Wirless Broadband Trend And Challenges
This document was uploaded by user and they confirmed that they have the permission to share it. If you are author or own the copyright of this book, please report to us by using this DMCA report form. Report DMCA
Overview
Download & View Wirless Broadband Trend And Challenges as PDF for free.
More details
- Words: 877
- Pages: 27
Page 1
MSPP
Wireless Broadband Trends and Challenges
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 2
MSPP
Technology Trends
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 3
MSPP
Wireless Applications Roadmap
UWB Wi-MAX
Source: Philips Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 4
MSPP
Communications and Computing Convergence
Source: Intel Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 5
MSPP
Quad-Band Mobile Phones
Handspring Treo 600
Motorola V525
• Multi-Band : GSM 850/900/1800/1900 MHz • Multi-Band : GSM 850/900/1800/1900 MHz • Baseband: 144 MHz ARM Processor
• Bluetooth
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 6
MSPP
SMART Phones
O2 Xphone • Multi-Band : GSM 900/1800/1900 MHz • Baseband: 144 MHz ARM Processor • Bluetooth • Wireless Modem
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 7
MSPP
Emerging Applications
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 8
MSPP
Wireless Standards
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 9
MSPP
Wireless Standards
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 10
MSPP
Wireless Broadband
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 11
MSPP
WLAN & UMTS / 3G Interoperability
Strong need for interoperability between LAN and Cellular standards Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 12
MSPP
WLAN Trends
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 13
MSPP
WLAN and Bluetooth Coexistence
Strong need for co-existence between LAN and PAN standards Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 14
MSPP
UWB (Ultrawideband)
Home Mesh Networking
Performance Requirements
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 15
MSPP
UWB (Ultrawideband) Impulse radio implementation Traditional design approach for UWB communication system using narrow time-domain pulses that occupy a very wide spectrum
Pulsed multi-band implementation In the Multi-band approach the information is encoded in multiple RF sub-bands at staggered time, each band occupying 500MHZ.
• encodes information using impulses
• use multiple frequency band to efficiently use the UWB spectrum
• impulses can be modulated either with position, or with amplitude or with phase
• transmits multiple UWB signal at different frequencies
• especially effective for radars systems • difficult to be realized in CMOS
• signals don’t interfere with each other because they operate at different frequencies
• application into niche markets such as radars, imaging, military communications
• available spectrum is broken down in bands each of them occupying 500MHz bandwidth. • can be realized in CMOS • application in personal network area which requires speeds of 110,220 and 480Mbps at 10m with low power consumption
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 16
MSPP
LMDS (Local Multipoint Distribution System)
• Point to Multipoint Communication (Video, Digital, Internet) • Interoperable with Ethernet and Optical Standards • Lower Entry and Deployment Costs Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 17
MSPP
Wi-MAX
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 18
MSPP
Wi-MAX
• Very High Data Rate • Interoperable with WLAN • Lower Entry and Deployment Costs Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
MSPP
Page 19
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 20
MSPP
SiP Integration: Technologies and Challenges
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 21
MSPP
Key Integration Challenges Higher Operating Frequency • Signal Integrity Design and Modelling • Low-loss substrate, materials, etc. • Low-loss interconnection
Miniaturization • High Density Interconnection • Compact Passives and Antenna Integration • Noise Coupling Reduction Design Methodologies • Thermal Management
Interoperability • Multi-Band (3G, WLAN, Bluetooth) • Mixed-Mode, Mixed-Signal Design and Modelling Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 22
MSPP
RF Module Integration Trends
Separate RF Modules
SiP RF Module
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 23
MSPP
802.11 a/b/g RF Module Integration
Source: EPCOS Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 24
MSPP
WLAN PA Module
Source: Infineon Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 25
MSPP
RF SiP
Source: Philips Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 26
MSPP
SiP with Antenna Integration
802.11 a/b/g
Source: IMEC
Bluetooth
Source: Amkor
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 27
MSPP
Summary Strong drive for integration of RF, Digital, Passives • Mixed-signal (Baseband and RF) integration • Multi-band and multi-mode functionality • Higher frequency: Wi-MAX (up to 11 GHz), UWB (up to 11 GHz), LMDS (28 GHz)
System in Package (SiP) will provide • Flexible and cost-effective integration of High-Q passives and antenna • Faster time-to-market • Enhanced interoperability between multiple wireless broadband standards
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
MSPP
Wireless Broadband Trends and Challenges
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 2
MSPP
Technology Trends
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 3
MSPP
Wireless Applications Roadmap
UWB Wi-MAX
Source: Philips Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 4
MSPP
Communications and Computing Convergence
Source: Intel Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 5
MSPP
Quad-Band Mobile Phones
Handspring Treo 600
Motorola V525
• Multi-Band : GSM 850/900/1800/1900 MHz • Multi-Band : GSM 850/900/1800/1900 MHz • Baseband: 144 MHz ARM Processor
• Bluetooth
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 6
MSPP
SMART Phones
O2 Xphone • Multi-Band : GSM 900/1800/1900 MHz • Baseband: 144 MHz ARM Processor • Bluetooth • Wireless Modem
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 7
MSPP
Emerging Applications
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 8
MSPP
Wireless Standards
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 9
MSPP
Wireless Standards
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 10
MSPP
Wireless Broadband
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 11
MSPP
WLAN & UMTS / 3G Interoperability
Strong need for interoperability between LAN and Cellular standards Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 12
MSPP
WLAN Trends
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 13
MSPP
WLAN and Bluetooth Coexistence
Strong need for co-existence between LAN and PAN standards Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 14
MSPP
UWB (Ultrawideband)
Home Mesh Networking
Performance Requirements
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 15
MSPP
UWB (Ultrawideband) Impulse radio implementation Traditional design approach for UWB communication system using narrow time-domain pulses that occupy a very wide spectrum
Pulsed multi-band implementation In the Multi-band approach the information is encoded in multiple RF sub-bands at staggered time, each band occupying 500MHZ.
• encodes information using impulses
• use multiple frequency band to efficiently use the UWB spectrum
• impulses can be modulated either with position, or with amplitude or with phase
• transmits multiple UWB signal at different frequencies
• especially effective for radars systems • difficult to be realized in CMOS
• signals don’t interfere with each other because they operate at different frequencies
• application into niche markets such as radars, imaging, military communications
• available spectrum is broken down in bands each of them occupying 500MHz bandwidth. • can be realized in CMOS • application in personal network area which requires speeds of 110,220 and 480Mbps at 10m with low power consumption
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 16
MSPP
LMDS (Local Multipoint Distribution System)
• Point to Multipoint Communication (Video, Digital, Internet) • Interoperable with Ethernet and Optical Standards • Lower Entry and Deployment Costs Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 17
MSPP
Wi-MAX
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 18
MSPP
Wi-MAX
• Very High Data Rate • Interoperable with WLAN • Lower Entry and Deployment Costs Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
MSPP
Page 19
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 20
MSPP
SiP Integration: Technologies and Challenges
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 21
MSPP
Key Integration Challenges Higher Operating Frequency • Signal Integrity Design and Modelling • Low-loss substrate, materials, etc. • Low-loss interconnection
Miniaturization • High Density Interconnection • Compact Passives and Antenna Integration • Noise Coupling Reduction Design Methodologies • Thermal Management
Interoperability • Multi-Band (3G, WLAN, Bluetooth) • Mixed-Mode, Mixed-Signal Design and Modelling Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 22
MSPP
RF Module Integration Trends
Separate RF Modules
SiP RF Module
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 23
MSPP
802.11 a/b/g RF Module Integration
Source: EPCOS Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 24
MSPP
WLAN PA Module
Source: Infineon Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 25
MSPP
RF SiP
Source: Philips Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 26
MSPP
SiP with Antenna Integration
802.11 a/b/g
Source: IMEC
Bluetooth
Source: Amkor
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
Page 27
MSPP
Summary Strong drive for integration of RF, Digital, Passives • Mixed-signal (Baseband and RF) integration • Multi-band and multi-mode functionality • Higher frequency: Wi-MAX (up to 11 GHz), UWB (up to 11 GHz), LMDS (28 GHz)
System in Package (SiP) will provide • Flexible and cost-effective integration of High-Q passives and antenna • Faster time-to-market • Enhanced interoperability between multiple wireless broadband standards
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
