow’
Charge Profile – Good Fit between Schrodinger-Poisson and MLDA Predictions
Fixed Charge Density Material Permittivity
TCAD Simulation: MLDA Model Predictions
Wave Function Effective Electron Potential Electron Energies
Source
• Electrons treated homogeneous locally. • Constant potential replaced by spatially varying potential. • Applicability for slowly varying potential
Potential
Modeling Channel Quantization: Local Density Approximation (LDA) ocal Density Approximation (LDA)
Lg = 40 nm
Drain
Tox = 0.7 nm
Insulator
Schrodinger Equation
Distance
40 nm Floating Body nFET on SOI Triangular Wall Approximation (Analytical Solution)
V(r) = Slowly varying potential
SiO2
Solving Schrodinger Equation for
TCAD Simulation: MLDA Model Predictions
E1 E0
Carrier density near the Si/SiO2 interface:
Ef Depth Under Interface
Effective density of states in conduction band Fermi Level
Abrupt Change in Potential at semiconductor-insulator Interfaces: LDA not Applicable
Modeling Channel Quantization: Modified Local Density Approximation dified Local Density Approximation (MLDA) SiO2
Transfer characteristics of 40 nm gate length nFET with substrate doping scaled by 4 X.
Transfer characteristics of 40 nm floating gate pFET. The MLDA model matches the SP solution within 10%
• Tox – 0.7 nm (40nm nFET), Model Calibrated for 2 nm Tox (MOSCap) • ~75% Less Computational Time for MLDA Simulations
Triangular Wall Approximation
Schrodinger Equation
The MLDA solution is within 10% of the SP solution across all the gate and drain biases.
Conclusions and References Conclusions
E1 E0
Solving Schrodinger Equation for
Ef Depth Under Interface
• Excellent match of MLDA model predictions to Schrodinger-Poisson solution for both the nFET and pFET structures • Verified predictive nature of MLDA model for varying oxide thicknesses and substrate doping
References Carrier density near the Si/SiO2 interface:
Effective density of states in conduction band Fermi Level Bessel Function of zeroth order Distance from Si/SiO2 interface
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www.PosterPresenta tions.com
1. G. Paasch, and H. Ubensee,” A modified local density approximation,” Physica Status Solidii (b), vol. 113, pp. 165-178, 1982. 2. W. Hansch, T. H. Vogelsang, R. Kircher, and M. Orlowski,” Carrier transport near the Si/SiO2 interface of a MOSFET,” Solid State Electronics, vol. 32, no. 10, pp. 839-849, 1989.