Overview Of Ic Packages

IC26_CHAPTER_1_2000_2.copy Page 1 Tuesday, May 23, 2000 1:01 PM

CHAPTER 1 OVERVIEW OF IC PACKAGES

page Package overview

1-2

Through-hole mount packages

1-4

Surface mount packages

1-5

Package type overview with lead count

1-6

IC26_CHAPTER_1_2000_2.copy Page 2 Tuesday, May 23, 2000 1:01 PM

Philips Semiconductors

Overview of IC packages

Chapter 1

PACKAGE OVERVIEW The development of the IC package is a dynamic technology. Applications that were unattainable only a few years ago are today common place thanks in part to advances in package design. From mobile telecommunications and satellite broadcasting to aerospace and automotive applications, each imposes its own individual demands on the electronic package. To meet such a diverse range of application requirements, our IC package range encompasses over thirty different types, most of which are sub-divided into a number of outline versions. An overview of this range is shown in Fig.1, with packages classified into board mounting methods, construction form and power handling capability. The packages in these “power” categories offer a high thermal dissipation enabling IC usage in some of the most demanding application areas. Notable extensions to our range since the last publication of this book include the Ball Gate Array (BGA) packages with their high pin count, and the miniature LFBGA packages. A photograph of each package type is given on pages 1 - 4 and 1 - 5, and a package overview with lead count is presented in the tables on pages 1 - 6 to 1 - 8.

2000 May 10

1-2

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Philips Semiconductors

Overview of IC packages

Chapter 1

gewidth

HCPGA

POWER CERAMIC

CDIL CPGA

THROUGH HOLE PACKAGES

DIP SDIP SIL

PLASTIC

DBS HDIP RBS RDBS SIL TBS

POWER

CLLCC CWQCCN

CERAMIC IC PACKAGES

SURFACE MOUNT PACKAGES

PMFP SO SSOP TSSOP VSO

DUAL

PLASTIC

HSOP HTSSOP

POWER

BCC LQFP PLCC QFP SQFP TQFP VQFN

QUAD

HBCC HLQFP HQFP HSQFP HTQFP

POWER

BGA LFBGA TFBGA VFBGA

ARRAY

HBGA

POWER

CONTACTLESS PACKAGES

METAL

MSQFP

PLASTIC

PLLMC MLC751

Fig.1 Package classification.

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Philips Semiconductors

Overview of IC packages

Chapter 1

TROUGH-HOLE MOUNT PACKAGES

CDIL

CPGA

DIP HDIP

SIL.MPF

SIL.P

2000 May 10

SDIP

DBS.MPF

SIL.MP

DBS.P

1-4

RBS.MPF

DBS.P Exposed die pad

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Philips Semiconductors

Overview of IC packages

Chapter 1

SURFACE MOUNT PACKAGES

CLLCC

SO

VSO

CWQCCN

SSOP

HTSSOP TSSOP

QFP

SQFP

PLCC

LFBGA TFBGA VFBGA

2000 May 10

BGA

BCC

VQFN

1-5

HSOP

PMFP

LQFP HLQFP HTQFP TQFP

HBGA

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PACKAGE NAME

NUMBER OF LEADS 4

8

9 10 13 14 16 20 24 28 30 32 38 40 44 48 52 56 64 68 80 81 84 96 100 114 120 128 132 144 156 160

BGA

X

HBCC

X

X

X

X

HBGA HLQFP

X

X

HQFP

X

HSOP

X

X

HSQFP HTQFP

X

HTSSOP

X

X

X

X

X

X

LFBGA

X

LQFP

X

X

X

X

X

X

X

X

X

X X

X

X

X

X

X

X

MSQFP 1-6

PLCC PMFP

X

X

QFP SMS.P SO

X

X

X

X

X

X

X X

X

X

X

X X

X

X

X

X

X

X

SOJ

X

SQFP

X

SSOP

X

X

X

X

X

X

TFBGA X X

X

X

X

X

X

X

X

X

VSO

X

X X

X

X

X

X

X

X X

X

X

X

X X X

X

X

Chapter 1

VFBGA VQFN

X X

TQFP TSSOP

X

X

Philips Semiconductors

Surface mount packages (part 1 of 2)

Overview of IC packages

2000 May 10

PACKAGE TYPE OVERVIEW WITH LEAD COUNT

IC26_CHAPTER_1_2000_2.copy Page 7 Tuesday, May 23, 2000 1:01 PM

BGA

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

HBCC HBGA

X

X

HLQFP HQFP HSOP HSQFP

X

X

HTQFP HTSSOP LFBGA LQFP

X

X

X

X

X

X

X X

X

MSQFP

X

PLCC 1-7

PMFP QFP SMS.P SO SOJ SQFP

X

X

X

SSOP TFBGA

X

X

X

TQFP TSSOP VSO VFBGA

Chapter 1

VQFN

Philips Semiconductors

NUMBER OF LEADS PACKAGE NAME 176 180 208 240 256 272 280 292 304 316 324 329 352 388 420 456 492 504 516 553 596 600 656 776 1140 1160 1312

Overview of IC packages

2000 May 10

Surface mount packages (part 2 of 2)

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NUMBER OF LEADS 3

7

8

9

DBS.MP

X

DBS.MPF

X

DBS.P

X

DIP

X

13

14

16

X

X

X

X

17

20

22

X

X

X

X

HDIP

23

24

X

27

28

32

40

X

X

X

42

48

52

56

64

X X

X

X

X

RBS.MPF

X

RDBS.P

X

SDIP

X X

SIL.MP

X

SIL.MPF

X

SIL.P

X

TBS.P TO-92

18

X

X

X

X

X

X X

X

Philips Semiconductors

PACKAGE NAME

Overview of IC packages

2000 May 10

Trough-hole mount packages

1-8

Chapter 1