Optix Osn 1500 Hardware Description(v100r007_02)

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OptiX OSN 1500 Intelligent Optical Transmission System V100R007

Hardware Description

Issue

02

Date

2007-09-10

Part Number

31401357

Huawei Technologies Proprietary

Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For any assistance, please contact our local office or company headquarters.

Huawei Technologies Co., Ltd. Address:

Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China

Website:

http://www.huawei.com

Email:

[email protected]

Copyright © 2007 Huawei Technologies Co., Ltd. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions and other Huawei trademarks are the property of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders.

Notice The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but the statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Proprietary

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Contents

Contents About This Document.....................................................................................................................1 1 Equipment Structure.................................................................................................................1-1 2 Cabinet.........................................................................................................................................2-1 2.1 Cabinet Type...................................................................................................................................................2-2 2.2 Cabinet Configuration.....................................................................................................................................2-2 2.2.1 Cabinet Indicator....................................................................................................................................2-3 2.2.2 DC PDU.................................................................................................................................................2-3 2.2.3 Other Configuration...............................................................................................................................2-4 2.3 Technical Specifications.................................................................................................................................2-5

3 Subrack.........................................................................................................................................3-1 3.1 Structure..........................................................................................................................................................3-2 3.2 Capacity...........................................................................................................................................................3-3 3.3 Slot Allocation.................................................................................................................................................3-4 3.4 Technical Specifications...............................................................................................................................3-17

4 Board List and Classification...................................................................................................4-1 4.1 Appearance and Dimensions of Boards..........................................................................................................4-2 4.2 Description of the Barcode on the Board........................................................................................................4-3 4.3 Board Classification........................................................................................................................................4-4 4.3.1 SDH Processing Boards.........................................................................................................................4-4 4.3.2 PDH Processing Boards.........................................................................................................................4-6 4.3.3 Data Processing Boards..........................................................................................................................4-7 4.3.4 Interface Boards and Switching Boards.................................................................................................4-9 4.3.5 Cross-Connect Boards and SCC Boards..............................................................................................4-10 4.3.6 Auxiliary Boards..................................................................................................................................4-10 4.3.7 WDM Processing Boards.....................................................................................................................4-11 4.3.8 Optical Amplifier Boards and Dispersion Compensation Board.........................................................4-11 4.3.9 Power Interface Boards........................................................................................................................4-12

5 SDH Processing Boards............................................................................................................5-1 5.1 SL1..................................................................................................................................................................5-3 5.1.1 Version Description................................................................................................................................5-3 5.1.2 Function and Feature..............................................................................................................................5-4 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 5.1.3 Working Principle and Signal Flow.......................................................................................................5-5 5.1.4 Front Panel.............................................................................................................................................5-7 5.1.5 Valid Slots..............................................................................................................................................5-8 5.1.6 Board Feature Code................................................................................................................................5-9 5.1.7 Board Configuration Reference.............................................................................................................5-9 5.1.8 Technical Specifications........................................................................................................................5-9

5.2 SLQ1.............................................................................................................................................................5-11 5.2.1 Version Description..............................................................................................................................5-11 5.2.2 Function and Feature............................................................................................................................5-12 5.2.3 Working Principle and Signal Flow.....................................................................................................5-13 5.2.4 Front Panel...........................................................................................................................................5-15 5.2.5 Valid Slots............................................................................................................................................5-16 5.2.6 Board Feature Code..............................................................................................................................5-17 5.2.7 Board Configuration Reference...........................................................................................................5-17 5.2.8 Technical Specifications......................................................................................................................5-17 5.3 SLO1.............................................................................................................................................................5-19 5.3.1 Version Description..............................................................................................................................5-19 5.3.2 Function and Feature............................................................................................................................5-19 5.3.3 Working Principle and Signal Flow.....................................................................................................5-20 5.3.4 Front Panel...........................................................................................................................................5-22 5.3.5 Valid Slots............................................................................................................................................5-24 5.3.6 Board Feature Code..............................................................................................................................5-24 5.3.7 Board Configuration Reference...........................................................................................................5-24 5.3.8 Technical Specifications......................................................................................................................5-25 5.4 SLT1..............................................................................................................................................................5-26 5.4.1 Version Description..............................................................................................................................5-26 5.4.2 Function and Feature............................................................................................................................5-26 5.4.3 Working Principle and Signal Flow.....................................................................................................5-27 5.4.4 Front Panel...........................................................................................................................................5-29 5.4.5 Valid Slots............................................................................................................................................5-31 5.4.6 Board Configuration Reference...........................................................................................................5-31 5.4.7 Technical Specifications......................................................................................................................5-31 5.5 SEP1..............................................................................................................................................................5-32 5.5.1 Version Description..............................................................................................................................5-33 5.5.2 Function and Feature............................................................................................................................5-33 5.5.3 Working Principle and Signal Flow.....................................................................................................5-34 5.5.4 Front Panel...........................................................................................................................................5-37 5.5.5 Valid Slots............................................................................................................................................5-39 5.5.6 TPS Protection for the Board...............................................................................................................5-39 5.5.7 Board Configuration Reference...........................................................................................................5-40 5.5.8 Technical Specifications......................................................................................................................5-41 5.6 SL4................................................................................................................................................................5-41 ii

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Contents

5.6.1 Version Description..............................................................................................................................5-42 5.6.2 Function and Feature............................................................................................................................5-42 5.6.3 Working Principle and Signal Flow.....................................................................................................5-43 5.6.4 Front Panel...........................................................................................................................................5-45 5.6.5 Valid Slots............................................................................................................................................5-47 5.6.6 Board Feature Code..............................................................................................................................5-47 5.6.7 Board Configuration Reference...........................................................................................................5-48 5.6.8 Technical Specifications......................................................................................................................5-48 5.7 SLD4.............................................................................................................................................................5-49 5.7.1 Version Description..............................................................................................................................5-50 5.7.2 Function and Feature............................................................................................................................5-50 5.7.3 Working Principle and Signal Flow.....................................................................................................5-51 5.7.4 Front Panel...........................................................................................................................................5-53 5.7.5 Valid Slots............................................................................................................................................5-55 5.7.6 Board Feature Code..............................................................................................................................5-55 5.7.7 Board Configuration Reference...........................................................................................................5-56 5.7.8 Technical Specifications......................................................................................................................5-56 5.8 SLQ4.............................................................................................................................................................5-57 5.8.1 Version Description..............................................................................................................................5-58 5.8.2 Function and Feature............................................................................................................................5-58 5.8.3 Working Principle and Signal Flow.....................................................................................................5-59 5.8.4 Front Panel...........................................................................................................................................5-61 5.8.5 Valid Slots............................................................................................................................................5-63 5.8.6 Board Feature Code..............................................................................................................................5-63 5.8.7 Board Configuration Reference...........................................................................................................5-63 5.8.8 Technical Specifications......................................................................................................................5-63 5.9 SL16..............................................................................................................................................................5-64 5.9.1 Version Description..............................................................................................................................5-65 5.9.2 Function and Feature............................................................................................................................5-66 5.9.3 Working Principle and Signal Flow.....................................................................................................5-67 5.9.4 Front Panel...........................................................................................................................................5-69 5.9.5 Valid Slots............................................................................................................................................5-70 5.9.6 Board Feature Code..............................................................................................................................5-70 5.9.7 Board Configuration Reference...........................................................................................................5-71 5.9.8 Technical Specifications......................................................................................................................5-71 5.10 SL16A.........................................................................................................................................................5-73 5.10.1 Version Description............................................................................................................................5-73 5.10.2 Function and Feature..........................................................................................................................5-74 5.10.3 Working Principle and Signal Flow...................................................................................................5-75 5.10.4 Front Panel.........................................................................................................................................5-77 5.10.5 Valid Slots..........................................................................................................................................5-79 5.10.6 Board Feature Code............................................................................................................................5-79 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 5.10.7 Board Configuration Reference.........................................................................................................5-79 5.10.8 Technical Specifications....................................................................................................................5-79

5.11 SF16............................................................................................................................................................5-81 5.11.1 Version Description............................................................................................................................5-81 5.11.2 Function and Feature..........................................................................................................................5-81 5.11.3 Working Principle and Signal Flow...................................................................................................5-83 5.11.4 Front Panel.........................................................................................................................................5-85 5.11.5 Valid Slots..........................................................................................................................................5-86 5.11.6 Board Configuration Reference.........................................................................................................5-86 5.11.7 Technical Specifications....................................................................................................................5-86

6 PDH Processing Boards............................................................................................................6-1 6.1 PL1..................................................................................................................................................................6-3 6.1.1 Version Description................................................................................................................................6-3 6.1.2 Function and Feature..............................................................................................................................6-3 6.1.3 Working Principle and Signal Flow.......................................................................................................6-4 6.1.4 Front Panel............................................................................................................................................. 6-6 6.1.5 Valid Slots..............................................................................................................................................6-7 6.1.6 Board Feature Code................................................................................................................................6-7 6.1.7 Board Configuration Reference............................................................................................................. 6-7 6.1.8 Technical Specifications........................................................................................................................ 6-8 6.2 PD1 .................................................................................................................................................................6-8 6.2.1 Version Description................................................................................................................................6-9 6.2.2 Function and Feature..............................................................................................................................6-9 6.2.3 Working Principle and Signal Flow.....................................................................................................6-10 6.2.4 Front Panel...........................................................................................................................................6-13 6.2.5 Valid Slots............................................................................................................................................6-13 6.2.6 Board Feature Code..............................................................................................................................6-14 6.2.7 TPS Protection for the Board...............................................................................................................6-15 6.2.8 Board Configuration Reference...........................................................................................................6-17 6.2.9 Technical Specifications......................................................................................................................6-17 6.3 PQ1................................................................................................................................................................6-18 6.3.1 Version Description..............................................................................................................................6-18 6.3.2 Function and Feature............................................................................................................................6-19 6.3.3 Working Principle and Signal Flow.....................................................................................................6-20 6.3.4 Front Panel...........................................................................................................................................6-22 6.3.5 Valid Slots............................................................................................................................................6-23 6.3.6 Board Feature Code..............................................................................................................................6-24 6.3.7 TPS Protection for the Board...............................................................................................................6-24 6.3.8 Board Configuration Reference...........................................................................................................6-26 6.3.9 Technical Specifications......................................................................................................................6-26 6.4 PQM .............................................................................................................................................................6-27 6.4.1 Version Description..............................................................................................................................6-27 iv

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Contents

6.4.2 Function and Feature............................................................................................................................6-27 6.4.3 Working Principle and Signal Flow.....................................................................................................6-28 6.4.4 Front Panel...........................................................................................................................................6-30 6.4.5 Valid Slots............................................................................................................................................6-31 6.4.6 TPS Protection for the Board...............................................................................................................6-32 6.4.7 Board Configuration Reference...........................................................................................................6-34 6.4.8 Technical Specifications......................................................................................................................6-34 6.5 PL3................................................................................................................................................................6-35 6.5.1 Version Description..............................................................................................................................6-35 6.5.2 Function and Feature............................................................................................................................6-36 6.5.3 Working Principle and Signal Flow.....................................................................................................6-36 6.5.4 Front Panel...........................................................................................................................................6-39 6.5.5 Valid Slots............................................................................................................................................6-40 6.5.6 TPS Protection for the Board...............................................................................................................6-40 6.5.7 Board Configuration Reference...........................................................................................................6-42 6.5.8 Technical Specifications......................................................................................................................6-42 6.6 PL3A.............................................................................................................................................................6-43 6.6.1 Version Description..............................................................................................................................6-43 6.6.2 Function and Feature............................................................................................................................6-44 6.6.3 Working Principle and Signal Flow.....................................................................................................6-45 6.6.4 Front Panel...........................................................................................................................................6-47 6.6.5 Valid Slots............................................................................................................................................6-48 6.6.6 Board Configuration Reference...........................................................................................................6-48 6.6.7 Technical Specifications......................................................................................................................6-48 6.7 PD3................................................................................................................................................................6-49 6.7.1 Version Description..............................................................................................................................6-50 6.7.2 Function and Feature............................................................................................................................6-50 6.7.3 Working Principle and Signal Flow.....................................................................................................6-51 6.7.4 Front Panel...........................................................................................................................................6-53 6.7.5 Valid Slots............................................................................................................................................6-54 6.7.6 TPS Protection for the Board...............................................................................................................6-55 6.7.7 Board Configuration Reference...........................................................................................................6-56 6.7.8 Technical Specifications......................................................................................................................6-57 6.8 PQ3................................................................................................................................................................6-57 6.8.1 Version Description..............................................................................................................................6-58 6.8.2 Function and Feature............................................................................................................................6-58 6.8.3 Working Principle and Signal Flow.....................................................................................................6-58 6.8.4 Front Panel...........................................................................................................................................6-61 6.8.5 Valid Slots............................................................................................................................................6-62 6.8.6 TPS Protection for the Board...............................................................................................................6-62 6.8.7 Board Configuration Reference...........................................................................................................6-64 6.8.8 Technical Specifications......................................................................................................................6-64 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

6.9 DX1...............................................................................................................................................................6-64 6.9.1 Version Description..............................................................................................................................6-65 6.9.2 Function and Feature............................................................................................................................6-65 6.9.3 Working Principle and Signal Flow.....................................................................................................6-66 6.9.4 Front Panel...........................................................................................................................................6-67 6.9.5 Valid Slots............................................................................................................................................6-68 6.9.6 Board Feature Code..............................................................................................................................6-68 6.9.7 TPS Protection for the Board...............................................................................................................6-69 6.9.8 Board Configuration Reference...........................................................................................................6-70 6.9.9 Technical Specifications......................................................................................................................6-70 6.10 DXA............................................................................................................................................................6-71 6.10.1 Version Description............................................................................................................................6-71 6.10.2 Function and Feature..........................................................................................................................6-72 6.10.3 Working Principle and Signal Flow...................................................................................................6-72 6.10.4 Front Panel.........................................................................................................................................6-73 6.10.5 Valid Slots..........................................................................................................................................6-74 6.10.6 Board Configuration Reference.........................................................................................................6-75 6.10.7 Technical Specifications....................................................................................................................6-75 6.11 SPQ4............................................................................................................................................................6-75 6.11.1 Version Description............................................................................................................................6-76 6.11.2 Function and Feature..........................................................................................................................6-76 6.11.3 Working Principle and Signal Flow...................................................................................................6-77 6.11.4 Front Panel.........................................................................................................................................6-80 6.11.5 Valid Slots..........................................................................................................................................6-81 6.11.6 TPS Protection for the Board.............................................................................................................6-82 6.11.7 Board Configuration Reference.........................................................................................................6-83 6.11.8 Technical Specifications....................................................................................................................6-83

7 Data Processing Boards.............................................................................................................7-1 7.1 EFT4................................................................................................................................................................7-3 7.1.1 Version Description................................................................................................................................7-3 7.1.2 Function and Feature..............................................................................................................................7-3 7.1.3 Working Principle and Signal Flow.......................................................................................................7-4 7.1.4 Front Panel............................................................................................................................................. 7-6 7.1.5 Valid Slots..............................................................................................................................................7-8 7.1.6 Board Configuration Reference............................................................................................................. 7-8 7.1.7 Technical Specifications........................................................................................................................ 7-8 7.2 EFT8................................................................................................................................................................7-9 7.2.1 Version Description................................................................................................................................7-9 7.2.2 Function and Feature..............................................................................................................................7-9 7.2.3 Working Principle and Signal Flow.....................................................................................................7-10 7.2.4 Front Panel...........................................................................................................................................7-12 7.2.5 Valid Slots............................................................................................................................................7-14 vi

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Contents

7.2.6 Board Configuration Reference...........................................................................................................7-15 7.2.7 Technical Specifications......................................................................................................................7-15 7.3 EFT8A...........................................................................................................................................................7-15 7.3.1 Version Description..............................................................................................................................7-16 7.3.2 Function and Feature............................................................................................................................7-16 7.3.3 Working Principle and Signal Flow.....................................................................................................7-17 7.3.4 Front Panel...........................................................................................................................................7-19 7.3.5 Valid Slots............................................................................................................................................7-21 7.3.6 Board Configuration Reference...........................................................................................................7-22 7.3.7 Technical Specifications......................................................................................................................7-22 7.4 EGT2.............................................................................................................................................................7-22 7.4.1 Version Description..............................................................................................................................7-23 7.4.2 Function and Feature............................................................................................................................7-23 7.4.3 Working Principle and Signal Flow.....................................................................................................7-24 7.4.4 Front Panel...........................................................................................................................................7-26 7.4.5 Valid Slots............................................................................................................................................7-27 7.4.6 Board Feature Code..............................................................................................................................7-27 7.4.7 Board Configuration Reference...........................................................................................................7-28 7.4.8 Technical Specifications......................................................................................................................7-28 7.5 EFS0..............................................................................................................................................................7-29 7.5.1 Version Description..............................................................................................................................7-29 7.5.2 Function and Feature............................................................................................................................7-30 7.5.3 Working Principle and Signal Flow.....................................................................................................7-32 7.5.4 Front Panel...........................................................................................................................................7-35 7.5.5 Valid Slots............................................................................................................................................7-36 7.5.6 TPS Protection......................................................................................................................................7-36 7.5.7 Board Configuration Reference...........................................................................................................7-37 7.5.8 Technical Specifications......................................................................................................................7-37 7.6 EFS4..............................................................................................................................................................7-37 7.6.1 Version Description..............................................................................................................................7-38 7.6.2 Function and Feature............................................................................................................................7-38 7.6.3 Working Principle and Signal Flow.....................................................................................................7-40 7.6.4 Front Panel...........................................................................................................................................7-43 7.6.5 Valid Slots............................................................................................................................................7-45 7.6.6 Board Configuration Reference...........................................................................................................7-45 7.6.7 Technical Specifications......................................................................................................................7-45 7.7 EGS2.............................................................................................................................................................7-45 7.7.1 Version Description..............................................................................................................................7-46 7.7.2 Function and Feature............................................................................................................................7-46 7.7.3 Working Principle and Signal Flow.....................................................................................................7-49 7.7.4 Front Panel...........................................................................................................................................7-51 7.7.5 Valid Slots............................................................................................................................................7-53 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 7.7.6 Board Feature Code..............................................................................................................................7-53 7.7.7 Board Configuration Reference...........................................................................................................7-53 7.7.8 Technical Specifications......................................................................................................................7-53

7.8 EMS4.............................................................................................................................................................7-54 7.8.1 Version Description..............................................................................................................................7-55 7.8.2 Function and Feature............................................................................................................................7-55 7.8.3 Working Principle and Signal Flow.....................................................................................................7-57 7.8.4 Front Panel...........................................................................................................................................7-60 7.8.5 Valid Slots............................................................................................................................................7-62 7.8.6 Board Feature Code..............................................................................................................................7-62 7.8.7 Board Protection...................................................................................................................................7-63 7.8.8 Board Configuration Reference...........................................................................................................7-65 7.8.9 Technical Specifications......................................................................................................................7-66 7.9 EGS4.............................................................................................................................................................7-67 7.9.1 Version Description..............................................................................................................................7-67 7.9.2 Function and Feature............................................................................................................................7-67 7.9.3 Working Principle and Signal Flow.....................................................................................................7-69 7.9.4 Front Panel...........................................................................................................................................7-72 7.9.5 Valid Slots............................................................................................................................................7-74 7.9.6 Board Feature Code..............................................................................................................................7-74 7.9.7 Board Protection...................................................................................................................................7-74 7.9.8 Board Configuration Reference...........................................................................................................7-77 7.9.9 Technical Specifications......................................................................................................................7-78 7.10 EGR2...........................................................................................................................................................7-79 7.10.1 Version Description............................................................................................................................7-79 7.10.2 Function and Feature..........................................................................................................................7-79 7.10.3 Working Principle and Signal Flow...................................................................................................7-82 7.10.4 Front Panel.........................................................................................................................................7-84 7.10.5 Valid Slots..........................................................................................................................................7-86 7.10.6 Board Feature Code............................................................................................................................7-86 7.10.7 Board Configuration Reference.........................................................................................................7-86 7.10.8 Technical Specifications....................................................................................................................7-86 7.11 EMR0..........................................................................................................................................................7-87 7.11.1 Version Description............................................................................................................................7-88 7.11.2 Function and Feature..........................................................................................................................7-89 7.11.3 Working Principle and Signal Flow...................................................................................................7-92 7.11.4 Front Panel.........................................................................................................................................7-94 7.11.5 Valid Slots..........................................................................................................................................7-97 7.11.6 Board Feature Code............................................................................................................................7-98 7.11.7 Board Configuration Reference.........................................................................................................7-98 7.11.8 Technical Specifications....................................................................................................................7-98 7.12 ADL4...........................................................................................................................................................7-99 viii

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7.12.1 Version Description..........................................................................................................................7-100 7.12.2 Function and Feature........................................................................................................................7-100 7.12.3 Working Principle and Signal Flow.................................................................................................7-101 7.12.4 Front Panel.......................................................................................................................................7-103 7.12.5 Valid Slots........................................................................................................................................7-104 7.12.6 Board Feature Code..........................................................................................................................7-104 7.12.7 Board Configuration Reference.......................................................................................................7-104 7.12.8 Technical Specifications..................................................................................................................7-105 7.13 ADQ1........................................................................................................................................................7-106 7.13.1 Version Description..........................................................................................................................7-106 7.13.2 Function and Feature........................................................................................................................7-106 7.13.3 Working Principle and Signal Flow.................................................................................................7-107 7.13.4 Front Panel.......................................................................................................................................7-109 7.13.5 Valid Slots........................................................................................................................................7-111 7.13.6 Board Feature Code..........................................................................................................................7-111 7.13.7 Board Configuration Reference.......................................................................................................7-111 7.13.8 Technical Specifications..................................................................................................................7-112 7.14 IDL4..........................................................................................................................................................7-113 7.14.1 Version Description..........................................................................................................................7-113 7.14.2 Function and Feature........................................................................................................................7-113 7.14.3 Working Principle ...........................................................................................................................7-115 7.14.4 Front Panel.......................................................................................................................................7-117 7.14.5 Valid Slots........................................................................................................................................7-118 7.14.6 Board Feature Code..........................................................................................................................7-118 7.14.7 Board Protection...............................................................................................................................7-118 7.14.8 Board Configuration Reference.......................................................................................................7-119 7.14.9 Technical Specifications..................................................................................................................7-119 7.15 IDQ1..........................................................................................................................................................7-120 7.15.1 Version Description..........................................................................................................................7-120 7.15.2 Function and Feature........................................................................................................................7-121 7.15.3 Working Principle and Signal Flow.................................................................................................7-122 7.15.4 Front Panel.......................................................................................................................................7-124 7.15.5 Valid Slots........................................................................................................................................7-126 7.15.6 Board Feature Code..........................................................................................................................7-126 7.15.7 Board Protection...............................................................................................................................7-126 7.15.8 Board Configuration Reference.......................................................................................................7-126 7.15.9 Technical Specifications..................................................................................................................7-127 7.16 MST4.........................................................................................................................................................7-128 7.16.1 Version Description..........................................................................................................................7-128 7.16.2 Function and Feature........................................................................................................................7-128 7.16.3 Working Principle and Signal Flow.................................................................................................7-130 7.16.4 Front Panel.......................................................................................................................................7-132 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 7.16.5 Valid Slots........................................................................................................................................7-133 7.16.6 Board Feature Code..........................................................................................................................7-133 7.16.7 Board Configuration Reference.......................................................................................................7-134 7.16.8 Technical Specifications..................................................................................................................7-134

8 Interface Boards and Switching Boards.................................................................................8-1 8.1 L12S................................................................................................................................................................8-3 8.1.1 Version Description................................................................................................................................8-3 8.1.2 Function and Feature..............................................................................................................................8-3 8.1.3 Working Principle and Signal Flow.......................................................................................................8-3 8.1.4 Front Panel.............................................................................................................................................8-4 8.1.5 Valid Slots..............................................................................................................................................8-5 8.1.6 Technical Specifications........................................................................................................................8-5 8.2 D12B...............................................................................................................................................................8-5 8.2.1 Version Description................................................................................................................................8-6 8.2.2 Function and Feature..............................................................................................................................8-6 8.2.3 Working Principle and Signal Flow.......................................................................................................8-6 8.2.4 Front Panel.............................................................................................................................................8-6 8.2.5 Valid Slots..............................................................................................................................................8-8 8.2.6 Technical Specifications........................................................................................................................8-9 8.3 D12S................................................................................................................................................................8-9 8.3.1 Version Description................................................................................................................................8-9 8.3.2 Function and Feature..............................................................................................................................8-9 8.3.3 Working Principle and Signal Flow.......................................................................................................8-9 8.3.4 Front Panel...........................................................................................................................................8-10 8.3.5 Valid Slots............................................................................................................................................8-12 8.3.6 Technical Specifications......................................................................................................................8-13 8.4 L75S..............................................................................................................................................................8-13 8.4.1 Version Description..............................................................................................................................8-13 8.4.2 Function and Feature............................................................................................................................8-13 8.4.3 Working Principle and Signal Flow.....................................................................................................8-14 8.4.4 Front Panel...........................................................................................................................................8-14 8.4.5 Valid Slots............................................................................................................................................8-15 8.4.6 Technical Specifications......................................................................................................................8-15 8.5 D75S..............................................................................................................................................................8-16 8.5.1 Version Description..............................................................................................................................8-16 8.5.2 Function and Feature............................................................................................................................8-16 8.5.3 Working Principle and Signal Flow.....................................................................................................8-16 8.5.4 Front Panel...........................................................................................................................................8-17 8.5.5 Valid Slots............................................................................................................................................8-19 8.5.6 Technical Specifications......................................................................................................................8-20 8.6 D34S..............................................................................................................................................................8-20 8.6.1 Version Description..............................................................................................................................8-20 x

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8.6.2 Function and Feature............................................................................................................................8-20 8.6.3 Working Principle and Signal Flow.....................................................................................................8-21 8.6.4 Front Panel...........................................................................................................................................8-21 8.6.5 Valid Slots............................................................................................................................................8-22 8.6.6 Technical Specifications......................................................................................................................8-23 8.7 C34S..............................................................................................................................................................8-23 8.7.1 Version Description..............................................................................................................................8-24 8.7.2 Function and Feature............................................................................................................................8-24 8.7.3 Working Principle and Signal Flow.....................................................................................................8-24 8.7.4 Front Panel...........................................................................................................................................8-25 8.7.5 Valid Slots............................................................................................................................................8-26 8.7.6 Technical Specifications......................................................................................................................8-26 8.8 EU04..............................................................................................................................................................8-27 8.8.1 Version Description..............................................................................................................................8-27 8.8.2 Function and Feature............................................................................................................................8-27 8.8.3 Working Principle and Signal Flow.....................................................................................................8-27 8.8.4 Front Panel...........................................................................................................................................8-28 8.8.5 Valid Slots............................................................................................................................................8-29 8.8.6 Technical Specifications......................................................................................................................8-30 8.9 EU08..............................................................................................................................................................8-30 8.9.1 Version Description..............................................................................................................................8-31 8.9.2 Function and Feature............................................................................................................................8-31 8.9.3 Working Principle and Signal Flow.....................................................................................................8-31 8.9.4 Front Panel...........................................................................................................................................8-32 8.9.5 Valid Slots............................................................................................................................................8-33 8.9.6 Technical Specifications......................................................................................................................8-33 8.10 OU08 ..........................................................................................................................................................8-34 8.10.1 Version Description............................................................................................................................8-34 8.10.2 Function and Feature..........................................................................................................................8-35 8.10.3 Working Principle and Signal Flow...................................................................................................8-35 8.10.4 Front Panel.........................................................................................................................................8-35 8.10.5 Valid Slots..........................................................................................................................................8-38 8.10.6 Technical Specifications....................................................................................................................8-38 8.11 MU04..........................................................................................................................................................8-39 8.11.1 Version Description............................................................................................................................8-39 8.11.2 Function and Feature..........................................................................................................................8-39 8.11.3 Working Principle and Signal Flow...................................................................................................8-39 8.11.4 Front Panel.........................................................................................................................................8-40 8.11.5 Valid Slots..........................................................................................................................................8-41 8.11.6 Technical Specifications....................................................................................................................8-42 8.12 TSB8............................................................................................................................................................8-42 8.12.1 Version Description............................................................................................................................8-43 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 8.12.2 Function and Feature..........................................................................................................................8-43 8.12.3 Working Principle and Signal Flow...................................................................................................8-43 8.12.4 Front Panel.........................................................................................................................................8-44 8.12.5 Valid Slots..........................................................................................................................................8-45 8.12.6 Technical Specifications....................................................................................................................8-46

8.13 EFF8............................................................................................................................................................8-46 8.13.1 Version Description............................................................................................................................8-47 8.13.2 Function and Feature..........................................................................................................................8-47 8.13.3 Working Principle and Signal Flow...................................................................................................8-47 8.13.4 Front Panel.........................................................................................................................................8-48 8.13.5 Valid Slots..........................................................................................................................................8-49 8.13.6 Technical Specifications....................................................................................................................8-50 8.14 ETF8............................................................................................................................................................8-51 8.14.1 Version Description............................................................................................................................8-51 8.14.2 Function and Feature..........................................................................................................................8-51 8.14.3 Working Principle and Signal Flow...................................................................................................8-51 8.14.4 Front Panel.........................................................................................................................................8-52 8.14.5 Valid Slots..........................................................................................................................................8-54 8.14.6 Technical Specifications....................................................................................................................8-55 8.15 ETS8............................................................................................................................................................8-56 8.15.1 Version Description............................................................................................................................8-56 8.15.2 Function and Feature..........................................................................................................................8-56 8.15.3 Working Principle and Signal Flow...................................................................................................8-56 8.15.4 Front Panel.........................................................................................................................................8-57 8.15.5 Valid Slots..........................................................................................................................................8-59 8.15.6 Technical Specifications....................................................................................................................8-59 8.16 DM12..........................................................................................................................................................8-60 8.16.1 Version Description............................................................................................................................8-60 8.16.2 Function and Feature..........................................................................................................................8-60 8.16.3 Working Principle and Signal Flow...................................................................................................8-60 8.16.4 Front Panel.........................................................................................................................................8-61 8.16.5 Valid Slots..........................................................................................................................................8-64 8.16.6 Technical Specifications....................................................................................................................8-64

9 Cross-Connect and System Control Boards..........................................................................9-1 9.1 CXL1...............................................................................................................................................................9-2 9.1.1 Version Description................................................................................................................................9-2 9.1.2 Function and Feature..............................................................................................................................9-2 9.1.3 Working Principle and Signal Flow.......................................................................................................9-5 9.1.4 Front Panel.............................................................................................................................................9-9 9.1.5 Valid Slots............................................................................................................................................9-11 9.1.6 Board Feature Code..............................................................................................................................9-11 9.1.7 Board Configuration Reference...........................................................................................................9-11 xii

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9.1.8 Technical Specifications......................................................................................................................9-12 9.2 CXL4.............................................................................................................................................................9-13 9.2.1 Version Description..............................................................................................................................9-14 9.2.2 Function and Feature............................................................................................................................9-14 9.2.3 Working Principle and Signal Flow.....................................................................................................9-17 9.2.4 Front Panel...........................................................................................................................................9-20 9.2.5 Valid Slots............................................................................................................................................9-22 9.2.6 Board Feature Code..............................................................................................................................9-22 9.2.7 Board Configuration Reference...........................................................................................................9-22 9.2.8 Technical Specifications......................................................................................................................9-23 9.3 CXL16...........................................................................................................................................................9-24 9.3.1 Version Description..............................................................................................................................9-25 9.3.2 Function and Feature............................................................................................................................9-25 9.3.3 Working Principle and Signal Flow.....................................................................................................9-28 9.3.4 Front Panel...........................................................................................................................................9-31 9.3.5 Valid Slots............................................................................................................................................9-33 9.3.6 Board Feature Code..............................................................................................................................9-33 9.3.7 Board Configuration Reference...........................................................................................................9-33 9.3.8 Technical Specifications......................................................................................................................9-34

10 Auxiliary Boards.....................................................................................................................10-1 10.1 EOW............................................................................................................................................................10-2 10.1.1 Version Description............................................................................................................................10-2 10.1.2 Function and Feature..........................................................................................................................10-2 10.1.3 Working Principle and Signal Flow...................................................................................................10-2 10.1.4 Front Panel.........................................................................................................................................10-3 10.1.5 Valid Slots..........................................................................................................................................10-5 10.1.6 Technical Specifications....................................................................................................................10-5 10.2 AUX............................................................................................................................................................10-6 10.2.1 Version Description............................................................................................................................10-6 10.2.2 Function and Feature..........................................................................................................................10-6 10.2.3 Working Principle and Signal Flow...................................................................................................10-7 10.2.4 Jumper..............................................................................................................................................10-11 10.2.5 Front Panel.......................................................................................................................................10-11 10.2.6 Valid Slots........................................................................................................................................10-14 10.2.7 Technical Specifications..................................................................................................................10-15 10.3 AMU..........................................................................................................................................................10-15 10.3.1 Version Description..........................................................................................................................10-15 10.3.2 Function and Feature........................................................................................................................10-15 10.3.3 Working Principle and Signal Flow.................................................................................................10-16 10.3.4 Front Panel.......................................................................................................................................10-17 10.3.5 Valid Slots........................................................................................................................................10-20 10.3.6 Technical Specifications..................................................................................................................10-20 Issue 02 (2007-09-10)

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10.4 FAN...........................................................................................................................................................10-21 10.4.1 Version Description..........................................................................................................................10-21 10.4.2 Function and Feature........................................................................................................................10-21 10.4.3 Working Principle and Signal Flow.................................................................................................10-22 10.4.4 Front Panel.......................................................................................................................................10-22 10.4.5 Valid Slots........................................................................................................................................10-23 10.4.6 Technical Specifications..................................................................................................................10-23

11 WDM Processing Boards......................................................................................................11-1 11.1 CMR2..........................................................................................................................................................11-3 11.1.1 Version Description............................................................................................................................11-3 11.1.2 Function and Feature..........................................................................................................................11-3 11.1.3 Working Principle and Signal Flow...................................................................................................11-4 11.1.4 Front Panel......................................................................................................................................... 11-5 11.1.5 Valid Slots..........................................................................................................................................11-7 11.1.6 Board Feature Code............................................................................................................................11-7 11.1.7 Technical Specifications.................................................................................................................... 11-8 11.2 CMR4..........................................................................................................................................................11-9 11.2.1 Version Description............................................................................................................................11-9 11.2.2 Function and Feature..........................................................................................................................11-9 11.2.3 Working Principle and Signal Flow.................................................................................................11-10 11.2.4 Front Panel.......................................................................................................................................11-11 11.2.5 Valid Slots........................................................................................................................................11-13 11.2.6 Board Feature Code..........................................................................................................................11-13 11.2.7 Technical Specifications..................................................................................................................11-14 11.3 MR2...........................................................................................................................................................11-15 11.3.1 Version Description..........................................................................................................................11-16 11.3.2 Function and Feature........................................................................................................................11-16 11.3.3 Working Principle and Signal Flow.................................................................................................11-16 11.3.4 Front Panel.......................................................................................................................................11-17 11.3.5 Valid Slots........................................................................................................................................11-19 11.3.6 Board Feature Code..........................................................................................................................11-19 11.3.7 Technical Specifications..................................................................................................................11-20 11.4 MR2A........................................................................................................................................................11-21 11.4.1 Version Description..........................................................................................................................11-21 11.4.2 Function and Feature........................................................................................................................11-21 11.4.3 Working Principle and Signal Flow.................................................................................................11-23 11.4.4 Front Panel.......................................................................................................................................11-24 11.4.5 Valid Slots........................................................................................................................................11-25 11.4.6 Technical Specifications..................................................................................................................11-25 11.5 MR2B........................................................................................................................................................11-26 11.5.1 Version Description..........................................................................................................................11-27 11.5.2 Function and Feature........................................................................................................................11-27 xiv

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11.5.3 Working Principle and Signal Flow.................................................................................................11-28 11.5.4 Front Panel.......................................................................................................................................11-29 11.5.5 Valid Slots........................................................................................................................................11-30 11.5.6 Technical Specifications..................................................................................................................11-30 11.6 MR2C........................................................................................................................................................11-31 11.6.1 Version Description..........................................................................................................................11-32 11.6.2 Function and Feature........................................................................................................................11-32 11.6.3 Working Principle and Signal Flow.................................................................................................11-33 11.6.4 Front Panel.......................................................................................................................................11-34 11.6.5 Valid Slots........................................................................................................................................11-36 11.6.6 Technical Specifications..................................................................................................................11-36 11.7 MR4...........................................................................................................................................................11-37 11.7.1 Version Description..........................................................................................................................11-37 11.7.2 Function and Feature........................................................................................................................11-37 11.7.3 Working Principle and Signal Flow.................................................................................................11-38 11.7.4 Front Panel.......................................................................................................................................11-39 11.7.5 Valid Slots........................................................................................................................................11-41 11.7.6 Board Feature Code..........................................................................................................................11-41 11.7.7 Technical Specifications..................................................................................................................11-42 11.8 LWX..........................................................................................................................................................11-43 11.8.1 Version Description..........................................................................................................................11-43 11.8.2 Function and Feature........................................................................................................................11-43 11.8.3 Working Principle and Signal Flow.................................................................................................11-44 11.8.4 Front Panel.......................................................................................................................................11-46 11.8.5 Valid Slots........................................................................................................................................11-48 11.8.6 Board Feature Code..........................................................................................................................11-48 11.8.7 Technical Specifications..................................................................................................................11-48 11.9 OBU1........................................................................................................................................................11-51 11.9.1 Version Description..........................................................................................................................11-52 11.9.2 Function and Feature........................................................................................................................11-52 11.9.3 Working Principle and Signal Flow.................................................................................................11-52 11.9.4 Front Panel.......................................................................................................................................11-54 11.9.5 Valid Slots........................................................................................................................................11-55 11.9.6 Board Feature Code..........................................................................................................................11-55 11.9.7 Technical Specifications..................................................................................................................11-56 11.10 FIB...........................................................................................................................................................11-57 11.10.1 Version Description........................................................................................................................11-57 11.10.2 Function and Feature......................................................................................................................11-57 11.10.3 Working Principle and Signal Flow...............................................................................................11-58 11.10.4 Front Panel.....................................................................................................................................11-58 11.10.5 Valid Slots......................................................................................................................................11-59 11.10.6 Technical Specifications................................................................................................................11-59 Issue 02 (2007-09-10)

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12 Optical Amplifier Boards and Dispersion Compensation Boards............................... 12-1 12.1 BA2............................................................................................................................................................. 12-2 12.1.1 Version Description............................................................................................................................12-2 12.1.2 Function and Feature..........................................................................................................................12-2 12.1.3 Working Principle and Signal Flow...................................................................................................12-3 12.1.4 Front Panel......................................................................................................................................... 12-5 12.1.5 Valid Slots..........................................................................................................................................12-7 12.1.6 Board Feature Code............................................................................................................................12-7 12.1.7 Technical Specifications.................................................................................................................... 12-7 12.2 BPA.............................................................................................................................................................12-8 12.2.1 Version Description............................................................................................................................12-9 12.2.2 Function and Feature..........................................................................................................................12-9 12.2.3 Working Principle and Signal Flow.................................................................................................12-10 12.2.4 Front Panel.......................................................................................................................................12-11 12.2.5 Valid Slots........................................................................................................................................12-13 12.2.6 Board Feature Code..........................................................................................................................12-13 12.2.7 Technical Specifications..................................................................................................................12-13 12.3 COA..........................................................................................................................................................12-14 12.3.1 Version Description..........................................................................................................................12-15 12.3.2 Function and Feature........................................................................................................................12-15 12.3.3 Working Principle and Signal Flow.................................................................................................12-18 12.3.4 Front Panel.......................................................................................................................................12-19 12.3.5 Installation Position..........................................................................................................................12-23 12.3.6 Board Feature Code..........................................................................................................................12-24 12.3.7 Technical Specifications..................................................................................................................12-24

13 Power Interface Boards.........................................................................................................13-1 13.1 UPM............................................................................................................................................................13-2 13.1.1 Version Description............................................................................................................................13-2 13.1.2 Function and Feature..........................................................................................................................13-2 13.1.3 Working Principle and Signal Flow...................................................................................................13-3 13.1.4 Rear Panel.......................................................................................................................................... 13-4 13.1.5 Valid Slots..........................................................................................................................................13-6 13.1.6 Technical Specifications.................................................................................................................... 13-6 13.2 PIU.............................................................................................................................................................. 13-7 13.2.1 Version Description............................................................................................................................13-8 13.2.2 Function and Feature..........................................................................................................................13-8 13.2.3 Working Principle and Signal Flow...................................................................................................13-8 13.2.4 Front Panel......................................................................................................................................... 13-9 13.2.5 Valid Slots........................................................................................................................................13-10 13.2.6 Technical Specifications..................................................................................................................13-10 13.3 PIUA..........................................................................................................................................................13-11 13.3.1 Version Description..........................................................................................................................13-11 xvi

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13.3.2 Function and Feature........................................................................................................................13-11 13.3.3 Working Principle and Signal Flow.................................................................................................13-12 13.3.4 Front Panel.......................................................................................................................................13-13 13.3.5 Valid Slots........................................................................................................................................13-14 13.3.6 Technical Specifications..................................................................................................................13-14

14 Cables.......................................................................................................................................14-1 14.1 Fiber Jumper................................................................................................................................................14-2 14.1.1 Types of Fiber Jumpers......................................................................................................................14-2 14.1.2 Connector...........................................................................................................................................14-3 14.2 Power Cables and Grounding Cables..........................................................................................................14-5 14.2.1 Cabinet –48 V/BGND/PGND Power Cable.......................................................................................14-5 14.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding Cable......................................................14-7 14.2.3 UPM Power Cable..............................................................................................................................14-9 14.3 Alarm Cable..............................................................................................................................................14-10 14.3.1 Alarm Input/Output Cable................................................................................................................14-10 14.4 Management Cable....................................................................................................................................14-12 14.4.1 OAM Serial Port Cable....................................................................................................................14-12 14.4.2 Serial 1–4/F1/F&f Serial Port Cable................................................................................................14-14 14.4.3 RS232/RS-422 Serial Port Cable.....................................................................................................14-15 14.4.4 Ordinary Telephone Wire.................................................................................................................14-17 14.4.5 COA Concatenating Cable...............................................................................................................14-18 14.4.6 Straight Through Cable....................................................................................................................14-19 14.4.7 Crossover Cable...............................................................................................................................14-20 14.5 Signal Cable..............................................................................................................................................14-21 14.5.1 75-ohm 8 x E1 Cable........................................................................................................................14-22 14.5.2 75-ohm 16 x E1 Cable......................................................................................................................14-23 14.5.3 120-ohm 8 x E1 Cable......................................................................................................................14-26 14.5.4 120-ohm 16 x E1 Cable....................................................................................................................14-28 14.5.5 E3/T3/STM-1 Cable.........................................................................................................................14-30 14.5.6 Framed E1 Cable..............................................................................................................................14-31 14.5.7 N x 64 kbit/s Cables.........................................................................................................................14-31 14.6 Clock Cable...............................................................................................................................................14-48 14.6.1 Clock Cable......................................................................................................................................14-48 14.6.2 One-Channel and Two-Channel Clock Transfer Cables..................................................................14-50

A Equipment and Board Alarm Indicators.............................................................................A-1 A.1 Indicators on the Cabinet...............................................................................................................................A-2 A.2 Board Alarm Indicator...................................................................................................................................A-2

B Labels..........................................................................................................................................B-1 B.1 Safety Label...................................................................................................................................................B-2 B.1.1 Label Description..................................................................................................................................B-2 B.1.2 Label Position.......................................................................................................................................B-3 Issue 02 (2007-09-10)

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B.2 Optical Module Labels...................................................................................................................................B-5 B.3 Engineering Labels........................................................................................................................................B-7

C Power Consumption and Weight..........................................................................................C-1 D Board Version Configuration................................................................................................D-1 E Board Loopbacks.......................................................................................................................E-1 F Board Configuration Reference..............................................................................................F-1 F.1 SDH Processing Boards..................................................................................................................................F-2 F.2 PDH Processing Board...................................................................................................................................F-2 F.3 Data Processing Board....................................................................................................................................F-4 F.3.1 SDH Parameters.....................................................................................................................................F-5 F.3.2 Ethernet Parameters...............................................................................................................................F-6 F.3.3 ATM Parameter.....................................................................................................................................F-7 F.4 Cross-Connect and Timing Unit.....................................................................................................................F-8

G Glossary.....................................................................................................................................G-1 H Acronyms and Abbreviations...............................................................................................H-1 Index.................................................................................................................................................i-1

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Figures Figure 1-1 Appearance of the OptiX OSN 1500A...............................................................................................1-1 Figure 1-2 Appearance of the OptiX OSN 1500B...............................................................................................1-1 Figure 2-1 ETSI cabinet.......................................................................................................................................2-2 Figure 2-2 Appearance of the DC PDU...............................................................................................................2-4 Figure 3-1 Structure of the OptiX OSN 1500A subrack......................................................................................3-2 Figure 3-2 Structure of the OptiX OSN 1500B subrack......................................................................................3-3 Figure 3-3 Slot access capacity of the OptiX OSN 1500A..................................................................................3-4 Figure 3-4 Slot access capacity of the OptiX OSN 1500B..................................................................................3-4 Figure 3-5 Slot layout of the OptiX OSN 1500A subrack...................................................................................3-5 Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots..........................................3-5 Figure 3-7 Slot access capacity of the OptiX OSN 1500A..................................................................................3-5 Figure 3-8 Slot layout of the OptiX OSN 1500B subrack...................................................................................3-6 Figure 3-9 Slot access capacity of the OptiX OSN 1500B..................................................................................3-6 Figure 3-10 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)......................................3-6 Figure 3-11 Access capacity of the OptiX OSN 1500B subrack (after the division of slots)..............................3-7 Figure 4-1 Barcode of a board..............................................................................................................................4-3 Figure 5-1 Block diagram for the working principle of the SL1..........................................................................5-5 Figure 5-2 Front panel of the N1SL1/N2SL1......................................................................................................5-7 Figure 5-3 Front panel of the R1SL1...................................................................................................................5-8 Figure 5-4 Block diagram for the working principle of the SLQ1.....................................................................5-13 Figure 5-5 Front panel of the N1SLQ1/N2SLQ1...............................................................................................5-15 Figure 5-6 Front panel of the R1SLQ1.............................................................................................................. 5-16 Figure 5-7 Block diagram for the working principle of the SLO1.....................................................................5-21 Figure 5-8 Front panel of the SLO1...................................................................................................................5-23 Figure 5-9 Block diagram for the working principle of the SLT1.....................................................................5-28 Figure 5-10 Front panel of the SLT1..................................................................................................................5-30 Figure 5-11 Block diagram for the working principle of the SEP1................................................................... 5-35 Figure 5-12 Block diagram for the working principle of the SEP used with the EU08.....................................5-35 Figure 5-13 Block diagram for the working principle of the SEP used with the OU08.................................... 5-36 Figure 5-14 Front panel of the SEP1..................................................................................................................5-38 Figure 5-15 Principle of the TPS protection for the SEP1 ................................................................................5-39 Figure 5-16 Slot configuration for the 1:1 TPS protection for the SEP1...........................................................5-40 Figure 5-17 Block diagram for the working principle of the SL4......................................................................5-44 Issue 02 (2007-09-10)

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Figure 5-18 Front panel of the N1SL4/N2SL4.................................................................................................. 5-46 Figure 5-19 Front panel of the R1SL4...............................................................................................................5-46 Figure 5-20 Block diagram for the working principle of the SLD4...................................................................5-52 Figure 5-21 Front panel of the N1SLD4/N2SLD4.............................................................................................5-54 Figure 5-22 Front panel of the R1SLD4............................................................................................................5-54 Figure 5-23 Block diagram for the working principle of the SLQ4...................................................................5-60 Figure 5-24 Front panel of the SLQ4.................................................................................................................5-62 Figure 5-25 Block diagram for the working principle of the SL16....................................................................5-67 Figure 5-26 Front panel of the SL16..................................................................................................................5-69 Figure 5-27 Block diagram for the working principle of the N1SL16A and N2SL16A....................................5-75 Figure 5-28 Block diagram for the working principle of the N3SL16A............................................................5-76 Figure 5-29 Front panel of the SL16A...............................................................................................................5-78 Figure 5-30 Block diagram for the working principle of the SF16....................................................................5-83 Figure 5-31 Front panel of the SF16..................................................................................................................5-85 Figure 6-1 Block diagram for the functions of the PL1.......................................................................................6-4 Figure 6-2 Block diagram of the E1 mapping/demapping...................................................................................6-5 Figure 6-3 Front panel of the PL1........................................................................................................................6-6 Figure 6-4 Block diagram for the functions of the PD1.....................................................................................6-11 Figure 6-5 Block diagram of the E1 mapping/ demapping ...............................................................................6-11 Figure 6-6 Front panel of the PD1......................................................................................................................6-13 Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack..............................6-15 Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack..............................6-16 Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A subrack........6-16 Figure 6-10 Block diagram for the functions of the PQ1...................................................................................6-20 Figure 6-11 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-21 Figure 6-12 Front panel of the PQ1....................................................................................................................6-23 Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack............................6-25 Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1....................................................................6-26 Figure 6-15 Block diagram for the functions of the PQM.................................................................................6-28 Figure 6-16 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-29 Figure 6-17 Front panel of the PQM..................................................................................................................6-31 Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack..........................6-33 Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack....6-34 Figure 6-20 Block diagram for the functions of the PL3...................................................................................6-37 Figure 6-21 Block diagram of the E3/T3 mapping/demapping .........................................................................6-37 Figure 6-22 Front panel of the PL3....................................................................................................................6-39 Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack............................6-41 Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack......6-42 Figure 6-25 Block diagram for the functions of the PL3A................................................................................6-45 Figure 6-26 Block diagram of the E3/T3 mapping/demapping .........................................................................6-45 Figure 6-27 Front panel of the PL3A.................................................................................................................6-47 Figure 6-28 Block diagram for the functions of the 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Figure 6-29 Block diagram of the E3/T3 mapping/demapping .........................................................................6-52 Figure 6-30 Front panel of the PD3....................................................................................................................6-54 Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack............................6-55 Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack......6-56 Figure 6-33 Block diagram for the functions of the PQ3...................................................................................6-59 Figure 6-34 Block diagram of the E3/T3 mapping/demapping .........................................................................6-59 Figure 6-35 Front panel of the PQ3....................................................................................................................6-61 Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack............................6-62 Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack......6-63 Figure 6-38 Block diagram for the functions of the DX1..................................................................................6-66 Figure 6-39 Front panel of the DX1...................................................................................................................6-67 Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack...........................6-69 Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-70 Figure 6-42 Block diagram for the functions of the DXA................................................................................. 6-72 Figure 6-43 Front panel of the DXA..................................................................................................................6-74 Figure 6-44 Block diagram for the functions of the SPQ4.................................................................................6-77 Figure 6-45 Block diagram of the 140M mapping/demapping .........................................................................6-78 Figure 6-46 Block diagram of the SDH overhead processing module...............................................................6-78 Figure 6-47 Front panel of the SPQ4................................................................................................................. 6-81 Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack......................... 6-82 Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4...........................................................6-83 Figure 7-1 Block diagram for the functions of the EFT4.....................................................................................7-5 Figure 7-2 Front panel of the EFT4......................................................................................................................7-7 Figure 7-3 Block diagram for the functions of the EFT8...................................................................................7-11 Figure 7-4 Front panel of the EFT8....................................................................................................................7-13 Figure 7-5 Block diagram for the functions of the EFT8A................................................................................7-18 Figure 7-6 Front panel of the EFT8A.................................................................................................................7-20 Figure 7-7 Block diagram for the functions of the EGT2..................................................................................7-24 Figure 7-8 Front panel of the EGT2...................................................................................................................7-26 Figure 7-9 Block diagram for the functions of the EFS0...................................................................................7-33 Figure 7-10 Front panel of the EFS0..................................................................................................................7-35 Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B subrack .............................................................................................................................................................................7-37 Figure 7-12 Block diagram for the functions of the EFS4.................................................................................7-41 Figure 7-13 Front panel of the EFS4..................................................................................................................7-43 Figure 7-14 Block diagram for the functions of the EGS2................................................................................ 7-49 Figure 7-15 Front panel of the EGS2.................................................................................................................7-52 Figure 7-16 Block diagram for the functions of the EMS4................................................................................7-58 Figure 7-17 Front panel of the EMS4................................................................................................................ 7-61 Figure 7-18 Normal working of the EMS4........................................................................................................7-63 Figure 7-19 Principle of the BPS protection for the EMS4............................................................................... 7-64 Figure 7-20 Principle of the PPS protection for the EMS4................................................................................7-65 Issue 02 (2007-09-10)

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Figures

Figure 7-21 Block diagram for the functions of the EGS4................................................................................7-70 Figure 7-22 Front panel of the EGS4.................................................................................................................7-73 Figure 7-23 Normal working of the EGS4.........................................................................................................7-75 Figure 7-24 Principle of the BPS protection for the EGS4................................................................................7-76 Figure 7-25 Principle of the PPS protection for the EGS4.................................................................................7-77 Figure 7-26 Block diagram for the functions of the EGR2................................................................................7-82 Figure 7-27 Front panel of the EGR2.................................................................................................................7-85 Figure 7-28 Block diagram for the functions of the EMR0...............................................................................7-92 Figure 7-29 Front panel of the N1EMR0...........................................................................................................7-95 Figure 7-30 Front panel of the N2EMR0...........................................................................................................7-96 Figure 7-31 Block diagram for the functions of the ADL4..............................................................................7-101 Figure 7-32 Front panel of the ADL4..............................................................................................................7-103 Figure 7-33 Block diagram for the functions of the ADQ1.............................................................................7-108 Figure 7-34 Front panel of the ADQ1..............................................................................................................7-110 Figure 7-35 Block diagram for the functions of the IDL4...............................................................................7-115 Figure 7-36 Front panel of the IDL4................................................................................................................7-117 Figure 7-37 Block diagram for the functions of the IDQ1...............................................................................7-123 Figure 7-38 Front panel of the IDQ1................................................................................................................7-125 Figure 7-39 Block diagram for the functions of the MST4..............................................................................7-130 Figure 7-40 Front panel of the MST4..............................................................................................................7-132 Figure 8-1 Block diagram for the functions of the L12S.....................................................................................8-3 Figure 8-2 Front panel of the L12S......................................................................................................................8-4 Figure 8-3 Block diagram for the functions of the D12B....................................................................................8-6 Figure 8-4 Front panel of the D12B.....................................................................................................................8-7 Figure 8-5 Block diagram for the functions of the D12S...................................................................................8-10 Figure 8-6 Front panel of the D12S....................................................................................................................8-11 Figure 8-7 Block diagram for the functions of the L75S...................................................................................8-14 Figure 8-8 Front panel of the L75S....................................................................................................................8-15 Figure 8-9 Block diagram for the functions of the D75S...................................................................................8-17 Figure 8-10 Front panel of the D75S..................................................................................................................8-18 Figure 8-11 Block diagram for the functions of the D34S.................................................................................8-21 Figure 8-12 Front panel of the D34S..................................................................................................................8-22 Figure 8-13 Block diagram for the functions of the C34S.................................................................................8-24 Figure 8-14 Front panel of the C34S..................................................................................................................8-25 Figure 8-15 Block diagram for the functions of the EU04.................................................................................8-28 Figure 8-16 Front panel of the EU04.................................................................................................................8-29 Figure 8-17 Block diagram for the functions of the EU08.................................................................................8-31 Figure 8-18 Front panel of the EU08.................................................................................................................8-32 Figure 8-19 Block diagram for the functions of the OU08................................................................................8-35 Figure 8-20 Front panel of the N1OU08............................................................................................................8-36 Figure 8-21 Front panel of the N2OU08............................................................................................................8-37 Figure 8-22 Block diagram for the functions of the MU04................................................................................8-40 xxii

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Figures

Figure 8-23 Front panel of the MU04................................................................................................................8-41 Figure 8-24 Block diagram for the functions of the TSB8.................................................................................8-43 Figure 8-25 Front panel of the TSB8.................................................................................................................8-44 Figure 8-26 Block diagram for the functions of the EFF8.................................................................................8-47 Figure 8-27 Front panel of the EFF8..................................................................................................................8-48 Figure 8-28 Block diagram for the functions of the ETF8.................................................................................8-52 Figure 8-29 Front panel of the ETF8..................................................................................................................8-53 Figure 8-30 Block diagram for the functions of the ETS8.................................................................................8-57 Figure 8-31 Front panel of the ETS8..................................................................................................................8-58 Figure 8-32 Block diagram for the functions of the DM12................................................................................8-61 Figure 8-33 Front panel of the DM12................................................................................................................8-62 Figure 9-1 Block diagram for the functions of the CXL1....................................................................................9-6 Figure 9-2 Block diagram of higher and lower order cross-connect modules....................................................9-9 Figure 9-3 Front panel of the CXL1...................................................................................................................9-10 Figure 9-4 Block diagram for the functions of the CXL4..................................................................................9-17 Figure 9-5 Block diagram of higher and lower order cross-connect modules..................................................9-20 Figure 9-6 Front panel of the CXL4...................................................................................................................9-21 Figure 9-7 Block diagram for the functions of the CXL16................................................................................9-28 Figure 9-8 Block diagram of higher and lower order cross-connect modules..................................................9-31 Figure 9-9 Front panel of the CXL16.................................................................................................................9-32 Figure 10-1 Block diagram for the functions of the EOW.................................................................................10-3 Figure 10-2 Front panel of the EOW..................................................................................................................10-4 Figure 10-3 Block diagram for the functions of the R1AUX.............................................................................10-8 Figure 10-4 Block diagram for the functions of the R2AUX.............................................................................10-9 Figure 10-5 Position of J9 on the AUX............................................................................................................10-11 Figure 10-6 Front panel of the AUX................................................................................................................10-12 Figure 10-7 Block diagram for the functions of the AMU...............................................................................10-16 Figure 10-8 Positions of orderwire bytes in the SDH frame............................................................................10-17 Figure 10-9 Front panel of the AMU...............................................................................................................10-18 Figure 10-10 Connection of the cabinet alarm indicators................................................................................10-20 Figure 10-11 Block diagram for the functions of the FAN..............................................................................10-22 Figure 10-12 Front panel of the FAN...............................................................................................................10-23 Figure 11-1 Block diagram for the functions of the CMR2...............................................................................11-4 Figure 11-2 Front panel of the CMR2................................................................................................................11-6 Figure 11-3 Block diagram for the functions of the CMR4.............................................................................11-10 Figure 11-4 Front panel of the CMR4..............................................................................................................11-12 Figure 11-5 Block diagram for the functions of the MR2................................................................................11-17 Figure 11-6 Front panel of the MR2................................................................................................................11-18 Figure 11-7 MR2A used as the OTM station...................................................................................................11-22 Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM station...........11-22 Figure 11-9 Block diagram for the functions of the MR2A.............................................................................11-23 Figure 11-10 Front panel of the MR2A............................................................................................................11-24 Issue 02 (2007-09-10)

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Figure 11-11 MR2B used as the OTM station.................................................................................................11-27 Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM station......... 11-28 Figure 11-13 Block diagram for the functions of the MR2B...........................................................................11-28 Figure 11-14 Front panel of the MR2B............................................................................................................11-29 Figure 11-15 MR2C used as the OTM station.................................................................................................11-32 Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C and LWX ...........................................................................................................................................................................11-33 Figure 11-17 Block diagram for the functions of the MR2C...........................................................................11-33 Figure 11-18 Front panel of the MR2C............................................................................................................11-35 Figure 11-19 Block diagram for the functions of the MR4..............................................................................11-38 Figure 11-20 Front panel of the MR4.............................................................................................................. 11-40 Figure 11-21 Block diagram for the functions of the LWX.............................................................................11-45 Figure 11-22 Front panel of the LWX..............................................................................................................11-47 Figure 11-23 Block diagram for the functions of the OBU1............................................................................11-53 Figure 11-24 Front panel of the OBU1............................................................................................................11-54 Figure 11-25 Location of the FIB in the optical transmission system............................................................. 11-57 Figure 11-26 Block diagram for the working principle of the FIB..................................................................11-58 Figure 11-27 Front panel of the FIB................................................................................................................ 11-59 Figure 12-1 Location of the BA in the optical transmission system..................................................................12-2 Figure 12-2 Block diagram for the functions of the BA2..................................................................................12-4 Figure 12-3 Front panel of the BA2...................................................................................................................12-6 Figure 12-4 Location of the BA and PA in the optical transmission system.....................................................12-9 Figure 12-5 Block diagram for the working principle of the BPA...................................................................12-10 Figure 12-6 Front panel of the BPA.................................................................................................................12-12 Figure 12-7 Appearance of the case-shaped 61COA and N1COA (PA)......................................................... 12-16 Figure 12-8 Appearance of the case-shaped 62COA.......................................................................................12-17 Figure 12-9 Application of the optical Raman amplifier (62COA).................................................................12-17 Figure 12-10 Block diagram for the functions of the 61COA and N1COA.................................................... 12-18 Figure 12-11 Front panel of the 61COA and N1COA.....................................................................................12-20 Figure 12-12 Front panel of the 62COA..........................................................................................................12-20 Figure 12-13 SC/PC fiber connector................................................................................................................12-21 Figure 12-14 E2000 flange and fiber connector...............................................................................................12-21 Figure 12-15 Position of the 61COA in the ETSI cabinet............................................................................... 12-24 Figure 13-1 Appearance of the power supply case............................................................................................13-2 Figure 13-2 Rear view of the UPM....................................................................................................................13-4 Figure 13-3 Block diagram for the functions of the PIU....................................................................................13-9 Figure 13-4 Front panel of the PIU..................................................................................................................13-10 Figure 13-5 Block diagram for the functions of the PIUA...............................................................................13-12 Figure 13-6 Front panel of the PIUA............................................................................................................... 13-13 Figure 14-1 LC/PC optical connector................................................................................................................14-3 Figure 14-2 SC/PC optical connector.................................................................................................................14-4 Figure 14-3 FC/PC optical connector.................................................................................................................14-4 Figure 14-4 E2000/APC optical connector........................................................................................................14-5 xxiv

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Figures

Figure 14-5 Cabinet –48 V power cable and BGND power grounding cable....................................................14-6 Figure 14-6 Cabinet PGND protection grounding cable (JG2)..........................................................................14-6 Figure 14-7 Cabinet PGND protection grounding cable (OT)...........................................................................14-6 Figure 14-8 Structure of the equipment –48 V/–60 V Power Cable..................................................................14-8 Figure 14-9 PGND power cable.........................................................................................................................14-8 Figure 14-10 Structure of the UPM power cable...............................................................................................14-9 Figure 14-11 Structure of the alarm input/output cable...................................................................................14-11 Figure 14-12 Structure of the OAM serial port cable.......................................................................................14-13 Figure 14-13 Structure of the Serial 1–4/F1/F&f serial port cable..................................................................14-14 Figure 14-14 Structure of the RS232/RS-422 serial port cable........................................................................14-16 Figure 14-15 Structure of the ordinary telephone wire....................................................................................14-17 Figure 14-16 Structure of the COA concatenating cable.................................................................................14-18 Figure 14-17 Structure of the straight through cable........................................................................................14-19 Figure 14-18 Structure of the crossover cable..................................................................................................14-20 Figure 14-19 Structure of the 75-ohm 8 x E1 cable.........................................................................................14-22 Figure 14-20 Structure of the 75-ohm 16 x E1 cable.......................................................................................14-24 Figure 14-21 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-26 Figure 14-22 Structure of the 120-ohm 16 x E1 cable.....................................................................................14-28 Figure 14-23 Structure of the E3/T3/STM-1 cable..........................................................................................14-30 Figure 14-24 Structure of the V.35 DCE cable................................................................................................14-33 Figure 14-25 Structure of the V.35 DTE cable................................................................................................14-35 Figure 14-26 Structure of the V.24 DCE cable................................................................................................14-36 Figure 14-27 Structure of the V.24 DTE cable................................................................................................14-38 Figure 14-28 Structure of the X.21 DCE cable................................................................................................14-39 Figure 14-29 Structure of the X.21 DTE cable................................................................................................14-40 Figure 14-30 Structure of the RS449 DCE cable.............................................................................................14-42 Figure 14-31 Structure of the RS449 DTE cable.............................................................................................14-43 Figure 14-32 Structure of the RS530 DCE cable.............................................................................................14-45 Figure 14-33 Structure of the RS530 DTE cable.............................................................................................14-47 Figure 14-34 Structure of the 75-ohm clock cable...........................................................................................14-49 Figure 14-35 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-49 Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)................................14-50 Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)................................14-50 Figure B-1 Labels on the OptiX OSN 1500B subrack........................................................................................B-4 Figure B-2 Labels on the OptiX OSN 1500A subrack........................................................................................B-4 Figure B-3 Labels on a board..............................................................................................................................B-5 Figure B-4 Optical module labels........................................................................................................................B-5

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Tables

Tables Table 2-1 Indicators on the ETSI cabinet.............................................................................................................2-3 Table 2-2 Connection of power terminals at side A and side B...........................................................................2-4 Table 2-3 Technical specifications of the ETSI cabinet.......................................................................................2-5 Table 3-1 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN 1500A....................................................................................................................................................................3-7 Table 3-2 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN 1500B....................................................................................................................................................................3-7 Table 3-3 Boards and their valid slots for the OptiX OSN 1500A.......................................................................3-8 Table 3-4 Boards and their valid slots for the OptiX OSN 1500B.....................................................................3-12 Table 3-5 Technical specifications of the OptiX OSN 1500A subrack..............................................................3-17 Table 3-6 Maximum power consumption of the OptiX OSN 1500A subrack...................................................3-17 Table 3-7 Technical specifications of the OptiX OSN 1500B subrack..............................................................3-18 Table 3-8 Maximum power consumption of the OptiX OSN 1500B subrack...................................................3-18 Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500........................................................4-2 Table 4-2 SDH processing boards for the OptiX OSN 1500A.............................................................................4-4 Table 4-3 SDH processing boards for the OptiX OSN 1500B.............................................................................4-5 Table 4-4 PDH processing boards for the OptiX OSN 1500A.............................................................................4-7 Table 4-5 PDH processing boards for the OptiX OSN 1500B.............................................................................4-7 Table 4-6 Data processing boards for the OptiX OSN 1500A.............................................................................4-8 Table 4-7 Data processing boards for the OptiX OSN 1500B.............................................................................4-8 Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A.....................................4-9 Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B......................................4-9 Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B .............................................................................................................................................................................4-10 Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B......................4-10 Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A..................................4-11 Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B..................................4-11 Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A/B .............................................................................................................................................................................4-12 Table 5-1 Version Description of the SL1............................................................................................................5-3 Table 5-2 Functions and features of the SL1........................................................................................................5-4 Table 5-3 Optical interfaces of the SL1................................................................................................................5-8 Table 5-4 Relation between the board feature code and the optical interface type..............................................5-9 Table 5-5 Specifications of the optical interfaces of the SL1.............................................................................5-10 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 5-6 Version Description of the SLQ1.......................................................................................................5-12 Table 5-7 Functions and features of the SLQ1...................................................................................................5-12 Table 5-8 Optical interfaces of the SLQ1...........................................................................................................5-16 Table 5-9 Relation between the board feature code and the optical interface type............................................5-17 Table 5-10 Specifications of the optical interfaces of the SLQ1........................................................................5-18 Table 5-11 Functions and features of the SLO1 board.......................................................................................5-20 Table 5-12 Optical interfaces of the SLO1.........................................................................................................5-23 Table 5-13 Relation between the board feature code and the optical interface type..........................................5-24 Table 5-14 Specifications of the optical interfaces of the SLO1........................................................................5-25 Table 5-15 Functions and features of the SLT1.................................................................................................5-26 Table 5-16 Optical interfaces of the SLT1.........................................................................................................5-30 Table 5-17 Specifications of the optical interfaces of the SLT1........................................................................5-31 Table 5-18 Functions and features of the SEP1.................................................................................................5-33 Table 5-19 Access capabilities for the SEP1......................................................................................................5-34 Table 5-20 Electrical interfaces of the SEP1......................................................................................................5-39 Table 5-21 Slots for the SEP1, EU08 and TSB8................................................................................................5-40 Table 5-22 Technical specifications of the SEP1 board.....................................................................................5-41 Table 5-23 Version Description of the SL4........................................................................................................5-42 Table 5-24 Functions and features of the SL4....................................................................................................5-42 Table 5-25 Optical interfaces of the SL4............................................................................................................5-47 Table 5-26 Relation between the board feature code and the optical interface type of the SL4........................5-47 Table 5-27 Specifications of the optical interfaces of the SL4...........................................................................5-48 Table 5-28 Version Description of the SLD4.....................................................................................................5-50 Table 5-29 Functions and features of the SLD4.................................................................................................5-50 Table 5-30 Optical interfaces of the SLD4.........................................................................................................5-55 Table 5-31 Relation between the board feature code and the optical interface type of the SLD4.....................5-56 Table 5-32 Specifications of the optical interfaces of the SLD4........................................................................5-56 Table 5-33 Version Description of the SLQ4.....................................................................................................5-58 Table 5-34 Functions and features of the SLQ4.................................................................................................5-59 Table 5-35 Optical interfaces of the SLQ4.........................................................................................................5-62 Table 5-36 Relation between the board feature code and the optical interface type of the SLQ4.....................5-63 Table 5-37 Specifications of the optical interfaces of the SLQ4........................................................................5-64 Table 5-38 Version Description of the SL16......................................................................................................5-65 Table 5-39 Functions and features of the SL16..................................................................................................5-66 Table 5-40 Optical interfaces of the SL16..........................................................................................................5-70 Table 5-41 Relation between the board feature code and the optical interface type for the SL16.....................5-70 Table 5-42 Specifications of the optical interfaces of the SL16.........................................................................5-71 Table 5-43 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths .............................................................................................................................................................................5-72 Table 5-44 Version Description of the SL16A...................................................................................................5-73 Table 5-45 Functions and features of the SL16A...............................................................................................5-74 Table 5-46 Optical interfaces of the SL16A.......................................................................................................5-78 Table 5-47 Relation between the board feature code and the optical interface type..........................................5-79

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Table 5-48 Specifications of the optical interfaces of the SL16A......................................................................5-79 Table 5-49 Functions and features of the SF16..................................................................................................5-81 Table 5-50 Optical interfaces of the SF16..........................................................................................................5-86 Table 5-51 Specifications of the optical interfaces of the SF16.........................................................................5-87 Table 5-52 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths .............................................................................................................................................................................5-87 Table 6-1 Functions and features of the PL1........................................................................................................6-3 Table 6-2 Interfaces on the front panel of the PL1...............................................................................................6-7 Table 6-3 Relation between the board feature code and the optical interface type of the PL1............................6-7 Table 6-4 Specifications of the electrical interfaces of the PL1...........................................................................6-8 Table 6-5 Version Description of the PD1...........................................................................................................6-9 Table 6-6 Functions and features of the PD1.......................................................................................................6-9 Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX OSN 1500A subrack .............................................................................................................................................................................6-14 Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-14 Table 6-9 Relation between the board feature code and the interface impedance type.....................................6-15 Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack.......6-17 Table 6-11 Version Description of the PQ1.......................................................................................................6-18 Table 6-12 Functions and features of the PQ1...................................................................................................6-19 Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the OptiX OSN 1500B subrack................................................................................................................................................................6-24 Table 6-14 Relation between the board feature code and the interface impedance type...................................6-24 Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack.......6-25 Table 6-16 Functions and features of the PQM..................................................................................................6-27 Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX OSN 1500B subrack................................................................................................................................................................6-32 Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-33 Table 6-19 Version description of the PL3........................................................................................................6-35 Table 6-20 Functions and features of the PL3....................................................................................................6-36 Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-40 Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack........6-41 Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-42 Table 6-24 Version description of the PL3A......................................................................................................6-44 Table 6-25 Functions and features of the PL3A.................................................................................................6-44 Table 6-26 Specifications of the electrical interfaces of the PL3A....................................................................6-48 Table 6-27 Version Description of the PD3.......................................................................................................6-50 Table 6-28 Functions and features of the PD3...................................................................................................6-50 Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-55 Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack.......6-56 Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-56 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 6-32 Functions and features of the PQ3...................................................................................................6-58 Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-62 Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack.......6-63 Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-63 Table 6-36 Functions and features of the DX1...................................................................................................6-65 Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-68 Table 6-38 Relation between the board feature code and the interface impedance type...................................6-69 Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack....................................................6-70 Table 6-40 Functions and features of the DXA..................................................................................................6-72 Table 6-41 Version Description of the SPQ4.....................................................................................................6-76 Table 6-42 Functions and features of the SPQ4.................................................................................................6-76 Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-82 Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack.......................................6-83 Table 7-1 Functions and features of the EFT4.....................................................................................................7-3 Table 7-2 Optical interfaces of the EFT4.............................................................................................................7-7 Table 7-3 Pins of the RJ-45 of the EFT4..............................................................................................................7-8 Table 7-4 Functions and features of the EFT8.....................................................................................................7-9 Table 7-5 Optical interfaces of the EFT8...........................................................................................................7-14 Table 7-6 Pins of the RJ-45 of the EFT8............................................................................................................7-14 Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A .............................................................................................................................................................................7-15 Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B .............................................................................................................................................................................7-15 Table 7-9 Functions and features of the EFT8A................................................................................................7-16 Table 7-10 Optical interfaces of the EFT8A......................................................................................................7-21 Table 7-11 Pins of the RJ-45 of the EFT8A.......................................................................................................7-21 Table 7-12 Functions and features of the EGT2.................................................................................................7-23 Table 7-13 Optical interfaces of the EGT2.........................................................................................................7-27 Table 7-14 Relation between the board feature code and the optical interface type..........................................7-27 Table 7-15 Specifications of the optical interfaces of the EGT2........................................................................7-28 Table 7-16 Version Description of the EFS0.....................................................................................................7-30 Table 7-17 Functions and features of the EFS0.................................................................................................7-30 Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack................................................................................................................................................................7-36 Table 7-19 Version Description of the EFS4.....................................................................................................7-38 Table 7-20 Functions and features of the EFS4.................................................................................................7-39 Table 7-21 Optical interfaces of the EFS4.........................................................................................................7-44 Table 7-22 Pins of the RJ-45 of the EFS4..........................................................................................................7-44 Table 7-23 Version Description of the EGS2.....................................................................................................7-46 Table 7-24 Functions and features of the EGS2.................................................................................................7-47 Table 7-25 Optical interfaces of the EGS2.........................................................................................................7-53

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Table 7-26 Relation between the board feature code and the optical interface type..........................................7-53 Table 7-27 Specifications of the optical interfaces of the EGS2........................................................................7-54 Table 7-28 Functions and features of the EMS4................................................................................................7-55 Table 7-29 Optical interfaces of the EMS4........................................................................................................7-62 Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A subrack................................................................................................................................................................7-62 Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack................................................................................................................................................................7-62 Table 7-32 Relation between the board feature code and the optical interface type..........................................7-63 Table 7-33 Specifications of the optical interfaces of the EMS4.......................................................................7-66 Table 7-34 Functions and features of the EGS4.................................................................................................7-68 Table 7-35 Optical interfaces of the EGS4.........................................................................................................7-74 Table 7-36 Relation between the board feature code and the optical interface type..........................................7-74 Table 7-37 Specifications of the optical interfaces of the EGS4........................................................................7-78 Table 7-38 Functions and features of the EGR2................................................................................................7-79 Table 7-39 Optical interfaces of the EGR2 .......................................................................................................7-86 Table 7-40 Relation between the board feature code and the optical interface type..........................................7-86 Table 7-41 Specifications of the interfaces of the EGR2...................................................................................7-87 Table 7-42 Version description of the EMR0....................................................................................................7-88 Table 7-43 Comparison of features of the N1EMR0 and N2EMR0..................................................................7-88 Table 7-44 Functions and features of the EMR0................................................................................................7-89 Table 7-45 Optical interfaces of the EMR0 .......................................................................................................7-97 Table 7-46 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A subrack................................................................................................................................................................7-97 Table 7-47 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack................................................................................................................................................................7-97 Table 7-48 Relation between the board feature code and the optical interface type..........................................7-98 Table 7-49 Specifications of the optical interfaces of the EMR0.......................................................................7-98 Table 7-50 Functions and features of the ADL4..............................................................................................7-100 Table 7-51 Optical interface of the ADL4 .......................................................................................................7-104 Table 7-52 Relation between the board feature code and the optical interface type........................................7-104 Table 7-53 Specifications of the optical interfaces of the ADL4.....................................................................7-105 Table 7-54 Functions and features of the ADQ1..............................................................................................7-107 Table 7-55 Optical interfaces of the ADQ1 .....................................................................................................7-111 Table 7-56 Relation between the board feature code and the optical interface type........................................7-111 Table 7-57 Specifications of the optical interfaces of the ADQ1.....................................................................7-112 Table 7-58 Functions and features of the IDL4................................................................................................7-114 Table 7-59 Optical interface of the IDL4 ........................................................................................................7-118 Table 7-60 Relation between the board feature code and the optical interface type........................................7-118 Table 7-61 Specifications of the optical interfaces of the IDL4.......................................................................7-119 Table 7-62 Functions and features of the IDQ1...............................................................................................7-121 Table 7-63 Optical interfaces of the IDQ1 ......................................................................................................7-126 Table 7-64 Relation between the board feature code and the optical interface type........................................7-126 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 7-65 Specifications of the optical interfaces of the IDQ1......................................................................7-127 Table 7-66 Functions and features of the MST4..............................................................................................7-129 Table 7-67 Services and service rates provided by the MST4.........................................................................7-129 Table 7-68 Optical interfaces of the MST4......................................................................................................7-133 Table 7-69 Relation between the board feature code and service type............................................................7-133 Table 7-70 Specifications of the optical interfaces of the MST4.....................................................................7-134 Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A subrack ...............................................................................................................................................................................8-5 Table 8-2 Interfaces on the front panel of the D12B............................................................................................8-7 Table 8-3 Pins of the DB44 interfaces of the D12B.............................................................................................8-8 Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN 1500B subrack ...............................................................................................................................................................................8-8 Table 8-5 Interfaces on the front panel of the D12S..........................................................................................8-11 Table 8-6 Pins of the DB44 interfaces of the D12S...........................................................................................8-12 Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN 1500B subrack .............................................................................................................................................................................8-12 Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S...........................................................8-15 Table 8-9 Interfaces on the front panel of the D75S..........................................................................................8-18 Table 8-10 Pins of the DB44 interfaces of the D75S.........................................................................................8-19 Table 8-11 Valid slots for the PQ1/PQM and corresponding slots for the D75S in the OptiX OSN 1500B subrack .............................................................................................................................................................................8-19 Table 8-12 Interfaces of the D34S......................................................................................................................8-22 Table 8-13 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack .............................................................................................................................................................................8-23 Table 8-14 Specifications of the electrical interfaces of the D34S....................................................................8-23 Table 8-15 Interfaces of the C34S......................................................................................................................8-26 Table 8-16 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack .............................................................................................................................................................................8-26 Table 8-17 Specifications of the electrical interfaces of the C34S.....................................................................8-26 Table 8-18 Interfaces of the EU04.....................................................................................................................8-29 Table 8-19 Valid slots for the SEP and corresponding slots for the EU04........................................................8-30 Table 8-20 Specifications of the electrical interfaces of the EU04....................................................................8-30 Table 8-21 Interfaces of the EU08.....................................................................................................................8-33 Table 8-22 Valid slots for the SEP and corresponding slots for the EU08........................................................8-33 Table 8-23 Specifications of the electrical interfaces of the EU08....................................................................8-33 Table 8-24 Version description of the OU08.....................................................................................................8-34 Table 8-25 Interfaces of the N1OU08................................................................................................................8-37 Table 8-26 Interfaces of the N2OU08................................................................................................................8-38 Table 8-27 Valid slots for the SEP and corresponding slots for the OU08........................................................8-38 Table 8-28 Specifications of the optical interfaces of the OU08........................................................................8-38 Table 8-29 Interfaces of the MU04....................................................................................................................8-41 Table 8-30 Valid slots for the SPQ4 and corresponding slots for the MU04.....................................................8-42 Table 8-31 Specifications of the electrical interfaces of the MU04...................................................................8-42 Table 8-32 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04....................................8-45

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Table 8-33 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S.......................................8-45 Table 8-34 Valid slots for the TSB8 and corresponding slots for the SEP and EU04.......................................8-45 Table 8-35 Valid slots for the TSB8 and corresponding slots for the SEP and EU08.......................................8-45 Table 8-36 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.....................................8-46 Table 8-37 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S........................................8-46 Table 8-38 Interfaces of the EFF8......................................................................................................................8-49 Table 8-39 Valid slots for the EFT8 and corresponding slots for the EFF8......................................................8-49 Table 8-40 Valid slots for the EFS0 and corresponding slots for the EFF8.......................................................8-49 Table 8-41 Valid slots for the EMS4 and corresponding slots for the EFF8.....................................................8-49 Table 8-42 Valid slots for the EMR0 and corresponding slots for the EFF8.....................................................8-50 Table 8-43 Specifications of the optical interfaces of the EFF8........................................................................8-50 Table 8-44 Interfaces of the ETF8......................................................................................................................8-53 Table 8-45 Pins of the RJ-45 connector of the ETF8.........................................................................................8-54 Table 8-46 Valid slots for the EFT8 and corresponding slots for the ETF8......................................................8-54 Table 8-47 Valid slots for the EFS0 and corresponding slots for the ETF8......................................................8-55 Table 8-48 Valid slots for the EMS4 and corresponding slots for the ETF8.....................................................8-55 Table 8-49 Valid slots for the EMR0 and corresponding slots for the ETF8.....................................................8-55 Table 8-50 Specifications of the electrical interfaces of the ETF8....................................................................8-55 Table 8-51 Interfaces of the ETS8......................................................................................................................8-58 Table 8-52 Pins of the RJ-45 connector of the ETS8.........................................................................................8-59 Table 8-53 Valid slots for the EFS0 and corresponding slots for the ETS8......................................................8-59 Table 8-54 Specifications of the electrical interfaces of the ETS8....................................................................8-59 Table 8-55 Interfaces on the front panel of the DM12.......................................................................................8-62 Table 8-56 Pins of the DB44 interfaces of the DM12........................................................................................8-63 Table 8-57 Pins of the DB28 interfaces of the DM12........................................................................................8-64 Table 8-58 Valid slots for the DX1 and corresponding slots for the DM12......................................................8-64 Table 9-1 Function and feature of the SDH processing unit of the CXL1...........................................................9-3 Table 9-2 Function and feature of the SCC unit of the CXL1.............................................................................9-3 Table 9-3 Function and feature of the cross-connect unit of the CXL1...............................................................9-4 Table 9-4 Function and feature of the clock unit of the CXL1............................................................................9-5 Table 9-5 Optical interface and switches on the CXL1......................................................................................9-11 Table 9-6 Relation between the board feature code and the optical interface type............................................9-11 Table 9-7 Logical slots displayed on the T2000 for the CXL1..........................................................................9-12 Table 9-8 Specifications of the optical interfaces of the CXL1.........................................................................9-12 Table 9-9 Function and feature of the SDH processing unit of the CXL4.........................................................9-14 Table 9-10 Function and feature of the SCC unit of the CXL4.........................................................................9-15 Table 9-11 Function and feature of the cross-connect unit of the CXL4...........................................................9-16 Table 9-12 Function and feature of the clock unit of the CXL4........................................................................9-16 Table 9-13 Optical interface and switches on the CXL4....................................................................................9-22 Table 9-14 Relation between the board feature code and the optical interface type..........................................9-22 Table 9-15 Logical slots displayed on the T2000 for the CXL4........................................................................9-23 Table 9-16 Specifications of the optical interfaces of the CXL4.......................................................................9-23 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 9-17 Function and feature of the SDH processing unit of the CXL16.....................................................9-25 Table 9-18 Function and feature of the SCC unit of the CXL16.......................................................................9-26 Table 9-19 Function and feature of the cross-connect unit of the CXL16.........................................................9-27 Table 9-20 Function and feature of the clock unit of the CXL16......................................................................9-27 Table 9-21 Optical interface and switches on the CXL16..................................................................................9-33 Table 9-22 Relation between the board feature code and the optical interface type..........................................9-33 Table 9-23 Logical slots displayed on the T2000 for the CXL16......................................................................9-34 Table 9-24 Specifications of the optical interfaces of the CXL16.....................................................................9-34 Table 10-1 Functions and features of the EOW.................................................................................................10-2 Table 10-2 Interfaces on the front panel of the EOW........................................................................................10-4 Table 10-3 Pins of the PHONE interface of the EOW.......................................................................................10-5 Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW......................................................................10-5 Table 10-5 Functions and features of the AUX..................................................................................................10-7 Table 10-6 Interfaces on the front panel of the AUX.......................................................................................10-12 Table 10-7 Pins of the CLK interface of the AUX...........................................................................................10-13 Table 10-8 Pins of the ETH and COM interfaces of the AUX.........................................................................10-13 Table 10-9 Pins of the ALM interface of the AUX..........................................................................................10-13 Table 10-10 Pins of the OAM interface of the AUX.......................................................................................10-14 Table 10-11 Pins of the F&f interface of the AUX..........................................................................................10-14 Table 10-12 Functions and features of the AMU.............................................................................................10-16 Table 10-13 Interfaces on the front panel of the AMU....................................................................................10-18 Table 10-14 Pins of the PHONE interface of the AMU...................................................................................10-19 Table 10-15 Pins of the S1 and S2 interfaces of the AMU..............................................................................10-19 Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU.............................................................10-19 Table 10-17 Functions and features of the FAN..............................................................................................10-21 Table 11-1 Functions and features of the CMR2...............................................................................................11-3 Table 11-2 Optical interfaces of the CMR2.......................................................................................................11-7 Table 11-3 Feature code of the CMR2...............................................................................................................11-7 Table 11-4 Specifications of the optical interfaces of the CMR2......................................................................11-8 Table 11-5 Functions and features of the CMR4.............................................................................................11-10 Table 11-6 Optical interfaces of the CMR4.....................................................................................................11-13 Table 11-7 Feature code of the CMR4.............................................................................................................11-13 Table 11-8 Specifications of the optical interfaces of the CMR4....................................................................11-14 Table 11-9 Functions and features of the MR2................................................................................................11-16 Table 11-10 Optical interfaces of the MR2......................................................................................................11-19 Table 11-11 Feature code of the MR2..............................................................................................................11-19 Table 11-12 Specifications of the optical interfaces of the MR2.....................................................................11-20 Table 11-13 Functions and features of the MR2A...........................................................................................11-22 Table 11-14 Optical interfaces of the MR2A...................................................................................................11-25 Table 11-15 Specifications of the optical interfaces of the MR2A..................................................................11-25 Table 11-16 Functions and features of the MR2B...........................................................................................11-27 Table 11-17 Optical interfaces of the MR2B...................................................................................................11-30

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Table 11-18 Specifications of the optical interfaces of the MR2B..................................................................11-30 Table 11-19 Functions and features of the MR2C...........................................................................................11-32 Table 11-20 Optical interfaces of the MR2C...................................................................................................11-35 Table 11-21 Specifications of the optical interfaces of the MR2C..................................................................11-36 Table 11-22 Functions and features of the MR4..............................................................................................11-37 Table 11-23 Optical interfaces of the MR4......................................................................................................11-41 Table 11-24 Board feature code.......................................................................................................................11-41 Table 11-25 Specifications of the optical interfaces of the MR4.....................................................................11-42 Table 11-26 Functions and features of the LWX.............................................................................................11-44 Table 11-27 Optical interfaces on the front panel of the LWX........................................................................11-48 Table 11-28 Relation between the board feature code and the receive/transmit scheme.................................11-48 Table 11-29 Specifications of the client-side optical interfaces of the LWX...................................................11-48 Table 11-30 Specifications of the WDM-side optical interfaces of the LWX.................................................11-49 Table 11-31 Functions and features of the OBU1............................................................................................11-52 Table 11-32 Optical interfaces of the OBU1....................................................................................................11-55 Table 11-33 Feature code of the OBU1............................................................................................................11-55 Table 11-34 Specifications of optical interfaces of the OBU1.........................................................................11-56 Table 11-35 Functions and features of the FIB................................................................................................11-58 Table 11-36 Optical interfaces of the FIB .......................................................................................................11-59 Table 11-37 Specifications of the optical interfaces of the FIB.......................................................................11-60 Table 12-1 Functions and features of the BA2...................................................................................................12-3 Table 12-2 Optical interfaces of the BA2 ..........................................................................................................12-7 Table 12-3 Relation between the board feature code and output optical power for the BA2............................12-7 Table 12-4 Specifications of the optical interfaces of the BA2..........................................................................12-8 Table 12-5 Functions and features of the BPA...................................................................................................12-9 Table 12-6 Optical interfaces of the BPA .......................................................................................................12-13 Table 12-7 Relation between the board feature code and output optical power for the BPA..........................12-13 Table 12-8 Specifications of the optical interfaces of the BPA........................................................................12-14 Table 12-9 Version Description of the COA....................................................................................................12-15 Table 12-10 Functions and features of the 61COA and N1COA.....................................................................12-16 Table 12-11 Functions and features of the 62COA..........................................................................................12-18 Table 12-12 Pins of the RS232 interface..........................................................................................................12-22 Table 12-13 Pins of the MONITOR-1 and MONITOR-2 interfaces...............................................................12-22 Table 12-14 Pins of the RJ-45 connector of the 62COA..................................................................................12-23 Table 12-15 Relation between the board feature code and output optical power for the 61COA...................12-24 Table 12-16 Specifications of the optical interfaces of the COA.....................................................................12-24 Table 13-1 Functions and features of the UPM..................................................................................................13-3 Table 13-2 Interfaces on the rear panel of the UPM..........................................................................................13-5 Table 13-3 Pins of the RS232 interface of the UPM..........................................................................................13-5 Table 13-4 Specifications of the power supply of the UPM..............................................................................13-6 Table 13-5 Functions and features of the PIU....................................................................................................13-8 Table 13-6 Interfaces on the front panel of the 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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 13-7 Functions and features of the PIUA...............................................................................................13-12 Table 13-8 Interfaces and switch on the front panel of the PIUA....................................................................13-14 Table 14-1 Types of fiber jumpers.....................................................................................................................14-2 Table 14-2 Types of connectors.........................................................................................................................14-3 Table 14-3 Equipment –48 V/–60 V power cable..............................................................................................14-8 Table 14-4 Connection of the UPM power cable...............................................................................................14-9 Table 14-5 Specifications of the UPM power cable.........................................................................................14-10 Table 14-6 Pin assignment of the alarm input/output cable.............................................................................14-11 Table 14-7 Pin assignment of the OAM serial port cable................................................................................14-13 Table 14-8 Pin assignment of the Serial 1–4/F1/F&f serial port cable............................................................14-15 Table 14-9 Pin assignment of the RS232/RS-422 serial port cable.................................................................14-16 Table 14-10 Pin assignment of the ordinary telephone wire............................................................................14-17 Table 14-11 Pin assignment of the COA concatenating cable.........................................................................14-18 Table 14-12 Pin assignment of the straight through cable...............................................................................14-19 Table 14-13 Pin assignment of the crossover cable.........................................................................................14-20 Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable.................................................................................14-22 Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable...............................................................................14-24 Table 14-16 Pin assignment of the 120-ohm E1 cable.....................................................................................14-27 Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable.............................................................................14-28 Table 14-18 Pin assignment of the DB28 connector of the DM12..................................................................14-31 Table 14-19 Pin assignment of the V.35 DCE cable........................................................................................14-33 Table 14-20 Pin assignment of the V.35 DTE cable........................................................................................14-35 Table 14-21 Pin assignment of the V.24 DCE cable........................................................................................14-36 Table 14-22 Technical specifications of the V.24 DCE cable..........................................................................14-37 Table 14-23 Pin assignment of the V.24 DTE cable........................................................................................14-38 Table 14-24 Technical specifications of the V.24 DTE cable..........................................................................14-38 Table 14-25 Pin assignment of the X.21 DCE cable........................................................................................14-39 Table 14-26 Technical specifications of the X.21 DCE cable..........................................................................14-40 Table 14-27 Pin assignment of the X.21 DTE cable........................................................................................14-41 Table 14-28 Technical specifications of the X.12 DTE cable..........................................................................14-41 Table 14-29 Pin assignment of the RS449 DCE cable.....................................................................................14-42 Table 14-30 Specifications of the RS449 DCE cable.......................................................................................14-43 Table 14-31 Pin assignment of the RS449 DTE cable.....................................................................................14-43 Table 14-32 Specifications of the RS449 DTE cable.......................................................................................14-44 Table 14-33 Pin assignment of the RS530 DCE cable.....................................................................................14-45 Table 14-34 Specifications of the RS530 DCE cable.......................................................................................14-46 Table 14-35 Pin assignment of the RS530 DTE cable.....................................................................................14-47 Table 14-36 Specifications of the RS530 DTE cable.......................................................................................14-48 Table 14-37 Pin assignment of the 120-ohm clock cable.................................................................................14-49 Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)........................14-51 Table B-1 Labels on the equipment.....................................................................................................................B-2 Table B-2 Optical module code and type mapping table.....................................................................................B-5

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Table B-3 Huawei specifications for engineering labels.....................................................................................B-7 Table C-1 Power consumption and weight of each board for the OptiX OSN 1500..........................................C-1 Table D-1 Board versions that are compatible with the OptiX OSN products....................................................D-1 Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment...........................................................E-1 Table E-2 Loopbacks of the PDH boards for the OptiX OSN equipment...........................................................E-2 Table E-3 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-3 Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-4 Table F-1 Mapping relation between the service type and setting of the C2.......................................................F-2 Table F-2 Mapping relation between the service type and setting of the C2.......................................................F-3 Table F-3 Mapping relation between the service type and setting of the V5.......................................................F-3 Table F-4 Mapping relation between the service type and setting of the V5.......................................................F-6

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About This Document

About This Document Overview This document describes the equipment structure, subrack structure and board classification. This document also describes each board of different classes in details. This document helps you get the detailed information on the equipment hardware.

Product Versions The following table lists the product versions related to this document. Product Name

Version

OptiX OSN 1500

V100R007

OptiX iManager T2000

V200R005C01

Intended Audience The intended audience of this document are: l

Network planners and designers

l

Installation personnel

l

Commissioning engineers

l

Network monitors

l

Data configuration engineers

l

Maintenance engineers

l

On-site maintenance engineers

Organization This document describes the cabinet, subrack, boards and each unit of the boards in terms of the function and working principle. Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

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2

Chapter

Description

1 Equipment Structure

This chapter describes the structure of the equipment.

2 Cabinet

This chapter describes the dimensions, appearance and technical specifications of the cabinet. This chapter also describes the configuration of the equipment in each cabinet.

3 Subrack

This chapter describes the structure of the subrack.

4 Board List and Classification

This chapter describes the classification of boards and appearance of the boards.

5 SDH Processing Boards

This chapter describes the SDH processing boards in terms of the function, principle, front panel, interface and technical specifications.

6 PDH Processing Boards

This chapter describes the PDH processing boards in terms of the function, principle, front panel, interface and technical specifications.

7 Data Processing Boards

This chapter describes the data processing boards in terms of the function, principle, front panel, interface and technical specifications.

8 Interface Boards and Switching Boards

This chapter describes the interface boards and switching boards in terms of the function, principle, front panel, interface and technical specifications.

9 Cross-Connect and System Control Boards

This chapter describes the cross-connect and system control boards in terms of the function, principle, front panel, interface and technical specifications.

10 Auxiliary Boards

This chapter describes the auxiliary boards in terms of the function, principle, front panel, interface and technical specifications.

11 WDM Processing Boards

This chapter describes the WDM processing boards in terms of the function, principle, front panel, interface and technical specifications.

12 Optical Amplifier Boards and Dispersion Compensation Boards

This chapter describes the optical amplifier boards and dispersion compensation boards in terms of the function, principle, front panel, interface and technical specifications.

13 Power Interface Boards

This chapter describes the power interface boards in terms of the function, principle, front panel, interface and technical specifications.

14 Cables

This chapter describes the external cables and internal cables in terms of the structure, appearance, pin assignment and technical specifications.

A Equipment and Board Alarm Indicators

This appendix describes the indication of the equipment and board alarm indicators.

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Chapter

Description

B Labels

This appendix describes the safety labels, optical module labels and engineering labels.

C Power Consumption and Weight

This appendix describes the power consumption and weight of each board.

D Board Version Configuration

This appendix describes the compatibility among the product versions.

E Board Loopbacks

This appendix describes the loopback capabilities of the boards.

F Board Configuration Reference

This appendix describes the parameters that can be configured by using the T2000.

G Glossary

This appendix lists the terms used in this document.

H Acronyms and Abbreviations

This appendix lists the acronyms and abbreviations used in this document.

Conventions Symbol Conventions The following symbols may be found in this document. They are defined as follows. Symbol

Description Indicates a hazard with a high level of risk which, if not avoided, will result in death or serious injury.

DANGER

WARNING

CAUTION

Indicates a hazard with a medium or low level of risk which, if not avoided, could result in minor or moderate injury. Indicates a potentially hazardous situation that, if not avoided, could cause equipment damage, data loss, and performance degradation, or unexpected results.

TIP

Indicates a tip that may help you solve a problem or save you time.

NOTE

Provides additional information to emphasize or supplement important points of the main text.

General Conventions

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Convention

Description

Times New Roman

Normal paragraphs are in Times New Roman. Huawei Technologies Proprietary

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

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Convention

Description

Boldface

Names of files, directories, folders, and users are in boldface. For example, log in as user root.

Italic

Book titles are in italics.

Courier New

Terminal display is in Courier New.

Command Conventions Convention

Description

Boldface

The keywords of a command line are in boldface.

Italic

Command arguments are in italic.

[]

Items (keywords or arguments) in square brackets [ ] are optional.

{ x | y | ... }

Alternative items are grouped in braces and separated by vertical bars. One is selected.

[ x | y | ... ]

Optional alternative items are grouped in square brackets and separated by vertical bars. One or none is selected.

{ x | y | ... } *

Alternative items are grouped in braces and separated by vertical bars. A minimum of one or a maximum of all can be selected.

GUI Conventions Convention

Description

Boldface

Buttons, menus, parameters, tabs, window, and dialog titles are in boldface. For example, click OK.

>

Multi-level menus are in boldface and separated by the “>” signs. For example, choose File > Create > Folder.

Keyboard Operation

4

Format

Description

Key

Press the key. For example, press Enter and press Tab.

Key 1+Key 2

Press the keys concurrently. For example, pressing Ctrl+Alt+A means the three keys should be pressed concurrently.

Key 1, Key 2

Press the keys in turn. For example, pressing Alt, A means the two keys should be pressed in turn.

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Mouse Operation Action

Description

Click

Select and release the primary mouse button without moving the pointer.

Double-click

Press the primary mouse button twice continuously and quickly without moving the pointer.

Drag

Press and hold the primary mouse button and move the pointer to a certain position.

Update History Updates between document versions are cumulative. Therefore, the latest document version contains all updates made to previous versions.

Updates in Issue 02 (2007-09-10) Based on Product Version V100R007 The updated contents are as follows. This release of the document fixes several bugs, adds product labels, and checks the parameters of the dimensions and weight. It also details function block diagram and relative description for each board.

Updates in Issue 01 (2007-06-15) Based on Product Version V100R007 This document of the V100R007 version is of the first release. Compared with the V100R006, this version has the following new or optimized content: l

The N3SL16, N3SL16A, N2PQ3, N2PD3, N2PL3, N2PL3A, TN11OBU1, TN11MR2, TN11MR4, TN11CMR2, TN11CMR4 are added.

l

Appendix E "Board Loopbacks" and Appendix F "Board Configuration Reference" are added.

l

The structure of the board description is adjusted and optimized. First the board version is described, and then the board function and feature, working principle and signal flow, front panel, valid slots, board feature code, board configuration reference, technical specifications and so on are described.

Updates in Issue 03 (2007-03-30) Based on Product Version V100R006 The updated contents are as follows. This release of the document fixes several bugs, adds product labels. It also checks the parameters of the slots and optical interfaces. In addition, it adds the description on the N1SL64 board.

Updates in Issue 02 (2007-01-10) Based on Product Version V100R006 The updated contents are as follows. This release of the document fixes several bugs in the document of previous version. The T2000 is upgraded from V200R003C02 to V200R004C01. Issue 02 (2007-09-10)

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Updates in Issue 01 (2006-09-20) Based on Product Version V100R006 This document of the V100R006 version is of the first release.

Updates in Issue 03 (2006-11-20) Based on Product Version V100R005 The updated contents are as follows. With updated naming of versions, this release of the document fixes several bugs in the manual of the previous version.

Updates in Issue 02 (2006-06-20) Based on Product Version V100R005 The former manual version is T2-042521-20060620-C-1.51. The updated contents are as follows. This release of the document fixes several bugs in the manual of the previous version.

Updates in Issue 01 (2006-03-20) Based on Product Version V100R005 The former manual version is T2-042521-20060320-C-1.50. This document of the V100R005 version is of the first release.

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1 Equipment Structure

Equipment Structure

The OptiX OSN 1500A and the OptiX OSN 1500B are both case-shaped equipment. The OptiX OSN 1500A/B subrack can be installed in a 300-mm or 600-mm ETSI cabinet, or a 19-inch cabinet. The OptiX OSN 1500A/B can also be installed against the wall. The OptiX OSN 1500A can be installed on the desk. Figure 1-1 shows the appearance of the OptiX OSN 1500A. Figure 1-1 Appearance of the OptiX OSN 1500A

Figure 1-2 shows the appearance of the OptiX OSN 1500B. Figure 1-2 Appearance of the OptiX OSN 1500B

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

2 Cabinet

2

Cabinet

About This Chapter The OptiX OSN subracks are installed in the cabinets. 2.1 Cabinet Type The OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inch cabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrack can be installed against the wall. 2.2 Cabinet Configuration On the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit (PDU). 2.3 Technical Specifications The specifications of the cabinet cover the dimensions, weight and number of allowed subracks.

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2.1 Cabinet Type The OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inch cabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrack can be installed against the wall. The OptiX OSN 1500 can be installed in the following cabinets: l

300-mm deep ETSI cabinet

l

600-mm deep ETSI cabinet

l

19-inch cabinet

l

Cabinet used for the access network equipment

2.2 Cabinet Configuration On the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit (PDU). Figure 2-1 shows where the cabinet indicators and the DC PDU are on the cabinet. Figure 2-1 ETSI cabinet 1 2 PowerCritical MajorMinor

Power distribution unit

H W

1. Cabinet indicator

D

2. DC PDU

2.2.1 Cabinet Indicator The indicators on the ETSI cabinet are power supply indicators and alarm severity indicators. 2.2.2 DC PDU The DC PDU is on the top of the cabinet and used to supply power for the equipment. 2.2.3 Other Configuration 2-2

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The external case-shaped devices can be installed in the cabinet as required.

2.2.1 Cabinet Indicator The indicators on the ETSI cabinet are power supply indicators and alarm severity indicators. Table 2-1 lists the information about the indicators on the ETSI cabinet. Table 2-1 Indicators on the ETSI cabinet Indicator

State

Indication

Normal power supply indicator: Power (green)

Lit

The power is supplied to the equipment.

Unlit

No power is supplied to the equipment.

Lit

Critical alarms are generated in the equipment.

Unlit

No critical alarms are generated in the equipment.

Lit

Major alarms are generated in the equipment.

Unlit

No major alarms are generated in the equipment.

Lit

Minor alarms are generated in the equipment.

Unlit

No minor alarms are generated in the equipment.

Critical alarm indicator: Critical (red)

Major alarm indicator: Major (orange)

Minor alarm indicator: Minor (yellow)

CAUTION The cabinet indicators are driven by the subrack. The cabinet indicators can be lit only after the cables are correctly connected and the subrack is powered on.

2.2.2 DC PDU The DC PDU is on the top of the cabinet and used to supply power for the equipment. Figure 2-2 shows the appearance of the DC PDU. Issue 02 (2007-09-10)

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Figure 2-2 Appearance of the DC PDU

1

1

7

3 2 OUTPUT

4

8

2 3 4 5

A

6

B

ON

3 2 OUTPUT

1

4

ON RTN1(+) RTN2(+) NEG1(-) NEG2(-)

OFF 32A

32A

20A

INPUT

OFF 32A

20A

1. Power terminal (A)

2. Power cable RTN1 (+)

3. Power cable RTN2 (+)

4. Power cable NEG1 (–)

5. Power cable NEG2 (–)

6. Power terminal (B)

7. PGND

8. Power switch

32A

20A

20A

For the OptiX OSN 1500A, the power terminals at side A and side B supply power to the PIU boards at side A and side B of the subrack respectively. Table 2-2 shows the connections of the power terminals at side A and side B. For the OptiX OSN 1500B, the power terminals at sides A and B supply power to the PIU boards at the upper and lower subrack respectively. Table 2-2 Connection of power terminals at side A and side B Power Terminal at Side A

Corresponding Subrack and PIU Board

Power Terminal at Side B

Corresponding Subrack and PIU Board

1

The PIU board at side A of the first subrack

1

The PIU board at side B of the first subrack

2

The PIU board at side A of the second subrack

2

The PIU board at side B of the second subrack

3

The PIU board at side A of the third subrack

3

The PIU board at side B of the third subrack

4

The PIU board at side A of the fourth subrack

4

The PIU board at side B of the fourth subrack

2.2.3 Other Configuration The external case-shaped devices can be installed in the cabinet as required. l

UPM

The UPM numbered GIE4805S can directly supply power to the OptiX OSN 1500. The UPM directly converts the 220 V mains supply to the –48 V DC power supply required by the 2-4

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communication equipment. If operators cannot provide the –48 V DC power supply for the equipment or require that the battery be used, the UPM can be applied. l

COA

l

Fiber management spool, which is used to spool the redundant fibers inside the cabinet.

2.3 Technical Specifications The specifications of the cabinet cover the dimensions, weight and number of allowed subracks. Table 2-3 lists the technical specifications of the ETSI cabinet. Table 2-3 Technical specifications of the ETSI cabinet

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Dimensions (mm)

Weight (kg)

Number of Allowed OptiX OSN 1500A/1500B Subracks

600 (W) x 300 (D) x 2000 (H)

55

600 (W) x 600 (D) x 2000 (H)

79

600 (W) x 300 (D) x 2200 (H)

60

The number of allowed OptiX OSN 1500A/1500B subracks varies with the cabinet capacity and the number of the power supplies.

600 (W) x 600 (D) x 2200 (H)

84

600 (W) x 300 (D) x 2600 (H)

70

600 (W) x 600 (D) x 2600 (H)

94

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3

Subrack

About This Chapter This chapter describes the cabinet in terms of the structure, capacity, slot allocation and technical specifications. 3.1 Structure The OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot area for boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrack is of a two-layer structure. The subrack consists of the slot area for processing boards, slot area for interface boards, slot area for the auxiliary interface board, power supply area and fan area. 3.2 Capacity Both the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into halfwidth slots. These slots have different service access capacities before and after the slot division. 3.3 Slot Allocation The OptiX OSN 1500A subrack has only one tier, where 12 slots are present before the division of slots. The OptiX OSN 1500B subrack has two tiers. The upper tier of the subrack, where four slots are present, is the slot area for interface boards. The lower tier of the subrack, where ten slots are present before the division of slots (including slots 4 and 5), is the slot area for processing boards. 3.4 Technical Specifications The specifications of the subrack cover dimensions, weight and maximum power consumption.

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3.1 Structure The OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot area for boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrack is of a two-layer structure. The subrack consists of the slot area for processing boards, slot area for interface boards, slot area for the auxiliary interface board, power supply area and fan area. Figure 3-1 shows the structure of the OptiX OSN 1500A subrack. Figure 3-1 Structure of the OptiX OSN 1500A subrack

1

2

H

3 4

W 6

D

5

1. Fan area

2. Slot area for boards

3. Power supply area

4. Slot area for interface boards

5. Fiber routing area

6. Mounting ear

The functions of these areas are as follows: l

Slot area for boards: This area is used to house the boards for the OptiX OSN 1500A.

l

Fan area: This area is used to house one fan module, which dissipates heat generated by the equipment.

l

Power supply area: This area is used to house two PIU boards, which are used to supply power for the equipment.

l

Fiber routing area: This area is used to route fibers and cables in the subrack.

Figure 3-2 shows the structure of the OptiX OSN 1500B subrack.

3-2

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Figure 3-2 Structure of the OptiX OSN 1500B subrack

1

2

3

4 4

H W

5

7

D

6

1. Slot area for interface boards

2. Power supply area

3. Fan area

4. Slot area for processing boards

5. Slot area for the auxiliary interface board

6. Fiber routing area

7. Mounting ear

The functions of these areas are as follows: l

Slot area for interface boards: This area is used to house the tributary interface boards and Ethernet interface boards for the OptiX OSN 1500B.

l

Slot area for processing boards: This area is used to house the line, tributary and Ethernet processing boards for the OptiX OSN 1500B.

l

Fan area: This area is used to house one fan module, which dissipates heat generated by the equipment.

l

Slot area for the auxiliary interface board: This area is used to house the auxiliary interface board, which provides alarm interfaces, orderwire phone interface, management and maintenance interface, and clock interface.

l

Power supply area: This area is used to house two PIU boards, which are used to supply power for the equipment.

l

Fiber routing area: This area is used to route fibers and cables in the subrack.

3.2 Capacity Both the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into halfwidth slots. These slots have different service access capacities before and after the slot division. In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots. In the OptiX OSN 1500B subrack, slots 11–13 can be divided into half-width slots. Figure 3-3 shows Issue 02 (2007-09-10)

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the slot access capacity of the OptiX OSN 1500A. Figure 3-4 shows the slot access capacity of the OptiX OSN 1500B. In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots. l

When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12.

l

When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13.

l

When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s.

l

When slots 12 and 13 are divided, the access capacity of each half-width slot is 1.25 Gbit/ s.

In the OptiX OSN 1500B subrack, slots 11–13 can be divided into half-width slots. l

When slot 11 is divided, the two half-width slots are numbered slot 1 and slot 11.

l

When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12.

l

When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13.

l

When slots 11–13 are not divided, the access capacity of each slot is 2.5 Gbit/s.

l

When slots 11–13 are divided, the access capacity of each half-width slot is 1.25 Gbit/s.

Figure 3-3 Slot access capacity of the OptiX OSN 1500A Slot XCS1A PIU

Slot20 FAN

Slot 11 PIU

XCS B Slot 6 1.25Gbit/s

Slot 2/12

2.5Gbit/s

Slot 7 1.25Gbit/s

Slot 3/13

2.5Gbit/s

Slot 8 1.25Gbit/s

Slot 4

2.5Gbit/s

Slot 9 1.25Gbit/s

Slot 5

2.5Gbit/s

Slot 10

AUX

Figure 3-4 Slot access capacity of the OptiX OSN 1500B Slot 14

Slot 18

PIU

Slot 19

PIU

Slot 15 Slot 16 Slot 17

Slot 20 FAN

Slot 1/11

2.5Gbit/s

Slot 6

622Mbit/s

Slot 2/12

2.5Gbit/s

Slot 7

622Mbit/s

Slot 3/13

2.5Gbit/s

Slot 8

622Mbit/s

Slot 4

2.5Gbit/s

Slot 9

622Mbit/s

Slot 5

2.5Gbit/s

Slot 10

AUX

3.3 Slot Allocation The OptiX OSN 1500A subrack has only one tier, where 12 slots are present before the division of slots. The OptiX OSN 1500B subrack has two tiers. The upper tier of the subrack, where four 3-4

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slots are present, is the slot area for interface boards. The lower tier of the subrack, where ten slots are present before the division of slots (including slots 4 and 5), is the slot area for processing boards. Figure 3-5 shows the slot layout of the OptiX OSN 1500A subrack. Figure 3-5 Slot layout of the OptiX OSN 1500A subrack Slot 1 Slot 20 FAN

Slot 6

Slot 11

Slot 12

Slot 7

Slot 13

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Slots 12 and 13 in the OptiX OSN 1500A subrack can be divided into two half-width slots respectively. See Figure 3-6. Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots

Slot 20 FAN

Slot 1

Slot 11

Slot 6

Slot 2

Slot 12

Slot 7

Slot 3

Slot 13

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Figure 3-7 shows the slot access capacity of the OptiX OSN 1500A. Figure 3-7 Slot access capacity of the OptiX OSN 1500A Slot 11

XCS B Slot 6 1.25Gbit/s

Slot 2/12

2.5Gbit/s

Slot 7 1.25Gbit/s

Slot 3/13

2.5Gbit/s

Slot 8 1.25Gbit/s

Slot 4

2.5Gbit/s

Slot 9 1.25Gbit/s

Slot 5

2.5Gbit/s

Slot 10

Slot XCS A 1

Slot20

When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s. When slots 12 and 13 are divided, the access capacity of each slot is 1.25 Gbit/s. The slots in the OptiX OSN 1500A subrack are allocated as follows: l

Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 4–5

l

Slots for processing boards before the division of slots: slots 6–9 and 12–13

l

Slots for processing boards after the division of slots: slots 6–9, 12–13, and 2–3

l

Slot for the orderwire board: slot 9 (also for the processing board)

l

Slot for the auxiliary interface board: slot 10

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Slots for PIU boards: slots 1 and 11

l

Slots for the fan board: slot 20

Figure 3-8 shows the slot layout of the OptiX OSN 1500B subrack. Figure 3-9 shows the slot access capacity of the OptiX OSN 1500B. Figure 3-8 Slot layout of the OptiX OSN 1500B subrack Slot 14

Interface board

Slot 15

Interface board

Slot 16

Interface board

Slot 17

Slot 20 FAN

Interface board

Slot 11

Processing board

Slot 12

Processing board

Slot 18

PIU

Slot 19

PIU

Slot 6 Processing

board

Slot 7 Processing

board

Slot 8 Processing

Slot 13

Processing board

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

board

Figure 3-9 Slot access capacity of the OptiX OSN 1500B Slot 14 Slot 15 Slot 16 Slot 17

Slot 20 FAN

Slot 18

PIU

Slot 19

PIU

Slot 11

2.5Gbit/s

Slot 6

622Mbit/s

Slot 12

2.5Gbit/s

Slot 7

622Mbit/s

Slot 13

2.5Gbit/s

Slot 8

622Mbit/s

Slot 4

2.5Gbit/s

Slot 9

622Mbit/s

Slot 5

2.5Gbit/s

Slot 10

AUX

NOTE

Slots 11–13 in the OptiX OSN 1500B subrack can be divided. As shown in Figure 3-10, the divided slots are in the dashed area. The slots in the left portion of the original slots are slots 1–3, and the slots in the right portion of the original slots are slots 11–13. After the division of slots, the maximum access capacity of each slot is 1.25 Gbit/s. See Figure 3-11.

Figure 3-10 Slot layout of the OptiX OSN 1500B subrack (after the division of slots) Slot 14

Interface board

Slot 15

Interface board

Slot 16

Interface board

Slot 17

Interface board Slot 11 Processing Slot 6 Processing board board Slot 12 Processing Slot 7 Processing board board Slot 13 Processing Slot 8 Processing board board

Slot 1 Slot 20

Slot 2 Slot 3

FAN

3-6

Slot 18

PIU

Slot 19

PIU

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

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Figure 3-11 Access capacity of the OptiX OSN 1500B subrack (after the division of slots) Slot 14 Slot 15 Slot 16 Slot 17 Slot 1

Slot 18

PIU

Slot 19

PIU

1.25 Gbit/s

Slot 11 1.25 Gbit/s

Slot 6

622 Mbit/s

Slot 20 Slot 2

1.25 Gbit/s

Slot 12 1.25 Gbit/s

Slot 7

622 Mbit/s

Slot 3

1.25 Gbit/s

Slot 13 1.25 Gbit/s

Slot 8

622 Mbit/s

2.5 Gbit/s

Slot 9

622 Mbit/s

2.5 Gbit/s

Slot 10

AUX

FAN

Slot 4 Slot 5

The slots in the OptiX OSN 1500B subrack are allocated as follows: l

Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 4–5

l

Slots for processing boards before the division of slots: slots 6–9 and 11–13

l

Slots for processing boards after the division of slots: slots 1–9 and 11–13

l

Slots for the interface boards: slots 14–17

l

Slot for the orderwire board: slot 9 (also for the processing board)

l

Slot for the auxiliary interface board: slot 10

l

Slots for PIU boards: slots 18 and 19

l

Slot for the fan board: slot 20

Mapping Relation Between Slots for Interface Boards and Slots for Processing Boards Table 3-1 lists the mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN 1500A. Table 3-1 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN 1500A. Slots for Processing Boards

Slots for Interface Boards

Slot 12

Slots 6 and 7

Table 3-2 lists the mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN 1500B. Table 3-2 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN 1500B.

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Slots for Processing Boards

Slots for Interface Boards

Slots for Processing Boards

Slots for Interface Boards

Slot 2

Slot 14

Slot 3

Slot 16

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Slots for Processing Boards

Slots for Interface Boards

Slots for Processing Boards

Slots for Interface Boards

Slot 7

Slot 15

Slot 8

Slot 17

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

The corresponding interface boards for the PD3, PL3, SEP, and SPQ4 can be housed only in slots of even numbers. The boards housed in slots 12 and 7 share the same interface board housed in slot 15, and the boards housed in slots 13 and 8 share the same interface board housed in slot 17. Therefore, when you configure the boards: l

If slot 12 houses the N1EMS4 (used with an interface board) or R1PD1, slot 7 cannot house any board used with an interface board.

l

If slot 13 houses the N1EMS4 (used with an interface board) or R1PD1, slot 8 cannot house any board used with an interface board.

Boards and Their Valid Slots Table 3-3 lists the boards and their valid slots for the OptiX OSN 1500A. Table 3-3 Boards and their valid slots for the OptiX OSN 1500A

3-8

Board

Full Name

Valid Slots

Q2CXL16

STM-16 integrated board of the SCC, cross-connect, timing and line units

Slots 4 and 5

Q2CXL4

STM-4 integrated board of the SCC, cross-connect, timing and line units

Slots 4 and 5

Q2CXL1

STM-1 integrated board of the SCC, cross-connect, timing and line units

Slots 4 and 5

N1SL16 (A)

1 x STM-16 optical interface board

Slots 12 and 13

N2SL16 (A)

1 x STM-16 optical interface board

Slots 12 and 13

N3SL16 (A)

1 x STM-16 optical interface board

Slots 12 and 13

N1SF16

1 x STM-16 optical interface board (with FEC)

Slots 12 and 13

N1SLQ4

4 x STM-4 optical interface board

Slots 12 and 13

N2SLQ4

4 x STM-4 optical interface board

Slots 12 and 13

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Board

Full Name

Valid Slots

N1SLD4

2 x STM-4 optical interface board

Slots 12 and 13

N2SLD4

2 x STM-4 optical interface board

Slots 12 and 13

N1SL4

1 x STM-4 optical interface board

Slots 12 and 13

N2SL4

1 x STM-4 optical interface board

Slots 12 and 13

N1SLT1

12 x STM-1 optical interface board

Slots 12 and 13

N2SLO1

8 x STM-1 optical interface board

Slots 12 and 13

N1SLQ1

4 x STM-1 optical interface board

Slots 12 and 13

N2SLQ1

4 x STM-1 optical interface board

Slots 12 and 13

N1SL1

1 x STM-1 optical interface board

Slots 12 and 13

N2SL1

1 x STM-1 optical interface board

Slots 12 and 13

N1SEP1

2 x STM-1 line processing board

Slots 12 and 13

R1SLD4

2 x STM-4 optical interface board (half-width)

Slots 2–3, 6–9, and 12–13

R1SL4

1 x STM-4 optical interface board (half-width)

Slots 2–3, 6–9, and 12–13

R1SLQ1

4 x STM-1 optical interface board (half-width)

Slots 2–3, 6–9, and 12–13

R1SL1

1 x STM-1 optical interface board (half-width)

Slots 2–3, 6–9, and 12–13

N1PL3A

3 x E3/T3 processing board (not used with the interface board)

Slots 12 and 13

N2PL3A

3 x E3/T3 processing board (not used with the interface board)

Slots 12 and 13

R1PD1A

32 x E1 processing board (halfwidth)

Slots 2 and 12

R1PD1B

32 x E1 processing board (halfwidth)

Slots 2 and 12

R2PD1

32 x E1/T1 hybrid processing board (half-width)

Slots 2 and 12

R1PL1A

16 x E1 processing board (halfwidth)

Slots 6–9

R1PL1B

16 x E1 processing board (halfwidth)

Slots 6–9

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3-10

Board

Full Name

Valid Slots

R1L75S

16 x EI 75-ohm interface board (half-width)

Slots 6 and 7

R1L12S

16 x E1 120-ohm interface board (half-width)

Slots 6 and 7

N2EGR2

2 x GE Ethernet ring processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EGS2

2 x GE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N2EGS2

2 x GE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EFS4

4 x 10M/100M Ethernet processing board

Slots 12 and 13

N2EFS4

4 x 10M/100M Ethernet processing board

Slots 12 and 13 (1.25 Gbit/s)

N1EMS4

4 x GE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EGS4

4 x GE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EGT2

2 x GE Ethernet transparent transmission board

Slots 12 and 13 (2.5 Gbit/s)

R1EFT4

4 x 10M/100M Ethernet transparent transmission board (half-width)

Slots 2–3, 12–13 and 6–9 (622 Mbit/s)

N1EFT8 (not used with the interface board)

8 x 10M/100M Ethernet transparent transmission board

Slots 12–13 (622 Mbit/s)

N1EMR0 (not used with the interface board)

1 x GE and 4 x FE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N2EMR0 (not used with the interface board)

1 x GE and 4 x FE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EFT8A

8 x FE transparent transmission board (interfaces are available on the front panel)

Slots 12 and 13 (622 Mbit/s)

N1ADL4

1 x STM-4 ATM processing board

Slots 12 and 13 (1.25 Gbit/s)

N1ADQ1

4 x STM-1 ATM processing board

Slots 12 and 13 (1.25 Gbit/s)

N1IDL4

1 x STM-4 IMA processing board

Slots 12 and 13 (1.25 Gbit/s)

N1IDQ1

4 x STM-1 IMA processing board

Slots 12 and 13 (1.25 Gbit/s)

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Board

Full Name

Valid Slots

N1MST4

4-channel multiservice (SAN or video service) transparent transmission board

Slots 12 and 13 (2.5 Gbit/s)

N1LWX

Arbitrary rate access board

Slots 12 and 13

N1MR2A

Arbitrary two-wavelength add/ drop board (processing board)

Slots 12 and 13

N1MR2B

Arbitrary two-wavelength add/ drop board (half-width)

Slots 12 and 13

TN11OBU1

Optical booster amplifier board

Slots 12 and 13

TN11MR2

2-channel optical add/drop multiplexing board

Slots 12 and 13

TN11MR4

4-channel optical add/drop multiplexing board

Slots 12 and 13

TN11CMR2

2-channel CWDM optical add/ drop multiplexing board

Slots 12 and 13

TN11CMR4

4-channel CWDM optical add/ drop multiplexing board

Slots 12 and 13

N1DXA

N x 64 kbit/s convergence and processing board

Slots 12 and 13

R1AMU

Orderwire processing or alarm concatenation board

Slot 9

N1FIB

Filter isolating board

Slots 12 and 13

ROP

Single wavelength long-haul board (remote pumping)

Slot 103 (external)

R1AUX

System auxiliary processing unit

Slot 10

R2AUX

System auxiliary processing unit

Slot 10

R1PIUA

PIU board

Slots 1 and 11

CAU

CAU power monitoring board

Slot 50

COA

COA board

Slots 101 and 102

N1BA2

2-channel optical booster amplifier board

Slots 12 and 13

N1BPA

1-channel amplifier and 1channel preamplifier board

Slots 12 and 13

R1FAN

Fan board

Slot 20

R1EOW

Orderwire communication board

Slot 9

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Table 3-4 lists the boards and their valid slots for the OptiX OSN 1500B. Table 3-4 Boards and their valid slots for the OptiX OSN 1500B

3-12

Board

Full Name

Valid Slots

Q2CXL16

STM-16 integrated board of the SCC, cross-connect, timing and line units

Slots 4 and 5

Q2CXL4

STM-4 integrated board of the SCC, cross-connect, timing and line units

Slots 4 and 5

Q2CXL1

STM-1 integrated board of the SCC, cross-connect, timing and line units

Slots 4 and 5

N1SL16 (A)

1 x STM-16 optical interface board

Slots 11–13

N2SL16 (A)

1 x STM-16 optical interface board

Slots 11–13

N3SL16 (A)

1 x STM-16 optical interface board

Slots 11–13

N1SF16

1 x STM-16 outband optical interface board (with FEC)

Slots 11–13

N1SLQ4

4 x STM-4 optical interface board

Slots 11–13

N2SLQ4

4 x STM-4 optical interface board

Slots 11–13

N1SLD4

2 x STM-4 optical interface board

Slots 11–13

N2SLD4

2 x STM-4 optical interface board

Slots 11–13

N1SL4

1 x STM-4 optical interface board

Slots 11–13

N2SL4

1 x STM-4 optical interface board

Slots 11–13

N1SLQ1

4 x STM-1 optical interface board

Slots 11–13

N2SLQ1

4 x STM-1 optical interface board

Slots 11–13

N1SL1

1 x STM-1 optical interface board

Slots 11–13

N2SL1

1 x STM-1 optical interface board

Slots 11–13

R1SLD4

2 x STM-4 optical interface board (half-width)

Slots 1–3 and 11–13 (for the board housed in any of slots 1–3 and 11–13, two optical interfaces can be configured), slots 6–9 (for the board housed in any of slots 6–9, one optical interface can be configured)

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Board

Full Name

Valid Slots

R1SL4

1 x STM-4 optical interface board (half-width)

Slots 1–3, 6–9 and 11–13

R1SLQ1

4 x STM-1 optical interface board (half-width)

Slots 1–3, 6–9 and 11–13

R1SL1

1 x STM-1 optical interface board (half-width)

Slots 1–3, 6–9 and 11–13

N1SEP

8 x STM-1 (e) processing board (used with the interface board)

Slots 12–13

N1SEP1

2 x STM-1 (e) processing board (not used with the interface board)

Slots 11–13

N1SLT1

12 x STM-1 optical interface board

Slots 11–13

N2SPQ4

4 x STM-1/E4 (e) processing board (used with the interface board)

Slots 12 and 13

N1EU08

8 x STM-1 (e) electrical interface board

Slots 14 and 16

N1OU08

8 x STM-1 optical interface board

Slots 14 and 16

N2OU08

8 x STM-1 optical interface board

Slots 14 and 16

N1EU04

4 x STM-1 (e) electrical interface board

Slots 14 and 16

N2SLO1

8 x AU-3 high density access board

Slots 11–13

R1PL1A

16 x E1 interface and processing board (interfaces available on the front panel)

Slots 6–9

R1PL1B

16 x E1 interface and processing board (interfaces available on the front panel)

Slots 6–9

N2PQ3

12 x E3/T3 processing board

Slots 12 and 13

N2PD3

6 x E3/T3 processing board

Slots 12 and 13

N2PL3

3 x E3/T3 processing board

Slots 12 and 13

N1PL3A

3 x E3/T3 processing board (not used with the interface board)

Slots 11–13

N2PL3A

3 x E3/T3 processing board (not used with the interface board)

Slots 11–13

N1PD3

6 x E3/T3 processing board

Slots 12 and 13

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3-14

Board

Full Name

Valid Slots

N1PL3

3 x E3/T3 processing board

Slots 12 and 13

N1C34S

3 x 34M/45M electrical interface switching board

Slots 14 and 16

N1D34S

6 x 34M/45M electrical interface switching board

Slots 14–17

N1SPQ4

4 x E4/STM-1 processing board

Slots 12–13

N1MU04

4 x E4/STM-1 processing board

Slots 14 and 16

N1PQ1A

63 x E1 75-ohm processing board

Slots 11–13

N1PQ1B

63 x E1 120-ohm processing board

Slots 11–13

N1PQM

63 x E1 75-ohm or 120-ohm processing board

Slots 11–13

N2PQ1

63 x E1/T1 hybrid processing board

Slots 11–13

R2PD1

32 x E1/T1 hybrid processing board

Slots 1–3, 6–8 and 11–13

N1D75S

32 x E1/T1 75-ohm electrical interface switching board

Slots 14–17

N1D12S

32 x E1/T1 120-ohm electrical interface switching board

Slots 14–17

N1D12B

32 x E1/T1 120-ohm electrical interface board

Slots 14–17

N1DX1

N x 64 kbit/s access and convergence board

Slots 11–13

N1DXA

N x 64 kbit/s convergence and processing board

Slots 11–13

N1DM12

N x 64 kbit/s interface board

Slots 14–17

N1EMS4 (used with the interface board)

4 x GE and 16 x FE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EMS4 (not used with the interface board)

4 x GE Ethernet processing board

Slots 11–13 (2.5 Gbit/s)

N1EGS4

4 x GE Ethernet processing board

Slots 11–13 (2.5 Gbit/s)

N2EFS4

4 x 10M/100M Ethernet processing board

Slots 11–13 (1.25 Gbit/s)

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Board

Full Name

Valid Slots

N4EFS0

10M/100M Ethernet processing board (used with the interface board)

Slots 12 and 13 (1.25 Gbit/s)

N1EFT8A

8 x FE transparent transmission board (interfaces available on the front panel)

Slots 11–13 (622 Mbit/s)

N1EFT8 (not used with the interface board)

8 x 10M/100M Ethernet transparent transmission board

Slots 11–13 (622 Mbit/s)

N1EFT8 (used with the interface board)

8 x 10M/100M Ethernet transparent transmission board

Slots 12 and 13 (1.25 Gbit/s)

R1AMU

Orderwire processing or alarm concatenation board

Slot 9

N1FIB

Filter isolating board

Slots 12 and 13

ROP

Single wavelength long-haul board (remote pumping)

Slot 103 (external)

R2AUX

System auxiliary interface board

Slot 10

N2EGR2

2 x GE Ethernet ring processing board

Slots 11–13 (2.5 Gbit/s)

N2EMR0 (used with the interface board)

1 x GE and 12 x FE Ethernet processing board

Slots 12–13 (2.5 Gbit/s)

N2EMR0 (not used with the interface board)

1 x GE and 4 x FE Ethernet processing board

Slots 11–13 (2.5 Gbit/s)

R1EFT4

4 x FE processing board (interfaces available on the front panel)

Slots 1–3, 11–13 and 6–9 (622 Mbit/s)

N1TSB8

8-channel electrical interface switching board

Slots 14 and 15

N1TSB4

4-channel electrical interface switching board

Slot 14

N1EFS0 (used with the interface board)

10M/100M Ethernet processing board

Slots 12–13 (622 Mbit/s)

N2EFS0 (used with the interface board)

10M/100M Ethernet processing board

Slots 12–13 (1.25 Gbit/s)

N1ETF8

8 x FE Ethernet electrical interface board

Slots 14–17

N1EFS4

4 x 10M/100M Ethernet processing board

Slots 11–13

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Board

Full Name

Valid Slots

N2EGS2

2 x GE Ethernet processing board

Slots 11–13 (2.5 Gbit/s)

N1EGT2

2 x GE Ethernet transparent transmission board

Slots 11–13 (2.5 Gbit/s)

N1MST4

4-channel multiservice transparent transmission board

Slots 11–13 (2.5 Gbit/s)

N1EGS2

2 x GE Ethernet processing board

Slots 11–13 (2.5 Gbit/s)

N1EMR0 (used with the interface board)

1 x GE and 12 x FE Ethernet processing board

Slots 12–13 (2.5 Gbit/s)

N1EMR0 (not used with the interface board)

1 x GE and 4 x FE Ethernet processing board

Slots 11–13 (2.5 Gbit/s)

N1EFF8

8-channel Ethernet optical interface board

Slots 14–17

N1ETS8

8 x 10/100M Ethernet twisted pair interface switching board

Slots 14 and 16

N1ADQ1

4 x STM-1 or 1 x STM-4 ATM processing board

Slots 11–13 (1.25 Gbit/s)

N1ADL4

1 x STM-4 ATM processing board

Slots 11–13 (1.25 Gbit/s)

N1IDQ1

4 x STM-1 IMA processing board

Slots 11–13 (1.25 Gbit/s)

N1IDL4

1 x STM-4 IMA processing board

Slots 11–13 (1.25 Gbit/s)

CAU

CAU power monitoring board

Slot 50

COA

COA board

Slots 101–102

N1BA2

2-channel optical booster amplifier board

Slots 11–13

N1BPA

Optical booster preamplifier board

Slots 11–13

R1PD1

32 x E1 processing board (halfwidth)

Slots 1–3, 6–8 and 11–13

R1FAN

Fan board

Slot 20

R1AUX

System auxiliary processing unit

Slot 10

R1EOW

Orderwire communication board

Slot 9

R1PIU

PIU board

Slots 18–19

N1MR2A

Arbitrary two-wavelength add/ drop board

Slots 11–13

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Board

Full Name

Valid Slots

N1MR2B

Arbitrary two-wavelength add/ drop board (half-width)

Slots 1–3, 6–9 and 11–13

N1MR2C

Arbitrary two-wavelength add/ drop board

Slots 14–17

N1LWX

Arbitrary rate access board

Slots 11–13

TN11OBU1

Optical booster amplifier board

Slots 11–13

TN11MR2

2-channel optical add/drop multiplexing board

Slots 11–13

TN11MR4

4-channel optical add/drop multiplexing board

Slots 11–13

TN11CMR2

2-channel CWDM optical add/ drop multiplexing board

Slots 11–13

TN11CMR4

4-channel CWDM optical add/ drop multiplexing board

Slots 11–13

3.4 Technical Specifications The specifications of the subrack cover dimensions, weight and maximum power consumption. Table 3-5 lists the technical specifications of the OptiX OSN 1500A subrack. Table 3-5 Technical specifications of the OptiX OSN 1500A subrack Dimensions (mm)

Weight (kg)

444 (W) x 262 (D) x 131 (H)

8 (the backplane, fans and two PIU boards included)

Table 3-6 lists power consumption of the OptiX OSN 1500A subrack. Table 3-6 Maximum power consumption of the OptiX OSN 1500A subrack Subrack Type

Maximum Power Consumption

Fuse Capacity

OptiX OSN 1500A general subrack

200 W

10 A

OptiX OSN 1500A enhanced subrack

313 W

15 A

Table 3-7 lists the technical specifications of the OptiX OSN 1500B subrack.

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Table 3-7 Technical specifications of the OptiX OSN 1500B subrack Dimensions (mm)

Weight (kg)

444 (W) x 263 (D) x 221 (H)

9 (the backplane, fans and two PIU boards included)

Table 3-8 lists power consumption of the OptiX OSN 1500B subrack. Table 3-8 Maximum power consumption of the OptiX OSN 1500B subrack

3-18

Subrack Type

Maximum Power Consumption

Fuse Capacity

OptiX OSN 1500B general subrack

280 W

10 A

OptiX OSN 1500B enhanced subrack

400 W

15 A

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4

4 Board List and Classification

Board List and Classification

About This Chapter This chapter describes the appearance, barcode and classification of boards used for the OptiX OSN systems. 4.1 Appearance and Dimensions of Boards Different boards have different appearance and dimensions. 4.2 Description of the Barcode on the Board The barcode on the front panel of the board indicates the board version, name and board features. 4.3 Board Classification By function, the boards can be classified into SDH processing boards, PDH processing boards, data processing boards, WDM processing boards and auxiliary boards.

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4.1 Appearance and Dimensions of Boards Different boards have different appearance and dimensions. Table 4-1 lists the appearance figures and dimensions of boards for the OptiX OSN 1500. Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500 Item

Appearance and Dimensions

Board appearance

Board classificatio n

Integrated board of the SCC, cross-connect and line units (CXL)

Board housed in a divided slot (PD1/PIUA/AUX/ EOW)

Service interface board (D75S, for example)

Height (mm)

262.05

111.8

262.05

Depth (mm)

220

220

110

Width (mm)

25.4

25.4

22

Note: The figure in the right cell illustrates the three dimensions. The height and width are measured for the front panel and the depth is measured for the printed circuit board (PCB).

H D

W

CAUTION Wear the anti-static wrist strap when holding the board with hands. Make sure that the anti-static wrist strap is well grounded. Otherwise, the static discharge may cause damage to the board.

DANGER Avoid direct eye exposure to laser beams launched from the optical interface board or optical interfaces. Otherwise, damage may be caused to the eyes.

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CAUTION l

Do not directly insert the attenuators into the level optical modules. If the attenuators are required, use the attenautors at the ODF side.

l

If a board requires an attenuator, insert the attenuator in the IN interface instead of the OUT interface.

l

When performing the loopback, use attenuators to prevent damage to the optical modules.

4.2 Description of the Barcode on the Board The barcode on the front panel of the board indicates the board version, name and board features. Two types of barcodes are used for the boards of the OptiX OSN 1500. l

16-character manufacturing code + board version + board name + board feature code

l

20-character manufacturing code + board version + board name + board feature code

The barcode is stuck on the front panel of a board. Figure 4-1 shows a barcode with 16-character manufacturing code. Figure 4-1 Barcode of a board

Bar code

0364401055000015 -SSN3SL16A01

①

②

③

④

5

① Last 6-character serial code of BOM ② Internal code ③ Board version ④ Board name 5 Board feature code

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For details on the board feature code, see the section that describes the board feature code for each board.

4.3 Board Classification By function, the boards can be classified into SDH processing boards, PDH processing boards, data processing boards, WDM processing boards and auxiliary boards. 4.3.1 SDH Processing Boards The OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1 levels. 4.3.2 PDH Processing Boards The OptiX OSN 1500 supports PDH processing boards at different rates and of different impedance. 4.3.3 Data Processing Boards The OptiX OSN 1500 supports data processing boards with the transparent transmission, switching or RPR function. 4.3.4 Interface Boards and Switching Boards The OptiX OSN 1500 supports the optical interface boards, electrical interface boards and switching boards. 4.3.5 Cross-Connect Boards and SCC Boards The OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line units at different rates. 4.3.6 Auxiliary Boards The OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boards and fan boards. 4.3.7 WDM Processing Boards The OptiX OSN 1500 supports WDM processing boards such as the optical add/drop multiplexing boards and optical power amplifier boards. 4.3.8 Optical Amplifier Boards and Dispersion Compensation Board The OptiX OSN 1500 supports several optical booster amplifier boards. 4.3.9 Power Interface Boards The OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports the UPM and R1PIU.

4.3.1 SDH Processing Boards The OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1 levels. Table 4-2 lists the SDH processing boards supported by the OptiX OSN 1500A. Table 4-2 SDH processing boards for the OptiX OSN 1500A

4-4

Board

Full Name

N1SL16

1 x STM-16 optical interface board Huawei Technologies Proprietary

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Board

Full Name

N2SL16

1 x STM-16 optical interface board

N3SL16

1 x STM-16 optical interface board

N1SL16A

1 x STM-16 optical interface board

N2SL16A

1 x STM-16 optical interface board

N3SL16A

1 x STM-16 optical interface board

N1SF16

1 x STM-16 optical interface board (with FEC)

N1SL4

1 x STM-4 optical interface board

N2SL4

1 x STM-4 optical interface board

R1SL4

1 x STM-4 optical interface board (half-width)

N1SLQ4

1 x STM-4 optical interface board

N2SLQ4

4 x STM-4 optical interface board

N1SLD4

2 x STM-4 optical interface board

N2SLD4

2 x STM-4 optical interface board

R1SLD4

2 x STM-4 optical interface board (half-width)

N1SLT1

12 x STM-1 optical interface board

N1SLQ1

4 x STM-1 optical interface board

N2SLQ1

4 x STM-1 optical interface board

R1SLQ1

4 x STM-1 optical interface board (half-width)

N1SL1

1 x STM-1 optical interface board

N2SL1

1 x STM-1 optical interface board

R1SL1

1 x STM-1 optical interface board (half-width)

N1SEP1

2 x STM-1 line processing board when interfaces are available on the front panel

N2SLO1

8 x STM-1 optical interface board

Table 4-3 lists the SDH processing boards supported by the OptiX OSN 1500B. Table 4-3 SDH processing boards for the OptiX OSN 1500B

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Board

Full Name

N1SL16

1 x STM-16 optical interface board

N2SL16

1 x STM-16 optical interface board

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Board

Full Name

N3SL16

1 x STM-16 optical interface board

N1SL16A

1 x STM-16 optical interface board

N2SL16A

1 x STM-16 optical interface board

N3SL16A

1 x STM-16 optical interface board

N1SF16

1 x STM-16 optical interface board (with FEC)

N1SL4

1 x STM-4 optical interface board

N2SL4

1 x STM-4 optical interface board

R1SL4

1 x STM-4 optical interface board (half-width)

N1SLQ4

4 x STM-4 optical interface board

N2SLQ4

4 x STM-4 optical interface board

N1SLD4

2 x STM-4 optical interface board

N2SLD4

2 x STM-4 optical interface board

R1SLD4

2 x STM-4 optical interface board (half-width)

N1SLT1

12 x STM-1 optical interface board

N1SLQ1

4 x STM-1 optical interface board

N2SLQ1

4 x STM-1 optical interface board

R1SLQ1

4 x STM-1 optical interface board (half-width)

N1SL1

1 x STM-1 optical interface board

N2SL1

1 x STM-1 optical interface board

R1SL1

1 x STM-1 optical interface board (half-width)

N1SEP1

2 x STM-1 line processing board when interfaces are available on the front panel 8 x STM-1 line processing board when used with an interface board

N2SLO1

8 x STM-1 optical interface board

4.3.2 PDH Processing Boards The OptiX OSN 1500 supports PDH processing boards at different rates and of different impedance. Table 4-4 lists the PDH processing boards supported by the OptiX OSN 1500A.

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Table 4-4 PDH processing boards for the OptiX OSN 1500A Board

Full Name

Board

Full Name

R1PL1

16 x E1 processing board

N1PL3A

3 x E3/T3 processing board (interfaces available on the front panel)

R1PD1

32 x E1 processing board

N2PL3A

3 x E3/T3 processing board (interfaces available on the front panel)

R2PD1

32 x E1/T1 processing board

N1DXA

DDN service convergence board

Table 4-5 lists the PDH processing boards supported by the OptiX OSN 1500B. Table 4-5 PDH processing boards for the OptiX OSN 1500B Board

Full Name

Board

Full Name

R1PL1

16 x E1 processing board

N2PL3A

3 x E3/T3 processing board (interfaces available on the front panel)

R1PD1

32 x E1 processing board

N1PD3

6 x E3/T3 processing board

R2PD1

32 x E1/T1 processing board

N2PD3

6 x E3/T3 processing board

N1PQ1

63 x E1 processing board

N2PQ3

12 x E3/T3 processing board

N2PQ1

63 x E1 processing board

N1DX1

DDN service access and convergence board

N1PQM

63 x E1/T1 processing board

N1DXA

DDN service convergence board

N1PL3

3 x E3/T3 processing board

N1SPQ4

4 x E4/STM-1 electrical processing board

N2PL3

3 x E3/T3 processing board

N2SPQ4

4 x E4/STM-1 electrical processing board

N1PL3A

3 x E3/T3 processing board (interfaces available on the front panel)

-

-

4.3.3 Data Processing Boards The OptiX OSN 1500 supports data processing boards with the transparent transmission, switching or RPR function. Table 4-6 lists the data processing boards supported by the OptiX OSN 1500A.

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Table 4-6 Data processing boards for the OptiX OSN 1500A Board

Full Name

Board

Full Name

N1EFT4

4 x FE Ethernet transparent transmission board (half-width)

N1EGS4

4 x GE Ethernet convergence board

N1EFT8

8 x FE Ethernet transparent transmission board

N2EGR2

2 x GE Ethernet ring processing board

N1EFT8 A

8 x FE Ethernet transparent transmission board

N1EMR0

4 x FE and 1 x GE Ethernet ring processing board

N1EGT2

2 x GE Ethernet transparent transmission board

N2EMR0

4 x FE and 1 x GE Ethernet ring processing board

N1EFS4

4 x FE Ethernet processing board with Lanswitch

N1ADL4

1 x STM-4 ATM processing board

N2EFS4

4 x FE Ethernet processing board with Lanswitch

N1ADQ1

1 x STM-4 ATM processing board

N1EGS2

2 x GE Ethernet processing board with Lanswitch

N1IDL4

1 x STM-4 ATM processing board

N2EGS2

2 x GE Ethernet processing board with Lanswitch

N1IDQ1

4 x STM-1 ATM processing board

N1EMS4

4 x GE Ethernet transparent transmission and convergence board

N1MST4

4-port multi-service transparent transmission board

Table 4-7 lists the data processing boards supported by the OptiX OSN 1500B. Table 4-7 Data processing boards for the OptiX OSN 1500B

4-8

Board

Full Name

Board

Full Name

N1EFT4

4 x FE Ethernet transparent transmission board (half-width)

N1EMS4

4 x GE and 16 x FE Ethernet transparent transmission and convergence board

N1EFT8

8 x FE or 16 x FE Ethernet transparent transmission board

N1EGS4

4 x GE Ethernet convergence board

N1EFT8 A

8 x FE Ethernet transparent transmission board

N2EGR2

2 x GE Ethernet ring processing board

N1EGT2

2 x GE Ethernet transparent transmission board

N1EMR0

12 x FE and 1 x GE Ethernet ring processing board

N1EFS0

8-port Fast Ethernet processing board with Lanswitch

N2EMR0

12 x FE and 1 x GE Ethernet ring processing board

N2EFS0

8 x FE Ethernet processing board with Lanswitch

N1ADL4

1 x STM-4 ATM processing board

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Board

Full Name

Board

Full Name

N4EFS0

8 x FE Ethernet processing board with Lanswitch

N1ADQ1

1 x STM-4 ATM processing board

N1EFS4

4 x FE Ethernet processing board with Lanswitch

N1IDL4

1 x STM-4 ATM processing board

N2EFS4

4 x FE Ethernet processing board with Lanswitch

N1IDQ1

4 x STM-1 ATM processing board

N1EGS2

2 x GE Ethernet processing board with Lanswitch

N1MST4

4-port multi-service transparent transmission board

N2EGS2

2 x GE Ethernet processing board with Lanswitch

-

-

4.3.4 Interface Boards and Switching Boards The OptiX OSN 1500 supports the optical interface boards, electrical interface boards and switching boards. Table 4-8 lists the interface boards and switching boards supported by the OptiX OSN 1500A. Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A Board

Full Name

R1L12S

16 x E1/T1 120-ohm electrical interface switching board

R1L75S

16 x E1 75-ohm electrical interface switching board

Table 4-9 lists the interface boards and switching boards supported by the OptiX OSN 1500B. Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B

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Board

Full Name

Board

Full Name

N1EU08

8 x STM-1 electrical interface board

N1D12S

32 x E1/T1 120-ohm electrical interface switching board

N1OU08

8 x STM-1 optical interface board (LC)

N1D12B

32 x E1/T1 120-ohm electrical interface board

N2OU08

8 x STM-1 optical interface board (SC)

N1EFF8

8 x 100M Ethernet optical interface board

N1D75S

32 x E1/T1 75-ohm electrical interface switching board

N1ETF8

8 x 100M Ethernet twisted pair interface board

N1MU04

4 x STM-1 electrical interface board

N1ETS8

8 x 10/100M Ethernet twisted pair interface switching board

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Board

Full Name

Board

Full Name

N1D34S

6 x E3/T3 electrical interface switching board

N1DM12

DDN service interface board

N1C34S

3 x E3/T3 electrical interface switching board

N1TSB4

4-channel electrical interface switching board

N1EU04

4 x STM-1 electrical interface board

N1TSB8

8-channel electrical interface switching board

4.3.5 Cross-Connect Boards and SCC Boards The OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line units at different rates. Table 4-10 lists the cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B. Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B Board

Full Name

Q2CXL1

Integrated board of the SCC, cross-connect and line units at the STM-1 level

Q2CXL4

Integrated board of the SCC, cross-connect and line units at the STM-4 level

Q2CXL16

Integrated board of the SCC, cross-connect and line units at the STM-16 level

4.3.6 Auxiliary Boards The OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boards and fan boards. Table 4-11 lists the auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B. Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B

4-10

Board

Full Name

Board

Full Name

R1EOW

Orderwire phone processing board

R1AUX/ R2AUX

System auxiliary interface board

R1AMU

Orderwire processing or alarm concatenation board

R1FAN

Fan board

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4.3.7 WDM Processing Boards The OptiX OSN 1500 supports WDM processing boards such as the optical add/drop multiplexing boards and optical power amplifier boards. Table 4-12 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500A. Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A Board

Full Name

Board

Full Name

TN11CMR2

2-channel optical add/drop multiplexing board

N1MR2C

2-channel optical add/drop multiplexing board

TN11CMR4

4-channel optical add/drop multiplexing board

N1LWX

Arbitrary bit rate wavelength conversion board

MR2

2-channel optical add/drop multiplexing board

TN11OBU1

Optical booster amplifier board

MR4

4-channel optical add/drop multiplexing board

N1FIB

Filter isolating board

N1MR2A

2-channel optical add/drop multiplexing board

-

-

Table 4-13 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500B. Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B Board

Full Name

Board

Full Name

TN11CMR2

2-channel optical add/drop multiplexing board

N1MR2B

2-channel optical add/drop multiplexing board

TN11CMR4

4-channel optical add/drop multiplexing board

N1MR2C

2-channel optical add/drop multiplexing board

MR2

2-channel optical add/drop multiplexing board

N1LWX

Arbitrary bit rate wavelength conversion board

MR4

42-channel optical add/drop multiplexing board

TN11OBU1

Optical booster amplifier board

N1MR2A

2-channel optical add/drop multiplexing board

N1FIB

Filter isolating board

4.3.8 Optical Amplifier Boards and Dispersion Compensation Board The OptiX OSN 1500 supports several optical booster amplifier boards. Table 4-14 lists the optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B. Issue 02 (2007-09-10)

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Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A/B Board

Full Name

N1BPA

Optical booster and pre-amplifier board

N1BA2

Optical booster amplifier board

N1COA/61COA/62COA

Case-shaped optical amplifier

4.3.9 Power Interface Boards The OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports the UPM and R1PIU. The UPM is an uninterruptible power module. The R1PIUA is used for the OptiX OSN 1500A as the power interface board. The R1PIU is used for the OptiX OSN 1500B as the power interface board.

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5 SDH Processing Boards

SDH Processing Boards

About This Chapter This chapter describes the SDH processing boards at the STM-1, STM-4, and STM-16 levels. 5.1 SL1 This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.2 SLQ1 This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 5.3 SLO1 This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 5.4 SLT1 This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.5 SEP1 This section describes the SEP1 board, in terms of the version, function, working principle, front panel, and specifications. 5.6 SL4 This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.7 SLD4 This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.8 SLQ4 This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.9 SL16 This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version, function, working principle, front panel and specifications. Issue 02 (2007-09-10)

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5.10 SL16A This section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.11 SF16 This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FEC function, in terms of the version, function, working principle, front panel and specifications.

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5.1 SL1 This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.1.1 Version Description The SL1 board has three versions: R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, which is housed in a divided slot in a subrack. 5.1.2 Function and Feature The SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. 5.1.3 Working Principle and Signal Flow The SL1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.1.4 Front Panel On the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safety class label. On the front panel of the R1SL1, there are indicators, interfaces and barcode. 5.1.5 Valid Slots The slots valid for the SL1 vary with the version of the board. 5.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL1 indicates the optical interface type. 5.1.7 Board Configuration Reference You can use the T2000 to set parameters for the SL1. 5.1.8 Technical Specifications The technical specifications of the SL1 cover the optical interface specifications, board dimensions, weight and power consumption.

5.1.1 Version Description The SL1 board has three versions: R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, which is housed in a divided slot in a subrack. Table 5-1 lists the details on the versions of the SL1 board. Table 5-1 Version Description of the SL1

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Item

Description

Functional version

The SL1 has three versions, R1, N1 and N2.

Difference

The N2SL1 supports the TCM function. The N1SL1 and R1SL1 do not support the TCM function. The R1SL1 is housed in a divided slot.

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Item

Description

Replaceability

The versions cannot be replaced by each other.

5.1.2 Function and Feature The SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-2 lists the functions and features of the SL1. Table 5-2 Functions and features of the SL1 Function and Feature

SL1

Basic function

Transmits and receives 1 x STM-1 optical signals.

Specification of the optical interface

Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-1.2 type complies with the standards defined by Huawei.

Specification of the optical module

Supports detection and query of the information on the optical module. Supports the usage and detection of the pluggable optical module SFP for easy maintenance. The optical interface supports the function of setting the on/off state of the laser and the ALS function.

Service processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing

Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the two-fiber bidirectional MSP protection ring, linear MPS, SNCP, SNCTP and SNCMP.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

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5.1.3 Working Principle and Signal Flow The SL1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. Figure 5-1 shows the block diagram for the working principle of the SL1. Figure 5-1 Block diagram for the working principle of the SL1 155 MHz

155Mbit/s 155Mbit/s

O/E

S P I

O/E

155Mbit/s

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

155Mbit/s

O/E

155Mbit/s

CDR

Cross-connect unit

Cross-connect unit

155Mbit/s

.... 155Mbit/s

Reference clock

155 MHz PLL

155Mbit/s

S P I

CDR

RST

MST

MSA

High speed bus

155Mbit/s 155Mbit/s

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module +3.3 V

+5 V +1.8 V

DC/DC converter

Cross-connect unit A

HPT

DC/DC converter

Frame header Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Module l

In the receive direction, the module converts the received optical signals into electrical signals.

l

In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides function to shut down the laser.

l

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module l

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RST l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

l

MST provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Controls the laser.

l

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter It provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply. 5-6

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5.1.4 Front Panel On the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safety class label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 5-2 shows the appearance of the front panel of the N1SL1/N2SL1. Figure 5-2 Front panel of the N1SL1/N2SL1 SL1 STAT ACT PROG SRV CLASS1 LASER PRODUCT

OUT

IN

SL1

Figure 5-3 shows the appearance of the front panel of the R1SL1.

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Figure 5-3 Front panel of the R1SL1

SL1 STAT ACT PROG SRV

OUT IN

SL1

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There is one pair of optical interfaces on the front panel of the SL1. Table 5-3 lists the type and usage of the optical interfaces. Table 5-3 Optical interfaces of the SL1 Interfaces on the Front Panel

Interface Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

5.1.5 Valid Slots The slots valid for the SL1 vary with the version of the board. The slots valid for the SL1 are as follows: l

5-8

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l

The N1SL1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l

The N2SL1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l

The R1SL1 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack.

l

The N1SL1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

l

The N2SL1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL1 indicates the optical interface type. Table 5-4 lists the relation between the board feature code and optical interface type for the SL1. Table 5-4 Relation between the board feature code and the optical interface type Board

Feature Code

Optical Interface Type

SSN1SL110, SSN2SL110

10

S-1.1

SSN1SL111, SSN2SL111

11

L-1.1

SSN1SL112, SSN2SL112

12

L-1.2

SSN1SL113, SSN2SL113

13

Ve-1.2

SSN1SL114, SSN2SL114

14

I-1

5.1.7 Board Configuration Reference You can use the T2000 to set parameters for the SL1. You can use the T2000 to set the following parameters for the SL1: l

J0

l

J1

l

C2

For details on the parameters, refer to F Board Configuration Reference.

5.1.8 Technical Specifications The technical specifications of the SL1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 5-5 lists the specifications of the optical interfaces of the SL1.

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Table 5-5 Specifications of the optical interfaces of the SL1 Item

Specification

Nominal bit rate

155.52 Mbit/s

Line code

NRZ

Optical interface type

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Optical source type

MLM

MLM

MLM, SLM

SLM

SLM

Working wavelengt h (nm)

1260–1360

1261–1360

1263–1360

1480–1580

1480–1580

Launched optical power (dBm)

–15 to –8

–15 to –8

–5 to 0

–5 to 0

–3 to 0

Receiver sensitivity (dBm)

–23

–28

–34

–34

–34

Overload optical power (dBm)

–8

–8

–10

–10

–10

Min. extinction ratio (dB)

8.2

8.2

10

10

10

Note: MLM indicates the multi-longitudinal mode and SLM indicates the single-longitudinal mode.

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the N1SL1/N2SL1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

The mechanical specifications of the R1SL1 are as follows: 5-10

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Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.3

5 SDH Processing Boards

Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1SL1/N2SL1 is 14 W. In the normal temperature (25℃), the maximum power consumption of the R1SL1 is 10.3 W.

5.2 SLQ1 This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 5.2.1 Version Description The SLQ1 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SLQ1 is a 4 x STM-1 optical interface board, which is housed in a divided slot in a subrack. 5.2.2 Function and Feature The SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. 5.2.3 Working Principle and Signal Flow The SLQ1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.2.4 Front Panel On the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode. 5.2.5 Valid Slots The slots valid for the SLQ1 vary with the version of the board. 5.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ1 indicates the optical interface type. 5.2.7 Board Configuration Reference You can use the T2000 to set parameters for the SLQ1. 5.2.8 Technical Specifications The technical specifications of the SLQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

5.2.1 Version Description The SLQ1 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SLQ1 is a 4 x STM-1 optical interface board, which is housed in a divided slot in a subrack. Table 5-6 lists the details on the versions of the SLQ1 board. Issue 02 (2007-09-10)

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Table 5-6 Version Description of the SLQ1 Item

Description

Functional version

The SLQ1 has three versions, R1, N1 and N2.

Difference

The N2SLQ1 supports the TCM function. The N1SLQ1 and R1SLQ1 do not support the TCM function. The R1SLQ1 is housed in a divided slot.

Replaceability

The versions cannot be replaced by each other.

5.2.2 Function and Feature The SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-7 lists the functions and features of the SLQ1. Table 5-7 Functions and features of the SLQ1 Function and Feature

SLQ1

Basic function

Transmits and receives 4 x STM-1 optical signals.

Specification of the optical interface

Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-1.2 type complies with the standards defined by Huawei.

Specification of the optical module

Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and detection of the pluggable optical module SFP for easy maintenance.

Service processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing

Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Supports one to four channels of ECC communication.

5-12

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the two-fiber unidirectional MSP protection ring, linear MSP, SNCP, SNCTP and SNCMP.

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Function and Feature

SLQ1

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.2.3 Working Principle and Signal Flow The SLQ1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. Figure 5-4 shows the block diagram for the working principle of the SLQ1. Figure 5-4 Block diagram for the working principle of the SLQ1 155 MHz

155Mbit/s 155Mbit/s

O/E O/E

S P I

155Mbit/s

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

155Mbit/s

O/E

155Mbit/s

CDR

Cross-connect unit

Cross-connect unit

155Mbit/s

.... 155Mbit/s

Reference clock

155 MHz PLL

155Mbit/s

S P I

CDR

RST

MST

MSA

HPT High speed bus

155Mbit/s 155Mbit/s

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module +3.3 V

+5 V +1.8 V

DC/DC converter

Cross-connect unit A

DC/DC converter

Frame header Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-1 units are described below:

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O/E Conversion Module l

In the receive direction, the module converts the received optical signals into electrical signals.

l

In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides function to shut down the laser.

l

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

l

MST provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

RST

MST

MSA

HPT

Communication and Control Module l

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l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Controls the laser.

l

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter It provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.2.4 Front Panel On the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 5-5 shows the appearance of the front panel of the N1SLQ1/N2SLQ1. Figure 5-5 Front panel of the N1SLQ1/N2SLQ1 SLQ1 STAT ACT PROG SRV CLASS1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

SLQ1

Figure 5-6 shows the appearance of the front panel of the R1SLQ1. Issue 02 (2007-09-10)

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Figure 5-6 Front panel of the R1SLQ1

SLQ1 STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 SLQ1

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four pairs of optical interfaces on the front panel of the SLQ1. Table 5-8 lists the type and usage of the optical interfaces. Table 5-8 Optical interfaces of the SLQ1 Interfaces

Interface Type

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

5.2.5 Valid Slots The slots valid for the SLQ1 vary with the version of the board. The slots valid for the SLQ1 are as follows: l

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The R1SLQ1 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500A subrack. Huawei Technologies Proprietary

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l

The N1SLQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l

The N2SLQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l

The R1SLQ1 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack.

l

The N1SLQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

l

The N2SLQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ1 indicates the optical interface type. Table 5-9 lists the relation between the board feature code and optical interface type for the SLQ1. Table 5-9 Relation between the board feature code and the optical interface type Board

Feature Code

Optical Interface Type

SSN2SLQ110, SSN1SLQ110

10

S-1.1

SSN2SLQ111, SSN1SLQ111

11

L-1.1

SSN2SLQ112, SSN1SLQ112

12

L-1.2

SSN2SLQ113, SSN1SLQ113

13

Ve-1.2

SSN2SLQ114, SSN1SLQ114

14

I-1

5.2.7 Board Configuration Reference You can use the T2000 to set parameters for the SLQ1. You can use the T2000 to set the following parameters for the SLQ1: l

J0

l

J1

l

C2

For details on the parameters, refer to F Board Configuration Reference.

5.2.8 Technical Specifications The technical specifications of the SLQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

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Optical Interface Specifications Table 5-10 lists the specifications of the optical interfaces of the SLQ1. Table 5-10 Specifications of the optical interfaces of the SLQ1 Item

Specification

Nominal bit rate

155.52 Mbit/s

Line code

NRZ

Optical interface type

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Optical source type

MLM

MLM

MLM, SLM

SLM

SLM

Working wavelength (nm)

1260–1360

1261–1360

1263–1360

1480–1580

1480–1580

Launched optical power (dBm)

–15 to –8

–15 to –8

–5 to 0

–5 to 0

–3 to 0

Receiver sensitivity (dBm)

–23

–28

–34

–34

–34

Overload optical power (dBm)

–8

–8

–10

–10

–10

Min. extinction ratio (dB)

8.2

8.2

10

10

10

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the N1SLQ1/N2SLQ1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

The mechanical specifications of the R1SLQ1 are as follows:

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l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.4 Huawei Technologies Proprietary

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Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1SLQ1/ N2SLQ1 is 15 W. In the normal temperature (25℃), the maximum power consumption of the R1SLQ1 is 12 W.

5.3 SLO1 This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 5.3.1 Version Description The functional version of the SLO1 board is N1. 5.3.2 Function and Feature The SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to the signals, to insert or extract the overhead bytes, and to generate alarm signals. 5.3.3 Working Principle and Signal Flow The SLO1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.3.4 Front Panel On the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety class label. 5.3.5 Valid Slots If the SLO1 is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to eight optical interfaces can be configured. If the SLO1 is housed in any of slots 11–13 of the OptiX OSN 1500B subrack, one to eight optical interfaces can be configured. 5.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLO1 indicates the optical interface type. 5.3.7 Board Configuration Reference You can use the T2000 to set parameters for the SLO1. 5.3.8 Technical Specifications The technical specifications of the SLO1 cover the optical interface specifications, board dimensions, weight and power consumption.

5.3.1 Version Description The functional version of the SLO1 board is N1.

5.3.2 Function and Feature The SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to the signals, to insert or extract the overhead bytes, and to generate alarm signals. Table 5-11 lists the functions and features of the SLO1. Issue 02 (2007-09-10)

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Table 5-11 Functions and features of the SLO1 board Function and Feature

SLO1

Basic function

Receives and transmits 8 x STM-1 optical signals.

Specification of the optical interface

Supports standard optical interfaces of the I-1.1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-1.2 type complies with the standards defined by Huawei.

Specification of the optical module

The optical module is pluggable. When optical modules of other types are inserted, an alarm indicating the mismatch of the optical module is reported. Supports detection and query of the information on the optical module. Supports the default off state of the laser. The laser is turned off before the software finishes the initialization when the board is powered on. Supports the usage and detection of the pluggable optical module SFP. Supports the setting and query of the on/off state of the laser. An alarm is generated when the laser is turned off. Performance events are reported to indicate the performance of the optical module.

Service processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing

Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. If the two SCC boards are not in service, the SLO1 does not transmit overhead bytes (long 0s) to the two SCC boards. Supports one to eight channels of ECC communication.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the two-fiber unidirectional MSP protection ring, linear MSP, SNCP, SNCTP and SNCMP.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.3.3 Working Principle and Signal Flow The SLO1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. Figure 5-7 shows the block diagram for the working principle of the SLO1. 5-20

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Figure 5-7 Block diagram for the working principle of the SLO1 155 MHz

155Mbit/s 155Mbit/s

O/E

S P I

O/E

155Mbit/s

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

155Mbit/s

O/E

155Mbit/s

CDR

Cross-connect unit

Cross-connect unit

155Mbit/s

.... 155Mbit/s

Reference clock

155 MHz PLL

155Mbit/s

S P I

CDR

RST

MST

MSA

HPT High speed bus

155Mbit/s 155Mbit/s

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module +3.3 V

+5 V +1.8 V

DC/DC converter

Cross-connect unit A

DC/DC converter

Frame header Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Module l

In the receive direction, the module converts the received optical signals into electrical signals.

l

In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides function to shut down the laser.

l

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

RST

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MST l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

l

MST provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Controls the laser.

l

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter It provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.3.4 Front Panel On the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety class label. Figure 5-8 shows the front panel of the SLO1. 5-22

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Figure 5-8 Front panel of the SLO1 SLO1 STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8 CLASS1 LASER PRODUCT

SLO1

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are eight pairs of optical interfaces on the front panel of the SLO1. Table 5-12 lists the type and usage of the optical interfaces. Table 5-12 Optical interfaces of the SLO1

Issue 02 (2007-09-10)

Interfaces

Interface Type

Usage

IN1–IN8

LC

Receives optical signals.

OUT1–OUT8

LC

Transmits optical signals.

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The optical interfaces of the SLO1 are level optical interfaces and indented by 20 mm. The SLO1 board can use the pluggable optical modules for easy maintenance.

WARNING The optical interfaces of the SLO1 board are level optical interfaces. Thus, use the optical attenuator only at the ODF side.

5.3.5 Valid Slots If the SLO1 is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to eight optical interfaces can be configured. If the SLO1 is housed in any of slots 11–13 of the OptiX OSN 1500B subrack, one to eight optical interfaces can be configured.

5.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLO1 indicates the optical interface type. Table 5-13 lists the relation between the board feature code and optical interface type for the SLO1. Table 5-13 Relation between the board feature code and the optical interface type Board

Feature Code

Optical Interface Type

SSN2SLO110

10

S-1.1

SSN2SLO111

11

L-1.1

SSN2SLO112

12

L-1.2

SSN2SLO113

13

Ve-1.2

SSN2SLO114

14

I-1

5.3.7 Board Configuration Reference You can use the T2000 to set parameters for the SLO1. You can use the T2000 to set the following parameters for the SLO1: l

J0

l

J1

l

C2

For details on the parameters, refer to F Board Configuration Reference.

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5.3.8 Technical Specifications The technical specifications of the SLO1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 5-14 lists the specifications of the optical interfaces of the SLO1. Table 5-14 Specifications of the optical interfaces of the SLO1 Item

Specification

Nominal bit rate

155520 kbit/s

Line code

NRZ

Optical interface type

I-1.1

S-1.1

L-1.1

L-1.2

Ve-1.2

Optical source type

MLM

MLM

MLM, SLM

SLM

SLM

Working wavelength (nm)

1261–1360

1261– 1360

1263– 1360

1480– 1580

1480– 1580

Launched optical power (dBm)

–15 to –8

–15 to –8

–5 to 0

–5 to 0

–3 to 0

Receiver sensitivity (dBm)

–23

–28

–34

–34

–34

Overload optical power (dBm)

–8

–8

–10

–10

–10

Min. extinction ratio (dB)

8.2

8.2

10

10

10

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the SLO1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the SLO1 is 26W. Issue 02 (2007-09-10)

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5.4 SLT1 This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.4.1 Version Description The functional version of the SLT1 board is N1. 5.4.2 Function and Feature The SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. 5.4.3 Working Principle and Signal Flow The SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. The external services are accessed by the external interface boards EU08 and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board. 5.4.4 Front Panel On the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety class label. 5.4.5 Valid Slots The SLT1, housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to twelve optical interfaces can be configured. For the SLT1, housed in any of slots 11–13 of the OptiX OSN 1500B subrack, one to twelve optical interfaces can be configured. 5.4.6 Board Configuration Reference You can use the T2000 to set parameters for the SLT1. 5.4.7 Technical Specifications The technical specifications of the SLT1 cover the optical interface specifications, board dimensions, weight and power consumption.

5.4.1 Version Description The functional version of the SLT1 board is N1.

5.4.2 Function and Feature The SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-15 lists the functions and features of the SLT1. Table 5-15 Functions and features of the SLT1

5-26

Function and Feature

SLT1

Basic function

Transmits and receives 12 x STM-1 optical signals.

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Function and Feature

SLT1

Specification of the optical interface

Supports S-1.1 standard optical interfaces compliant with ITU-T G.957 in features.

Specification of the optical module

Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and detection of the pluggable optical module SFP for easy maintenance.

Service processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing

Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Supports one to eight channels of ECC communication.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the two-fiber unidirectional MSP protection ring, linear MSP protection ring, SNCP, SNCTP, and SNCMP.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.4.3 Working Principle and Signal Flow The SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. The external services are accessed by the external interface boards EU08 and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board. Figure 5-9 shows the block diagram for the working principle of the SLT1.

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Figure 5-9 Block diagram for the working principle of the SLT1 155 MHz

155Mbit/s 155Mbit/s

O/E

S P I

O/E

155Mbit/s

S P I

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

155Mbit/s

155Mbit/s

O/E

155Mbit/s

Cross-connect unit

Cross-connect unit

155Mbit/s

.... 155Mbit/s

CDR

Reference clock

155 MHz PLL

CDR

RST

MST

MSA

HPT High speed bus

155Mbit/s 155Mbit/s

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module +3.3 V

+5 V +1.8 V

DC/DC converter

Cross-connect unit A

DC/DC converter

Frame header Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Module l

In the receive direction, the module converts the received optical signals into electrical signals.

l

In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides function to shut down the laser.

l

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

RST

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MST l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

l

MST provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Controls the laser.

l

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter It provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.4.4 Front Panel On the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 5-10 shows the appearance of the front panel of the SLT1. Issue 02 (2007-09-10)

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Figure 5-10 Front panel of the SLT1 SLT1 STAT ACT PROG SRV CLASS1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8 OUT9 IN9 OUT10 IN10 OUT11 IN11 OUT12 IN12

SLT1

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are 12 pairs of optical interfaces on the front panel of the SLT1. Table 5-16 lists the type and usage of the optical interfaces. Table 5-16 Optical interfaces of the SLT1

5-30

Interface

Interface Type

Usage

IN1-IN12

LC

Receives optical signals.

OUT1-OUT12

LC

Transmits optical signals.

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WARNING The optical interfaces of the SLT1 board are level optical interfaces. Thus, use the optical attenuator only at the ODF side.

5.4.5 Valid Slots The SLT1, housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to twelve optical interfaces can be configured. For the SLT1, housed in any of slots 11–13 of the OptiX OSN 1500B subrack, one to twelve optical interfaces can be configured.

5.4.6 Board Configuration Reference You can use the T2000 to set parameters for the SLT1. You can use the T2000 to set the following parameters for the SLT1: l

J0

l

J1

l

C2

For details on the parameters, refer to F Board Configuration Reference.

5.4.7 Technical Specifications The technical specifications of the SLT1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 5-17 lists the specifications of the optical interfaces of the SLT1. Table 5-17 Specifications of the optical interfaces of the SLT1

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Item

Specification

Nominal bit rate

155.52 Mbit/s

Line code

NRZ

Optical interface type

S-1.1

Optical source type

MLM

Working wavelength (nm)

1261–1360

Launched optical power (dBm)

–15 to –8

Receiver sensitivity (dBm)

–28

Overload optical power (dBm)

–8

Min. extinction ratio (dB)

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Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the SLT1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.2

Power Consumption In the normal temperature (25℃), the maximum power consumption of the SLT1 is 15 W.

5.5 SEP1 This section describes the SEP1 board, in terms of the version, function, working principle, front panel, and specifications. 5.5.1 Version Description The functional version of the SEP1 board is N1. 5.5.2 Function and Feature The SEP1 board processes STM-1 electrical signals. 5.5.3 Working Principle and Signal Flow The SEP1 board consists of the line interface module and CDR module, SDH overhead processing module, RST and so on. The external services are accessed by the external interface boards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an optical interface board. 5.5.4 Front Panel On the front panel of the SEP1, there are indicators, interfaces and barcode. 5.5.5 Valid Slots When the SEP1 board is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, it cannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces are available on the front panel of the SEP1 board, it can be housed in any of slots 11–13. When the SEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housed in any of slots 12–13. 5.5.6 TPS Protection for the Board The TPS protection is equipment-level protection. When the working board fails, the accessed services are switched to the protection board. 5.5.7 Board Configuration Reference You can use the T2000 to set parameters for the SEP1. 5.5.8 Technical Specifications The technical specifications of the SEP1 cover the board dimensions, weight and power consumption. 5-32

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5.5.1 Version Description The functional version of the SEP1 board is N1. When interfaces are available on the front panel of the SEP1 (the logical board is displayed as the SEP1 on the T2000), the SEP1 processes 2 x STM-1 electrical signals. In this case, the SEP1 is a 2 x STM-1 signal processing board. When the SEP1 is used with the interface board (the logical board is displayed as the SEP on the T2000), the SEP1 processes 8 x STM-1 electrical signals. In this case, the SEP1 is an 8 x STM-1 signal processing board. The physical boards for the 2 x STM-1 signal processing board and 8 x STM-1 signal processing board are both the SEP1. Thus, they are defined as the SEP1 when the logical boards are not differentiated.

5.5.2 Function and Feature The SEP1 board processes STM-1 electrical signals. Table 5-18 lists the functions and features of the SEP1. Table 5-18 Functions and features of the SEP1 Function and Feature

SEP1

Basic function

Processes 2 x STM-1 signals when interfaces are available on the front panel. Processes 8 x STM-1 signals when used with the interface board.

Specification of the optical module

Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the pluggable optical module SFP.

Service processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing

Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the TPS protection when used with the interface board and the switching board. Supports the two-fiber unidirectional MSP protection ring, linear MSP protection, and SNCP.

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Function and Feature

SEP1

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

When the SEP1 is used with different interface boards and electrical interface switching boards, the access capabilities for the STM-1 signals are different. See Table 5-19. Table 5-19 Access capabilities for the SEP1 Interface Board

SEP1

None

Accesses and processes 2 x STM-1 electrical signals, and does not support the TPS protection.

EU08

Accesses and processes 8 x STM-1 electrical signals.

OU08

Accesses and processes 8 x STM-1 optical signals.

EU08+OU08

The hybrid usage is not supported.

EU08+TSB8

Accesses and processes 8 x STM-1 electrical signals, and supports the TPS protection for the SEP1 board.

CAUTION When the SEP1 is used with the interface board, the two interfaces on the front panel are invalid. The hybrid usage of the EU08 and OU08 is not supported.

5.5.3 Working Principle and Signal Flow The SEP1 board consists of the line interface module and CDR module, SDH overhead processing module, RST and so on. The external services are accessed by the external interface boards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an optical interface board. Figure 5-11 shows the block diagram for the working principle of the SEP1.

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Figure 5-11 Block diagram for the working principle of the SEP1 Reference clock

155 MHz PLL

Cross-connect unit

SDH overhead processing module

K1 and K2 insertion/extration

K1 and K2

high speed bus 155 Mbit/s Port 1 155 Mbit/s

CMI

Transfo rmer CMI

155 Mbit/s Port 2 155 Mbit/s

Transfor mer

SPI Encode/ Decode Encode/ Decode

NRZ

CDR

155 Mbit/s

RST

MST

MSA

HPT

NRZ

155 Mbit/s

CDR

155 Mbit/s

DCC

Frame header

LOS

Communication and control module

Communication

+3.3 V +1.8 V

high speed bus

155 Mbit/s

Fuse

DC/DC converter

DC/DC converter

Cross-connect unit

Cross-connect unit A Cross-connect unit B

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

Figure 5-12 shows the block diagram for the working principle of the SEP used with the EU08. Figure 5-12 Block diagram for the working principle of the SEP used with the EU08 Reference clock

155 MHz PLL EU08 155 Mbit/s Port 1

Port 8

155 Mbit/s

Transfo rmer

155 Mbit/s 155 Mbit/s

155 Mbit/s Port 1 155 Mbit/s Port 2

SPI

Transfo rmer

CMI

Encode / Decode

CDR

Encode / Decode

CDR

CMI

Transfo rmer

Encode/ Decode CMI

155 Mbit/s 155 Mbit/s

CMI

Transfor mer

NRZ

CDR

SDH overhead processing module

K1 and K2 insertion/extration

Cross-connect unit

155 Mbit/s high speed bus

155 Mbit/s

155 Mbit/s

RST

CDR

MST

MSA

high speed bus

HPT

DCC

Communication and control module +3.3 V

DC/DC converter

Cross-connect unit A Cross-connect unit B

155 Mbit/s 155 Mbit/s

LOS

+1.8 V

K1 and K2

155 Mbit/s NRZ

Encode/ Decode

155 Mbit/s 155 Mbit/s

Cross-connect unit

DC/DC converter

Frame header Communication

Fuse

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

Figure 5-13 shows the block diagram for the working principle of the SEP used with the OU08. Issue 02 (2007-09-10)

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Figure 5-13 Block diagram for the working principle of the SEP used with the OU08

O/E

155 Mbit/s Port 1 155 Mbit/s

O/E

Port 8 155 Mbit/s

O/E

Reference clock

155 MHz PLL

OU08 NRZ

155 Mbit/s

CDR

SDH overhead processing module 155 Mbit/s

S P I

NRZ

K1 and K2 insertion/extration

K1 and K2

high speed bus

155 Mbit/s

O/E

Port 1

Port 2

155 Mbit/s 155 Mbit/s

Transfo rmer

155 Mbit/s 155 Mbit/s Transfor

SPI Encode/ Decode

CMI

NRZ

Encode/ Decode

mer

155 Mbit/s

CDR

RST

MST

MSA

HPT

high speed bus

155 Mbit/s NRZ

CMI

CDR

LOS

DCC

Communication and control module

LOS Laser shut down +3.3 V

DC/DC converter

Cross-connect unit A

Cross-connect unit B

155 Mbit/s 155 Mbit/s

+1.8 V

Cross-connect unit

155 Mbit/s

CDR

155 Mbit/s

Cross-connect unit

DC/DC converter

Frame header Communication

Fuse

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

The function modules are described below:

Line Interface Module and CDR Module l

In the receive direction, the received electrical signals (CMI code) are isolated through the converter and then transmitted to the decoding unit. The CDR module then recovers the data and clock signals after decoding.

l

In the transmit direction, the SDH signals, which are processed by the overhead processing unit, are transmitted to the encoding unit. After isolation by converter, 155 Mbit/s electrical signals (CMI code) are output. The encoding and decoding unit monitors R_LOS alarms.

SDH Overhead Processing Module l

This module includes RST, MST, MSA and HPT. It also provides inloop and outloop function.

l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

l

In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

RST

MST

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l

Provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect unit.

l

Controls the laser.

l

Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting the ADM when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter Module It provides the board with required DC voltages. It converts the –48 V/ –60 V power supply to the following voltages: + 3.3 V, + 1.8 V. It also provides protection for +3.3 V power supply.

5.5.4 Front Panel On the front panel of the SEP1, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 5-14 shows the appearance of the front panel of the SEP1.

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Figure 5-14 Front panel of the SEP1

SEP1 STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2 SEP1

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are two pairs of optical interfaces on the front panel of the SEP1. Table 5-20 lists the type and usage of the optical interfaces.

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Table 5-20 Electrical interfaces of the SEP1 Interface

Interface Type

Usage

IN1-IN2

75-ohm SMB

Receives the STM-1 signals.

OUT1-OUT2

75-ohm SMB

Transmits the STM-1 signals.

Note: The SEP1 board can also be used with interface boards EU08 and OU08. In this case, the SEP1 is defined as the SEP. When the SEP1 is used with the interface board, the two interfaces on the front panel are invalid.

5.5.5 Valid Slots When the SEP1 board is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, it cannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces are available on the front panel of the SEP1 board, it can be housed in any of slots 11–13. When the SEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housed in any of slots 12–13.

5.5.6 TPS Protection for the Board The TPS protection is equipment-level protection. When the working board fails, the accessed services are switched to the protection board. In this way, complex network-level protection, such as the MSP and SNCP, are not triggered, but the reliability of the equipment can be ensured. The OptiX OSN 1500B supports the TPS protection for the SEP1. The SEP1 board can be used with the EU08 and TSB8 boards to realize the 1:1 TPS protection for 2 x STM-1 electrical signals. The OptiX OSN 1500A does not support the SEP1 board.

Protection Principle Figure 5-15 shows the principle of the TPS protection for the SEP1 board. Figure 5-15 Principle of the TPS protection for the SEP1 8×STM-1(e)

EU08

TSB8

2

1

Switch control signal

1

2

Crossconnect and timing board

SLOT 9/10 Protection SEP

Working SEP Fail

SLOT12

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SLOT13

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Normal state: When the working boards are running normally, the control switch of the EU08 is in position 1 and the EU08 directly accesses the service signals to the SEP1 board.

l

Switching state: When a failure is detected on the working board, the working board housed in each slot can be protected in the following ways. –

When the working board housed in slot 13 fails, the control switch of the corresponding EU08 shifts from position 1 to position 2. At the same time, the control switch of the TSB8 shifts from position 1 to position 2, and thus the working board housed in slot 13 is protected by the protection board housed in slot 12.

Hardware Configuration Figure 5-16 shows the slot configuration for the 1:1 TPS protection for the SEP1. Figure 5-16 Slot configuration for the 1:1 TPS protection for the SEP1 Slot 14

TSB8

Slot 15 Slot 16

EU08

Slot 17

Slot 18

PIU

Slot 19

PIU

Slot 6

Slot 11 Slot 20

Slot 12

Protection

Slot 7

FAN

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 5-16, the protection board housed in slot 12 protects the board housed in slot 13. Table 5-21 lists the slots for the SEP1, EU08 and TSB8. Table 5-21 Slots for the SEP1, EU08 and TSB8 Board

Protection Group

SEP1 (working board)

Slot 12

TSB8

Slot 14

SEP1 (working board)

Slot 13

EU08

Slot 16

5.5.7 Board Configuration Reference You can use the T2000 to set parameters for the SEP1. You can use the T2000 to set the following parameters for the SEP1: l

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J1

l

C2

5 SDH Processing Boards

For details on the parameters, refer to F Board Configuration Reference.

5.5.8 Technical Specifications The technical specifications of the SEP1 cover the board dimensions, weight and power consumption. Table 5-22 Technical specifications of the SEP1 board Item

Specification

Nominal bit rate

155.520 Mbit/s

Line code

Coded mark inversion (CMI), NRZ

Connector

SMB

Mechanical Specifications The mechanical specifications of the SEP1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the SEP1 is 17 W.

5.6 SL4 This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.6.1 Version Description The SL4 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which is housed in a divided slot in a subrack. 5.6.2 Function and Feature The SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead bytes, and to perform the MSP protection. 5.6.3 Working Principle and Signal Flow The SL4 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.6.4 Front Panel On the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SL4, there are indicators, interfaces and barcode. 5.6.5 Valid Slots Issue 02 (2007-09-10)

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The slots valid for the SL4 vary with the version of the board. 5.6.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL4 indicates the optical interface type. 5.6.7 Board Configuration Reference You can use the T2000 to set parameters for the SL4. 5.6.8 Technical Specifications The technical specifications of the SL4 cover the optical interface specifications, board dimensions, weight and power consumption.

5.6.1 Version Description The SL4 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which is housed in a divided slot in a subrack. Table 5-23 lists the details on the versions of the SL4 board. Table 5-23 Version Description of the SL4 Item

Description

Functional version

The SL4 has three versions, R1, N1 and N2.

Difference

The N2SL4 supports the TCM function. The N1 and R1SL4 do not support the TCM function. The R1SL4 is housed in a divided slot.

Replaceability

The versions cannot be replaced by each other.

5.6.2 Function and Feature The SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead bytes, and to perform the MSP protection. The SL4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. Table 5-24 lists the functions and features of the SL4. Table 5-24 Functions and features of the SL4

5-42

Function and Feature

SL4

Basic function

Receives and transmits 1 x STM-4 optical signals, and processes 1 x STM-4 standard or concatenation services.

Specification of the optical interface

Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-4.2 type complies with the standards defined by Huawei.

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Function and Feature

SL4

Specification of the optical module

Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the pluggable optical module SFP.

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenation services.

Overhead processing

Supports the processing of the SOH bytes of the STM-4 signals.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP, SNCP, SNCTP, and SNCMP.

Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Supports the optical-path-shared MSP and SNCP protection. Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.6.3 Working Principle and Signal Flow The SL4 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. Figure 5-17 shows the block diagram for the working principle of the SL4.

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Figure 5-17 Block diagram for the working principle of the SL4 155 MHz

622Mbit/s 622Mbit/s

O/E

S P I

O/E

622Mbit/s

S P I

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

622Mbit/s

O/E

622Mbit/s

Cross-connect unit

Cross-connect unit

622Mbit/s

.... 622Mbit/s

CDR

Reference clock

155 MHz PLL

622Mbit/s

CDR

RST

MST

MSA

HPT High speed bus

622Mbit/s 622Mbit/s

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module +3.3 V

+5 V +1.8 V

DC/DC converter

Cross-connect unit A

DC/DC converter

Frame header Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-4 units are described below:

O/E Conversion Module l

In the receive direction, the module converts the received optical signals into electrical signals.

l

In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides function to shut down the laser.

l

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

RST

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MST l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

l

MST provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Controls the laser.

l

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter It provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.6.4 Front Panel On the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 5-18 shows the appearance of the front panel of the N1SL4/N2SL4. Issue 02 (2007-09-10)

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Figure 5-18 Front panel of the N1SL4/N2SL4 SL4 STAT ACT PROG SRV

CLASS1 LASER PRODUCT

OUT

IN

SL4

Figure 5-19 shows the appearance of the front panel of the R1SL4. Figure 5-19 Front panel of the R1SL4

SL4 STAT ACT PROG SRV

OUT IN

SL4

Indicators The following indicators are present on the front panel of the board: 5-46

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l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There is one pair of optical interfaces on the front panel of the SL4. Table 5-25 lists the type and usage of the optical interfaces. Table 5-25 Optical interfaces of the SL4 Interface

Interface Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

The SL4 board can use the pluggable optical modules for easy maintenance.

5.6.5 Valid Slots The slots valid for the SL4 vary with the version of the board. The slots valid for the SL4 are as follows: l

The R1SL4 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500A subrack.

l

The N1SL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l

The N2SL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l

The R1SL4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack.

l

The N1SL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

l

The N2SL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.6.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL4 indicates the optical interface type. Table 5-26 lists the relation between the board feature code and optical interface type for the SL4. Table 5-26 Relation between the board feature code and the optical interface type of the SL4

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Board

Feature Code

Optical Interface Type

SSN1SL410, SSN2SL410

10

S-4.1

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Board

Feature Code

Optical Interface Type

SSN1SL411, SSN2SL411

11

L-4.1

SSN1SL412, SSN2SL412

12

L-4.2

SSN1SL413, SSN2SL413

13

Ve-4.2

SSN1SL414, SSN2SL414

14

I-4

5.6.7 Board Configuration Reference You can use the T2000 to set parameters for the SL4. You can use the T2000 to set the following parameters for the SL4: l

J0

l

J1

l

C2

For details on the parameters, refer to F Board Configuration Reference.

5.6.8 Technical Specifications The technical specifications of the SL4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 5-27 lists the specifications of the optical interfaces of the SL4. Table 5-27 Specifications of the optical interfaces of the SL4

5-48

Item

Specification

Nominal bit rate

622080 kbit/s

Line code

NRZ

Optical interface type

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source type

MLM

MLM

SLM

SLM

SLM

Working wavelength (nm)

1261–1360

1274–1356

1280–1335

1480–1580

1480–1580

Launched optical power (dBm)

–15 to –8

–15 to –8

–3 to +2

–3 to +2

–3 to +2

Receiver sensitivity (dBm)

–23

–28

–28

–28

–34

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Item

Specification

Overload optical power (dBm)

–8

–8

–8

–8

–13

Min. extinction ratio (dB)

8.2

8.2

10

10

10.5

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the N1SL4/N2SL4 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

The mechanical specifications of the R1SL4 are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.5

Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1SL4/N2SL4 is 15 W. In the normal temperature (25℃), the maximum power consumption of the R1SL4 is 10 W.

5.7 SLD4 This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.7.1 Version Description The SLD4 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board, which is housed in a divided slot in a subrack. 5.7.2 Function and Feature The SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. 5.7.3 Working Principle and Signal Flow The SLD4 board consists of the O/E conversion module, CDR module, SDH overhead processing module so on. 5.7.4 Front Panel On the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode. Issue 02 (2007-09-10)

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5.7.5 Valid Slots The slots valid for the SLD4 vary with the cross-connect capacity of the subrack. 5.7.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLD4 indicates the optical interface type. 5.7.7 Board Configuration Reference You can use the T2000 to set parameters for the SLD4. 5.7.8 Technical Specifications The technical specifications of the SLD4 cover the optical interface specifications, board dimensions, weight and power consumption.

5.7.1 Version Description The SLD4 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board, which is housed in a divided slot in a subrack. Table 5-28 lists the details on the versions of the SLD4 board. Table 5-28 Version Description of the SLD4 Item

Description

Functional version

The SLD4 has three versions, R1, N1 and N2.

Difference

The N2SLD4 supports the TCM function. The N1SLD4 and R1SLD4 do not support the TCM function. The SLD4 board of the R1SLD4 is housed in a divided slot.

Replaceability

The versions cannot be replaced by each other.

5.7.2 Function and Feature The SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. Table 5-29 lists the functions and features of the SLD4. Table 5-29 Functions and features of the SLD4

5-50

Function and Feature

SLD4

Basic function

Receives and transmits 2 x STM-4 optical signals, and processes 2 x STM-4 standard or concatenation services.

Specification of the optical interface

Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-4.2 type complies with the standards defined by Huawei.

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Function and Feature

SLD4

Specifications of the optical module

Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the pluggable optical module SFP.

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenation services.

Overhead processing

Supports the processing of the SOH bytes of the STM-4 signals. Supports the transparent transmission or termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Supports one to two channels of ECC communication.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP, SNCP, SNCTP, and SNCMP. Supports the optical-path-shared MSP and SNCP protection.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.7.3 Working Principle and Signal Flow The SLD4 board consists of the O/E conversion module, CDR module, SDH overhead processing module so on. Figure 5-20 shows the block diagram for the working principle of the SLD4.

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Figure 5-20 Block diagram for the working principle of the SLD4 155 MHz

622Mbit/s 622Mbit/s

O/E

S P I

O/E

622Mbit/s

S P I

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

622Mbit/s

O/E

622Mbit/s

Cross-connect unit

Cross-connect unit

622Mbit/s

.... 622Mbit/s

CDR

Reference clock

155 MHz PLL

622Mbit/s

CDR

RST

MST

MSA

HPT High speed bus

622Mbit/s 622Mbit/s

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module +3.3 V

+5 V +1.8 V

DC/DC converter

Cross-connect unit A

DC/DC converter

Frame header Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-4 units are described below:

O/E Conversion Module l

In the receive direction, the module converts the received optical signals into electrical signals.

l

In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides function to shut down the laser.

l

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

RST

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MST l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

l

MST provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Controls the laser.

l

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter It provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.7.4 Front Panel On the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 5-21 shows the appearance of the front panel of the N1SLD4/N2SLD4. Issue 02 (2007-09-10)

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Figure 5-21 Front panel of the N1SLD4/N2SLD4 SLD4 STAT ACT PROG SRV CLASS1 LASER PRODUCT

OUT1 IN1 OUT2 IN2

SLD4

Figure 5-22 shows the appearance of the front panel of the R1SLD4. Figure 5-22 Front panel of the R1SLD4

SLD4 STAT ACT PROG SRV

OUT IN OUT IN

SLD4

Indicators The following indicators are present on the front panel of the board: 5-54

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l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are two pairs of optical interfaces on the front panel of the SLD4. Table 5-30 lists the type and usage of the optical interfaces. Table 5-30 Optical interfaces of the SLD4 Interface

Interface Type

Usage

IN1-IN2

LC

Receives optical signals.

OUT1-OUT2

LC

Transmits optical signals.

The SLD4 board can use the pluggable optical modules for easy maintenance.

5.7.5 Valid Slots The slots valid for the SLD4 vary with the cross-connect capacity of the subrack. The slots valid for the SLD4 are as follows: l

The R1SLD4 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500A subrack.

l

The N1SLD4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l

The N2SLD4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l

The R1SLD4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack. For the board housed in any of slots 1–3 and 11–13, two optical interfaces can be configured. For the board housed in any of slots 6–9, one optical interface can be configured.

l

The N1SLD4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

l

The N2SLD4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.7.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLD4 indicates the optical interface type. Table 5-31 lists the relation between the board feature code and optical interface type for the SLD4.

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Table 5-31 Relation between the board feature code and the optical interface type of the SLD4 Board

Feature Code

Optical Interface Type

SSN1SLD410, SSN2SLD410

10

S-4.1

SSN1SLD411, SSN2SLD411

11

L-4.1

SSN1SLD412, SSN2SLD412

12

L-4.2

SSN1SLD413, SSN2SLD413

13

Ve-4.2

SSN1SLD414, SSN2SLD414

14

I-4

5.7.7 Board Configuration Reference You can use the T2000 to set parameters for the SLD4. You can use the T2000 to set the following parameters for the SLD4: l

J0

l

J1

l

C2

For details on the parameters, refer to F Board Configuration Reference.

5.7.8 Technical Specifications The technical specifications of the SLD4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 5-32 lists the specifications of the optical interfaces of the SLD4. Table 5-32 Specifications of the optical interfaces of the SLD4

5-56

Item

Specification

Nominal bit rate

622080 kbit/s

Line code

NRZ

Optical interface type

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source interface

MLM

MLM

SLM

SLM

SLM

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Item

Specification

Working wavelength (nm)

1261–1360

1274–1356

1280–1335

1480–1580

1480–1580

Launched optical power (dBm)

–15 to –8

–15 to –8

–3 to +2

–3 to +2

–3 to +2

Receiver sensitivity (dBm)

–23

–28

–28

–28

–34

Overload optical power (dBm)

–8

–8

–8

–8

–13

Min. extinction ratio (dB)

8.2

8.2

10

10

10.5

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the N1SLD4/N2SLD4 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

The mechanical specifications of the R1SLD4 are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.5

Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1SLD4/N2SLD4 is 15 W. In the normal temperature (25℃), the maximum power consumption of the R1SLD4 is 11 W.

5.8 SLQ4 This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.8.1 Version Description The SLQ4 board has two versions, N1 and N2. The difference between the two versions lies in the support for the TCM function. Issue 02 (2007-09-10)

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5.8.2 Function and Feature The SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. 5.8.3 Working Principle and Signal Flow The SLQ4 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.8.4 Front Panel On the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety class label. 5.8.5 Valid Slots The SLQ4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 5.8.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ4 indicates the optical interface type. 5.8.7 Board Configuration Reference You can use the T2000 to set parameters for the SLQ4. 5.8.8 Technical Specifications The technical specifications of the SLQ4 cover the optical interface specifications, board dimensions, weight and power consumption.

5.8.1 Version Description The SLQ4 board has two versions, N1 and N2. The difference between the two versions lies in the support for the TCM function. Table 5-33 lists the details on the versions of the SLQ4 board. Table 5-33 Version Description of the SLQ4 Item

Description

Functional version

The SLQ4 has two versions, N1 and N2.

Difference

The N2SLQ4 supports the TCM function. The N1SLQ4 does not support the TCM function.

Replaceability

The versions cannot be replaced by each other.

5.8.2 Function and Feature The SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. Table 5-34 lists the functions and features of the SLQ4.

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Table 5-34 Functions and features of the SLQ4 Function and Feature

SLQ4

Basic function

Transmits and receives 4 x STM-4 optical signals.

Specification of the optical interface

Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-4.2 type complies with the standards defined by Huawei.

Specification of the optical module

Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the pluggable optical module SFP .

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenation services.

Overhead processing

Supports the processing of the SOH bytes of the STM-4 signals. Supports the transparent transmission or termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Supports one to four channels of ECC communication.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP, SNCP, SNCTP and SNCMP. Supports the optical-path-shared MSP and SNCP protection.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.8.3 Working Principle and Signal Flow The SLQ4 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. Figure 5-23 shows the block diagram for the working principle of the SLQ4.

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Figure 5-23 Block diagram for the working principle of the SLQ4 155 MHz

622Mbit/s 622Mbit/s

O/E

S P I

O/E

622Mbit/s

S P I

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

622Mbit/s

O/E

622Mbit/s

Cross-connect unit

Cross-connect unit

622Mbit/s

.... 622Mbit/s

CDR

Reference clock

155 MHz PLL

622Mbit/s

CDR

RST

MST

MSA

HPT High speed bus

622Mbit/s 622Mbit/s

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module +3.3 V

+5 V +1.8 V

DC/DC converter

Cross-connect unit A

DC/DC converter

Frame header Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-4 units are described below:

O/E Conversion Module l

In the receive direction, the module converts the received optical signals into electrical signals.

l

In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides function to shut down the laser.

l

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

RST

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MST l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

l

MST provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Controls the laser.

l

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter It provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.8.4 Front Panel On the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 5-24 shows the appearance of the front panel of the SLQ4. Issue 02 (2007-09-10)

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Figure 5-24 Front panel of the SLQ4 SLQ4 STAT ACT PROG SRV

CLASS1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

SLQ4

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four pairs of optical interfaces on the front panel of the SLQ4. Table 5-35 lists the type and usage of the optical interfaces. Table 5-35 Optical interfaces of the SLQ4 Interface

Interface Type

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

The SLQ4 board can use the pluggable optical modules for easy maintenance. 5-62

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5.8.5 Valid Slots The SLQ4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.8.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ4 indicates the optical interface type. Table 5-36 lists the relation between the board feature code and optical interface type for the SLQ4. Table 5-36 Relation between the board feature code and the optical interface type of the SLQ4 Board

Feature Code

Optical interface type

SSN1SLQ410, SSN2SLQ410

10

S-4.1

SSN1SLQ411, SSN2SLQ411

11

L-4.1

SSN1SLQ412, SSN2SLQ412

12

L-4.2

SSN1SLQ413, SSN2SLQ413

13

Ve-4.2

SSN1SLQ414, SSN2SLQ414

14

I-4

5.8.7 Board Configuration Reference You can use the T2000 to set parameters for the SLQ4. You can use the T2000 to set the following parameters for the SLQ4: l

J0

l

J1

l

C2

For details on the parameters, refer to F Board Configuration Reference.

5.8.8 Technical Specifications The technical specifications of the SLQ4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 5-37 lists the specifications of the optical interfaces of the SLQ4. Issue 02 (2007-09-10)

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Table 5-37 Specifications of the optical interfaces of the SLQ4 Item

Specification

Nominal bit rate

622080 kbit/s

Line code

NRZ

Optical interface type

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source type

MLM

MLM

SLM

SLM

SLM

Working wavelength (nm)

1261–1360

1274–1356

1280–1335

1480–1580

1480–1580

Launched optical power (dBm)

–15 to –8

–15 to –8

–3 to +2

–3 to +2

–3 to +2

Receiver sensitivity (dBm)

–23

–28

–28

–28

–34

Overload optical power (dBm)

–8

–8

–8

–8

–13

Min. extinction ratio (dB)

8.2

8.2

10

10

10.5

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the SLQ4 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the SLQ4 is 16 W.

5.9 SL16 This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.9.1 Version Description 5-64

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The SL16 board has three versions, N1, N2 and N3. The difference among the three versions lies in the support for the TCM function and AU-3 services. 5.9.2 Function and Feature The SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process the overhead. 5.9.3 Working Principle and Signal Flow The SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead processing module, RST and so on. 5.9.4 Front Panel On the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label, and APD alarm label. 5.9.5 Valid Slots The SL16 board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and any of slots 11–13 in the OptiX OSN 1500B subrack. 5.9.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL16 indicates the optical interface type. 5.9.7 Board Configuration Reference You can use the T2000 to set parameters for the SL16. 5.9.8 Technical Specifications The technical specifications of the SL16 cover the optical interface specifications, board dimensions, weight and power consumption.

5.9.1 Version Description The SL16 board has three versions, N1, N2 and N3. The difference among the three versions lies in the support for the TCM function and AU-3 services. Table 5-38 lists the details on the versions of the SL16 board. Table 5-38 Version Description of the SL16 Item

Description

Functional version

The SL16 has three versions, N1, N2 and N3.

Difference

The N1SL16 does not support the TCM function and AU-3 services. The N2SL16 supports the TCM function, and it can be configured with AU-3 services. The TCM function and AU-3 services cannot be configured on the N3SL16 at the same time. The N3SL16 supports the board version replacement function.

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Item

Description

Replaceability

The N1SL16 and N2SL16 cannot be replaced by each other. When the TCM function and AU-3 services are not required, the N3SL16 can fully replace the N2SL16 and N1SL16. The N3SL16 supports the board version replacement function and can replace the N1SL16. After the N1SL16 is replaced, the N3SL16 is consistent with the N1SL16 in configuration and service status.

5.9.2 Function and Feature The SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process the overhead. Table 5-39 lists the functions and features of the SL16. Table 5-39 Functions and features of the SL16 Function and Feature

SL16

Basic function

Transmits and receives 1 x STM-16 optical signals.

Specification of the optical interface

Supports optical interfaces of the L-16.2, L-16.2Je, V-16.2Je (with BA), U-16.2Je (with BA and PA) types. The optical interface of the L-16.2 type complies with ITU-T G.957 and ITU-T G.692 in features. The optical interfaces of the L-16.2Je, V-16.2Je (with BA), and U-16.2Je (with BA and PA) comply with the standards defined by Huawei. Supports the output of standard wavelengths that comply with ITU-T G.692. The U-16.2Je optical interface can be directly connected to the DWDM equipment.

Specification of the optical module

Supports detection and query of the information on the optical module.

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, and VC-4-16c concatenation services.

The optical interface supports the function of setting the on/off state of the laser and the ALS function.

Supports AU-3 services. Overhead processing

Supports the processing of the SOH of the STM-16 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

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Alarm and performance event

Provides rich alarms and performance events.

Processing of the K byte

Processes two sets of K bytes. One SL16 board supports a maximum of two MSP protection rings.

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Function and Feature

SL16

Specifications of the REG

Supports the setting and query of the REG working mode.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, SNCP, SNCTP and SNCMP. Supports the optical-path-shared MSP and SNCP protection.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

5.9.3 Working Principle and Signal Flow The SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead processing module, RST and so on. Figure 5-25 shows the block diagram for the working principle of the SL16. Figure 5-25 Block diagram for the working principle of the SL16 155 MHz

2.488 Gbit/s

2.488 Gbit/s

S P I O/E

K1 and K2

K1 and K2 insertion/extration

Cross-connect unit

Cross-connect unit

DEMUX

O/E

2.488 Gbit/s

16 x 155 Mbit/s

Reference clock

155 MHz PLL

2.488 Gbit/s

16 x 155 Mbit/s

RST

MST

MSA

high speed bus

Cross-connect unit A

high speed bus

Cross-connect unit B

HPT

MUX

DCC SDH overhead processing module

IIC

Communication and control module

LOS Laser shut down

+3.3 V 5V +1.8 V

DC/DC converter

DC/DC converter

Frame header Communication

SCC unit

Cross-connect unit SCC unit

-48 V/-60 V

Fuse

-48 V/-60 V Fuse

+3.3 V

+3.3 V backup power

O/E Conversion Module l

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In the transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides the function to shut down the laser.

MUX/DEMUX Module l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time.

l

In the transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module It includes RST, MST, MSA and HPT, and provides outloop and inloop function.

RST l

In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, and BIP-8 errored block count.

l

In the transmitting direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

l

In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection.

l

In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion of MS_REI MS_RDI and MS_AIS.

l

Provides extraction or insertion of K1 byte and K2 byte.

l

In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module

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l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface. Huawei Technologies Proprietary

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l

Tracing the clock signal from the active and the standby cross-connect units.

l

Implements laser controlling function.

l

Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting the ADM when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter Module This module provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also provides protection for the board +3.3V power supply.

l

5.9.4 Front Panel On the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label, and APD alarm label.

Appearance of the Front Panel Figure 5-26 shows the appearance of the front panel of the SL16. Figure 5-26 Front panel of the SL16 SL16 STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

!

APD

Receiver MAX:-9dBm

OUT

IN

SL16

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There is one pair of optical interfaces on the front panel of the SL16. Table 5-40 lists the type and usage of the optical interfaces. Table 5-40 Optical interfaces of the SL16 Interface

Interface Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

5.9.5 Valid Slots The SL16 board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and any of slots 11–13 in the OptiX OSN 1500B subrack.

5.9.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL16 indicates the optical interface type. Table 5-41 lists the relation between the board feature code and optical interface type for the SL16. Table 5-41 Relation between the board feature code and the optical interface type for the SL16

5-70

Board

Feature Code

Optical interface type

SSN1SL1601, SSN2SL1601

01

L-16.2

SSN1SL1602, SSN2SL1602, SSN3SL1602

02

L-16.2Je

SSN1SL1603, SSN2SL1603, SSN3SL1603

03

V-16.2Je

SSN1SL1604, SSN2SL1604, SSN3SL1604

04

U-16.2

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5.9.7 Board Configuration Reference You can use the T2000 to set parameters for the SL16. You can use the T2000 to set the following parameters for the SL16: l

J0

l

J1

l

C2

For details on the parameters, refer to F Board Configuration Reference.

5.9.8 Technical Specifications The technical specifications of the SL16 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 5-42 lists the specifications of the optical interfaces of the SL16. Table 5-42 Specifications of the optical interfaces of the SL16

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Item

Specification

Nominal bit rate

2488320 kbit/s

Optical Interface Type

L-16.2

L-16.2Je

V-16.2Je (BA)

U-16.2Je (BA+PA)

Optical source type

SLM

SLM

SLM

SLM

Working wavelengt h (nm)

1500–1580

1530–1560

1530–1565

1550.12

Launched optical power (dBm)

–2 to +3

5 to 7

–2 to +3 (without BA)

Receiver sensitivity (dBm)

–28

–28

Overload optical power (dBm)

–9

–9

13 to 15 (with BA)

–2 to +3 (without BA and PA)

15 to 18 (with BA)

–28

–28 (without PA and BA)

–32 (with PA)

–9

–9 (without PA and BA)

–10 (with PA)

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Item

Specification

Min. extinction ratio (dB)

8.2

8.2

8.2

8.2

Note: The optical interface of the Le-16.2 type is the same as the optical interface of the L-16.2Je type. The launched optical power of the optical interface of the V-16.2Je type is measured when the booster amplifer (BA) is added. The launched optical power of the optical interfaces of the V-16.2Je and U-16.2Je types ranges from –2 dBm to –3 dBm when no BA is added. Table 5-43 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths Item

Specification

Nominal bit rate

2488320 kbit/s

Dispersion limit (km)

170

640

Mean launched optical power (dBm)

–2 to +3

–5 to –1

Receiver sensitivity (dBm)

–28

–28

Min. overload (dBm)

–9

–9

Max. allowed dispersion (ps/nm)

3400

10880

Min. extinction ratio (dB)

8.2

10

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the SL16 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1SL16 is 20 W. In the normal temperature (25℃), the maximum power consumption of the N2SL16 is 20 W. In the normal temperature (25℃), the maximum power consumption of the N3SL16 is 22 W.

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5.10 SL16A This section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.10.1 Version Description The SL16A board has three versions, N1, N2, and N3. The difference among the three versions lies in the support for the TCM function. 5.10.2 Function and Feature The SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process the overhead bytes, and to perform the MSP protection. 5.10.3 Working Principle and Signal Flow The SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead processing module, RST and so on. 5.10.4 Front Panel On the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label, and APD alarm label. 5.10.5 Valid Slots The SL16A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL16A can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 5.10.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL16A indicates the optical interface type. 5.10.7 Board Configuration Reference You can use the T2000 to set the J0 parameter for the SL16A. 5.10.8 Technical Specifications The technical specifications of the SL16A cover the optical interface specifications, board dimensions, weight and power consumption.

5.10.1 Version Description The SL16A board has three versions, N1, N2, and N3. The difference among the three versions lies in the support for the TCM function. Table 5-44 lists the details on the versions of the SL16A board. Table 5-44 Version Description of the SL16A

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Item

Description

Functional version

The SL16A has three versions, N1, N2, and N3.

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Item

Description

Difference

The N1SL16A does not support the TCM function and AU-3 services. The N2SL16A supports the TCM function, and it can be configured with AU-3 services. The TCM function and AU-3 services cannot be configured on the N3SL16A at the same time. The N3SL16A supports the board version replacement function and can replace the N3SL16A and N1SL16A. After the N3SL16A and N1SL16A are replaced, the N3SL16A and N1SL16A are consistent with the N1SL16A in configuration and service status.

Replaceability

The N1SL16A and N2SL16A cannot be replaced by each other. When the TCM function and AU-3 services are not required, the N3SL16A can fully replace the N2SL16A and N1SL16A.

5.10.2 Function and Feature The SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process the overhead bytes, and to perform the MSP protection. Table 5-45 lists the functions and features of the SL16A. Table 5-45 Functions and features of the SL16A Function and Feature

SL16A

Basic function

Transmit and receive 1 x STM-16 optical signals.

Specification of the optical interface

Supports optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2 types. The optical interfaces comply with ITU-T G.957 and ITU-T G.692 in features. Supports the output of standard wavelengths that comply with ITU-T G.692 and can be directly connected to the DWDM equipment.

Specification of the optical module

Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the SFP pluggable optical module.

5-74

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, and VC-4-16c concatenation services.

Overhead processing

Supports the processing of the SOH bytes of the STM-16 signals.

Alarm and performance event

Provides rich alarms and performance events.

Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0 bytes.

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Function and Feature

SL16A

Processing of the K byte

Processes two sets of the K bytes.

Specifications of the REG

Supports the setting and query of the REG working mode.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, SNCP, SNCTP and SNCMP. Supports the optical-path-shared MSP and SNCP protection.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports AU-3 services.

5.10.3 Working Principle and Signal Flow The SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead processing module, RST and so on. Figure 5-27 shows the block diagram for the working principle of the N1SL16A and N2SL16A. Figure 5-27 Block diagram for the working principle of the N1SL16A and N2SL16A 155 MHz

2.488 Gbit/s

2.488 Gbit/s

S P I O/E

K1 and K2

K1 and K2 insertion/extration

Cross-connect unit

2.488 Gbit/s

16 x 155 Mbit/s

RST

MST

MSA

high speed bus

Cross-connect unit A

high speed bus

Cross-connect unit B

HPT

MUX

DCC SDH overhead processing module

IIC

Communication and control module

LOS Laser shut down

+3.3 V 5V +1.8 V

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Cross-connect unit

DEMUX

O/E

2.488 Gbit/s

16 x 155 Mbit/s

Reference clock

155 MHz PLL

DC/DC converter

DC/DC converter

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Frame header Communication

SCC unit

Cross-connect unit SCC unit

-48 V/-60 V

Fuse

-48 V/-60 V Fuse

+3.3 V

+3.3 V backup power

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Figure 5-28 shows the block diagram for the working principle of the N3SL16A. Figure 5-28 Block diagram for the working principle of the N3SL16A 155 MHz

2.488 Gbit/s

2.488 Gbit/s

K1 and K2

K1 and K2 insertion/extration

Cross-connect unit

Cross-connect unit

DEMUX

O/E S P I

2.488 Gbit/s

16 x 155 Mbit/s

Reference clock

155 MHz PLL

2.488 Gbit/s

16 x 155 Mbit/s

RST

MST

MSA

Cross-connect unit A

high speed bus

Cross-connect unit B

HPT

MUX

O/E

high speed bus

DCC

SCC unit

SDH overhead processing module

IIC

Communication and control module

LOS Laser shut down

+3.3 V 5V +1.8 V

DC/DC converter

DC/DC converter

Frame header Communication

Cross-connect unit SCC unit

-48 V/-60 V

Fuse

-48 V/-60 V Fuse

+3.3 V

+3.3 V backup power

O/E Conversion Module l

In the receive direction, it converts the received optical signals into electrical signals.

l

In the transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides the function to shut down the laser.

MUX/DEMUX Module l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time.

l

In the transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module It includes RST, MST, MSA and HPT, and provides outloop and inloop function.

RST

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l

In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, and BIP-8 errored block count.

l

In the transmitting direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

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MST l

In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection.

l

In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion of MS_REI MS_RDI and MS_AIS.

l

Provides extraction or insertion of K1 byte and K2 byte.

l

In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Tracing the clock signal from the active and the standby cross-connect units.

l

Implements laser controlling function.

l

Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting the ADM when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter Module l

This module provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also provides protection for the board +3.3V power supply.

5.10.4 Front Panel On the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label, and APD alarm label.

Appearance of the Front Panel Figure 5-29 shows the appearance of the front panel of the SL16A. Issue 02 (2007-09-10)

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Figure 5-29 Front panel of the SL16A SL16A STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

APD

!

Receiver MAX:-9dBm

OUT

IN

SL16A

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There is one pair of optical interfaces on the front panel of the SL16A. Table 5-46 lists the type and usage of the optical interfaces. Table 5-46 Optical interfaces of the SL16A

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Interface

Interface Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

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5.10.5 Valid Slots The SL16A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL16A can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.10.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL16A indicates the optical interface type. Table 5-47 lists the relation between the board feature code and optical interface type for the SL16A. Table 5-47 Relation between the board feature code and the optical interface type Board

Feature Code

Optical Interface Type

SSN1SL16A01, SSN2SL16A01, SSN3SL16A01

01

I-16

SSN1SL16A02, SSN2SL16A02, SSN3SL16A02

02

S-16.1

SSN1SL16A03, SSN2SL16A03, SSN3SL16A03

03

L-16.1

SSN1SL16A04, SSN2SL16A04, SSN3SL16A04

04

L-16.2

5.10.7 Board Configuration Reference You can use the T2000 to set the J0 parameter for the SL16A. For details on the parameter, refer to F Board Configuration Reference.

5.10.8 Technical Specifications The technical specifications of the SL16A cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 5-48 lists the specifications of the optical interfaces of the SL16A. Table 5-48 Specifications of the optical interfaces of the SL16A

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Item

Specification

Nominal bit rate

2488320 kbit/s

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Item

Specification

Optical Interface Type

I-16

S-16.1

L-16.1

L-16.2

Optical source type

MLM

SLM

SLM

SLM

Working wavelength (nm)

1266–1360

1260–1360

1280–1335

1500–1580

Launched optical power (dBm)

–10 to –3

–5 to 0

–2 to +3

–2 to +3

Receiver sensitivity (dBm)

–18

–18

–27

–28

Overload optical power (dBm)

–3

0

–9

–9

Min. extinction ratio (dB)

8.2

8.2

8.2

8.2

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the SL16A are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg):

l

–

N1SL16A and N2SL16A:1.1

–

N3SL16A:0.9

Weight (kg):1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1SL16A and N2SL16A are 20 W. In the normal temperature (25℃), the maximum power consumption of the N3SL16A is 17 W. 5-80

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5.11 SF16 This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FEC function, in terms of the version, function, working principle, front panel and specifications. 5.11.1 Version Description The functional version of the SF16 board is N1. 5.11.2 Function and Feature The SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) optical signals and to process the overhead. 5.11.3 Working Principle and Signal Flow The SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDH overhead processing module and so on. 5.11.4 Front Panel On the front panel of the SF16, there are indicators, interfaces, barcode and laser safety class label. 5.11.5 Valid Slots The SF16 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SF16 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 5.11.6 Board Configuration Reference You can use the T2000 to set parameters for the SF16. 5.11.7 Technical Specifications The technical specifications of the SF16 cover the optical interface specifications, board dimensions, weight and power consumption.

5.11.1 Version Description The functional version of the SF16 board is N1.

5.11.2 Function and Feature The SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) optical signals and to process the overhead. Table 5-49 lists the functions and features of the SF16. Table 5-49 Functions and features of the SF16 Function and Feature

SF16

Basic function

Receives and transmits 1 x OTU1 (2.666 Gbit/s, FEC) optical signals. Supports the enabling or disabling of the FEC function.

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Function and Feature

SF16

Specification of the optical interface

Supports optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types. The optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types comply with the standards defined by Huawei. The optical interface supports the output of standard wavelengths that comply with ITU-T G.692 and can be directly connected to the DWDM equipment.

Specification of the optical module

Supports detection and query of the information on the optical module.

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, and VC-4-16c concatenation services.

The optical interface supports the function of setting the on/off state of the laser and the ALS function.

Supports AU-3 services. The SF16 board encapsulates and encodes signals with the FEC function, and processes overhead bytes, which comply with ITU-T G.709. Overhead processing

Supports the processing of the OTU, ODU, and OPU overhead bytes, performance monitoring, and alarm detection, which comply with ITU-T G.709. Supports the processing of the SOH of the STM-16 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event

Provides rich alarms and performance events.

Processing of the K byte

Processes two sets of K bytes. One SF16 board supports a maximum of two MSP protection rings.

Specification of the REG

Supports the setting and query of the REG working mode.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, SNCP, SNCTP and SNCMP.

Supports alarms and performance events related to the OTU, ODU, and OPU layers and the FEC function.

Supports the optical-path-shared MSP and SNCP protection. Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

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5.11.3 Working Principle and Signal Flow The SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDH overhead processing module and so on. Figure 5-30 shows the block diagram for the working principle of the SF16. Figure 5-30 Block diagram for the working principle of the SF16 155 MHz PLL

2.666 Gbit/s

2.666 Gbit/s

O/E

16x155 Mbit/s

16x166 Mbit/s

155 MHz PLL

Reference clock

K1 and K2

K1 and K2 insertion/extration

Cross-connect unit

Cross-connect unit

high speed bus

S P I

2.666 Gbit/s

DEMUX

155 MHz

Cross-connect unit

FEC 2.666 Gbit/s

O/E

16x155 Mbit/s

16x166 Mbit/s

RST

MST

MSA

HPT high speed bus

MUX DCC SDH overhead processing module

166 MHz PLL IIC LOS Laser shut down

Communication and control module +3.3 V

5V +1.8 V

DC/DC converter

DC/DC converter

Frame header Communication

Fuse

Cross-connect unit

SCC unit

Cross-connect unit SCC unit -48 V/-60 V -48 V/-60 V

Fuse

+3.3 V backup power

The function modules are described below:

O/E Conversion Module l

In the receive direction, the module converts the received 2.666 Gbit/s FEC optical signals into electrical signals.

l

In the transmit direction, the module converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides function to shut down the laser.

MUX/DEMUX Module l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovers the clock signal at the same time.

l

In the transmit direction, the MUX part multiplexes the parallel electrical signals received from the FEC module into high rate electrical signals.

l

In the downstream direction, the FEC encoding and decoding module receives 2.488 Gbit/ s SDH signals, which are sent by the SDH overhead processing chip. After frame search,

FEC Module

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FEC encoding, data packets encapsulation and scrambling, the 2.488 Gbit/s SDH signals are converted to 2.666 Gbit/s signals and then transmitted to the MUX module. l

In the upstream direction, signals take the reverse process. The FEC encoding and decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After frame search, FEC encoding, data packets encapsulation and scrambling in the FEC module, the 2.488 Gbit/s signals are recovered and then transmitted to SDH overhead processing chip. The frame format of the 2.666 Gbit/s signals complies with ITU G.709.

l

The FEC processing module connects to the communication and control unit through a CPU bus. The CPU controls working modes of the FEC module by configuring the internal register. The working mode can be regenerator mode, that is, REG mode. The CPU can monitor the performance through the internal register.

SDH Overhead Processing Module This module includes RST, MST, MSA and HPT. It also provides inloop and outloop function.

RST l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0), mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

l

In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

l

Provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, and AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring)

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module l

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l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect unit.

l

Controls the laser.

l

Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting the ADM when the CXL is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC Converter It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3V power supply.

5.11.4 Front Panel On the front panel of the SF16, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 5-31 shows the appearance of the front panel of the SF16. Figure 5-31 Front panel of the SF16

SF 16 STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT

IN

SF16

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There is one pair of optical interfaces on the front panel of the SF16. Table 5-50 lists the type and usage of the optical interfaces. NOTE

The SF16 uses the unpluggable optical module.

Table 5-50 Optical interfaces of the SF16 Interface

Interface Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

5.11.5 Valid Slots The SF16 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SF16 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.11.6 Board Configuration Reference You can use the T2000 to set parameters for the SF16. You can use the T2000 to set the following parameters for the SF16: l

J0

l

J1

l

C2

For details on the parameters, refer to F Board Configuration Reference.

5.11.7 Technical Specifications The technical specifications of the SF16 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 5-51 lists the specifications of the optical interfaces of the SF16. 5-86

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Table 5-51 Specifications of the optical interfaces of the SF16 Item

Specification

Nominal bit rate

2666057.143 kbit/s

Service processing capability

1 x STM-16 standard services or concatenation services

Line code

NRZ

Optical Interface Typea

Ve-16.2c

Ve-16.2d

Ve-16.2f

FEC+BA(14) +PA

FEC+BA(17) +PA

FEC+BA(17)+RA+PA

Optical source type

SLM

SLM

SLM

Wavelength (nm)

1550.12

Launched optical power (dBm)b

–5 to –1

–5 to –1

–5 to –1

Launched optical power (dBm)c

13–15

13–15

15–18

Receiver sensitivity (dBm)b

–27.5

–27.5

–27.5

Receiver sensitivity (dBm)d

–37

–37

–42

Overload optical power (dBm)d

–10

–10

–10

Min. extinction ratio (dB)b

10

10

10

a: The numbers in the brackets indicate the specifications. For example, BA (14) indicates that the optical power amplified by the BA is 14 dBm. "FEC+BA+PA+RA" indicates that the optical interface is used with the FEC, PA, Raman amplifier and BA. b: The specifications are for the optical module itself rather than for the amplifier. c: The specifications are for the BA. d: The specifications are for the PA. Table 5-52 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths

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Item

Specification

Nominal bit rate

2666057.143 kbit/s

Dispersion limit (km)

640

Mean launched optical power (dBm)

–5 to –1

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Item

Specification

Receiver sensitivity (dBm)

–28

Min. overload (dBm)

–9

Max. allowed dispersion (ps/nm)

10880

Min. extinction ratio (dB)

8.2

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the SF16 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the SF16 is 26 W.

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6 PDH Processing Boards

PDH Processing Boards

About This Chapter This chapter describes the PDH processing boards for the E1/T1, E3/T3, E4/STM-1, and DDN signals. 6.1 PL1 This section describes the PL1, a 16 x E1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.2 PD1 This section describes the PD1, a 32 x E1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.3 PQ1 This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.4 PQM This section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.5 PL3 This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.6 PL3A This section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.7 PD3 This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.8 PQ3 This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.9 DX1 Issue 02 (2007-09-10)

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This section describes the DX1, a DDN interface convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 6.10 DXA This section describes the DXA, a DDN convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 6.11 SPQ4 This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version, function, working principle, front panel and specifications.

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6.1 PL1 This section describes the PL1, a 16 x E1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.1.1 Version Description The functional version of the PL1 is R1. 6.1.2 Function and Feature The PL1 is used to directly access and process E1 electrical signals, to process the overhead, to report alarms and performance events and to provide the maintenance features. 6.1.3 Working Principle and Signal Flow The PL1 consists of the PPI, E1 mapping/demapping, interface conversion module, communication and control module and so on. 6.1.4 Front Panel On the front panel of the PL1, there are indicators and interfaces. 6.1.5 Valid Slots The PL1 can be housed in any of slots 6–9 of the OptiX OSN 1500A subrack or the OptiX OSN 1500B subrack. 6.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the PL1 indicates the interface impedance type. 6.1.7 Board Configuration Reference You can use the T2000 to set parameters for the PL1. 6.1.8 Technical Specifications The technical specifications of the PL1 cover the optical interface specifications, board dimensions, weight and power consumption.

6.1.1 Version Description The functional version of the PL1 is R1.

6.1.2 Function and Feature The PL1 is used to directly access and process E1 electrical signals, to process the overhead, to report alarms and performance events and to provide the maintenance features. Table 6-1 lists the functions and features of the PL1. Table 6-1 Functions and features of the PL1

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Function and Feature

PL1

Basic function

Processes 16 x E1 signals (interfaces available on the front panel).

Service processing

Directly accesses and processes 16 x E1 electrical signals.

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Function and Feature

PL1

Overhead processing

Supports the transparent transmission and termination of POH bytes at the VC-12 level, such as the J2 byte.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Maintenance feature

Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

6.1.3 Working Principle and Signal Flow The PL1 consists of the PPI, E1 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-1 shows the block diagram for the functions of the PL1. Figure 6-1 Block diagram for the functions of the PL1 1.5 MHz/ 2 MHz OSC

E1

E1

155 MHz PLL

155 Mbit/s

6 x 2 Mbit/s

LIU

E1 mapping/ demapping

P P I

6 x 2 Mbit/s

LIU

LOS Outloop/Inloop control

Reference clock

155 Mbit/s

Interface coversion module

+1.8 V

DC/DC converter

Cross-connect unit A

High speed bus

Cross-connect unit B

Cross-connect unit

Communication

+3.3 V

+2.5 V

High speed bus

Frame header

Communication and control module

DC/DC converter

Cross-connect unit

SCC Unit

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

Figure 6-2 shows the block diagram of the E1 mapping/demapping. 6-4

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Figure 6-2 Block diagram of the E1 mapping/demapping E1 mapping/demapping E1

LPA

PDH AIS Detector

LPT

LPOH(V5/J2/N2/ K4) insertion LPOH(V5/J2/N2/ K4) Extraction

HPA

HPT

STM-1

TU-AIS/TU-LOP Detector

E1

STM-1

LPA

LPT

HPA

HPT

The function modules are described as follows.

PPI The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: l

Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the PDH LOS signals.

E1 mapping/demapping l

LPA

l

The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as to be transported into the synchronous network for check of the PDH AIS.

l

LPT

l

The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the VC-12 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-12: V5, J2, N2, and K4.

l

HPA

l

HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TUG2->TUG3->VC-4.

l

HPT

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The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and POH.

l

MST and RST

l

These two functions are necessary to create a proprietary STM–1 signal in order to interface the “E1 mapping/demapping” block with the multiplex unit.

Interface conversion module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Control the indicator on the board.

DC/DC converter It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are provided to the board.

6.1.4 Front Panel On the front panel of the PL1, there are indicators and interfaces.

Appearance of the Front Panel Figure 6-3 shows the appearance of the front panel of the PL1. Figure 6-3 Front panel of the PL1

PL1 STAT ACT PROG SRV

1-16

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are 16 2mmHM interfaces on the front panel of the PL1. Table 6-2 lists the type and usage of the interfaces. Table 6-2 Interfaces on the front panel of the PL1 Interface

Interface Type

Usage

1–8

2mmHM

Receives the first eight channels (1–8) of E1 signals.

9–16

2mmHM

Receives the last eight channels (9–16) of E1 signals.

6.1.5 Valid Slots The PL1 can be housed in any of slots 6–9 of the OptiX OSN 1500A subrack or the OptiX OSN 1500B subrack.

6.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the PL1 indicates the interface impedance type. Table 6-3 lists the relation between the board feature code and interface impedance type for the PL1. Table 6-3 Relation between the board feature code and the optical interface type of the PL1 Board

Feature Code

Interface Impedance Type

SSR1PL1A01

A01

75 ohms

SSR1PL1B01

B01

120 ohms

6.1.7 Board Configuration Reference You can use the T2000 to set parameters for the PL1. You can use the T2000 to set the following parameters for the PL1: l

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V5 byte

l

Tributary loopback

l

Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.1.8 Technical Specifications The technical specifications of the PL1 cover the optical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications Table 6-4 lists the specifications of the optical interfaces of the PL1. Table 6-4 Specifications of the electrical interfaces of the PL1 Interface Type

Code

Output Signal Bit Rate

Allowed Input Frequency Deviation

2048 kbit/s

HDB3

Compliant with ITU-T G.703

Allowed Input Attenuatio n

Input Jitter Tolerance

Mechanical Specifications The mechanical specifications of the PL1 are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.5

Power Consumption In the normal temperature (25℃), the maximum power consumption of the PL1 is 7 W.

6.2 PD1 This section describes the PD1, a 32 x E1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.2.1 Version Description The PD1 has two versions, R1 and R2. The two versions have different functions. 6.2.2 Function and Feature The PD1 is used to process E1 signals and the overhead, to report alarms and performance events, and to provide the maintenance features and TPS protection. 6.2.3 Working Principle and Signal Flow The PD1 consists of the PPI, E1 mapping/demapping, interface conversion module, communication and control module and so on. 6.2.4 Front Panel 6-8

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On the front panel of the PD1, there are indicators. 6.2.5 Valid Slots The PD1 must be used with the L75S or L12S. 6.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the PD1 indicates the interface impedance type. 6.2.7 TPS Protection for the Board The PD1 supports the 1:N TPS protection. 6.2.8 Board Configuration Reference You can use the T2000 to set parameters for the PD1. 6.2.9 Technical Specifications The technical specifications of the PD1 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.2.1 Version Description The PD1 has two versions, R1 and R2. The two versions have different functions. Table 6-5 lists the details on the versions of the PD1 board. Table 6-5 Version Description of the PD1 Item

Description

Functional version

The PD1 has two versions, R1 and R2.

Difference

The R2PD1 supports the E13 function and the board version replacement function.

Replaceability

The R1PD1A can be replaced by the R2PD1A. The R1PD1B can be replaced by the R2PD1B.

6.2.2 Function and Feature The PD1 is used to process E1 signals and the overhead, to report alarms and performance events, and to provide the maintenance features and TPS protection. Table 6-6 lists the functions and features of the PD1. Table 6-6 Functions and features of the PD1

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Function and Feature

PD1 R1PD1

R2PD1

Basic function

Processes 32 x E1 signals.

Processes 32 x E1 signals.

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Function and Feature

PD1 R1PD1

R2PD1

Service processing

Accesses and processes 32 x E1 electrical signals when used with the interface board.

Accesses and processes 32 x E1 electrical signals when used with the interface board. Supports the E13 function, which is used to converge E1 services into E3 services.

Overhead processing

Supports the transparent transmission and termination of the POH bytes at the VC-12 level, such as the J2 byte.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Maintenanc e feature

Supports inloop and outloop for the electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

Protection scheme

Supports the TPS protection when used with the electrical interface switching board.

6.2.3 Working Principle and Signal Flow The PD1 consists of the PPI, E1 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-4 shows the block diagram for the functions of the PD1.

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Figure 6-4 Block diagram for the functions of the PD1 1.5 MHz/ 2 MHz OSC

E1

E1

155 MHz PLL

155 Mbit/s

6 x 2 Mbit/s

LIU

E1 mapping/ demapping

P P I

LOS Outloop/Inloop control

Interface coversion module

155 Mbit/s

6 x 2 Mbit/s

LIU

Reference clock

+1.8 V

Cross-connect unit A

High speed bus

Cross-connect unit B

Cross-connect unit

Communication

+3.3 V

+2.5 V

High speed bus

Frame header

Communication and control module

DC/DC converter

DC/DC converter

Cross-connect unit

SCC Unit

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

Figure 6-5 shows the block diagram of the E1mapping/ demapping. Figure 6-5 Block diagram of the E1 mapping/ demapping E1 mapping/demapping E1

LPA

PDH AIS Detector

LPT

LPOH(V5/J2/N2/ K4) insertion LPOH(V5/J2/N2/ K4) Extraction

HPA

HPT

STM-1

TU-AIS/TU-LOP Detector

E1

STM-1

LPA

LPT

HPA

HPT

The function modules are described as follows.

PPI The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: Issue 02 (2007-09-10)

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Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the PDH LOS signals.

E1 mapping/demapping l

LPA

l

The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as to be transported into the synchronous network for check of the PDH AIS.

l

LPT

l

The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the VC-12 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-12: V5, J2, N2, and K4.

l

HPA

l

HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TUG2->TUG3->VC-4.

l

HPT

l

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and POH.

l

MST and RST

l

These two functions are necessary to create a proprietary STM–1 signal in order to interface the “E1 mapping/demapping” block with the multiplex unit.

Interface conversion module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Control the indicator on the board.

DC/DC converter It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are provided to the board. 6-12

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6.2.4 Front Panel On the front panel of the PD1, there are indicators.

Appearance of the Front Panel Figure 6-6 shows the appearance of the front panel of the PD1. Figure 6-6 Front panel of the PD1

PD1 STAT ACT PROG SRV

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are no interfaces on the front panel of the PD1. In the OptiX OSN 1500A subrack, the PD1 is used with the L75S or L12S, which provides 75ohm or 120-ohm E1 interfaces. For details, see the sections that describe the L75S and L12S. In the OptiX OSN 1500B subrack, the PD1 is used with the D75S or D12S, which provides 75ohm or 120-ohm E1 interfaces. For details, see the sections that describe the D75S and D12S.

6.2.5 Valid Slots The PD1 must be used with the L75S or L12S. In the OptiX OSN 1500A subrack, the PD1 can be housed in any of half-width slots 2 and 12. Table 6-7 lists the valid slots for the PD1 and corresponding slots for the L75S and L12S. Issue 02 (2007-09-10)

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Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX OSN 1500A subrack Valid Slot for the PD1

Corresponding Slot for the L75S and L12S

Slot 12

Slot 7 (1–16 channels services) Slot 6 (17–32 channels services)

NOTE

Slot 2 can house a protection board of the TPS protection. The board housed in slot 2 protects the board housed in slot 12.

In the OptiX OSN 1500B subrack, the PD1 can be housed in any of slots 1–3, 6–8 and 11–13. Table 6-8 lists the valid slots for the PD1 and the corresponding slots for the D75S and D12S. Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX OSN 1500B subrack Valid Slot for the PD1

Corresponding Slot for the D75S and D12S

Slot 2

Slot 14

Slot 3

Slot 16

Slots 7 and 12

Slot 15

Slots 8 and 13

Slot 17

NOTE

l

Boards housed in slots 7 and 12 share the interface board housed in slot 15. The boards housed in slots 7 and 12 cannot be used with the interface board housed in slot 15 to add or drop services at the same time.

l

Boards housed in slots 8 and 13 share the interface board housed in slot 17. The boards housed in slots 8 and 13 cannot be used with the interface board housed in slot 17 to add or drop services at the same time.

l

Slot 1 can house a protection board of the TPS protection. The board housed in slot 1 protects the boards housed in slots 2 and 3.

l

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the boards housed in slots 12 and 13.

l

Slot 6 can house a protection board of the TPS protection. The board housed in slot 6 protects the boards housed in slots 7 and 8.

6.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the PD1 indicates the interface impedance type. Table 6-9 lists the relation between the board feature code and interface impedance type for the PD1.

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Table 6-9 Relation between the board feature code and the interface impedance type Board

Feature Code

Interface Impedance Type

SSR1PD1A01, SSR2PD1A01

A01

75 ohms

SSR1PD1B01, SSR2PD1B01

B01

120 ohms

6.2.7 TPS Protection for the Board The PD1 supports the 1:N TPS protection.

Protection Principle In the OptiX OSN 1500A subrack, used with the L75S or L12S, two PD1 boards can get 1:1 TPS protection. Figure 6-7 shows the principle for the TPS protection of the PD1. Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack

L75S

S L O T 2

S L O T 7

L75S

E1protection bus

S L O T 6

S L O T

E1 service bus

12

Protection

Working

Fail

PD1

PD1

Detect board fault Cross-connect and timing board

TPS switching control bus

In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PD1 boards can get 1:N (1≤2) TPS protection. Figure 6-8 shows the principle of the TPS protection for the PD1.

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Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack

E1 protection bus D75S

D75S

E1 service bus Fail Protection

Working

PD1

PD1

Working PD1

Detect board fault

TPS switching control bus

Cross-connect and timing board

When detecting a failure in the working PD1 board, the cross-connect board issues a command to switch the services from the faulty PD1 to the protection PD1. In this way, services are protected.

Hardware Configuration In the OptiX OSN 1500A subrack, PD1 boards can be housed in the half-width slots to realize the 1:1 TPS protection. Figure 6-9 shows the slot configuration for the 1:1 TPS protection for the PD1. Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A subrack Slot 1 Slot 20

PD1(P) Slot 2 Slot 3

FAN

Slot 11

Slot 6 L75S(17~32)

Slot 12 PD1(W)

Slot 7 L75S(1~16)

Slot 13

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Table 6-10 shows the slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack.

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Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack Board

Protection Group Before the Slot Division

Protection Group After the Slot Division

PD1 (protection)

Slot 6

Slot 1

Slot 11

Slot 6

PD1 (working)

Slots 7 and 8

Slots 2 and 3

Slots 12 and 13

Slots 7 and 8

D75S/D12S

Slots 15 and 17

Slots 14 and 16

Slots 15 and 17

Slots 15 and 17

The two protection groups that contain slots 6 and 11 share the protection bus and thus cannot coexist. Before the slots are divided, the OptiX OSN 1500B supports one group of TPS protection for E1 services. After the slots are divided, the OptiX OSN 1500B supports a maximum of two TPS protection groups for E1 services.

6.2.8 Board Configuration Reference You can use the T2000 to set parameters for the PD1. You can use the T2000 to set the following parameters for the PD1: l

J2 byte

l

V5 byte

l

Tributary loopback

l

Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.2.9 Technical Specifications The technical specifications of the PD1 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications The L12S, L75S, D12S or D75S board provides electrical interfaces for the PD1. For specifications of the electrical interfaces, see the sections that describe these boards.

Mechanical Specifications The mechanical specifications of the PD1 are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg)

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0.5 (R1PD1)

–

0.56 (R2PD1) Huawei Technologies Proprietary

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Power Consumption In the normal temperature (25℃), the maximum power consumption of the R1PD1 is 15 W. In the normal temperature (25℃), the maximum power consumption of the R2PD1 is 10.4 W.

6.3 PQ1 This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.3.1 Version Description The PQ1 has two versions, R1 and R2. The two versions have different functions. 6.3.2 Function and Feature The PQ1 can be used to process E1 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.3.3 Working Principle and Signal Flow The PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and so on. 6.3.4 Front Panel On the front panel of the PQ1, there are indicators. 6.3.5 Valid Slots The PQ1 must be used with the D75S, D12S or D12B. 6.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the PQ1 indicates the interface impedance type. 6.3.7 TPS Protection for the Board The PQ1 supports the 1:N TPS protection. 6.3.8 Board Configuration Reference You can use the T2000 to set parameters for the PQ1. 6.3.9 Technical Specifications The technical specifications of the PQ1 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.3.1 Version Description The PQ1 has two versions, R1 and R2. The two versions have different functions. Table 6-11 lists the details on the versions of the PQ1 board. Table 6-11 Version Description of the PQ1

6-18

Item

Description

Functional version

The PQ1 has two versions, N1 and N2.

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Item

Description

Difference

The N2PQ1 supports the E13 function and the board version replacement function. The N2PQ1 does not perform the tributary timing function.

Replaceability

When the tributary timing function is not required, the N1PQ1A can be replaced by the N2PQ1A. When the tributary timing function is not required, the N1PQ1B can be replaced by the N2PQ1B.

NOTE: When the impedance of interfaces is ignored, the PQ1A (75 ohms) and PQ1B (100 ohms/120 ohms) are called PQ1 hereinafter.

6.3.2 Function and Feature The PQ1 can be used to process E1 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-12 lists the functions and features of the PQ1. Table 6-12 Functions and features of the PQ1 Function and Feature

PQ1 N1PQ1

N2PQ1

Basic function

Processes 63 x E1 signals.

Processes 63 x E1 signals.

Service processing

Processes 63 x E1 electrical signals when used with an interface board.

Processes 63 x E1 electrical signals when used with an interface board. Supports the E13 function, which is used to converge E1 services into E3 services.

Overhead processing

Supports the transparent transmission and termination of the POH bytes at the VC-12, such as the J2 byte.

Alarm and performanc e event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Maintenan ce feature

Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

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Function and Feature

PQ1

Protection scheme

Supports the TPS protection when used with the interface board.

N1PQ1

N2PQ1

When the working board is the PQ1, the protection board can be the PQM. In this way, the hybrid protection is provided.

6.3.3 Working Principle and Signal Flow The PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and so on. Figure 6-10 shows the block diagram for the functions of the PQ1. Figure 6-10 Block diagram for the functions of the PQ1 1.5 MHz/ 2 MHz OSC

E1/T1

E1/T1

155 MHz PLL

6 x 1.5 Mbit/s/ 6 x 2 Mbit/s

LIU P P I

6 x 1.5 Mbit/s/ 6 x 2 Mbit/s

LIU

LOS Outloop/Inloop control

155 Mbit/s

E1/T1 mapping/ demapping

155 Mbit/s

Interface coversion module

+1.8 V

DC/DC converter

Cross-connect unit A

High speed bus

Cross-connect unit B

Cross-connect unit

Communication

+3.3 V

DC/DC converter

Cross-connect unit

High speed bus

Frame header

Communication and control module

+2.5 V

Reference clock

SCC Unit

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

Figure 6-11 shows the block diagram of the E1/T1 mapping/ demapping.

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Figure 6-11 Block diagram of the E1/T1 mapping/ demapping E1/T1 mapping/demapping E1/T1

LPA

PDH AIS Detector

LPT

LPOH(V5/J2/N2/ K4) insertion LPOH(V5/J2/N2/ K4) Extraction

HPA

HPT

STM-1

TU-AIS/TU-LOP Detector

E1/T1

STM-1

LPT

LPA

HPA

HPT

The function modules are described as follows.

PPI The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: l

Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the PDH LOS signals.

E1/T1 mapping/demapping l

LPA

l

The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be adapted so as to be transported into the synchronous network for check of the PDH AIS.

l

LPT

l

The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the VC-12 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-12: V5, J2, N2, and K4.

l

HPA

l

HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TUG2->TUG3->VC-4.

l

HPT

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The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and POH.

l

MST and RST

l

These two functions are necessary to create a proprietary STM–1 signal in order to interface the “E1/T1 mapping/demapping” block with the multiplex unit.

Interface conversion module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Control the indicator on the board.

DC/DC converter It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are provided to the board.

6.3.4 Front Panel On the front panel of the PQ1, there are indicators.

Appearance of the Front Panel Figure 6-12 shows the appearance of the front panel of the PQ1.

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Figure 6-12 Front panel of the PQ1 PQ1 STAT ACT PROG SRV

PQ1

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are no interfaces on the front panel of the PQ1. The D75S, D12S or D12B provides 75-ohm or 120-ohm E1/T1 interfaces for the PQ1. For details, see the sections that describe the D75S, D12S and D12B.

6.3.5 Valid Slots The PQ1 must be used with the D75S, D12S or D12B. The OptiX OSN 1500A does not support the PQ1 board. Issue 02 (2007-09-10)

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In the OptiX OSN 1500B subrack, the PQ1 can be housed in any of slots 11–13, and must be used with the D75S, D12S or D12B. Table 6-13 lists the valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B. Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the OptiX OSN 1500B subrack Valid Slot for the PQ1

Corresponding Slot for the D75S, D12S and D12B

Slot 12

Slot 14 (1–32 channels of services) Slot 15 (33–63 channels of services)

Slot 13

Slot 16 (1–32 channels of services) Slot 17 (33–63 channels of services)

NOTE

l

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the boards housed in slots 12 and 13.

l

If the interface board for the boards housed in slot 12 and 13 is the D12B, the boards housed in slot 12 and 13 cannot get the TPS protection.

6.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the PQ1 indicates the interface impedance type. Table 6-14 lists the relation between the board feature code and interface impedance type for the PQ1. Table 6-14 Relation between the board feature code and the interface impedance type Board

Feature Code

Interface Impedance Type

SSN1PQ1A01, SSN2PQ1A01

A01

75 ohms

SSN1PQ1B01, SSN2PQ1B01

B01

120 ohms

6.3.7 TPS Protection for the Board The PQ1 supports the 1:N TPS protection.

Protection Principle In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PQ1 can get the 1:N (≤2) TPS protection. Figure 6-13 shows the principle of the TPS protection for the PQ1. 6-24

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Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack

S L O T 16

D75S D75S

S L O T 17

S S L L O O T T 14 15

D75S D75S

E1 protection bus

E1 service bus

SLOT 11

SLOT 12

SLOT 13

Working

Working

Protection

Fail

Detect board fault Cross-connect and timing board

TPS switching control bus

When detecting a failure in the working PD1 board, the cross-connect board issues a command to switch the services from the faulty PQ1 to the protection PQ1. In this way, services are protected.

Hardware Configuration Table 6-15 lists the slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack. Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack

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Working Board

Protection Board

Slot

PQ1A (75 ohms)

PQ1A (75 ohms)

PQ1B (120 ohms)

PQ1B (120 ohms) or PQM

Slot 11 can house the protection board. The board in slot 11 protects the boards in slots 12 and 13. Figure 6-14 shows the slot configuration for the 1:2 TPS protection for the PQ1.

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Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1

Slot 20

FAN

Slot 14

D75S

Slot 15

D75S

Slot 16

D75S

Slot 17

D75S

Slot 11

Protection

Slot 6

Slot 12

Working

Slot 7

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Slot 18

PIU

Slot 19

PIU

6.3.8 Board Configuration Reference You can use the T2000 to set parameters for the PQ1. You can use the T2000 to set the following parameters for the PQ1: l

J2 byte

l

V5 byte

l

Tributary loopback

l

Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.3.9 Technical Specifications The technical specifications of the PQ1 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications The D75S, D12S or D12B provides electrical interfaces for the PQ1. For the specifications of these electrical interfaces, see the section that describes the D75S, D12S or D12B.

Mechanical Specifications The mechanical specifications of the PQ1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1PQ1 is 19 W. In the normal temperature (25℃), the maximum power consumption of the N2PQ1 is 13 W. 6-26

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6.4 PQM This section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.4.1 Version Description The functional version of the PQM board is N1. 6.4.2 Function and Feature The PQM is used to process E1/T1 signals and the overhead, to report alarms and performance events, and to provide the maintenance features and TPS protection. 6.4.3 Working Principle and Signal Flow The PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module, communication and control module and so on. 6.4.4 Front Panel On the front panel of the PQM, there are indicators. 6.4.5 Valid Slots The OptiX OSN 1500A does not support the PQM board. 6.4.6 TPS Protection for the Board The PQM supports the 1:N TPS protection. 6.4.7 Board Configuration Reference You can use the T2000 to set parameters for the PQM. 6.4.8 Technical Specifications The technical specifications of the PQM cover the electrical interface specifications, board dimensions, weight and power consumption.

6.4.1 Version Description The functional version of the PQM board is N1.

6.4.2 Function and Feature The PQM is used to process E1/T1 signals and the overhead, to report alarms and performance events, and to provide the maintenance features and TPS protection. Table 6-16 lists the functions and features of the PQM. Table 6-16 Functions and features of the PQM

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Function and Feature

PQM

Basic function

Processes 63 x E1/T1 signals.

Service processing

The PQM accesses and processes 63 x E1/T1 electrical signals when used with the interface board. Each channel can be configured as E1 or T1.

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Function and Feature

PQM

Overhead processing

Supports the transparent transmission and termination of the POH bytes at the VC-12 level, such as the J2 byte.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Maintenance feature

Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function. When used with the interface board, the PQM supports the TPS protection.

Protection scheme

When the working board is the PQ1, the protection board can be the PQM. In this way, the hybrid protection is provided.

6.4.3 Working Principle and Signal Flow The PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-15 shows the block diagram for the functions of the PQM. Figure 6-15 Block diagram for the functions of the PQM 1.5 MHz/ 2 MHz OSC

E1/T1

E1/T1

155 MHz PLL

6 x 1.5 Mbit/s/ 6 x 2 Mbit/s

LIU P P I

6 x 1.5 Mbit/s/ 6 x 2 Mbit/s

LIU

LOS Outloop/Inloop control

155 Mbit/s

E1/T1 mapping/ demapping

155 Mbit/s

Interface coversion module

+1.8 V

DC/DC converter

Cross-connect unit A

High speed bus

Cross-connect unit B

Cross-connect unit

Communication

+3.3 V

DC/DC converter

Cross-connect unit

High speed bus

Frame header

Communication and control module

+2.5 V

Reference clock

SCC Unit

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

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Figure 6-16 shows the block diagram of the E1/T1 mapping/ demapping. Figure 6-16 Block diagram of the E1/T1 mapping/ demapping E1/T1 mapping/demapping E1/T1

LPA

PDH AIS Detector

LPT

LPOH(V5/J2/N2/ K4) insertion LPOH(V5/J2/N2/ K4) Extraction

HPA

HPT

STM-1

TU-AIS/TU-LOP Detector

E1/T1

STM-1

LPT

LPA

HPA

HPT

The function modules are described as follows.

PPI The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: l

Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the PDH LOS signals.

E1/T1 mapping/demapping l

LPA

l

The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be adapted so as to be transported into the synchronous network for check of the PDH AIS.

l

LPT

l

The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the VC-12 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-12: V5, J2, N2, and K4.

l

HPA

l

HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TUG2->TUG3->VC-4.

l

HPT

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The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and POH.

l

MST and RST

l

These two functions are necessary to create a proprietary STM–1 signal in order to interface the “E1/T1 mapping/demapping” block with the multiplex unit.

Interface conversion module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Control the indicator on the board.

DC/DC converter It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are provided to the board.

6.4.4 Front Panel On the front panel of the PQM, there are indicators.

Appearance of the Front Panel Figure 6-17 shows the appearance of the front panel of the PQM.

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Figure 6-17 Front panel of the PQM PQM STAT ACT PROG SRV

PQM

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are no interfaces on the front panel of the PQM. The D12S or D12B provides 100-ohm T1/E1 interfaces for the PQM. For details, see the sections that describe the D12S and D12B.

6.4.5 Valid Slots The OptiX OSN 1500A does not support the PQM board. In the OptiX OSN 1500B subrack, the PQM can be housed in any of slots 11–13, and must be used with the D12S or D12B. Issue 02 (2007-09-10)

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Table 6-17 lists the valid slots for the PQM and corresponding slots for the D12S and D12B. Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX OSN 1500B subrack Valid Slot for the PQM

Corresponding Slot for the D12S and D12B

Slot 12

Slot 14 (1–32 channels of services) Slot 15 (33–63 channels of services)

Slot 13

Slot 16 (1–32 channels of services) Slot 17 (33–63 channels of services)

NOTE

l

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the boards housed in slots 12 and 13.

l

If the interface board for the boards housed in slots 12 and 13 is the D12B, the boards housed in slots 12 and 13 cannot get the TPS protection.

6.4.6 TPS Protection for the Board The PQM supports the 1:N TPS protection.

Protection Principle In the OptiX OSN 1500B, used with the D12S, the PQM can be configured into one 1:N (N≤ 2) TPS protection group. Figure 6-18 shows the principle of the TPS protection for the PQM.

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Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack

S L O T 16

S L O T 17

D12S

D12S

D12S

S S L L O O T T 14 15

D12S

E1/T1 protection bus

E1/T1 service bus

SLOT 11

SLOT 12

SLOT 13

Working

Working

Protection

Fail

Detect board fault Cross-connect and timing board

TPS switching control bus

When detecting a fault in the working PQM board, the cross-connect board issues a command to switch the services from the faulty PQM to the protection PQM. In this way, services are protected.

Hardware Configuration Table 6-18 lists the slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack. Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack

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Working Board

Protection Board

Slot

PQM (E1)

PQM (E1)

PQM (T1)

PQM (T1)

Slot 11 can house the protection board. The board in slot 11 protects the boards in slots 12 and 13. Figure 6-19 shows the slot configuration for the 1:2 TPS protection for the PQM.

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Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack

Slot 20

FAN

Slot 14

D12S

Slot 15

D12S

Slot 16

D12S

Slot 17

D12S

Slot 11

Protection

Slot 6

Slot 12

Working

Slot 7

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Slot 18

PIU

Slot 19

PIU

6.4.7 Board Configuration Reference You can use the T2000 to set parameters for the PQM. You can use the T2000 to set the following parameters for the PQM: l

J2 byte

l

V5 byte

l

Tributary loopback

l

Service loading indication

l

Path service type

For details on these parameters, see F Board Configuration Reference.

6.4.8 Technical Specifications The technical specifications of the PQM cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications The D12S or D12B provides electrical interfaces for the PQM. For the specifications of the electrical interfaces, see the sections that describe the D12S and D12B.

Mechanical Specifications The mechanical specifications of the PQM are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the PQM is 22 W. 6-34

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6.5 PL3 This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.5.1 Version Description The PL3 has two versions, N1 and N2. The two versions have different functions. 6.5.2 Function and Feature The PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.5.3 Working Principle and Signal Flow The PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. 6.5.4 Front Panel On the front panel of the PL3, there are indicators. 6.5.5 Valid Slots The OptiX OSN 1500A does not support the PL3 board. 6.5.6 TPS Protection for the Board The PL3 supports the 1:N TPS protection. 6.5.7 Board Configuration Reference You can use the T2000 to set parameters for the PL3. 6.5.8 Technical Specifications The technical specifications of the PL3 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.5.1 Version Description The PL3 has two versions, N1 and N2. The two versions have different functions. Table 6-19 lists the details on the versions of the PL3 board. Table 6-19 Version description of the PL3 Item

Description

Functional version

The PL3 has two versions, N1 and N2.

Difference

The N1PL3 does not support the E13/M13 function. The N2PL3 supports the E13/M13 function. The N2PL3 supports the board version replacement function and can replace the N1PL3. After the N1PL3 is replaced, the N2PL3 is consistent with the N1PL3 in configuration and service status.

Replaceability

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The N2PL3 can fully replace the N1PL3.

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6.5.2 Function and Feature The PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-20 lists the functions and features of the PL3. Table 6-20 Functions and features of the PL3 Function and Feature

PL3

Basic function

Processes 3 x E3/T3 signals.

Service processing

Accesses and processes 3 x E3/T3 electrical signals.

Overhead processing

Supports the setting and query of all path overhead bytes at the VC-3 level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Maintenance feature

Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

Protection scheme

Supports the TPS protection when used with the interface board and the switching board.

6.5.3 Working Principle and Signal Flow The PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-20 shows the block diagram for the functions of the PL3.

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Figure 6-20 Block diagram for the functions of the PL3 34 MHz/ 45 MHz OSC

E3/T3

E3/T3

6 x 34 Mbit/s/ 6 x 45 Mbit/s

LIU P P I

LOS

E3/T3 mapping/ demapping

2 x 155 Mbit/s

Interface coversion module

High speed bus

Frame header

Communication and control module

Outloop/Inloop control

High speed bus

2 x 155 Mbit/s

6 x 34 Mbit/s/ 6 x 45 Mbit/s

LIU

Reference clock

155 MHz PLL

Cross-connect unit B

SCC Unit

Fuse

DC/DC converter

DC/DC converter

Cross-connect unit A

Cross-connect unit

Communication

+3.3 V

+1.8 V

Cross-connect unit

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-21 shows the block diagram of the E3/T3 mapping/demapping. Figure 6-21 Block diagram of the E3/T3 mapping/demapping E3/T3 mapping/demapping

E3/T3

LPA

HPA

LPT

HPT

STM-1

LPOH(J1/C2/B3) insertion PDH AIS Detector

TU-AIS/TU-LOP Detector LPOH(J1/C2/B3) extraction

E3/T3

STM-1

LPA

HPA

LPT

HPT

LPA: Low order Path Adaptation

LPT: Low order Path Termination

HPA: High order Path Adaptation

HPT: High order Path Termination

The function modules are described as follows.

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PPI l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:

l

Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the A_LOS alarm.

E3/T3 mapping/demapping l

LPA

l

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted so as to be transported into the synchronous network.

l

LPT

l

The virtual container (VC-3) is formatted by lower order path termination (LPT).

l

The VC-3 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the VC-3 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3, and N1.

l

HPA

l

HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.

l

HPT

l

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and POH.

l

MST and RST

l

The functions are necessary to create a proprietary STM–1 signal in order to connect the interface conversion module.

Interface conversion module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

6-38

l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board. Huawei Technologies Proprietary

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DC/DC converter module Through the DC/ DC converting module, different direct currents are provided to each chip on the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3 V power are provided to the board.

6.5.4 Front Panel On the front panel of the PL3, there are indicators.

Appearance of the Front Panel Figure 6-22 shows the appearance of the front panel of the PL3. Figure 6-22 Front panel of the PL3

PL3 STAT ACT PROG SRV

PL3

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

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Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are no interfaces on the front panel of the PL3. The C34S, an electrical interface switching board, provides the E3/T3 interfaces for the PL3. For details, see the section that describes the D34S.

6.5.5 Valid Slots The OptiX OSN 1500A does not support the PL3 board. In the OptiX OSN 1500B subrack, the PL3 can be housed in any of slots 12–13, and must be used with the C34S. Table 6-21 lists the valid slots for the PL3 and corresponding slots for the C34S. Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack Valid Slot for the PL3

Corresponding Slot for the C34S

Slot 12

Slot 14

Slot 13

Slot 16

6.5.6 TPS Protection for the Board The PL3 supports the 1:N TPS protection.

Protection Principle In the OptiX OSN 1500B, used with the C34S and TSB8, the PL3 can be configured into one 1:1 TPS protection group. Figure 6-23 shows the principle of the TPS protection for the PL3.

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Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack 3 xE3/T3

TSB8

3

2

C34S

1

1

Switch control signal

2

Crossconnect and timing board

SLOT 4/5

Protection PL3

Working PL3 Fail

SLOT12

l

SLOT13

Normal state When the working boards are running normally, the control switch of the C34S is in position 1 and services are directly accessed to the PL3 board.

l

Switching state When the working board detects a fault and requires a switching, the control switch of the C34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding position. In this way, the protection board protects the faulty working board.

Hardware Configuration Table 6-22 lists the slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack. Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack

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Working Board

Protection Board

Slot

PL3 (E3)

PL3 (E3)/PD3 (E3)

PL3 (T3)

PL3 (T3)/PD3 (T3)

If the working board is the PL3, the PD3 can be the protection board. Figure 6-24 shows the slot configuration for the 1:1 TPS protection for the PL3.

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Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack Slot 14

TSB8

Slot 15 Slot 16

C34S

Slot 17

Slot 12

FAN

PIU

Slot 19

PIU

Slot 6

Slot 11 Slot 20

Slot 18

Protection

Slot 7

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 6-24, the protection board housed in slot 12 protects the board housed in slot 13. Table 6-23 lists the slots for the PL3, C34S and TSB8. Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack Board

Protection Group

PL3 (working)

Slot 13

PL3/PD3 (protection)

Slot 12

TSB8

Slot 14

C34S

Slot 16

6.5.7 Board Configuration Reference You can use the T2000 to set parameters for the PL3. You can use the T2000 to set the following parameters for the PL3: l

J1 byte

l

C2 byte

l

Tributary loopback

l

Service loading indication

l

Path service type

For details on these parameters, see F Board Configuration Reference.

6.5.8 Technical Specifications The technical specifications of the PL3 cover the electrical interface specifications, board dimensions, weight and power consumption.

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Electrical Interface Specifications The C34S provides electrical interfaces for the PL3. For the specifications of the electrical interfaces, see the section that describes the C34S.

Mechanical Specifications The mechanical specifications of the PL3 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1PL3 is 15 W. In the normal temperature (25℃), the maximum power consumption of the N2PL3 is 12 W.

6.6 PL3A This section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.6.1 Version Description The PL3A board has two functional versions, N1 and N2. The difference between the two versions lies in the support for the E13/M13 function. 6.6.2 Function and Feature The PL3A can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.6.3 Working Principle and Signal Flow The PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. 6.6.4 Front Panel On the front panel of the PL3A, there are indicators and interfaces. 6.6.5 Valid Slots The PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B subracks 6.6.6 Board Configuration Reference You can use the T2000 to set parameters for the PL3A. 6.6.7 Technical Specifications The technical specifications of the PL3A cover the electrical interface specifications, board dimensions, weight and power consumption.

6.6.1 Version Description The PL3A board has two functional versions, N1 and N2. The difference between the two versions lies in the support for the E13/M13 function. Table 6-24 lists the details on the versions of the PL3A board. Issue 02 (2007-09-10)

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Table 6-24 Version description of the PL3A Item

Description

Functional version

The PL3A has two versions, N1 and N2.

Difference

The N1PL3A does not support the E13/M13 function. The N2PL3A supports the E13/M13 function. The N2PL3A supports the board version replacement function and can replace the N1PL3A. After the N1PD3A is replaced, the N2PD3A is consistent with the N1PD3A in configuration and service status.

Replaceability

The N2PD3A can fully replace the N1PD3A.

6.6.2 Function and Feature The PL3A can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-25 lists the functions and features of the PL3A. Table 6-25 Functions and features of the PL3A Function and Feature

PL3A

Basic function

Processes 3 x E3/T3 signals. The N2PL3A supports the E13 function, which is used to converge E1 services into E3 services. The N2PL3A supports the M13 function, which is used to converge T1 services into T3 services.

Service processing

Accesses and processes 3 x E3/T3 electrical signals.

Overhead processing

Supports the setting and query of all path overhead bytes at the VC-3 level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Maintenance feature

Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

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6.6.3 Working Principle and Signal Flow The PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-25 shows the block diagram for the functions of the PL3A. Figure 6-25 Block diagram for the functions of the PL3A 34 MHz/ 45 MHz OSC

E3/T3

E3/T3

6 x 34 Mbit/s/ 6 x 45 Mbit/s

LIU P P I

LOS

E3/T3 mapping/ demapping

2 x 155 Mbit/s

Interface coversion module

High speed bus

Frame header

Communication and control module

Outloop/Inloop control

High speed bus

2 x 155 Mbit/s

6 x 34 Mbit/s/ 6 x 45 Mbit/s

LIU

Reference clock

155 MHz PLL

Cross-connect unit B

SCC Unit

Fuse

DC/DC converter

DC/DC converter

Cross-connect unit A

Cross-connect unit

Communication

+3.3 V

+1.8 V

Cross-connect unit

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-26 shows the block diagram of the E3/T3 mapping/demapping. Figure 6-26 Block diagram of the E3/T3 mapping/demapping E3/T3 mapping/demapping

E3/T3

LPA

HPA

LPT

HPT

STM-1

LPOH(J1/C2/B3) insertion PDH AIS Detector

TU-AIS/TU-LOP Detector LPOH(J1/C2/B3) extraction

E3/T3

STM-1

LPA

LPT

LPA: Low order Path Adaptation

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HPA

HPT

LPT: Low order Path Termination

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HPT: High order Path Termination

The function modules are described as follows.

PPI l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:

l

Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the A_LOS alarm.

E3/T3 mapping/demapping l

LPA

l

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted so as to be transported into the synchronous network.

l

LPT

l

The virtual container (VC-3) is formatted by lower order path termination (LPT).

l

The VC-3 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the VC-3 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3, and N1.

l

HPA

l

HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.

l

HPT

l

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and POH.

l

MST and RST

l

The functions are necessary to create a proprietary STM–1 signal in order to connect the interface conversion module.

Interface conversion module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

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l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units. Huawei Technologies Proprietary

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l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC converter module Through the DC/ DC converting module, different direct currents are provided to each chip on the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3 V power are provided to the board.

6.6.4 Front Panel On the front panel of the PL3A, there are indicators and interfaces.

Appearance of the Front Panel Figure 6-27 shows the appearance of the front panel of the PL3A. Figure 6-27 Front panel of the PL3A

PL3A STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3

PL3A

Indicators The following indicators are present on the front panel of the board: Issue 02 (2007-09-10)

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Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are three pairs of 75-ohm unbalanced interfaces, which are of the SMB type.

6.6.5 Valid Slots The PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B subracks The PL3A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The PL3A can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

6.6.6 Board Configuration Reference You can use the T2000 to set parameters for the PL3A. You can use the T2000 to set the following parameters for the PL3A: l

J1 byte

l

C2 byte

l

Tributary loopback

l

Service loading indication

l

Path service type

For details on these parameters, see F Board Configuration Reference.

6.6.7 Technical Specifications The technical specifications of the PL3A cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications Table 6-26 lists the specifications of the electrical interfaces of the PL3A. Table 6-26 Specifications of the electrical interfaces of the PL3A

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Interface Type

Code

Output Signal Bit Rate

34368 kbit/s

HDB3

Compliant with ITU-T G.703

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Allowed Input Frequency Deviation

Allowed Input Attenuatio n

Input Jitter Tolerance

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Interface Type

Code

Output Signal Bit Rate

Allowed Input Frequency Deviation

44736 kbit/s

B3ZS

Compliant with ITU-T G.703

Allowed Input Attenuatio n

Input Jitter Tolerance

Mechanical Specifications The mechanical specifications of the PL3A are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1PL3A is 15 W. In the normal temperature (25℃), the maximum power consumption of the N2PL3A is 12 W.

6.7 PD3 This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.7.1 Version Description The PD3 board has two functional versions, N1 and N2. The difference between the two versions lies in the support for the E13/M13 function. 6.7.2 Function and Feature The PD3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.7.3 Working Principle and Signal Flow The PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. 6.7.4 Front Panel On the front panel of the PD3, there are indicators. 6.7.5 Valid Slots The OptiX OSN 1500A does not support the PD3 board. 6.7.6 TPS Protection for the Board The PD3 supports the 1:N TPS protection. 6.7.7 Board Configuration Reference You can use the T2000 to set parameters for the PD3. 6.7.8 Technical Specifications The technical specifications of the PD3 cover the electrical interface specifications, board dimensions, weight and power consumption.

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6.7.1 Version Description The PD3 board has two functional versions, N1 and N2. The difference between the two versions lies in the support for the E13/M13 function. Table 6-27 lists the details on the versions of the PD3 board. Table 6-27 Version Description of the PD3 Item

Description

Functional version

The PD3 has two functional versions, N1 and N2.

Difference

The N1PD3 does not support the E13/M13 function. The N2PD3 supports the E13/M13 function. The N2PD3 supports the board version replacement function and can replace the N1PD3. After the N1PD3 is replaced, the N2PD3 is consistent with the N1PD3 in configuration and service status.

Replaceability

The N2PD3 can fully replace the N1PD3.

6.7.2 Function and Feature The PD3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-28 lists the functions and features of the PD3. Table 6-28 Functions and features of the PD3 Function and Feature

PD3

Basic function

Processes 6 x E3/T3 signals.

Service processing

Accesses and processes 6 x E3/T3 electrical signals. The N2PD3 supports the E13 function, which is used to converge E1 services into E3 services. The N2PD3 supports the M13 function, which is used to converge T1 services into T3 services.

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Overhead processing

Supports the setting and query of all path overhead bytes at the VC-3 level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

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Function and Feature

PD3

Maintenance feature

Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function. Supports the TPS protection when used with the interface and switching boards.

Protection scheme

6.7.3 Working Principle and Signal Flow The PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-28 shows the block diagram for the functions of the PD3. Figure 6-28 Block diagram for the functions of the PD3 34 MHz/ 45 MHz OSC

E3/T3

E3/T3

155 MHz PLL

6 x 34 Mbit/s/ 6 x 45 Mbit/s

LIU P P I

LOS Outloop/Inloop control

High speed bus

2 x 155 Mbit/s

E3/T3 mapping/ demapping

6 x 34 Mbit/s/ 6 x 45 Mbit/s

LIU

Reference clock

2 x 155 Mbit/s

Interface coversion module

Frame header

Communication and control module

DC/DC converter

DC/DC converter

Cross-connect unit A

Cross-connect unit B

Cross-connect unit

Communication

+3.3 V

+1.8 V

High speed bus

Cross-connect unit

SCC Unit

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-29 shows the block diagram of the E3/T3 mapping/demapping.

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Figure 6-29 Block diagram of the E3/T3 mapping/demapping E3/T3 mapping/demapping

E3/T3

LPA

HPA

LPT

HPT

STM-1

LPOH(J1/C2/B3) insertion PDH AIS Detector

TU-AIS/TU-LOP Detector LPOH(J1/C2/B3) extraction

E3/T3

STM-1

LPA

LPT

HPA

HPT

LPA: Low order Path Adaptation

LPT: Low order Path Termination

HPA: High order Path Adaptation

HPT: High order Path Termination

The function modules are described as follows.

PPI l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:

l

Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the A_LOS alarm.

E3/T3 mapping/demapping

6-52

l

LPA

l

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted so as to be transported into the synchronous network.

l

LPT

l

The virtual container (VC-3) is formatted by lower order path termination (LPT).

l

The VC-3 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the VC-3 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3, and N1.

l

HPA

l

HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.

l

HPT

l

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and POH. Huawei Technologies Proprietary

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l

MST and RST

l

The functions are necessary to create a proprietary STM–1 signal in order to connect the interface conversion module.

Interface converting module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

DC/DC converter module Through the DC/ DC converting module, different direct currents are provided to each chip on the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3 V power are provided to the board.

6.7.4 Front Panel On the front panel of the PD3, there are indicators.

Appearance of the Front Panel Figure 6-30 shows the appearance of the front panel of the PD3.

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Figure 6-30 Front panel of the PD3 PD3 STAT ACT PROG SRV

PD3

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces No interfaces are present on the front panel of the PD3. The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PD3. For details, see the section that describes the D34S.

6.7.5 Valid Slots The OptiX OSN 1500A does not support the PD3 board. In the OptiX OSN 1500B subrack, the PD3 can be housed in any of slots 12–13, and must be used with the D34S. Table 6-29 lists the valid slots for the PD3 and corresponding slots for the D34S. 6-54

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Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack Valid Slot for the PD3

Corresponding Slot for the D34S

Slot 12

Slot 14

Slot 13

Slot 16

6.7.6 TPS Protection for the Board The PD3 supports the 1:N TPS protection.

Protection Principle For the OptiX OSN 1500B, when used with the D34S and TSB8, the PD3 can be configured into one 1:1 TPS protection group. Figure 6-31 shows the principle of the TPS protection for the PD3. Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack 6 xE3/T3

TSB8

3

2

1

D34S

1

Switch control signal

2

Crossconnect and timing board

SLOT 4/5 Protection

Working

PD3

PD3 Fail

SLOT12

l

SLOT13

Normal state When the working boards are running normally, the control switch of the D34S is in position 1 and services are directly accessed to the PD3 board.

l

Switching state When the working board detects a fault and requires a switching, the control switch of the D34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding position. In this way, the protection board protects the faulty working board.

Hardware Configuration Table 6-30 lists the slot configuration for the TPS protection for the PD3 in the OptiX OSN 1500B subrack. Issue 02 (2007-09-10)

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Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack Working Board

Protection Board

Slot

PD3 (E3)

PD3 (E3)

PD3 (T3)

PD3 (T3)

Figure 6-32 shows the slot configuration for the 1:1TPS protection for the PD3

Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack Slot 14

TSB8

Slot 15 Slot 16

D34S

Slot 17

Slot 18

PIU

Slot 19

PIU

Slot 6

Slot 11 Slot 20

Slot 12

Protection

Slot 7

FAN

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 6-32, the protection board housed in slot 12 protects the board housed in slot 13. Table 6-31 lists the slots for the PD3, D34S and TSB8. Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack Board

Protection Group

PD3 (working)

Slot 13

PD3 (protection)

Slot 12

TSB8

Slot 14

D34S

Slot 16

6.7.7 Board Configuration Reference You can use the T2000 to set parameters for the PD3. You can use the T2000 to set the following parameters for the PD3:

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l

J1 byte

l

C2 byte

l

Tributary loopback

l

Service loading indication

l

Path service type Huawei Technologies Proprietary

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For details on these parameters, see F Board Configuration Reference.

6.7.8 Technical Specifications The technical specifications of the PD3 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications The D34S provides electrical interfaces for the PD3. For the specifications of the electrical interfaces, see the section that describes the D34S.

Mechanical Specifications The mechanical specifications of the PD3 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the N1PD3 is 19 W. In the normal temperature (25℃), the maximum power consumption of the N2PD3 is 12 W.

6.8 PQ3 This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.8.1 Version Description The functional version of the PQ3 board is N2. 6.8.2 Function and Feature The PQ3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.8.3 Working Principle and Signal Flow The PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. 6.8.4 Front Panel On the front panel of the PQ3, there are indicators. 6.8.5 Valid Slots The OptiX OSN 1500A does not support the PQ3 board. 6.8.6 TPS Protection for the Board The PQ3 supports the 1:N TPS protection. 6.8.7 Board Configuration Reference You can use the T2000 to set parameters for the PQ3. 6.8.8 Technical Specifications Issue 02 (2007-09-10)

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The technical specifications of the PQ3 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.8.1 Version Description The functional version of the PQ3 board is N2.

6.8.2 Function and Feature The PQ3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-32 lists the functions and features of the PQ3. Table 6-32 Functions and features of the PQ3 Function and Feature

PQ3

Basic function

Processes 12 x E3/T3 signals.

Service processing

Accesses and processes 12 x E3/T3 electrical signals. Supports the E13 function, which is used to converge E1 services into E3 services. Supports the M13 function, which is used to converge T1 services into T3 services.

Overhead processing

Supports the setting and query of all path overhead bytes at the VC-3 level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Maintenance feature

Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

Protection scheme

Supports the TPS protection when used with the interface board and the switching board.

6.8.3 Working Principle and Signal Flow The PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-33 shows the block diagram for the functions of the PQ3. 6-58

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Figure 6-33 Block diagram for the functions of the PQ3 34 MHz/ 45 MHz OSC

E3/T3

E3/T3

6 x 34 Mbit/s/ 6 x 45 Mbit/s

LIU P P I

LOS

E3/T3 mapping/ demapping

2 x 155 Mbit/s

Interface coversion module

High speed bus

Frame header

Communication and control module

Outloop/Inloop control

High speed bus

2 x 155 Mbit/s

6 x 34 Mbit/s/ 6 x 45 Mbit/s

LIU

Reference clock

155 MHz PLL

Cross-connect unit B

SCC Unit

Fuse

DC/DC converter

DC/DC converter

Cross-connect unit A

Cross-connect unit

Communication

+3.3 V

+1.8 V

Cross-connect unit

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-34 shows the block diagram of the E3/T3 mapping/demapping. Figure 6-34 Block diagram of the E3/T3 mapping/demapping E3/T3 mapping/demapping

E3/T3

LPA

HPA

LPT

HPT

STM-1

LPOH(J1/C2/B3) insertion PDH AIS Detector

TU-AIS/TU-LOP Detector LPOH(J1/C2/B3) extraction

E3/T3

STM-1

LPA

HPA

LPT

HPT

LPA: Low order Path Adaptation

LPT: Low order Path Termination

HPA: High order Path Adaptation

HPT: High order Path Termination

The function modules are described as follows.

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PPI l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:

l

Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the A_LOS alarm.

E3/T3 mapping/demapping l

LPA

l

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted so as to be transported into the synchronous network.

l

LPT

l

The virtual container (VC-3) is formatted by lower order path termination (LPT).

l

The VC-3 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the VC-3 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3, and N1.

l

HPA

l

HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.

l

HPT

l

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and POH.

l

MST and RST

l

The functions are necessary to create a proprietary STM–1 signal in order to connect the interface conversion module.

Interface conversion module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

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l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board. Huawei Technologies Proprietary

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DC/DC converter module Through the DC/ DC converting module, different direct currents are provided to each chip on the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3 V power are provided to the board.

6.8.4 Front Panel On the front panel of the PQ3, there are indicators.

Appearance of the Front Panel Figure 6-35 shows the appearance of the front panel of the PQ3. Figure 6-35 Front panel of the PQ3 PQ3 STAT ACT PROG SRV

PQ3

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators. Issue 02 (2007-09-10)

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Interfaces There are no interfaces on the front panel of the PQ3. The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PQ3. For details, see the section that describes the D34S.

6.8.5 Valid Slots The OptiX OSN 1500A does not support the PQ3 board. In the OptiX OSN 1500B subrack, the PQ3 can be housed in any of slots 12–13, and must be used with the D34S. Table 6-33 lists the valid slots for the PQ3 and corresponding slots for the D34S. Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack Valid Slot for the PQ1

Corresponding Slot for the D34S

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

6.8.6 TPS Protection for the Board The PQ3 supports the 1:N TPS protection.

Protection Principle In the OptiX OSN 1500B, used with the D34S and TSB8, the PQ3 can be configured into one 1:1 TPS protection group. Figure 6-36 shows the principle of the TPS protection for the PQ3. Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack 6 xE3/T3

TSB8

TSB8

1

2

1

2

6 xE3/T3

D34S

1

2

D34S

1

Switch control signal

2

Crossconnect and timing board

Protection

Working PQ3

SLOT 4/5

PQ3 Fail

SLOT12

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Normal state When the working boards are running normally, the control switch of the D34S is in position 1 and services are directly accessed to the PQ3 board.

l

Switching state When the working board detects a fault and requires a switching, the control switch of the D34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding position. In this way, the protection board protects the faulty working board.

Hardware Configuration NOTE

Two TSB8 boards are required to configure the TPS protection for the N2PQ3.

Table 6-34 lists the slot configuration for the TPS protection for the PQ3 in the OptiX OSN 1500B subrack. Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack Working Board

Protection Board

Slot

PQ3 (E3)

PQ3 (E3)

PQ3 (T3)

PQ3 (T3)

Figure 6-37 shows the slot configuration for the 1:3 TPS protection for the PQ3.

Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack Slot 14

TSB8

Slot 15

TSB8

Slot 16

D34S

Slot 17

D34S

Slot 12

FAN

PIU

Slot 19

PIU

Slot 6

Slot 11 Slot 20

Slot 18

Protection

Slot 7

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 6-37, the protection board housed in slot 12 protects the board housed in slot 13. Table 6-35 lists the slots for the PQ3, D34S and TSB8. Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack

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Board

Protection Group

PQ3 (working)

Slot 13

PQ3 (protection)

Slot 12 Huawei Technologies Proprietary

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Board

Protection Group

TSB8

Slots 14–15

D34S

Slots 16–17

6.8.7 Board Configuration Reference You can use the T2000 to set parameters for the PQ3. You can use the T2000 to set the following parameters for the PQ3: l

J1 byte

l

C2 byte

l

Tributary loopback

l

Service loading indication

l

Path service type

For details on these parameters, see F Board Configuration Reference.

6.8.8 Technical Specifications The technical specifications of the PQ3 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications The D34S provides electrical interfaces for the PQ3. For the specifications of the electrical interfaces, see the section that describes the D34S.

Mechanical Specifications The mechanical specifications of the PL1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the PQ3 is 13 W.

6.9 DX1 This section describes the DX1, a DDN interface convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 6.9.1 Version Description The functional version of the DX1 board is N1. 6.9.2 Function and Feature The DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k level at the system side. 6-64

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6.9.3 Working Principle and Signal Flow The DX1 consists of the interface and frame processing module, encoding/decoding module, timeslot cross-connect module, framing/deframing module and so on. 6.9.4 Front Panel On the front panel of the DX1, there are indicators. 6.9.5 Valid Slots The OptiX OSN 1500A does not support the DX1 board. 6.9.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the DX1 indicates the interface impedance type. 6.9.7 TPS Protection for the Board The DX1 supports the 1:N TPS protection. 6.9.8 Board Configuration Reference You can use the T2000 to set parameters for the DX1. 6.9.9 Technical Specifications The technical specifications of the DX1 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.9.1 Version Description The functional version of the DX1 board is N1.

6.9.2 Function and Feature The DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k level at the system side. Table 6-36 lists the functions and features of the DX1. Table 6-36 Functions and features of the DX1

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Function and Feature

DX1

Basic function

Processes eight channels of N x 64 kbit/s services and 8 x framed E1 services.

Used with the interface board

Accesses eight channels of N x 64 kbit/s and 8 x framed E1 services and realizes the 1:N TPS protection when used with the DM12.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Connector

The connectors of the DB28 and DB44 are present on the front panel of the DM12. The DB28 is for the N x 64 kbit/s signals, and the DB44 is for the framed E1 signals.

Cross-connects 48 channels of N x 64 kbit/s signals at the system side.

One DX1 board should be used with two DM12 boards.

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Function and Feature

DX1

Loopback function

Supports inloop and outloop.

PRBS selftest

Supported.

6.9.3 Working Principle and Signal Flow The DX1 consists of the interface and frame processing module, encoding/decoding module, timeslot cross-connect module, framing/deframing module and so on. Figure 6-38 shows the block diagram for the functions of the DX1. Figure 6-38 Block diagram for the functions of the DX1 Backplane

8X Frame E1

8X Nx64 kbit/s

DM12 Frame E1 interface module N x 64 kbit/s interface module Power DM12

8X Nx64 kbit/s

Backplane DX1 Frame E1 encoding/decoding and frame processing module Nx64k bit/s interface and frame processing module

64kbit/s Timeslot crossconnect module

N x 64 kbit/s interface module

Framing/ deframing module

mapping/ demapping module

Communication and control module

Power Frame E1 interface module

+3.3 V

DC/DC converter

Crossconnect unit

SCC unit

DC/DC converter

Fuse

Fuse

-48 V/-60 V -48 V/-60 V +3.3 V backup power

In the transmit direction The SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module, which recovers the signals. The framing/deframing module converts the signals to framed E1 signals and transmits the signals to the timeslot cross-connect module. The timeslot crossconnect module cross-connects and grooms the signals in the 64 kbit/s granularities, and transmits the services that are dropped at the NE to the interface module.

In the receive direction The DX1 accesses 8 x framed E1 signals from the framed E1 interface module and eight channels of N x 64 kbit/s services from the N x 64 kbit/s interface module of the DM12. In addition, the DX1 recovers the clock and data signals. 6-66

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The DX1 decodes the framed E1 signals and processes the frames. The DX1 also converts the N x 64 kbit/s signals, processes the frames. The DX1 then transmits the signals to the 64 kbit/s cross-connect module. The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s granularities. The timeslot cross-connect module then transmits the signals to the framing/deframing module. The framing/deframing module then maps the signals into the VC-4 and transmits the signals into the SDH cross-connect board.

Control and communication module The control and communication module performs the board communication, control and service configuration.

DC/DC converter module The DC/DC converter module provides the DC voltages required by the modules of the board.

6.9.4 Front Panel On the front panel of the DX1, there are indicators.

Appearance of the Front Panel Figure 6-39 shows the appearance of the front panel of the DX1. Figure 6-39 Front panel of the DX1 DX1 STAT ACT PROG SRV

DX1

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are no interfaces on the front panel of the DX1. When used with the DM12, the DX1 can input and output the framed E1 and N x 64 kbit/s signals. For details, see the section that describes the DM12.

6.9.5 Valid Slots The OptiX OSN 1500A does not support the DX1 board. In the OptiX OSN 1500B subrack, the DX1 can be housed in any of slots 11–13, and must be used with the DM12. Table 6-37 lists the valid slots for the DX1 and corresponding slots for the DM12. Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN 1500B subrack Valid Slot for the DX1

Corresponding Slot for the DM12

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

NOTE

l

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the boards housed in slots 12 and 13.

l

One DX1 should be used with two DM12 to access eight channels of N x 64 kbit/s signals. The DM12 board housed in the slot with a smaller slot number is used to access 8 x framed E1 and four channels of N x 64 kbit/s signals. The DM12 board housed in the slot with a larger slot number is used to access four channels of N x 64 kbit/s signals.

6.9.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the DX1 indicates the interface impedance type. Table 6-38 lists the relation between the board feature code and interface impedance type for the DX1. 6-68

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Table 6-38 Relation between the board feature code and the interface impedance type Board Barcode

Feature Code

Interface Impedance Type

SSN1DX1A01

A01

75 ohms

SSN1DX1B01

B01

120 ohms

6.9.7 TPS Protection for the Board The DX1 supports the 1:N TPS protection.

Protection Principle In the OptiX OSN 1500B, used with the DM12, the DX1 can be configured into one 1:N (N≤ 2) TPS protection group. Figure 6-40 shows the principle of the TPS protection for the DX1. Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack

S S L L protection bus O O T T 14 15

S L O T 16

S L O T 17

DM12 DM12

DM12 DM12

service bus S L O T 11

S L O T 12

S L O T 13

Fail

Working

Working

Protection

Detect board fault

TPS switching control bus

Cross-connect and timing board

When detecting a fault in the working DX1 board, the cross-connect board issues a command to switch the services from the faulty DX1 to the protection DX1. In this way, services are protected.

Hardware Configuration Figure 6-41 shows the slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack. Issue 02 (2007-09-10)

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Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack Slot 14

DM12

Slot 15

DM12

Slot 16

DM12

Slot 17

DM12

Slot 11

Protection

Slot 6

Slot 20

Slot 12

Working

Slot 7

Slot 13

Working

Slot 8

FAN

Slot

4

CXL16/4/1

Slot 9

EOW

Slot

5

CXL16/4/1

Slot 10

AUX

Slot 18

PIU

Slot 19

PIU

As shown in Figure 6-41, the protection board housed in slot 11 protects the boards housed in slots 12–13. Table 6-39 lists the slots for the DX1 and DM12 in the OptiX OSN 1500B subrack. Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack Board

Protection Group

DX1 (working)

Slots 12 and 13

DX1 (protection)

Slot 11

DM12

Slots 14–17

6.9.8 Board Configuration Reference You can use the T2000 to set parameters for the DX1. You can use the T2000 to set the following parameters for the DX1: l

J2 byte

l

Tributary loopback

l

Service loading indication

l

Protocol mode of serial ports

l

DDN clock source management

For details on these parameters, see F Board Configuration Reference.

6.9.9 Technical Specifications The technical specifications of the DX1 cover the electrical interface specifications, board dimensions, weight and power consumption.

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Electrical Interface Specifications The DM12 provides electrical interfaces for the DX1. For the specifications of the electrical interfaces, see the section that describes the DM12.

Mechanical Specifications The mechanical specifications of the DX1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the DX1 is 15 W. NOTE

After the TPS protection is performed, the power consumption of the DX1 is 31 W.

6.10 DXA This section describes the DXA, a DDN convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 6.10.1 Version Description The functional version of the DXA board is N1. 6.10.2 Function and Feature The DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k level at the system side. 6.10.3 Working Principle and Signal Flow The DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/ demapping module, control and communication module and power supply module. 6.10.4 Front Panel On the front panel of the DXA, there are indicators. 6.10.5 Valid Slots The DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B subracks. 6.10.6 Board Configuration Reference You can use the T2000 to set parameters for the DXA. 6.10.7 Technical Specifications The technical specifications of the DXA cover the optical interface specifications, board dimensions, weight and power consumption.

6.10.1 Version Description The functional version of the DXA board is N1. Issue 02 (2007-09-10)

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6.10.2 Function and Feature The DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k level at the system side. Table 6-40 lists the functions and features of the DXA. Table 6-40 Functions and features of the DXA Function and Feature

DXA

Basic function

Cross-connects 63 x framed E1 signals.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Loopback function

Supports inloop and outloop.

PRBS self-test

Not supported.

6.10.3 Working Principle and Signal Flow The DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/ demapping module, control and communication module and power supply module. Figure 6-42 shows the block diagram for the functions of the DXA. Figure 6-42 Block diagram for the functions of the DXA Backplane

64 kbit/s timeslot crossconnect module

Framing/ deframing module

Mapping/ demapping module

Crossconnect unit

Control and communication module +3.3 V DC/DC converter

DC/DC converter

Crossconnect unit

Fuse

-48 V/-60 V -48 V/-60 V

Fuse

+3.3 V Backup Power

In the transmit direction The SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module, which recovers the signals. The framing/deframing module converts the signals to framed E1 6-72

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signals and transmits the signals to the timeslot cross-connect module. The timeslot crossconnect module cross-connects and grooms the signals in the 64 kbit/s granularities.

In the receive direction The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s granularities. The timeslot cross-connect module then transmits the signals to the framing/ deframing module. The framing/deframing module then maps the signals into the VC-4 and transmits the signals into the SDH cross-connect board.

Control and communication module The control and communication module performs the board communication, control and service configuration.

DC/DC converter module The DC/DC converter module provides the DC voltages required by the modules of the board.

6.10.4 Front Panel On the front panel of the DXA, there are indicators.

Appearance of the Front Panel Figure 6-43 shows the appearance of the front panel of the DXA.

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Figure 6-43 Front panel of the DXA

DXA STAT ACT PROG SRV

DXA

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are no interfaces on the front panel of the DXA.

6.10.5 Valid Slots The DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B subracks. The DXA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. 6-74

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The DXA can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

6.10.6 Board Configuration Reference You can use the T2000 to set parameters for the DXA. You can use the T2000 to set the following parameters for the DXA: l

J2 byte

l

Tributary loopback

l

Service loading indication

l

Protocol mode of serial ports

l

DDN clock source management

For details on these parameters, see F Board Configuration Reference.

6.10.7 Technical Specifications The technical specifications of the DXA cover the optical interface specifications, board dimensions, weight and power consumption.

Mechanical Specifications The mechanical specifications of the DXA are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.8

Power Consumption In the normal temperature (25℃), the maximum power consumption of the DXA is 10 W.

6.11 SPQ4 This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.11.1 Version Description The SPQ4 has two versions, N1 and N2. The two versions have different functions. 6.11.2 Function and Feature The SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarms and performance events, and to provide the maintenance features and protection. 6.11.3 Working Principle and Signal Flow The SPQ4 consists of the interface module, encoding/decoding module, frame synchronization and scramble processing module, mapping/demapping module, SDH overhead processing module, logic control module, and power supply module. 6.11.4 Front Panel On the front panel of the SPQ4, there are indicators. 6.11.5 Valid Slots Issue 02 (2007-09-10)

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The OptiX OSN 1500A does not support the SPQ4 board. 6.11.6 TPS Protection for the Board The SPQ4 supports the 1:N TPS protection. 6.11.7 Board Configuration Reference You can use the T2000 to set parameters for the SPQ4. 6.11.8 Technical Specifications The technical specifications of the SPQ4 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.11.1 Version Description The SPQ4 has two versions, N1 and N2. The two versions have different functions. Table 6-41 lists the details on the versions of the SPQ4 board. Table 6-41 Version Description of the SPQ4 Item

Description

Functional version

The SPQ4 has two versions, N1 and N2.

Difference

The equipment of the V100R001 and V100R002 versions support the N1SPQ4. The equipment of the V100R003 and later versions support the N2SPQ2.

Replaceability

The N1SPQ4 can be replaced by the N2SPQ4. When the N1SPQ4 is replaced, the NE should be upgraded.

6.11.2 Function and Feature The SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarms and performance events, and to provide the maintenance features and protection. Table 6-42 lists the functions and features of the SPQ4. Table 6-42 Functions and features of the SPQ4 Function and Feature

SPQ4

Basic function

Processes 4 x STM-1/E4 signals.

Service processing

Accesses and processes 4 x E4/STM-1 electrical signals. For each channel, the E4 and STM-1 signals are compatible. Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing

Supports the processing of SOH bytes for the STM-1 signals, such as B1, B2, K1, K2, M1, F1, and D1–D12. Supports the transparent transmission and termination of POH bytes, including J1, B3, C2, G1, and H4. Supports the setting and query of the J0/J1/C2 bytes.

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Function and Feature

SPQ4

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the TPS protection when used with the interface board and the switching board. Supports the two-fiber unidirectional MSP protection ring, linear MSP protection, and SNCP.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

6.11.3 Working Principle and Signal Flow The SPQ4 consists of the interface module, encoding/decoding module, frame synchronization and scramble processing module, mapping/demapping module, SDH overhead processing module, logic control module, and power supply module. Figure 6-44 shows the block diagram for the functions of the SPQ4.Figure 6-45 shows the block diagram of the 140M mapping/ demapping. Figure 6-46 shows the block diagram of the SDH overhead processing module. Figure 6-44 Block diagram for the functions of the SPQ4 34 MHz OSC

4x139 Mbit/s E4/STM-1

LIU

LIU

P P I/ S P I

4x155 Mbit/s

Reference clock

155 MHz PLL

140M mapping/demapping

High speed bus

4x155 Mbit/s

Cross-connect unit A

Interface conversion module SDH overhead processing module

High speed bus

4x155 Mbit/s

DCC

Cross-connect unit

EN 140M/155M LOS Outloop/Inloop control

Frame header

Communication and control module

Communication

+3.3 V 5V +1.8V +2.5V

DC/DC converter

Cross-connect unit B

SCC unit

K1 and K2

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Crossconnect unit

DC/DC converter

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Fuse

Cross-connect unit SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

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Figure 6-45 Block diagram of the 140M mapping/demapping 140M mapping/demapping 155Mbit/s

139Mbit/s

LPA

HPT

PDH AIS detector

E4 AIS insertion

PG

MST

RST

MST

RST

E4 AIS insertion

J1/C2/B3

155Mbit/s

139Mbit/s

SIPO

HPT

LPA

Figure 6-46 Block diagram of the SDH overhead processing module SDH overhead processing module

Crossconnect unit

K1 and K2 insertion/extration

155 Mbit/s 155 Mbit/s

RST

MST

MSA

HPT

155 Mbit/s 155 Mbit/s

DCC

SCC unit

The principle of the E4/ STM-1 electrical interface units is described below.

PPI/SPI

6-78

l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:

l

Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the PDH LOS signals.

l

The SPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:

l

Encodes and decodes signals.

l

Recovers data and clock.

l

Processes the R_LOS signals.

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SDH Overhead Processing Module and 140M Mapping/Demapping Module SDH Overhead Processing Module (155Mbit/s SDH Signals) The functions required to manage 155 Mbit/s SDH signals are implemented by the SDH overhead processing module.

RST l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

l

In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection.

l

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion.

l

Provides extraction or insertion of K1 byte and K2 byte.

l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, AU_AIS generation.

l

OH termination

l

J1 path trace message recover

l

REI information recovering

l

HP_RDI detection (path status monitoring

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MST

MSA

HPT

140M mapping/demapping (140Mbit/s PDH signals) The functions required to manage 140 Mbit/s PDH signals are implemented by the 140M mapping/demapping module.

LPA The 140 Mbit/s plesiochronous stream is inserted in a C4 container to be adapted so as to be transported into the synchronous network. PDH AIS is monitored and E4 AIS in inserted.

HPT The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and Issue 02 (2007-09-10)

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POH. The latter contains nine octets equally distributing within the frame. These overhead bytes can be extracted: J1, B3. C2, G1, F2, H4, F3, K3 and N1.E4 AIS can be inserted in downstream direction. PG (Pointer generator) A fixed pointer value is inserted in the SOH to structure the AU4 signal.

MST and RST These two functions are necessary to create a proprietary STM–1 signal in order to connect with interface conversion module. In the receive direction, MST and RST perform frame alignment detection (A1, A2).

Interface converting module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

l

Traces the clock signal from the active and the standby cross-connect units.

l

Realizes the pass-through of orderwire and ECC bytes between the two service processing boards constituting the ADM when the GSCC is not online.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Control the indicator on the board.

DC/DC converter module It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to the following voltages: +2.5 V, + 3.3 V, + 1.8 V, + 5 V. In addition, protection for +3.3 V power are provided to the board.

6.11.4 Front Panel On the front panel of the SPQ4, there are indicators.

Appearance of the Front Panel Figure 6-47 shows the appearance of the front panel of the SPQ4.

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Figure 6-47 Front panel of the SPQ4

SPQ4 STAT ACT PROG SRV

SPQ4

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are no interfaces on the front panel of the SPQ4. When used with the MU04, the SPQ4 can input or output the E4/STM-1 signals. For details, see the section that describes the MU04.

6.11.5 Valid Slots The OptiX OSN 1500A does not support the SPQ4 board. In the OptiX OSN 1500B subrack, the SPQ4 can be housed in any of slots 12–13, and must be used with the MU04. Issue 02 (2007-09-10)

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Table 6-43 lists the valid slots for the SPQ4 and corresponding slots for the MU04. Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN 1500B subrack Valid Slot for the SPQ4

Corresponding Slot for the DMU04

Slot 12

Slot 14

Slot 13

Slot 16

6.11.6 TPS Protection for the Board The SPQ4 supports the 1:N TPS protection.

Protection Principle In the OptiX OSN 1500B, used with the MU04 and TSB8, the SPQ4 can be configured into one 1:1 TPS protection group. Figure 6-48 shows the principle of the TPS protection for the SPQ4. Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack 4×E4/STM-1

TSB8

3

2

MU04 1

1

Switch control signal

2

Crossconnect and timing board

SLOT 4/5 Protection

SPQ4

Working SPQ4 Fail

SLOT12

l

SLOT13

Normal state When the working boards are running normally, the control switch of the MU04 is in position 1 and the MU04 directly accesses the service signals to the SLH1.

l

Switching state When the working board detects a fault and requires a switching, the control switch of the MU04 is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding position. In this way, the protection board protects the faulty working board.

Hardware Configuration Figure 6-49 shows the slot configuration for the 1:2 TPS protection for the SPQ4 in the OptiX OSN 1500B subrack. 6-82

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Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4 Slot 14

TSB8

Slot 15 Slot 16

MU04

Slot 17

Slot 18

PIU

Slot 19

PIU

Slot 6

Slot 11 Slot 20

Slot 12

Protection

Slot 7

FAN

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 6-49, the protection board housed in slot 12 protects the board housed in slot 13. Table 6-44 lists the slots for the SPQ4, MU04 and TSB8. Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack Board

Protection Group

SPQ4 (working)

Slot 13

SPQ4 (protection)

Slot 12

MU04

Slot 16

TSB8

Slot 14

6.11.7 Board Configuration Reference You can use the T2000 to set parameters for the SPQ4. You can use the T2000 to set the following parameters for the SPQ4: l

J1 byte

l

C2 byte

For details on these parameters, see F Board Configuration Reference.

6.11.8 Technical Specifications The technical specifications of the SPQ4 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications The MU04 provides electrical interfaces for the SPQ4. For the specifications of the electrical interfaces, see the section that describes the MU04. Issue 02 (2007-09-10)

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Mechanical Specifications The mechanical specifications of the SPQ4 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.9

Power Consumption In the normal temperature (25℃), the maximum power consumption of the SPQ4 is 24 W.

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7 Data Processing Boards

Data Processing Boards

About This Chapter This chapter describes the data processing boards for the FE, GE, ATM, and SAN signals. 7.1 EFT4 This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.2 EFT8 This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.3 EFT8A This section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.4 EGT2 This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.5 EFS0 This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.6 EFS4 This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.7 EGS2 This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.8 EMS4 This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission and convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 7.9 EGS4 Issue 02 (2007-09-10)

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This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 7.10 EGR2 This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.11 EMR0 This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.12 ADL4 This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.13 ADQ1 This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.14 IDL4 This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.15 IDQ1 This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.16 MST4 This section describes the MST4, a 4-channel multi-service transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications.

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7.1 EFT4 This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.1.1 Version Description The functional version of the EFT4 board is R1. 7.1.2 Function and Feature The EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames. 7.1.3 Working Principle and Signal Flow The EFT4 consists of the ethernet access module, mapping module, interface converting module, Communication and control module and so on. 7.1.4 Front Panel On the front panel of the EFT4, there are indicators, interfaces and barcode. 7.1.5 Valid Slots The EFT4 can be housed in any of slots 2, 3, 6–9 and 12–13 in the OptiX OSN 1500A subrack. The EFT4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack. 7.1.6 Board Configuration Reference You can use the T2000 to set parameters for the EFT4. 7.1.7 Technical Specifications The specifications of the EFT4 cover the mechanical specifications and power consumption.

7.1.1 Version Description The functional version of the EFT4 board is R1.

7.1.2 Function and Feature The EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames. Table 7-1 lists the functions and features of the EFT4. Table 7-1 Functions and features of the EFT4

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Function and Feature

EFT4

Basic function

Transmits 4 x FE services.

Specification of the optical interface

Supports 10Base-T/100Base-TX signals. The optical interfaces comply with IEEE 802.3u.

Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes. Huawei Technologies Proprietary

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Function and Feature

EFT4

Max. uplink bandwidth

622 Mbit/s.

Number of VCTRUNKs

4.

Encapsulation format

HDLC. LAPS. GFP-F.

Mapping granularity

Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).

Ethernet service type

Supports EPL.

MPLS

Not supported.

VLAN

Supports VLAN transparent transmission.

LPT

Not supported.

CAR

Not supported.

Flow control function

Supports the IEEE 802.3x flow control based on FE port.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042.

Test frame

Receives and transmits Ethernet test frames.

Ethernet performance monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.1.3 Working Principle and Signal Flow The EFT4 consists of the ethernet access module, mapping module, interface converting module, Communication and control module and so on. Figure 7-1 shows the block diagram for the functions of the EFT4.

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Figure 7-1 Block diagram for the functions of the EFT4

ENCP FE

Ethernet access module

Cross-connect unit

Interface converting module

VCP DENCP

Cross-connect unit

Mapping module Laser shutdown

LOS

Communication

Communication and control module

+3.3 V

Clock module

SCC unit

Reference clock and frame header

+1.5 V +1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

SCC unit

Fuse

- 48 V/-60V - 48 V/-60V

+3.3 V

+3.3 V backup power

77 125 155 MHz MHz MHz

The function modules of ethernet switching boards are described below: ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet access module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Mapping module The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets. Issue 02 (2007-09-10)

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Interface converting module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions: l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

Control indicators

Clock unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC converter module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.1.4 Front Panel On the front panel of the EFT4, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-2 shows the appearance of the front panel of the EFT4.

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Figure 7-2 Front panel of the EFT4

EFT4 STAT ACT PROG SRV

FE1 FE2 FE3 FE4

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four FE interfaces on the front panel of the EFT4. Table 7-2 lists the type and usage of the interfaces. Table 7-2 Optical interfaces of the EFT4 Interface

Interface Type

Usage

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

Table 7-3 lists the pins of the RJ-45 interface. Issue 02 (2007-09-10)

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Table 7-3 Pins of the RJ-45 of the EFT4 Pin

Description

1

Transmitting positive

2

Transmitting negative

3

Receiving positive

4

Grounding

5

Grounding

6

Receiving negative

7

Grounding

8

Grounding

7.1.5 Valid Slots The EFT4 can be housed in any of slots 2, 3, 6–9 and 12–13 in the OptiX OSN 1500A subrack. The EFT4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack. NOTE

The slots are divided slots.

7.1.6 Board Configuration Reference You can use the T2000 to set parameters for the EFT4. You can use the T2000 to set the following parameters for the EFT4: l

Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.1.7 Technical Specifications The specifications of the EFT4 cover the mechanical specifications and power consumption.

Mechanical Specifications The mechanical specifications of the EFT4 are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.5

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EFT4 is 14 W. 7-8

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7.2 EFT8 This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.2.1 Version Description The functional version of the EFT8 board is N1. 7.2.2 Function and Feature The EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames. 7.2.3 Working Principle and Signal Flow The EFT8 consists of the ethernet access module, mapping module, interface converting module, communication and control module and so on. 7.2.4 Front Panel On the front panel of the EFT8, there are indicators, interfaces and barcode. 7.2.5 Valid Slots The EFT8 can be used with the ETF8 and EFF8. 7.2.6 Board Configuration Reference You can use the T2000 to set parameters for the EFT8. 7.2.7 Technical Specifications The specifications of the EFT8 cover the mechanical specifications and power consumption.

7.2.1 Version Description The functional version of the EFT8 board is N1.

7.2.2 Function and Feature The EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames. Table 7-4 lists the functions and features of the EFT8. Table 7-4 Functions and features of the EFT8 Function and Feature

EFT8

Basic function

Transmits 8 x FE or 16 x FE services

Used with the interface board

Accesses 8 x Ethernet signals at the electrical port. Accesses 16 x Ethernet signals at the electrical port when used with the ETF8. Accesses 8 x Ethernet optical signals and 8 x Ethernet electrical signals when used with the EFF8.

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Function and Feature

EFT8

Specification of the optical interface

Supports the 10Base-T/100Base-TX signals when used with the ETF8.

Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink bandwidth

1.25 Gbit/s.

Number of VCTRUNKs

16.

Encapsulation format

Supports HDLC, LAPS, and GFP-F.

Mapping granularity

Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).

Ethernet service type

Supports EPL.

MPLS

Not supported.

VLAN

Supports the VLAN transparent transmission.

LPT

Not supported.

CAR

Not supported.

Flow control function

Supports the IEEE 802.3x flow control based on FE port.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042.

Test frame

Receives and transmits GFP test frames.

Ethernet performance monitoring

Supports Ethernet performance monitoring at the port level.

Alarms and performance events

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Supports the 100Base-FX/100Base-TX signals when used with the EFF8. The optical interfaces comply with IEEE 802.3u.

7.2.3 Working Principle and Signal Flow The EFT8 consists of the ethernet access module, mapping module, interface converting module, communication and control module and so on. Figure 7-3 shows the block diagram for the functions of the EFT8.

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Figure 7-3 Block diagram for the functions of the EFT8

ENCP FE

Ethernet access module

Cross-connect unit

Interface converting module

VCP DENCP

Cross-connect unit

Mapping module Laser shutdown

LOS

Communication

Communication and control module

SCC unit

Reference clock and frame header

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

SCC unit

Fuse

- 48 V/-60V - 48 V/-60V

+3.3 V

+3.3 V backup power

77 125 155 MHz MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

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Interface Converting Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions: l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

Control indicators

Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.2.4 Front Panel On the front panel of the EFT8, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-4 shows the appearance of the front panel of the EFT8.

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Figure 7-4 Front panel of the EFT8

EFT8 STAT ACT PROG SRV FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are eight interfaces on the front panel of the EFT8. Table 7-5 lists the type and usage of the interfaces.

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Table 7-5 Optical interfaces of the EFT8 Interface

Interface Type

Usage

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE5

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE6

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE7

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE8

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

Table 7-6 lists the pins of the RJ-45 interface. Table 7-6 Pins of the RJ-45 of the EFT8 Pin

Description

1

Transmitting positive

2

Transmitting negative

3

Receiving positive

4

Grounding

5

Grounding

6

Receiving negative

7

Grounding

8

Grounding

7.2.5 Valid Slots The EFT8 can be used with the ETF8 and EFF8. Table 7-7 and Table 7-8 list the valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8. 7-14

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Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A Valid Slot for the EFT8

Corresponding Slot for the ETF8 and EFF8

Slot 12

Without the interface board

Slot 13

Without the interface board

Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B Valid Slot for the EFT8

Corresponding Slot for the ETF8 and EFF8

Slot 11

Without the interface board

Slot 12

Slot 14

Slot 13

Slot 16

7.2.6 Board Configuration Reference You can use the T2000 to set parameters for the EFT8. You can use the T2000 to set the following parameters for the EFT8: l

Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.2.7 Technical Specifications The specifications of the EFT8 cover the mechanical specifications and power consumption.

Mechanical Specifications The mechanical specifications of the EFT8 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EFT8 is 26 W.

7.3 EFT8A This section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. Issue 02 (2007-09-10)

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7.3.1 Version Description The functional version of the EFT8A board is N1. 7.3.2 Function and Feature The EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames. 7.3.3 Working Principle and Signal Flow The EFT8A consists of the ethernet access module, mapping module, interface converting module, communication and control module and so on. 7.3.4 Front Panel On the front panel of the EFT8A, there are indicators, interfaces and barcode. 7.3.5 Valid Slots The EFT8A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFT8A can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.3.6 Board Configuration Reference You can use the T2000 to set parameters for the EFT8A. 7.3.7 Technical Specifications The specifications of the EFT8A cover the mechanical specifications and power consumption.

7.3.1 Version Description The functional version of the EFT8A board is N1.

7.3.2 Function and Feature The EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames. Table 7-9 lists the functions and features of the EFT8A. Table 7-9 Functions and features of the EFT8A

7-16

Function and Feature

EFT8A

Basic function

Transparently transmits 8 x FE services.

Specification of the optical interface

Supports 10Base-T/100Base-TX signals. The optical interfaces comply with IEEE 802.3u.

Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink bandwidth

622 Mbit/s.

Number of VCTRUNKs

8.

Encapsulation format

Supports HDLC, LAPS, and GFP-F.

Mapping granularity

Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).

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Function and Feature

EFT8A

Ethernet service type

Supports EPL.

MPLS

Not supported.

VLAN

Supports VLAN transparent transmission.

LPT

Not supported.

CAR

Not supported.

Flow control function

Supports the IEEE 802.3x flow control based on FE port.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042.

Test frame

Receives and transmits GFP test frames.

Ethernet performance monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.3.3 Working Principle and Signal Flow The EFT8A consists of the ethernet access module, mapping module, interface converting module, communication and control module and so on. Figure 7-5 shows the block diagram for the functions of the EFT8A.

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Figure 7-5 Block diagram for the functions of the EFT8A

ENCP FE

Ethernet access module

Cross-connect unit

Interface converting module

VCP DENCP

Cross-connect unit

Mapping module Laser shutdown

LOS

Communication

Communication and control module

+3.3 V

Clock module

SCC unit

Reference clock and frame header

+1.5 V +1.8 V +2.5 V

DC/DC converter

DC/DC converter Fuse

SCC unit

Fuse

- 48 V/-60V - 48 V/-60V

+3.3 V

+3.3 V backup power

77 125 155 MHz MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

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Interface Converting Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions: l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

Control indicators

Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.3.4 Front Panel On the front panel of the EFT8A, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-6 shows the appearance of the front panel of the EFT8A.

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Figure 7-6 Front panel of the EFT8A

EFT8A STAT ACT PROG SRV

FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8A

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are eight FE interfaces on the front panel of the EFT8A. Table 7-10 lists the type and usage of the interfaces.

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Table 7-10 Optical interfaces of the EFT8A Interface

Interface Type

Usage

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE5

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE6

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE7

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE8

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

Table 7-11 lists the pins of the RJ-45 interface. Table 7-11 Pins of the RJ-45 of the EFT8A Pin

Description

1

Transmitting positive

2

Transmitting negative

3

Receiving positive

4

Grounding

5

Grounding

6

Receiving negative

7

Grounding

8

Grounding

7.3.5 Valid Slots The EFT8A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFT8A can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

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7.3.6 Board Configuration Reference You can use the T2000 to set parameters for the EFT8A. You can use the T2000 to set the following parameters for the EFT8A: l

Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.3.7 Technical Specifications The specifications of the EFT8A cover the mechanical specifications and power consumption.

Mechanical Specifications The mechanical specifications of the EFT8A are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EFT8A is 26 W.

7.4 EGT2 This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.4.1 Version Description The functional version of the EGT2 board is N1. 7.4.2 Function and Feature The EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames. 7.4.3 Working Principle and Signal Flow The EGT2 consists of the ethernet access module, mapping module, interface converting module, interface converting module, Communication and Control Module and so on. 7.4.4 Front Panel On the front panel of the EGT2, there are indicators, interfaces and barcode. 7.4.5 Valid Slots The EGT2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGT2 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.4.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGT2 indicates the optical interface type. 7-22

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7.4.7 Board Configuration Reference You can use the T2000 to set parameters for the EGT2. 7.4.8 Technical Specifications The specifications of the EGT2 cover the optical interface specifications, mechanical specifications and power consumption.

7.4.1 Version Description The functional version of the EGT2 board is N1.

7.4.2 Function and Feature The EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames. Table 7-12 lists the functions and features of the EGT2. Table 7-12 Functions and features of the EGT2

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Function and Feature

EGT2

Basic function

Transparently transmits 2 x GE services.

Specification of the optical interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. The optical interfaces support the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km.

Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink bandwidth

2.5 Gbit/s.

Number of VCTRUNKs

2.

Encapsulation format

Supports HDLC, LAPS, and GFP-F.

Mapping granularity

Supports VC-4, VC-3, VC-3-Xv (X≤24), and VC-4-Xv (X≤8).

Ethernet service type

Supports EPL.

MPLS

Not supported.

VLAN

Supports VLAN transparent transmission.

LPT

Not supported. Huawei Technologies Proprietary

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Function and Feature

EGT2

CAR

Not supported.

Flow control function

Supports the IEEE 802.3x flow control based on GE port.

LCAS

Dynamically increases or decreases the bandwidth and realizes the protection function, compliant with ITU-T G.7042.

Test frame

Receives and transmits Ethernet test frames.

Ethernet performance monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.4.3 Working Principle and Signal Flow The EGT2 consists of the ethernet access module, mapping module, interface converting module, interface converting module, Communication and Control Module and so on. Figure 7-7 shows the block diagram for the functions of the EGT2. Figure 7-7 Block diagram for the functions of the EGT2

ENCP GE

Ethernet access module

Cross-connect unit

Interface converting module

VCP DENCP

Cross-connect unit

Mapping module Laser shutdown

LOS

Communication

Communication and control module

+3.3 V

Clock module

SCC unit

Reference clock and frame header

+1.5 V +1.8 V +2.5 V

DC/DC converter

DC/DC converter Fuse

SCC unit

Fuse

- 48 V/-60V - 48 V/-60V

+3.3 V

+3.3 V backup power

77 125 155 MHz MHz MHz

ENCP: data encapsulation module

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VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Converting Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions: l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

Control indicators

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Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.4.4 Front Panel On the front panel of the EGT2, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-8 shows the appearance of the front panel of the EGT2. Figure 7-8 Front panel of the EGT2

EGT2 STAT ACT PROG SRV LINK1 ACT1 LINK2 ACT2

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 EGT2

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are two GE interfaces on the front panel of the EGT2. Table 7-13 lists the type and usage of the interfaces. Table 7-13 Optical interfaces of the EGT2 Interface

Interface Type

Usage

IN1/OUT1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

IN2/OUT2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

7.4.5 Valid Slots The EGT2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGT2 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.4.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGT2 indicates the optical interface type. Table 7-14 lists the relation between the board feature code and optical interface type for the EGT2. Table 7-14 Relation between the board feature code and the optical interface type

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Board Barcode

Feature Code

Optical Interface Type

SSN1EGT210

10

1000Base-SX (0.55 km)

SSN1EGT211

11

1000Base-LX (10 km)

SSN1EGT212

12

1000Base-ZX (40 km)

SSN1EGT213

13

1000Base-ZX (70 km) Huawei Technologies Proprietary

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7.4.7 Board Configuration Reference You can use the T2000 to set parameters for the EGT2. You can use the T2000 to set the following parameters for the EGT2: l

Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.4.8 Technical Specifications The specifications of the EGT2 cover the optical interface specifications, mechanical specifications and power consumption.

Optical Interface Specifications Table 7-15 lists the specifications of the interfaces of the EGT2. Table 7-15 Specifications of the optical interfaces of the EGT2 Item

Specification

Optical interface type

1000Base-ZX (70 km)

1000Base-ZX (40 km)

1000Base-LX (10 km)

1000Base-SX (0.55 km)

Optical source type

MLM

MLM

MLM

MLM

Launched optical power (dBm)

–4 to +2

–2 to +5

–9 to –3

–9.5 to 0

Central wavelength (nm)

1480 to 1580

1270 to 1355

1270 to 1355

770 to 860

Overload optical power (dBm)

–3

–3

–3

0

Receiver sensitivity (dBm)

–22

–23

–19

–17

Extinction ratio (dB)

9

9

9

9

Laser Safety Class The safety class of the laser on the board is CLASS 1. 7-28

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The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the EGT2 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.9

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EGT2 is 29 W.

7.5 EFS0 This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.5.1 Version Description The EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version is stopped. 7.5.2 Function and Feature The EFS0 supports Layer 2 switching, MPLS and broadcast. 7.5.3 Working Principle and Signal Flow The EFS0 consists of the ethernet access module, network processor module, mapping module, interface converting module and so on. 7.5.4 Front Panel On the front panel of the EFS0, there are indicators, interfaces and barcode. 7.5.5 Valid Slots The EFS0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack. 7.5.6 TPS Protection The EFS0 supports the 1:N TPS protection. 7.5.7 Board Configuration Reference You can use the T2000 to set parameters for the EFS0. 7.5.8 Technical Specifications The specifications of the EFS0 cover the mechanical specifications and power consumption.

7.5.1 Version Description The EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version is stopped. The OptiX OSN 1500A does not support the EFS0. The OptiX OSN 1500B supports the EFS0. Table 7-16 lists the details on the versions of the EFS0 board.

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Table 7-16 Version Description of the EFS0 Item

Description

Functional version

The EFS0 has three versions, N1, N2, and N4.

Difference

The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s. The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s. The N1EFS0 supports the port flow, port+VLAN ID flow, and port +VLAN PRI flow. The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow, and port+VLAN PRI flow.

Replaceability

The N2EFS0 supports the board version replacement function and can replace the N1EFS0. The N4EFS0 supports the board version replacement function and can replace the N1EFS0 and N2EFS0.

7.5.2 Function and Feature The EFS0 supports Layer 2 switching, MPLS and broadcast. Table 7-17 lists the functions and features of the EFS0. Table 7-17 Functions and features of the EFS0 Function and Feature

EFS0

Basic function

Processes 8 x FE services.

Used with the interface board

Accesses 8 x FE signals at the electrical interface when used with the ETF8. Accesses 8 x FE signals at the optical interface when used with the EFF8. Realizes the TPS protection for 8 x FE signals at the electrical interface when used with the ETS8 and TSB8.

Specification of the optical interface

Supports the 10Base-T/100Base-TX signals when used with the ETF8.

Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink bandwidth

The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s.

Supports the 100Base-FX signals when used with the EFF8. The optical inerfaces comply with IEEE 802.3u.

The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s. The maximum uplink bandwidth of the N4EFS0 is 1.25 Gbit/s.

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Function and Feature

EFS0

Number of VCTRUNKs

The number of the VCTRUNKs of the N1EFS0 is 12. The number of the VCTRUNKs of the N2EFS0 is 24. The number of the VCTRUNKs of the N4EFS0 is 24.

Mapping granularity

Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤12).

Encapsulation format

GFP.

EPL

Supports transparent transmission based on port and Ethernet private line services based on port+VLAN.

EVPL

Supports EVPL services that use the frame encapsulation formats of MartinioE and stack VLAN.

EPLAN

Supports the Layer 2 convergence and point to multipoint convergence. Supports the Layer 2 forwarding function. Supports switching at the client and SDH sides. Supports the function of self-learning the source MAC address. The length of the MAC address table is 16k. The aging time of the MAC address can be set and queried. Supports the configuration of static MAC route. The N1EFS0 and N2EFS0 support the dynamic query of the MAC address, and support the query of the number of the learned MAC addresses according to VB+VLAN or VB+LP. The N4EFS0 does not support the dynamic query of the MAC address, but it supports the query of the number of the learned MAC addresses according to VB+VLAN or VB+LP. Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 16. The maximum number of logical ports for each VB is 30.

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EVPLAN

Supports EVPLAN services. The N1EFS0 uses the frame encapsulation formats of MPLS MartinioE, MPLS MartinioP and stack VLAN. The N2EFS0 and N4EFS0 use the frame encapsulation formats of MPLS MartinioE and stack VLAN.

MPLS

Supported.

VLAN

Compliant with IEEE 802.1q/p.

VLAN convergence

Supported (4k VLAN).

RSTP

Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w.

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Function and Feature

EFS0

Multicast (IGMP Snooping)

Supported.

CAR

Supported. The granularity is 64 kbit/s.

Service based QoS flow classification

The N1EFS0 supports the port service, port+VLAN ID service, and port +VLAN PRI service. The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow, and port+VLAN PRI flow.

LCAS

Dynamically increases or decreases the bandwidth and realizes the protection function, compliant with ITU-T G.7042.

LPT

Supports the LPT function, which can be enabled or disabled.

Flow control function

Supports the IEEE 802.3x flow control based on port.

Test frame

Receives and transmits Ethernet test frames.

Loopback function

Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports inloop and outloop at the VC-3 level.

Ethernet performance monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.5.3 Working Principle and Signal Flow The EFS0 consists of the ethernet access module, network processor module, mapping module, interface converting module and so on. Figure 7-9 shows the block diagram for the functions of the EFS0.

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Figure 7-9 Block diagram for the functions of the EFS0 E N C P

Control FE

Ethernet access module

Network processor

Switch fabric

Laser shutdown

V C P

D E N C P

Data

Network processor module

Cross-connect unit

Interface coversion module Cross-connect unit

Mapping module

LOS

Communication

Communication and control module

Reference clock and frame header

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

50 77 125 155 MHz MHz MHz MHz

ENCP: data encapsulation module

SCC unit

+3.3 V backup power

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported: l

Multi-protocol label switching (MPLS)

l

L2MPLS VPN

l

Ethernet/ VLAN

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In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module: l

Supports flow sense and flow classification

l

Supports uni-cast, multi-cast and broadcast of the flow

l

Provides data priority setting

l

Provides weighted fair queuing (WFQ)

l

Provides four classes of services (CoS)

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:

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l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

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Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.5.4 Front Panel On the front panel of the EFS0, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-10 shows the appearance of the front panel of the EFS0. Figure 7-10 Front panel of the EFS0

EFS0 STAT ACT PROG SRV

EFS0

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are no interfaces on the front panel of the EFS0. The interfaces are present on the ETF8 or EFF8.

7.5.5 Valid Slots The EFS0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack. When the N1EFS0 is housed in any of slots 12–13 in the OptiX OSN 1500B subrack, the bandwidth is 622 Mbit/s. When the N2EFS0 or N4EFS0 is housed in any of slots 12–13 in the OptiX OSN 1500B subrack, the bandwidth is 1.25 Gbit/s. The EFS0 can be used with the ETF8 and EFF8. Table 7-18 lists the valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8. Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack Valid Slot for the EFS0

Corresponding Slot for the ETF8 and EFF8

Slot 12

Slot 14

Slot 13

Slot 16

7.5.6 TPS Protection The EFS0 supports the 1:N TPS protection. Figure 7-11 shows the slot configuration for the 1:1 TPS protection for the EFS0.

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Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B subrack Slot 14

TSB8

Slot 15 Slot 16

ETS8

Slot 17

Slot 18

PIU

Slot 19

PIU

Slot 6

Slot 11 Slot 20

Slot 12

EFS0 Protection

Slot 7

FAN

Slot 13

EFS0 Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 7-11, the protection board housed in slot 12 protects the board housed in slot 13. The ETS8, housed in slot 16, is used with the working ETS0. The TSB8, housed in slot 14, is used with the protection EFS0.

7.5.7 Board Configuration Reference You can use the T2000 to set parameters for the EFS0. You can use the T2000 to set the following parameters for the EFS0: l

Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.5.8 Technical Specifications The specifications of the EFS0 cover the mechanical specifications and power consumption.

Mechanical Specifications The mechanical specifications of the EFS0 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EFS0 is 35 W.

7.6 EFS4 This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. Issue 02 (2007-09-10)

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7.6.1 Version Description The EFS4 has two functional versions, N1 and N2. The two versions have different maximum uplink bandwidth. 7.6.2 Function and Feature The EFS4 supports Layer 2 switching, MPLS and broadcast. 7.6.3 Working Principle and Signal Flow The EFS4 consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication Module and the power supply module 7.6.4 Front Panel On the front panel of the EFS4, there are indicators, interfaces and barcode. 7.6.5 Valid Slots The EFS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.6.6 Board Configuration Reference You can use the T2000 to set parameters for the EFS4. 7.6.7 Technical Specifications The specifications of the EFS4 cover the mechanical specifications and power consumption.

7.6.1 Version Description The EFS4 has two functional versions, N1 and N2. The two versions have different maximum uplink bandwidth. Table 7-19 lists the details on the versions of the EFS4 board. Table 7-19 Version Description of the EFS4 Item

Description

Functional version

The EFS4 has two versions, N1 and N2.

Difference

The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s. The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s. The N2EFS4 supports the board version replacement function.

Replaceability

The N2EFS4 supports the board version replacement function and can replace the N1EFS4.

7.6.2 Function and Feature The EFS4 supports Layer 2 switching, MPLS and broadcast. Table 7-20 lists the functions and features of the EFS4.

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Table 7-20 Functions and features of the EFS4 Function and Feature

EFS4

Basic function

Processes 4 x FE services.

Specification of the optical interfaces

Supports 10Base-T/100Base-TX signals. The optical interfaces comply with IEEE 802.3u.

Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink bandwidth

The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.

Number of VCTRUNKs

The number of the VCTRUNKs of the N1EFS4 is 12.

Mapping granularity

Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤12).

Encapsulation format

GFP.

EPL

Supports transparent transmission based on port and Ethernet private line services based on port+VLAN.

EVPL

Supports EVPL services that use the frame encapsulation formats of MartinioE and stack VLAN.

EPLAN

Supports the Layer 2 convergence and point to multipoint convergence.

The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s.

The number of the VCTRUNKs of the N2EFS4 is 24.

Supports the Layer 2 forwarding function and switching at the client and SDH sides. Supports the function of self-learning the source MAC address. The length of the MAC address table is 16k. The aging time of the MAC address can be set and queried. Supports the configuration of static MAC route. The N1EFS4 supports the dynamic query of the MAC address, and supports the query of the number of the learned MAC addresses according to VB+VLAN or VB+LP. The N2EFS4 does not support the dynamic query of the MAC address, but it supports the query of the number of the learned MAC addresses according to VB+VLAN or VB+LP. Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 16 (a maximum of two VBs for the N2EGS2). The maximum number of logical ports for each VB is 30.

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Function and Feature

EFS4

EVPLAN

Supports EVPLAN services. The N1EFS4 uses the frame encapsulation formats of MPLS MartinioE, MPLS MartinioP and stack VLAN. The N2EFS4 uses the frame encapsulation formats of MPLS MartinioE and stack VLAN.

MPLS

Supported.

VLAN

Compliant with IEEE 802.1q/p.

VLAN convergence

Supported (4k VLAN).

RSTP

Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w.

Multicast (IGMP Snooping)

Supported.

CAR

Supported. The granularity is 64 kbit/s.

Service based

The N1EFS4 supports the port service, port+VLAN ID service, and port +VLAN PRI service.

QoS flow classification

The N2EFS4 supports the port flow, port+VLAN ID flow, and port +VLAN PRI flow.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042.

LPT

Supports the LPT function, which can be enabled or disabled.

Flow control function

Supports the IEEE 802.3x flow control based on port.

Test frame

Receives and transmits Ethernet test frames.

Loopback function

Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports inloop and outloop at the VC-3 level.

Ethernet performance monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.6.3 Working Principle and Signal Flow The EFS4 consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication Module and the power supply module 7-40

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Figure 7-12 shows the block diagram for the functions of the EFS4. Figure 7-12 Block diagram for the functions of the EFS4 E N C P

Control FE

Ethernet access module

Network processor

Switch fabric

Laser shutdown

V C P

D E N C P

Data

Network processor module

Cross-connect unit

Interface coversion module Cross-connect unit

Mapping module

LOS

Communication

Communication and control module

Reference clock and frame header

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

77 125 155 50 MHz MHz MHz MHz

ENCP: data encapsulation module

SCC unit

+3.3 V backup power

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported: l

Multi-protocol label switching (MPLS)

l

L2MPLS VPN

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Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module: l

Supports flow sense and flow classification

l

Supports uni-cast, multi-cast and broadcast of the flow

l

Provides data priority setting

l

Provides weighted fair queuing (WFQ)

l

Provides four classes of services (CoS)

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:

7-42

l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

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Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.6.4 Front Panel On the front panel of the EFS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-13 shows the appearance of the front panel of the EFS4. Figure 7-13 Front panel of the EFS4

EFS4 STAT ACT PROG SRV

FE1

FE2

FE3

FE4

EFS4

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four FE interfaces on the front panel of the EFS4. Table 7-21 lists the type and usage of the interfaces. Table 7-21 Optical interfaces of the EFS4 Interface

Interface Type

Usage

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

Table 7-22 lists the pins of the RJ-45 interface. Table 7-22 Pins of the RJ-45 of the EFS4

7-44

Pin

Description

1

Transmitting positive

2

Transmitting negative

3

Receiving positive

4

Grounding

5

Grounding

6

Receiving negative

7

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Description

8

Grounding

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7.6.5 Valid Slots The EFS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.6.6 Board Configuration Reference You can use the T2000 to set parameters for the EFS4. You can use the T2000 to set the following parameters for the EFS4: l

Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.6.7 Technical Specifications The specifications of the EFS4 cover the mechanical specifications and power consumption.

Mechanical Specifications The mechanical specifications of the EFS4 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EFS4 is 30 W.

7.7 EGS2 This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.7.1 Version Description The EGS2 has two functional versions, N1 and N2. The two versions have different functions and features. 7.7.2 Function and Feature The EGS2 supports Layer 2 switching, MPLS and broadcast. 7.7.3 Working Principle and Signal Flow The EGS2 consists of the ethernet access module, network processor module, mapping module, interface converting module, communication and control module and so on. Issue 02 (2007-09-10)

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7.7.4 Front Panel On the front panel of the EGS2, there are indicators, interfaces and barcode. 7.7.5 Valid Slots The EGS2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS2 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.7.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGS2 indicates the optical interface type. 7.7.7 Board Configuration Reference You can use the T2000 to set parameters for the EGS2. 7.7.8 Technical Specifications The specifications of the EGS2 cover the optical interface specifications, mechanical specifications and power consumption.

7.7.1 Version Description The EGS2 has two functional versions, N1 and N2. The two versions have different functions and features. Table 7-23 lists the details on the versions of the EGS2 board. Table 7-23 Version Description of the EGS2 Item

Description

Functional version

The EGS2 has two versions, N1 and N2.

Difference

The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s. The maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s. The number of the VCTRUNKs of the N1EGS2 is 24. The number of the VCTRUNKs of the N2EGS2 is 48. The encapsulation formats of the N1EGS2 are GFP, LAPS, and HDLC. The encapsulation format of the N1EGS2 is GFP. The N1EGS2 supports the MartinioP encapsulation of the MPLS. The N2EGS2 does not support the MartinioP encapsulation. The N2EGS2 supports the board version replacement function.

Replaceability

On certain conditions, the N2EGS2 can replace the N1EGS2. When the N2EGS2 replaces the N1EGS2, the N1EGS2 should not be configured with MartinioP or CoS of the MPLS.

7.7.2 Function and Feature The EGS2 supports Layer 2 switching, MPLS and broadcast. Table 7-24 lists the functions and features of the EGS2.

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Table 7-24 Functions and features of the EGS2 Function and Feature

EGS2

Basic function

Processes 2 x GE services.

Specification of the optical interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. The optical interfaces support the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km.

Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q/p. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink bandwidth

The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s.

Number of VCTRUNKs

The number of the VCTRUNKs of the N1EGS2 is 24.

Mapping granularity

Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤12).

Encapsulation format

The encapsulation formats for the N1EGS2 are GFP, LAPS, and HDLC.

EPL

Supports transparent transmission based on port and Ethernet private line services based on port+VLAN.

EVPL

Not supported by the N1EGS2.

The maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s.

The number of the VCTRUNKs of the N2EGS2 is 48.

The encapsulation format for the N2EGS2 is GFP.

The N2EGS2 supports EVPL services that use the frame encapsulation formats of MartinioE and stack VLAN. EPLAN

Supports the Layer 2 convergence and point to multipoint convergence. Supports the Layer 2 forwarding function and switching at the client and SDH sides. Supports the function of self-learning the source MAC address. The length of the MAC address table is 16k. The aging time of the MAC address can be set and queried. Supports the configuration of the static MAC route. Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 2. The maximum number of logical ports for each VB is 30.

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Function and Feature

EGS2

EVPLAN

Not supported by the N1EGS2. The N2EGS2 supports EVPL services that use the frame encapsulation formats of MPLS MartinioE, MPLS MartinioP and stack VLAN. The N2EGS2 does not support the encapsulation format of MPLS MartinioP.

MPLS

Not supported by the N1EGS2. Supported by the N2EGS2.

VLAN

Compliant with IEEE 802.1q/p.

VLAN convergence

Supported (4k VLAN).

RSTP

Not supported by the N1EGS2. The N2EGS2 supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w.

Multicast (IGMP Snooping)

Not supported by the N1EGS2.

CAR

Supported.

Supported by the N2EGS2.

The granularity is 64 kbit/s. Service based QoS flow classification LCAS

The N1EGS2 supports the port service, port+VLAN ID service, and port +VLAN PRI service. The N2EGS2 supports the port flow, port+VLAN ID flow, and port +VLAN PRI flow. Not supported by the N1EGS2. The N2EGS2 supports LCAS, compliant with ITU-T G.7042. Dynamically increases or decreases the bandwidth, and realizes the protection function.

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LPT

Supports the LPT function, which can be enabled or disabled.

Flow control function

Supports the IEEE 802.3x flow control based on port.

Test frame

Receives and transmits Ethernet test frames.

Loopback function

Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports inloop and outloop at the VC-3 level.

Ethernet performance monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

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7.7.3 Working Principle and Signal Flow The EGS2 consists of the ethernet access module, network processor module, mapping module, interface converting module, communication and control module and so on. Figure 7-14 shows the block diagram for the functions of the EGS2. Figure 7-14 Block diagram for the functions of the EGS2 E N C P

Control GE

Ethernet access module

Network processor

Switch fabric

Laser shutdown

V C P

D E N C P

Data

Network processor module

Cross-connect unit

Interface coversion module Cross-connect unit

Mapping module

LOS

Communication

Communication and control module

Reference clock and frame header

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

SCC unit

-48 V/ -60 V -48 V/ -60 V

Fuse

50 77 125 155 MHz MHz MHz MHz

ENCP: data encapsulation module

SCC unit

+3.3 V backup power

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. Issue 02 (2007-09-10)

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After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported: l

Multi-protocol label switching (MPLS)

l

L2MPLS VPN

l

Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module: l

Supports flow sense and flow classification

l

Supports uni-cast, multi-cast and broadcast of the flow

l

Provides data priority setting

l

Provides weighted fair queuing (WFQ)

l

Provides four classes of services (CoS)

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:

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l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock Huawei Technologies Proprietary

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Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

Control indicators

Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.7.4 Front Panel On the front panel of the EGS2, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-15 shows the appearance of the front panel of the EGS2.

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Figure 7-15 Front panel of the EGS2

EGS2 STAT ACT PROG SRV LINK1 ACT1 LINK2 ACT2

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 EGS2

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are two GE interfaces on the front panel of the EGS2. Table 7-25 lists the type and usage of the interfaces. 7-52

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Table 7-25 Optical interfaces of the EGS2 Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

OUT2/IN2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

7.7.5 Valid Slots The EGS2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS2 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.7.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGS2 indicates the optical interface type. Table 7-26 lists the relation between the board feature code and optical interface type for the EGS2. Table 7-26 Relation between the board feature code and the optical interface type Board Barcode

Feature Code

Optical Interface Type

SSN2EGS210

10

1000Base-SX (0.55 km)

SSN2EGS211

11

1000Base-LX (10 km)

SSN2EGS212

12

1000Base-ZX (40 km)

SSN2EGS213

13

1000Base-ZX (70 km)

7.7.7 Board Configuration Reference You can use the T2000 to set parameters for the EGS2. You can use the T2000 to set the following parameters for the EGS2: l

Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.7.8 Technical Specifications The specifications of the EGS2 cover the optical interface specifications, mechanical specifications and power consumption. Issue 02 (2007-09-10)

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Optical Interface Specifications Table 7-27 lists the specifications of the interfaces of the EGS2. Table 7-27 Specifications of the optical interfaces of the EGS2 Item

Specification

Optical interface type

1000Base-ZX (70 km)

1000Base-ZX (40 km)

1000Base-SX (10 km)

1000Base-LX (0.55 km)

Optical source type

MLM

MLM

MLM

MLM

Launched optical power (dBm)

–4 to +2

–2 to +5

–9 to –3

–9.5 to 0

Central wavelength (nm)

1480 to 1580

1270 to 1355

1270 to 1355

770 to 860

Overload optical power (dBm)

–3

–3

–3

0

Receiver sensitivity (dBm)

–22

–23

–19

–17

Extinction ratio (dB)

9

9

9

9

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the EGS2 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EGS2 is 43 W.

7.8 EMS4 This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission and convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 7.8.1 Version Description The functional version of the EMS4 board is N1. 7-54

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7.8.2 Function and Feature The EMS4 supports Layer 2 switching, link convergence, and multicast. 7.8.3 Working Principle and Signal Flow The EMS4 consists of the ethernet access module, mapping module, interface conversion module and so on. 7.8.4 Front Panel On the front panel of the EMS4, there are indicators, interfaces and barcode. 7.8.5 Valid Slots The EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without the interface board, the EMS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. With the interface board, the EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack. 7.8.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EMS4 indicates the optical interface type. 7.8.7 Board Protection The EMS4 supports the board protection switching (BPS) and port protection switching (PPS) protection. 7.8.8 Board Configuration Reference You can use the T2000 to set parameters for the EMS4. 7.8.9 Technical Specifications The specifications of the EMS4 cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

7.8.1 Version Description The functional version of the EMS4 board is N1.

7.8.2 Function and Feature The EMS4 supports Layer 2 switching, link convergence, and multicast. Table 7-28 lists the functions and features of the EMS4. Table 7-28 Functions and features of the EMS4 Function and Feature

EMS4

Basic function

Accesses and processes 4 x GE services, and processes 16 x FE services.

Used with the interface board

Accesses 16 x FE signals at the electrical interface when used with the ETF8. Accesses 16 x FE signals at the optical interface when used with the EFF8. Accesses 8 x FE signals at the electrical interface and 8 x FE signals at the optical interface when used with the ETF8 and EFF8.

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Function and Feature

EMS4

Specification of the optical interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. Supports the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km. Supports 10Base-T/100Base-TX signals when used with the ETF8. Supports 100Base-FX signals when used with the EFF8. The optical interfaces are compliant with IEEE 802.3u.

Format of service frames

Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE 802.1p TAG. Supports frames with a length ranging from 64 bytes to 9216 bytes. Supports Jumbo frames with a length less than 9216 bytes.

Max. uplink bandwidth

2.5 Gbit/s.

Mapping granularity

Virtual concatenation: VC-12, VC-3, VC-4, VC-12-Xv (X≤64), VC-3-Xv (X≤24), and VC-4-Xv (X≤8).

VCG

A maximum of 64.

Encapsulation format

Supports GFP-F, LAPS, and HDLG.

EPL

Supports transparent transmission based on port. Supports 42 x bidirectional services.

EVPL

Supports EVPL services based on port+VLAN. Supports a maximum of 8000 links. Supports EVPL services based on QinQ. Supports service forwarding based on port.

EPLAN

Supports the Layer 2 forwarding function and switching at the client and SDH sides. Supports 1k MAC switching or 4K VLAN MAC switching. Supports the function of self-learning the source MAC address. The length of the MAC address table is 128k. The aging time of the MAC address can be set and queried. The configuration of static MAC routes is supported. Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of VB. The maximum number of VBs is two.

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Function and Feature

EMS4

VLAN

Supports VLAN and QinQ, the addition, deletion and switching of VLAN labels, compliant with IEEE 802.1q/p.

RSTP

Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w.

Multicast(IGMPSnooping)

Supported.

ETH-OAM

Supports CC for the multicast and LB test for the unicast.

Test frame

Supported.

Service mirroring

Not supported.

Link convergence

Supports manual link convergence and static link convergence.

VLAN convergence

Supported (4095 VLAN).

Protection

Supports the 1+1 hot backup for the board and the PPS protection.

CAR

Supported. The granularity is 64 kbit/s.

Flow classification

Supports the port flow and port+VLAN ID flow.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042.

LPT

Supported.

Flow control function

Supports the IEEE 802.3x flow control based on port.

Loopback function

Supports inloop at the Ethernet port (PHY layer) and outloop at the SDH side.

Ethernet performance monitoring

Supports Ethernet performance monitoring RMON at the port level and VCTRUNK.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.8.3 Working Principle and Signal Flow The EMS4 consists of the ethernet access module, mapping module, interface conversion module and so on. Figure 7-16 shows the block diagram for the functions of the EMS4.

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Figure 7-16 Block diagram for the functions of the EMS4 E N C P

Control GE/FE Ethernet

access module

Network processor

Switch fabric

Laser shutdown

V C P

D E N C P

Data

Network processor module

Cross-connect unit

Interface coversion module Cross-connect unit

Mapping module

LOS

Communication

Communication and control module

Reference clock and frame header

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

SCC unit SCC unit

-48 V/ -60 V -48 V/ -60 V

77 125 155 50 MHz MHz MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

In the Transmit Direction The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to the EGS4 through the backplane. The interface module transmits the signals to the encapsulation and mapping module. The encapsulation and mapping module then compensates for the time delay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames, strips the data packets, and transmits the data packets to the service processing module. Finally, the service processing module converges the data and transmits the data through the ethernet physical interface.

In the Receive Direction The interface module accesses the signals from external Ethernet device, such as the Ethernet switch and router. The interface module then decodes the signals and converts the series signals into parallel signals. The service processing module then aligns the frames, strips the preamble code, terminates the CRC code and performs the Ethernet statistics for the Ethernet performance. In addition, the service processing module classifies the flow (Ethernet or VLAN packet formats) according to the service type and configuration. If the switch is not required on the local, the data services are forwarded to other local ports according to the configuration. If the data services are to be transmitted to the upstream SDH line, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLC formats. Finally, the encapsulation module transmits the frames to the mapping module, which maps frames into VC-4/VC-3/VC-12, concatenated frames or a single VC-3 concatenated frame. The interface module then transmits the frames to the cross-connect unit.

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Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported: l

Ethernet/ VLAN

The network processor module: l

Supports flow sense and flow classification

l

Supports uni-cast, multi-cast and broadcast of the flow

l

Provides data priority setting

l

Provides weighted fair queuing (WFQ)

l

Provides four classes of services (CoS)

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLC format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: Issue 02 (2007-09-10)

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Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions: l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

Control indicators

Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V.

7.8.4 Front Panel On the front panel of the EMS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-17 shows the appearance of the front panel of the EMS4.

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Figure 7-17 Front panel of the EMS4

EMS4 STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 LINK

ACT

EMS4

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four pairs of optical interfaces on the front panel of the EMS4. Table 7-29 lists the type and usage of the optical interfaces. Issue 02 (2007-09-10)

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Table 7-29 Optical interfaces of the EMS4 Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

OUT2/IN2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

OUT3/IN3

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

OUT4/IN4

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

7.8.5 Valid Slots The EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without the interface board, the EMS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. With the interface board, the EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack. The EMS4 can be used with the ETF8 and EFF8. Table 7-30 and Table 7-31 list the valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8. Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A subrack Valid Slot for the EMS4

Corresponding Slot for the ETF8 and EFF8

Slot 12

Without the interface board

Slot 13

Without the interface board

Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack Valid Slot for the EMS4

Corresponding Slot for the ETF8 and EFF8

Slot 11

Without the interface board

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

7.8.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EMS4 indicates the optical interface type. Table 7-32 lists the relation between the board feature code and optical interface type for the EMS4. 7-62

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Table 7-32 Relation between the board feature code and the optical interface type Board Barcode

Feature Code

Optical Interface Type

SSN1EMS410

10

1000Base-LX (0.55 km)

SSN1EMS411

11

1000Base-SX (10 km)

SSN1EMS412

12

1000Base-ZX (40 km)

SSN1EMS413

13

1000Base-ZX (70 km)

7.8.7 Board Protection The EMS4 supports the board protection switching (BPS) and port protection switching (PPS) protection.

Protection Principle When the BPS protection is performed to the EMS4, the GE and FE ports use the single-fed dual-selective scheme to get protected. The EMS4 has four four GE ports and 16 FE ports, which may be connected to many communication devices. Normally, the active board is working and services are transmitted in the two directions of the active link. On the backup link, the EMS4 disables the transmission of all ports. In this case, the ports of opposite board are in the Linkdown state. At the same time, the opposite board enables the transmission and does not transmit services. In this way, the receive ports of the backup EMS4 are not in the Linkdown state. The solid lines in Figure 7-18 show how the EMS4 normally works. Figure 7-18 Normal working of the EMS4

No.1

Active communication equipment

A

Active EMS4

Standby communication equipment

No.2

No.3

Active communication equipment

XCS

B Standby communication equipment

No.1 No.2

Standby EMS4

No.3

C

Active communication equipment Standby communication equipment

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BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or any board fault, the cross-connect board switches all services to the standby board. In this way, services are protected. As the solid lines shown in Figure 7-19. The services numbered 1, 2 and 3 are all switched to the standby EMS4 and corresponding communication equipment. Figure 7-19 Principle of the BPS protection for the EMS4

No.1

A

Active EMS4

Active communication equipment Standby communication equipment

No.2

No.3

Active communication equipment

XCS

B Standby communication equipment

No.1 No.2

Standby EMS4

No.3

C

Active communication equipment Standby communication equipment

l

PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or any board fault, the cross-connect board switches all services to the standby board. In this way, services are protected. The solid lines in Figure 7-20 show how the PPS protection is performed. Only the service numbered 1 is switched to the standby EMS4 and the standby communication equipment.

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Figure 7-20 Principle of the PPS protection for the EMS4

No.1

Active communication equipment

A

Active EMS4

Standby communication equipment

No.2

No.3 Active communication equipment

XCS

B Standby communication equipment

No.1 No.2

Standby EMS4

No.3

C

Active communication equipment

Standby communication equipment

The conditions that trigger the protection for the EMS4 are as follows: l

Fault at at the PHY layer of the MAC port, also Linkdown

l

Fault in key board hardware units, such as the power supply module and the optical module

WARNING When the board-level protection is performed, FE ports only support the 100M full duplex mode and GE ports support the auto-negotiation and 1000M full duplex mode.

Board Configuration Two EMS4 boards should be configured for the protection. One EMS4 is the active board and the other is the standby board. For the protection, the access capacity of the slot for the standby board must be larger than that of the slot for the active board.

7.8.8 Board Configuration Reference You can use the T2000 to set parameters for the EMS4. You can use the T2000 to set the following parameters for the EMS4: Issue 02 (2007-09-10)

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Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.8.9 Technical Specifications The specifications of the EMS4 cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

Optical Interface Specifications Table 7-33 lists the specifications of the interfaces of the EMS4. Table 7-33 Specifications of the optical interfaces of the EMS4 Item

Specification

Optical interface type

1000Base-ZX (70 km)

1000Base-ZX (40 km)

1000Base-SX (10 km)

1000Base-LX (0.55 km)

Optical source type

MLM

MLM

MLM

MLM

Launched optical power (dBm)

–4 to +2

–2 to +5

–9 to –3

–9.5 to 0

Central wavelength (nm)

1480 to 1580

1270 to 1355

1270 to 1355

770 to 860

Overload optical power (dBm)

–3

–3

–3

0

Receiver sensitivity (dBm)

–22

–23

–19

–17

Extinction ratio (dB)

9

9

9

9

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the EMS4 are as follows:

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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

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Power Consumption In the normal temperature (25℃), the maximum power consumption of the EMS4 is 65 W if the EMS4 is not used with an interface board. In the normal temperature (25℃), the maximum power consumption of the EMS4 is 75 W if the EMS4 is used with an interface board.

7.9 EGS4 This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 7.9.1 Version Description The functional version of the EGS4 board is N1. 7.9.2 Function and Feature The EGS4 supports Layer 2 switching, MPLS and broadcast. 7.9.3 Working Principle and Signal Flow The EGS4 consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication module and the power supply module. 7.9.4 Front Panel On the front panel of the EGS4, there are indicators, interfaces and barcode. 7.9.5 Valid Slots The EGS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.9.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGS4 indicates the optical interface type. 7.9.7 Board Protection The EGS4 supports the board protection switching (BPS) and port protection switching (PPS) protection. 7.9.8 Board Configuration Reference You can use the T2000 to set parameters for the EGS4. 7.9.9 Technical Specifications The specifications of the EGS4 cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

7.9.1 Version Description The functional version of the EGS4 board is N1.

7.9.2 Function and Feature The EGS4 supports Layer 2 switching, MPLS and broadcast. Table 7-34 lists the functions and features of the EGS4. Issue 02 (2007-09-10)

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Table 7-34 Functions and features of the EGS4 Function and Feature

EGS4

Basic function

Accesses and processes 4 x GE services.

Specification of the optical interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. The optical interfaces support the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km.

Format of service frames

Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE 802.1p TAG. Supports frames with a length ranging from 64 bytes to 9216 bytes. Supports Jumbo frames with a length less than 9216 bytes.

Max. uplink bandwidth

2.5 Gbit/s.

Mapping granularity

Virtual concatenation: VC-12, VC-3, VC-4, VC-12-Xv (X≤64), VC-3-Xv (X≤24), and VC-4-Xv (X≤8).

VCG

64 to the maximum.

Encapsulation format

Supports GFP-F, LAPS, and HDLG.

EPL

Supports transparent transmission based on port.

EVPL

Supports EVPL services based on port+VLAN. Supports a maximum of 8000 links. Supports EVPL services based on QinQ. Supports service forwarding based on port.

EPLAN

Supports the Layer 2 forwarding function and switching at the client and SDH sides. Supports 1k MAC switching or 4k VLAN MAC switching. Supports the function of self-learning the source MAC address. The length of the MAC address table is 128k. The aging time of the MAC address can be set and queried. The configuration of static MAC routes is supported. Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of VB. The maximum number of VBs is two.

VLAN

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Supports VLAN and QinQ, the addition, deletion and switching of VLAN labels, compliant with IEEE 802.1q/p.

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Function and Feature

EGS4

RSTP

Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w.

Multicast(IGMPSnooping)

Supported.

ETH-OAM

Supports CC for the multicast and LB test for the unicast.

Test frame

Supported.

Service mirroring

Not supported.

Link convergence

Supports manual link convergence and static link convergence.

VLAN convergence

Supported (4095 VLAN).

Protection

Supports the 1+1 hot backup for the board and the PPS protection.

CAR

Supported. The granularity is 64 kbit/s.

Flow classification

Supports the port flow and port+VLAN ID flow.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042.

LPT

Supported.

Flow control function

Supports the IEEE 802.3x flow control based on port.

Loopback function

Supports inloop at the Ethernet port (PHY layer).

Ethernet performance monitoring

Supports Ethernet performance monitoring RMON at the port level and VCTRUNK.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.9.3 Working Principle and Signal Flow The EGS4 consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication module and the power supply module. Figure 7-21 shows the block diagram for the functions of the EGS4.

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Figure 7-21 Block diagram for the functions of the EGS4 E N C P

Control GE

Ethernet access module

Network processor

Switch fabric

Laser shutdown

V C P

D E N C P

Data

Network processor module

Cross-connect unit

Interface coversion module Cross-connect unit

Mapping module

LOS

Communication

Communication and control module

Reference clock and frame header

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

SCC unit SCC unit

-48 V/ -60 V -48 V/ -60 V

50 77 125 155 MHz MHz MHz MHz

In the Transmit Direction The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to the EGS4 through the backplane. The interface module transmits the signals to the encapsulation and mapping module. The encapsulation and mapping module then compensates for the time delay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames, strips the data packets, and transmits the data packets to the service processing module. Finally, the service processing module converges the data and transmits the data through the ethernet physical interface.

In the Receive Direction The interface module accesses the 1000Base-SX/LX/ZX signals from external Ethernet device, such as the Ethernet switch and router. The interface module then decodes the signals and converts the series signals into parallel signals. The service processing module then aligns the frames, strips the preamble code, terminates the CRC code and performs the Ethernet statistics for the Ethernet performance. In addition, the service processing module classifies the flow (Ethernet or VLAN packet formats) according to the service type and configuration. If the switch is not required on the local, the data services are forwarded to other local ports according to the configuration. If the data services are to be transmitted to the upstream SDH line, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLC formats. Finally, the encapsulation module transmits the frames to the mapping module, which maps frames into VC-4/VC-3/VC-12 or concatenated frames. The interface module then transmits the frames to the cross-connect unit.

Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E 7-70

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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported: l

Ethernet/ VLAN

The network processor module: l

Supports flow sense and flow classification

l

Supports uni-cast, multi-cast and broadcast of the flow

l

Provides data priority setting

l

Provides weighted fair queuing (WFQ)

l

Provides four classes of services (CoS)

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLC format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

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The control module also contains basic logic units. This module enjoys the following functions: l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

Control indicators

Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V.

7.9.4 Front Panel On the front panel of the EGS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-22 shows the appearance of the front panel of the EGS4.

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Figure 7-22 Front panel of the EGS4 EGS4 STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 LINK

ACT

EGS4

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four pairs of optical interfaces on the front panel of the EGS4. Table 7-35 lists the type and usage of the optical interfaces.

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Table 7-35 Optical interfaces of the EGS4 Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

OUT2/IN2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

OUT3/IN3

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

OUT4/IN4

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

7.9.5 Valid Slots The EGS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.9.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGS4 indicates the optical interface type. Table 7-36 lists the relation between the board feature code and optical interface type for the EGS4. Table 7-36 Relation between the board feature code and the optical interface type Board Barcode

Feature Code

Optical Interface Type

SSN1EGS410

10

1000Base-SX (0.55 km)

SSN1EGS411

11

1000Base-LX (10 km)

SSN1EGS412

12

1000Base-ZX (40 km)

SSN1EGS413

13

1000Base-ZX (70 km)

7.9.7 Board Protection The EGS4 supports the board protection switching (BPS) and port protection switching (PPS) protection.

Protection Principle When the BPS protection is performed to the EGS4, the GE and FE ports use the single-fed dualselective scheme to get protected. The EGS4 has four four GE ports and 16 FE ports, which may be connected to many communication devices. Normally, the active board is working and services are transmitted in the two directions of the active link. On the standby link, the EGS4 disables the transmission of all ports. In this case, the ports of the opposite board are in the Linkdown state. At the same time, the opposite board enables the transmission and does not 7-74

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transmit services. In this way, the receive ports of the standby EGS4 are not in the Linkdown state. The solid lines in Figure 7-23 show how the EGS4 normally works. Figure 7-23 Normal working of the EGS4

No.1

A

Active EGS4

Active communication equipment Standby communication equipment

No.2

No.3

Active communication equipment

XCS

B Standby communication equipment

No.1 No.2

Standby EGS4

No.3

C

Active communication equipment Standby communication equipment

l

BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or any board fault, the cross-connect board switches all services to the standby board. In this way, services are protected. The lines in Figure 7-24 show how the BPS protection is performed. The services numbered 1, 2 and 3 are all switched to the standby EGS4 and corresponding communication equipment.

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Figure 7-24 Principle of the BPS protection for the EGS4

No.1

A

Active EGS4

Active communication equipment Standby communication equipment

No.2

No.3

Active communication equipment

XCS

B Standby communication equipment

No.1 No.2

Standby EGS4

No.3

C

Active communication equipment Standby communication equipment

l

PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or any board fault, the cross-connect board switches all services to the standby board. In this way, services are protected. The solid lines in Figure 7-25 show how the PPS protection is performed. Only the service numbered 1 is switched to the standby EGS4 and the standby communication equipment.

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Figure 7-25 Principle of the PPS protection for the EGS4

No.1

Active communication equipment

A

Active EGS4

Standby communication equipment

No.2

No.3 Active communication equipment

XCS

B Standby communication equipment

No.1 No.2

Standby EGS4

No.3

C

Active communication equipment

Standby communication equipment

The conditions that trigger the protection for the EGS4 are as follows: l

Fault at at the PHY layer of the MAC port, also Linkdown

l

Fault in key board hardware units, such as the power supply module and the optical module

WARNING When the protection is performed, the GE ports support auto-negotiation and 1000M full duplex modes.

Board Configuration Two EGS4 boards should be configured for the protection. One EGS4 is the active board and the other is the standby board. For the protection, the access capacity of the slot for the standby board must be larger than that of the slot for the active board.

7.9.8 Board Configuration Reference You can use the T2000 to set parameters for the EGS4. You can use the T2000 to set the following parameters for the EGS4: Issue 02 (2007-09-10)

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Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.9.9 Technical Specifications The specifications of the EGS4 cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

Optical Interface Specifications Table 7-37 lists the specifications of the interfaces of the EGS4. Table 7-37 Specifications of the optical interfaces of the EGS4 Item

Specification

Optical interface type

1000Base-ZX (70 km)

1000Base-ZX (40 km)

1000Base-LX (10 km)

1000Base-SX (0.55 km)

Optical source type

MLM

MLM

MLM

MLM

Launched optical power (dBm)

–4 to +2

–2 to +5

–9 to –3

–9.5 to 0

Central wavelength (nm)

1480–1580

1270–1355

1270–1355

770–860

Overload optical power (dBm)

–3

–3

–3

0

Receiver sensitivity (dBm)

–22

–23

–19

–17

Extinction ratio (dB)

9

9

9

9

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the EGS4 are as follows:

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l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1 Huawei Technologies Proprietary

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Power Consumption In the normal temperature (25℃), the maximum power consumption of the EGS4 is 70 W.

7.10 EGR2 This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.10.1 Version Description The functional version of the EGR2 board is N2. 7.10.2 Function and Feature The EGR2 supports Layer 2 switching, port convergence, and RPR. 7.10.3 Working Principle and Signal Flow The EGR2 consists of the ethernet processing module, network processor module, RPR protocol processing module and so on. 7.10.4 Front Panel On the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety class label. 7.10.5 Valid Slots The EGR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGR2 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.10.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGR2 indicates the optical interface type. 7.10.7 Board Configuration Reference You can use the T2000 to set parameters for the EGR2. 7.10.8 Technical Specifications The technical specifications of the EGR2 cover the optical interface specifications, board dimensions, weight and power consumption.

7.10.1 Version Description The functional version of the EGR2 board is N2.

7.10.2 Function and Feature The EGR2 supports Layer 2 switching, port convergence, and RPR. Table 7-38 lists the functions and features of the EGR2. Table 7-38 Functions and features of the EGR2

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Function and Feature

EGR2

Basic function

Accesses and processes 2 x GE services. Supports the RPR feature. Huawei Technologies Proprietary

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Function and Feature

EGR2

Specification of the optical interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. The optical interfaces support the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km.

Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink bandwidth

2.5 Gbit/s.

Mapping granularity

Supports VC-3, VC-3-2v, VC-4, and VC-4-Xv (X≤8).

Encapsulation format

Supports GFP-F and LAPS.

EVPL

Supports EVPL services. The frame format can be Ethernet II, IEEE 802.3, IEEE 802.1q TAG, or MPLS Martini. Supports the MPLS encapsulation and forwarding based on port and port+VLAN. Supports five types of LSP, including ingress LSP, egress LSP, transit LSP, RPR ingress LSP, and RPR transit LSP. Supports 512 LSPs. Supports EVPLAN services and uses the stack VLAN encapsulation.

EVPLAN

Supports the function of self-learning the source MAC address. For the N2EGR2, the capacity of the MAC address table is 64k. The aging time of the MAC address can be set and queried. Supports the configuration of static MAC routes (maximum: 4k). Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 16. The maximum number of logical ports for each VB is 32.

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MPLS

Supports MartinioE.

Stack VLAN

Supported.

VLAN

Supports 4096 VLAN labels, the addition and deletion of VLAN labels, and the switching function, compliant with IEEE 802.1q/p.

VLAN convergence

Supported (4k VLAN).

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Function and Feature

EGR2

VLAN switching

Supports the replacement of VLAN in Ethernet signal frames.

Port convergence

Supports the convergence at a maximum of two GE ports.

RPR

Supports RPR, compliant with IEEE 802.17. The ring network supports a maximum of 255 nodes, and it supports the dropping of sink nodes and weighted fairness algorithm. Supports five priority levels, including A0, A1, B_EIR, B_CIR and C. Provides topology automatic discovery function, and detects the network status in real time. Supports three protection modes, including Steering, Wrapping, and Wrapping+Steering. The invalid time for signals is less than 50 ms. Supports the manual configuration of the ringlet route in the RPR ring network. Supports the ringlet self-learning, which learns the mapping relation between the MAC address and node number.

RSTP

Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w.

Multicast (IGMP Snooping)

Supported.

CAR

Supported. The granularity is 64 kbit/s.

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Flow classification

Supports the port flow, port+VLAN ID flow, and port+VLAN ID +VLAN PRI flow.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042.

Flow control function

Supports the IEEE 802.3x flow control based on port.

Echo test frame

Supports the Echo function of the PRP OAM, which is used to test the availability of the link.

Loopback function

Supports inloop at the Ethernet port (PHY layer or MAC layer).

Ethernet performance monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Weighted fairness algorithm

Supported.

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Function and Feature

EGR2

Topology automatic discovery

Supported.

Max. number of nodes

255.

Service priority level

Supports A0, A1, B_CIR, B_EIR and C.

7.10.3 Working Principle and Signal Flow The EGR2 consists of the ethernet processing module, network processor module, RPR protocol processing module and so on. Figure 7-26 shows the block diagram for the functions of the EGR2. Figure 7-26 Block diagram for the functions of the EGR2

E N C P

Control singnal GE/FE Ethernet

Switch fabric

Network processor

access module

Data Network processor module

RPR MAC

RPR MAC

east

west

D N C P

RPR protocol process module

Crossconnect unit V C P

Interface conversion module

Mapping module

Laser shut down

Communication

Communication and control module

LOS

Crossconnect unit

SCC unit

Reference clock and frame header

Cross-connect unit

50 MHZ 77 MHZ 125 MHZ

Clock module

100 MHZ +3.3 V +1.5 V +2.5 V

DC/DC +1.8 V converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

RPR: resilient package ring

The function modules are described as follows:

Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E 7-82

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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported: l

MPLS

l

L2MPLS VPN

l

Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module: l

Supports flow sense and flow classification

l

Supports uni-cast, multi-cast and broadcast of the flow

l

Provides data priority setting

l

Provides weighted fair queuing (WFQ)

l

Provides four classes of services (CoS)

RPR Protocol Processing Module RPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protection switching schemes. By applying the RPR protocol and RPR weight fair algorithm, this module controls the bandwidth of each node to access the ring network. Therefore, the RPR ring features spatial reuse and statistic multiplex. Bandwidth utilization is then improved. Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for topology auto-discovery provides correct and reliable means to fast find topologies of all nodes and the changes to these topologies. RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reused spatially. The entire RPR ring accommodates 255 nodes to the maximum.

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, the virtual concatenation supports LCAS function. The encapsulation formats are LAPS and GFP. Issue 02 (2007-09-10)

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In the downstream direction, virtual concatenations are received. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions: l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

Control indicators

Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.

DC/DC Converter Module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.10.4 Front Panel On the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 7-27 shows the appearance of the front panel of the EGR2. 7-84

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Figure 7-27 Front panel of the EGR2 EGR2 STAT ACT PROG SRV LINK1 ACT1 LINK2 ACT2

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 EGR2

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are two optical interfaces on the front panel of the EGR2. Table 7-39 lists the type and usage of the optical interfaces.

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Table 7-39 Optical interfaces of the EGR2 Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

OUT2/IN2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

7.10.5 Valid Slots The EGR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGR2 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.10.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGR2 indicates the optical interface type. Table 7-40 lists the relation between the board feature code and optical interface type for the EGR2. Table 7-40 Relation between the board feature code and the optical interface type Board Barcode

Feature Code

Optical Interface Type

SSN2EGR210

10

1000Base-SX (0.55 km)

SSN2EGR211

11

1000Base-LX (10 km)

SSN2EGR212

12

1000Base-ZX (40 km)

SSN2EGR213

13

1000Base-ZX (70 km)

7.10.7 Board Configuration Reference You can use the T2000 to set parameters for the EGR2. You can use the T2000 to set the following parameters for the EGR2: l

Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.10.8 Technical Specifications The technical specifications of the EGR2 cover the optical interface specifications, board dimensions, weight and power consumption. Table 7-41 lists the specifications of the interfaces of the EGR2. 7-86

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Table 7-41 Specifications of the interfaces of the EGR2 Optical Optical Interface Type Source Type

Launched Optical Power (dBm)

Central Wavele ngth (nm)

Overloa d Optical Power (dBm)

Receiver Sensitivit y (dBm)

Extin ction Ratio (dB)

1000Base-ZX (70 km)

MLM

–4 to +2

1480 to 1580

–3

–22

9

1000Base-ZX (40 km)

MLM

–2 to +5

1270 to 1355

–3

–23

9

1000Base-LX (10 km)

MLM

–9 to –3

1270 to 1355

–3

–19

9

1000Base-SX (0.55 km)

MLM

–9.5 to 0

770 to 860

0

–17

9

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the EGR2 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EGR2 is 40 W.

7.11 EMR0 This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.11.1 Version Description The EMR0 has two versions, N1 and N2. The production of the N1 version is stopped. 7.11.2 Function and Feature The EMR0 supports Layer 2 switching, port convergence, and RPR. 7.11.3 Working Principle and Signal Flow The EMR0 consists of the ethernet processing module, network processor module, RPR protocol processing module, mapping module and so on. 7.11.4 Front Panel On the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety class label. Issue 02 (2007-09-10)

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7.11.5 Valid Slots The EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without the interface board, the EMR0 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. With the interface board, the EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack. 7.11.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EMR0 indicates the optical interface type. 7.11.7 Board Configuration Reference You can use the T2000 to set parameters for the EMR0. 7.11.8 Technical Specifications The technical specifications of the EMR0 cover the optical interface specifications, board dimensions, weight and power consumption.

7.11.1 Version Description The EMR0 has two versions, N1 and N2. The production of the N1 version is stopped. Table 7-42 lists the details on the versions of the EMR0 board. Table 7-42 Version description of the EMR0 Item

Description

Functional version

The EMR0 has two versions, N1 and N2.

Difference

The N2EMR0 supports all functions of the N1EMR0. The N2EMR0 also has some new functions and extends some functions of the N1EMR0. For details, see Table 7-43.

Replaceability

The N2EMR0 can replace the N1EMR0.

Table 7-43 Comparison of features of the N1EMR0 and N2EMR0

7-88

Item

N1EMR0

N2EMR0

Port convergence function

-

Supports the convergence function at a maximum of eight FE ports.

VLAN label switching

-

Supports the VLAN label switching for the Ethernet data.

EVPLAN services

Supports EVPLAN services and uses the stack VLAN encapsulation.

Supports EVPLAN services and uses the stack VLAN encapsulation.

MAC address table

Supports the 16k MAC address table.

Supports the 64k MAC address table.

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Item

N1EMR0

N2EMR0

VB features

Supports the creation, deletion and query of the VB. The maximum number of the VBs is 32. The maximum number of logical ports for each VB is 16.

Supports the creation, deletion and query of the VB. The maximum number of the VBs is 16. The maximum number of logical ports for each VB is 32.

PRP ring network

-

Supports the manual configuration of the ringlet route in the RPR ring network.

RPR OAM

-

Supports the Echo function of the PRP OAM, which is used to test the availability of the link.

CAR

Supported.

Supported.

Flow classification

Supports the port flow, port +VLAN ID flow, and port +VLAN PRI flow.

Supports the port flow, port+VLAN ID flow, and port+VLAN ID+VLAN PRI flow.

7.11.2 Function and Feature The EMR0 supports Layer 2 switching, port convergence, and RPR. Table 7-44 lists the functions and features of the EMR0. Table 7-44 Functions and features of the EMR0 Function and Feature

EMR0

Basic function

Accesses and processes 12 x FE services and 1 x GE services. Supports the RPR feature.

Used with the interface board

Supports four FE ports and one GE ports. Accesses 12 x FE signals at the electrical interface when used with the ETF8. Accesses 8 x FE signals at the optical interface when used with the EFF8.

Specification of the optical interface

Supports the 10Base-T/100Base-TX signals when used with the ETF8. The maximum transmission distance is 100 m. Supports the 100Base-FX signals when used with the EFF8, compliant with IEEE 802.3u.

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Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG . Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink bandwidth

2.5 Gbit/s.

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Function and Feature

EMR0

Mapping granularity

VC-3, VC-3-2v, VC-4, and VC-4-Xv (X≤8).

Encapsulation format

Supports GFP-F and LAPS.

EVPL

Supports EVPL services. The frame format can be Ethernet II, IEEE 802.3, IEEE 802.1q TAG, or MPLS Martini. EVPL services support the MPLS encapsulation and forwarding based on port and port +VLAN. Supports five types of LSP, including ingress LSP, egress LSP, transit LSP, RPR ingress LSP, and RPR transit LSP. Supports 512 LSPs.

EVPLAN

Supports EVPLAN services and uses the stack VLAN encapsulation. Supports the function of self-learning the source MAC address. For the N2EMR0, the capacity of the MAC address table is 16k. The aging time of the MAC address can be set and queried. Supports the configuration of static MAC routes (maximum: 4k). Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of the VB. The N2EMR0 supports a maximum of 16 VBs. The maximum number of logical ports for each VB is 32. The N1EMR0 supports a maximum of 32 VBs. The maximum number of logical ports for each VB is 16.

7-90

MPLS

Supports MartinioE.

Stack VLAN

Supported.

VLAN

Supports 4096 VLAN labels, the addition and deletion of VLAN labels, and the switching function, compliant with IEEE 802.1q/p.

VLAN convergence

Supported (4k VLAN).

VLAN switching

Supports the replacement of VLAN in Ethernet signal frames.

Port convergence

Supports the convergence function at a maximum of eight FE ports.

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EMR0

RPR

Supported and compliant with IEEE 802.17.

7 Data Processing Boards

Supports a maximum of 255 nodes in the ring network, and the dropping of sink nodes. Supports weighted fairness algorithm. Supports five priority levels, including A0, A1, B_EIR, B_CIR and C. Provides topology automatic discovery function, and detects the network status in real time. Supports three protection modes, including Steering, Wrapping, and Wrapping+Steering. The invalid time for signals is less than 50 ms. Supports the ringlet self-learning, which learns the mapping relation between the MAC address and node number. The N2EMR0 supports the manual configuration of the ringlet route in the RPR ring network. RSTP

Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w.

Multicast (IGMP Snooping)

Supported.

CAR

Supported. The granularity is 64 kbit/s.

Flow classification

The N1EMR0 supports the port flow, port+VLAN ID flow, and port +VLAN PRI flow. The N2EMR0 supports the port flow, port+VLAN ID flow, and port +VLAN ID+VLAN PRI flow.

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LCAS

Dynamically increases or decreases the bandwidth and realizes the protection function, compliant with ITU-T G.7042.

Flow control function

Supports the IEEE 802.3x flow control based on port.

Echo test frame

Supports the Echo function of the PRP OAM, which is used to test the availability of the link.

Loopback function

Supports inloop at the Ethernet port (PHY layer or MAC layer).

Ethernet performance monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and performance events

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Weighted fairness algorithm

Supported.

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Function and Feature

EMR0

Topology automatic discovery

Supported.

Max. number of nodes

255.

Service priority levels

Supports A0, A1, B_CIR, B_EIR and C.

7.11.3 Working Principle and Signal Flow The EMR0 consists of the ethernet processing module, network processor module, RPR protocol processing module, mapping module and so on. Figure 7-28 shows the block diagram for the functions of the EMR0. Figure 7-28 Block diagram for the functions of the EMR0

E N C P

Control singnal GE/FE Ethernet

Switch fabric

Network processor

access module

Data Network processor module

RPR MAC

RPR MAC

east

west

D N C P

RPR protocol process module

Crossconnect unit V C P

Interface conversion module

Mapping module

Laser shut down

Communication

Communication and control module

LOS

Crossconnect unit

SCC unit

Reference clock and frame header

Cross-connect unit

50 MHZ 77 MHZ 125 MHZ

Clock module

100 MHZ +3.3 V +1.5 V +2.5 V

DC/DC +1.8 V converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

RPR: resilient package ring

The function modules are described as follows:

Ethernet Access Module In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E 7-92

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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported: l

MPLS

l

L2MPLS VPN

l

Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module: l

Supports flow sense and flow classification

l

Supports uni-cast, multi-cast and broadcast of the flow

l

Provides data priority setting

l

Provides weighted fair queuing (WFQ)

l

Provides four classes of services (CoS)

RPR Protocol Processing Module RPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protection switching schemes. By applying the RPR protocol and RPR weight fair algorithm, this module controls the bandwidth of each node to access the ring network. Therefore, the RPR ring features spatial reuse and statistic multiplex. Bandwidth utilization is then improved. Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for topology auto-discovery provides correct and reliable means to fast find topologies of all nodes and the changes to these topologies. RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reused spatially. The entire RPR ring accommodates 255 nodes to the maximum.

Mapping Module The mapping module consists of encapsulation and mapping. In the upstream direction, the virtual concatenation supports LCAS function. The encapsulation formats are LAPS and GFP. Issue 02 (2007-09-10)

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In the downstream direction, virtual concatenations are received. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting Module The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module: l

Manages and configures other modules of the boards.

l

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions: l

Writes and reads register

l

Provides interface for CPU

l

Checks, selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Controls the shutting down of the optical module

l

Processes communication

l

Control indicators

Clock Unit This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.

DC/DC Converter Module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.11.4 Front Panel On the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 7-29 shows the appearance of the front panel of the N1EMR0. Figure 7-30 shows the appearance of the front panel of the N2EMR0. 7-94

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Figure 7-29 Front panel of the N1EMR0

EMR0 STAT ACT PROG SRV LINK ACT

CLASS 1 LASER PRODUCT

OUT1 IN1

FE1

FE2

FE3

FE4

EMR0

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Figure 7-30 Front panel of the N2EMR0

EMR0 STAT ACT PROG SRV LINK ACT

CLASS 1 LASER PRODUCT

OUT1 IN1

FE1

FE2

FE3

FE4

EMR0

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators. 7-96

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Interfaces There are five interfaces on the front panel of the EMR0. Table 7-45 lists the type and usage of the interfaces. Table 7-45 Optical interfaces of the EMR0 Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX signals.

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX signals.

7.11.5 Valid Slots The EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without the interface board, the EMR0 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. With the interface board, the EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack. The EMR0 can be used with the ETF8 and EFF8. Table 7-46 and Table 7-47 list the valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8. Table 7-46 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A subrack Valid Slot for the EMR0

Corresponding Slot for the ETF8 and EFF8

Slot 12

Without the interface board

Slot 13

Without the interface board

Table 7-47 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack

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Valid Slot for the EMR0

Corresponding Slot for the ETF8 and EFF8

Slot 11

Without the interface board

Slot 12

Slot 15

Slot 13

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7.11.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EMR0 indicates the optical interface type. Table 7-48 lists the relation between the board feature code and optical interface type for the EMR0. Table 7-48 Relation between the board feature code and the optical interface type Board Barcode

Feature Code

Optical Interface Type

SSN2EMR010

10

1000Base-SX (0.55 km)

SSN2EMR011

11

1000Base-LX (10 km)

SSN2EMR012

12

1000Base-ZX (40 km)

SSN2EMR013

13

1000Base-ZX (70 km)

7.11.7 Board Configuration Reference You can use the T2000 to set parameters for the EMR0. You can use the T2000 to set the following parameters for the EMR0: l

Working mode

l

Enabling of the LCAS

l

Maximum packet length

l

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.11.8 Technical Specifications The technical specifications of the EMR0 cover the optical interface specifications, board dimensions, weight and power consumption. Table 7-49 lists the specifications of the interfaces of the EMR0. Table 7-49 Specifications of the optical interfaces of the EMR0

7-98

Item

Specification

Optical interface type

1000Base-ZX (70 km)

1000Base-ZX (40 km)

1000Base-LX (10 km)

1000Base-SX (0.55 km)

Optical source type

MLM

MLM

MLM

MLM

Launched optical power (dBm)

–4 to +2

–2 to +5

–9 to –3

–9.5 to 0

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Item

Specification

Central wavelength (nm)

1480 to 1580

1270 to 1355

1270 to 1355

770 to 860

Overload optical power (dBm)

–3

–3

–3

0

Receiver sensitivity (dBm)

–22

–23

–19

–17

Extinction ratio (dB)

9

9

9

9

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the EMR0 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.2

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EMR0 is 50 W.

7.12 ADL4 This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.12.1 Version Description The functional version of the ADL4 board is N1. 7.12.2 Function and Feature The ADL4 supports the ATM switching and ATM protection. 7.12.3 Working Principle and Signal Flow The ADL4 consists of the O/E converting module, physical layer module, ATM module and so on. 7.12.4 Front Panel On the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety class label. 7.12.5 Valid Slots The ADL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.12.6 Board Feature Code Issue 02 (2007-09-10)

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The code behind the board name in the barcode is the board feature code. The board feature code of the ADL4 indicates the optical interface type. 7.12.7 Board Configuration Reference You can use the T2000 to set parameters for the ADL4. 7.12.8 Technical Specifications The technical specifications of the ADL4 cover the optical interface specifications, board dimensions, weight and power consumption.

7.12.1 Version Description The functional version of the ADL4 board is N1.

7.12.2 Function and Feature The ADL4 supports the ATM switching and ATM protection. Table 7-50 lists the functions and features of the ADL4. Table 7-50 Functions and features of the ADL4

7-100

Function and Feature

ADL4

Basic function

Accesses and processes 1 x STM-4 ATM services.

Optical interface type

Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2 types.

Connector type

LC.

Optical module type

SFP.

E3 ATM interface

Supports 12 x E3 signals, which are accessed by the PD3/PL3/ N1PL3A.

IMA function

Not supported.

Max. uplink bandwidth

Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.

ATM switching capability

1.2 Gbit/s.

Mapping granularity

Supports VC-3, VC-4, or VC-4-Xv (X: 1–4).

Service type

Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection

2048.

Statistical multiplexing

Supported.

Flow type and QoS

Supports IETF RFC2514, ATM forum TM4.0.

ATM multicast connection

Supports spacial multicast and logical multicast.

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Function and Feature

ADL4

ATM protection (ITUT I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VCRing protection schemes.

OAM function (ITU-T I.610)

Supports AIS, RDI, LB , and CC.

Maintenance feature

Supports inloop and outloop at the ATM layer levels, supports inloop at the optical interface, which are used for maintenance and fault locating.

Alarm and performance event

Provides rich alarms and performance events. The loopback is used for maintenance and fault locating.

7.12.3 Working Principle and Signal Flow The ADL4 consists of the O/E converting module, physical layer module, ATM module and so on. Figure 7-31 shows the block diagram for the functions of the ADL4. Figure 7-31 Block diagram for the functions of the ADL4 622Mbit/s

E/O

622Mbit/s

high speed bus

PHY module

ATM module

Mapping module high speed bus

E3 module

O/E 622Mbit/s

622Mbit/s

LOS

Reference clock and frame header

Communication and control module

Laser shut down

Cross-connet unit A

Communication

Cross-connet unit B

Cross-connet unit

Scc unit

50 MHz 77 MHz 100 MHz

Clock module 3.3 V

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

+1.2 V Fuse +1.5 V +1.8 V

DC/DC converter

+3.3 V backup power

+2.5 V

The function modules are described as follows. Issue 02 (2007-09-10)

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O/E Converting Module In the receive direction, optical signals are converted to electrical signals. In the transmit direction, electrical signals are converted to optical signals.

Physical Layer Module The physical layer module mainly: l

Mappings ATM cells into SDH frames

l

Demappings SDH frames to ATM cells

l

Processes ATM service physical layer functions: cell delimitation, test and generation of HEC series

ATM Module The ATM module mainly performs ATM layer functions in the ATM protocol. These functions include: l

Flow control

l

Extraction and generation of cell headers

l

ATM switching

E3 Module The E3 module mainly processes the ATM services at E3 rate. This module: l

Mappings the ATM cells into E3 containers

l

Demappings E3 containers to ATM cells

l

Perform ATM physical layer function to the ATM service at E3 rate

Mapping Module The mapping module: l

Mappings ATM cells into SDH frame payload

l

Demappings SDH frame payload to ATM cells

l

Supports ATM physical layer functions

l

Supports VC-4-Xv (X≤4) virtual concatenation

Communication and Control Module The communication and control module:

7-102

l

Controls writing and reading of each chip

l

Communicates with the NE

l

Issues configured services

l

Reports alarms of each functional module

l

Checks R_LOS alarms of optical modules Huawei Technologies Proprietary

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Controls the shutting of transmission

Clock Module This module mainly generates working clocks for each chip. The frequencies of the clocks are 50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.12.4 Front Panel On the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 7-32 shows the appearance of the front panel of the ADL4. Figure 7-32 Front panel of the ADL4

ADL4 STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT1 IN1 ADL4

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There is one optical interface on the front panel of the ADL4. Table 7-51 lists the type and usage of the optical interface. Table 7-51 Optical interface of the ADL4 Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives STM-4 optical signals.

7.12.5 Valid Slots The ADL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.12.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the ADL4 indicates the optical interface type. Table 7-52 lists the relation between the board feature code and optical interface type of the ADL4. Table 7-52 Relation between the board feature code and the optical interface type Board

Feature Code

Optical Interface Type

SSN1ADL410

10

S-4.1

SSN1ADL411

11

L-4.1

SSN1ADL412

12

L-4.2

SSN1ADL413

13

Ve-4.2

7.12.7 Board Configuration Reference You can use the T2000 to set parameters for the ADL4. You can use the T2000 to set the following parameters for the ADL4: 7-104

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l

Port type

l

Flow type

l

Service type

l

Peak cell rate (PCR)

l

Sustainable cell rate (SCR)

l

Maximum cell burst size

l

Cell delay variation tolerance (CDVT)

For details on these parameters, refer to F Board Configuration Reference.

7.12.8 Technical Specifications The technical specifications of the ADL4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 7-53 lists the specifications of the optical interfaces of the ADL4. Table 7-53 Specifications of the optical interfaces of the ADL4 Item

Specification

Optical interface type

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source type

MLM

SLM

SLM

SLM

Transmission distance (km)

2–15

15–40

40–80

80–100

Wavelength (nm)

1274–1356

1280–1335

1480–1580

1480–1580

Overload optical power (dBm)

–8

–8

–8

–8

Receiver sensitivity (dBm)

–23

–28

–28

–33

Launched optical power (dBm)

–15 to –8

–3 to +2

–3 to +2

–2 to +2

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the ADL4 are as follows: Issue 02 (2007-09-10)

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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.9

Power Consumption In the normal temperature (25℃), the maximum power consumption of the ADL4 is 41 W.

7.13 ADQ1 This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.13.1 Version Description The functional version of the ADQ1 board is N1. 7.13.2 Function and Feature The ADQ1 supports the ATM switching and ATM protection. 7.13.3 Working Principle and Signal Flow The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so on. 7.13.4 Front Panel On the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety class label. 7.13.5 Valid Slots The ADQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.13.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the ADQ1 indicates the optical interface type. 7.13.7 Board Configuration Reference You can use the T2000 to set parameters for the ADQ1. 7.13.8 Technical Specifications The technical specifications of the ADQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

7.13.1 Version Description The functional version of the ADQ1 board is N1.

7.13.2 Function and Feature The ADQ1 supports the ATM switching and ATM protection. Table 7-54 lists the functions and features of the ADQ1.

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Table 7-54 Functions and features of the ADQ1 Function and Feature

ADQ1

Basic function

Accesses and processes 4 x STM-1 ATM services.

Optical interface type

Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types.

Connector type

LC.

Optical module type

SFP.

E3 ATM interface

Supports 12 x E3 signals, which are accessed by the PD3/PL3/ N1PL3A.

IMA function

Not supported.

Max. uplink bandwidth

Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.

ATM switching capability

1.2 Gbit/s.

Mapping granularity

Supports VC-3, VC-4, or VC-4-Xv (X: 1–4).

Service type

Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection

2048.

Statistical multiplexing

Supported.

Flow type and QoS

Supports IETF RFC2514 and ATM forum TM4.0.

ATM multicast connection

Supports spacial multicast and logical multicast.

ATM protection (ITUT I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VCRing protection schemes.

OAM function (ITU-T I.610)

Supports AIS, RDI, LB , and CC.

Maintenance feature

Supports inloop and outloop at the ATM layer levels, supports inloop at the optical interface, which are used for maintenance and fault locating.

Alarm and performance event

Provides rich alarms and performance events, which are used for maintenance and fault locating.

7.13.3 Working Principle and Signal Flow The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so on. Figure 7-33 shows the block diagram for the functions of the ADQ1.

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Figure 7-33 Block diagram for the functions of the ADQ1 4x155 Mbit/s

4x155Mbit/s

E/O

high speed bus

PHY module 4x155Mbit/s

ATM module

4x155Mbit/s

O/E

Mapping module high speed bus

E3 module

LOS

Reference clock and frame header

Communication and control module

Laser shut down

Cross-connet unit A

Communication

Cross-connet unit B

Cross-connet unit

Scc unit

50 MHz 77 MHz 100 MHz

Clock module 3.3 V

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

+1.2 V Fuse +1.5 V +1.8 V

DC/DC converter

+3.3 V backup power

+2.5 V

The function modules are described as follows.

O/E Converting Module In the receive direction, optical signals are converted to electrical signals. In the transmit direction, electrical signals are converted to optical signals.

Physical Layer Module The physical layer module mainly: l

Mappings ATM cells into SDH frames

l

Demappings SDH frames to ATM cells

l

Processes ATM service physical layer functions: cell delimitation, test and generation of HEC series

ATM Module The ATM module mainly performs ATM layer functions in the ATM protocol. These functions include:

7-108

l

Flow control

l

Extraction and generation of cell headers

l

ATM switching Huawei Technologies Proprietary

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E3 Module The E3 module mainly processes the ATM services at E3 rate. This module: l

Mappings the ATM cells into E3 containers

l

Demappings E3 containers to ATM cells

l

Perform ATM physical layer function to the ATM service at E3 rate

Mapping Module The mapping module: l

Mappings ATM cells into SDH frame payload

l

Demappings SDH frame payload to ATM cells

l

Supports ATM physical layer functions

l

Supports VC-4-Xv (X≤4) virtual concatenation

Communication and Control Module The communication and control module: l

Controls writing and reading of each chip

l

Communicates with the NE

l

Issues configured services

l

Reports alarms of each functional module

l

Checks R_LOS alarms of optical modules

l

Controls the shutting of transmission

Clock Module This module mainly generates working clocks for each chip. The frequencies of the clocks are 50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.13.4 Front Panel On the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 7-34 shows the appearance of the front panel of the ADQ1. Issue 02 (2007-09-10)

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Figure 7-34 Front panel of the ADQ1

ADQ1 STAT ACT PROG SRV CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 ADQ1

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four pairs of optical interfaces on the front panel of the ADQ1. Table 7-55 lists the type and usage of the optical interfaces.

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Table 7-55 Optical interfaces of the ADQ1 Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT2/IN2

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT3/IN3

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT4/IN4

LC (pluggable)

Transmits and receives STM-1 optical signals.

7.13.5 Valid Slots The ADQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.13.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the ADQ1 indicates the optical interface type. Table 7-56 lists the relation between the board feature code and optical interface type for the ADQ1. Table 7-56 Relation between the board feature code and the optical interface type Board

Feature Code

Optical Interface Type

SSN1ADQ110

10

S-1.1

SSN1ADQ111

11

L-1.1

SSN1ADQ112

12

L-1.2

SSN1ADQ113

13

Ve-1.2

SSN1ADQ114

14

Ie-1

7.13.7 Board Configuration Reference You can use the T2000 to set parameters for the ADQ1. You can use the T2000 to set the following parameters for the ADQ1: l

Port type

l

Flow type

l

Service type

l

Peak cell rate (PCR)

l

Sustainable cell rate (SCR)

l

Maximum cell burst size

l

Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference. Issue 02 (2007-09-10)

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7.13.8 Technical Specifications The technical specifications of the ADQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 7-57 lists the specifications of the optical interfaces of the ADQ1. Table 7-57 Specifications of the optical interfaces of the ADQ1 Item

Specification

Optical interface type

Ie-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Optical source type

MLM

MLM

MLM, SLM

SLM

SLM

Wavelength (nm)

1260 to 1360

1261 to 1360

1263 to 1360

1480 to 1580

1480 to 1580

Transmission distance (km)

0 to 0.5

2 to 15

15 to 40

40 to 80

80 to 100

Launched optical power (dBm)

–19 to –14

–15 to –8

–5 to 0

–5 to 0

–3 to 0

Receiving optical power (dBm)

–31

–28

–34

–34

–34

Overload optical power (dBm)

–14

–8

–10

–10

–10

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the ADQ1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.9

Power Consumption In the normal temperature (25℃), the maximum power consumption of the ADQ1 is 37 W. 7-112

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7.14 IDL4 This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.14.1 Version Description The functional version of the IDL4 board is N1. 7.14.2 Function and Feature The IDL4 supports the ATM switching, IMA, and ATM protection. 7.14.3 Working Principle The IDL4 consists of the O/E converting module, physical layer module, ATM module and so on. 7.14.4 Front Panel On the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety class label. 7.14.5 Valid Slots The IDL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.14.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the IDL4 indicates the optical interface type. 7.14.7 Board Protection The IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should be housed in paired slots. 7.14.8 Board Configuration Reference You can use the T2000 to set parameters for the IDL4. 7.14.9 Technical Specifications The technical specifications of the IDL4 cover the optical interface specifications, board dimensions, weight and power consumption.

7.14.1 Version Description The functional version of the IDL4 board is N1.

7.14.2 Function and Feature The IDL4 supports the ATM switching, IMA, and ATM protection. Table 7-58 lists the functions and features of the IDL4.

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Table 7-58 Functions and features of the IDL4 Function and Feature

IDL4

Basic function

Accesses and processes 1 x STM-4 ATM services.

Optical interface type

Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2 types.

Connector type

LC.

Optical module type

SFP.

E3 ATM interface

Not supported.

IMA function (ATM Forum IMA 1.1 standard)

Accesses and processes IMA services when used with E1 service processing board N1PQ1/N1PQM. Supports a maximum of 63 IMA E1 services. One ATM port supports a maximum of 16 IMA groups. Each IMA group supports 1–32 E1 signals. One ATM port supports a maximum of E1 links of 16 non-IMA groups. The maximum IMA multichannel delay is 226 ms.

Max. uplink bandwidth

Supports 8 x VC-4, or 63 x VC-12 and +7 x VC-4.

ATM switching capability

1.0 Gbit/s.

Mapping granularity

Supports VC-12, VC-4, or VC-4-Xc (X:1–4), VC-12-Xv (X:1–32).

IMA feature

Accesses and processes IMA services when used with E1 service processing board. Processes IMA services for a maximum of 63 x E1 signals. Supports a maximum of 16 IMA groups. Each IMA group supports 1– 32 E1 signals. The maximum IMA multichannel delay is 226 ms.

7-114

Service type

Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection

2048.

Statistical multiplexing

Supported.

Flow type and QoS

Supports IETF RFC2514 and ATM forum TM4.0.

ATM multicast connection

Supports spacial multicast and logical multicast.

ATM protection (ITU-T I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring protection schemes.

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Function and Feature

IDL4

Board level 1+1 protection

Supported.

OAM function (ITU-T I.610)

Supports AIS, RDI, LB , and CC.

Maintenance feature

Supports inloop and outloop at the ATM layer levels, supports inloop at the optical interface, which are used for maintenance and fault locating.

Alarm and performance event

Provides rich alarms and performance events, which are used for maintenance and fault locating.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can coexist with single E1. The IMA group can dynamically increase or decrease the bandwidth to enhance the bandwidth utilization. The IMA group can also converge 2M services, and can connect to other IMA equipment.

7.14.3 Working Principle The IDL4 consists of the O/E converting module, physical layer module, ATM module and so on. Figure 7-35 shows the block diagram for the functions of the IDL4. Figure 7-35 Block diagram for the functions of the IDL4

622 Mbit/s

E/O

high speed bus

622 Mbit/s

Cross-connet unit A

PHY module

ATM module

high speed bus

IMA module

O/E 622 Mbit/s

Mapping module

622 Mbit/s

LOS

Communication and control module

Laser shut down

Cross-connet unit B

Reference clock and frame header Communication

Cross-connet unit Scc unit

50 MHz 77 MHz 100 MHz

Clock module +3.3 V

+1.2 V +1.5 V +1.8 V +2.5 V

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DC/DC converter

Fuse

-48 V/ -60 V Fuse

DC/DC converters

Huawei Technologies Proprietary

-48 V/ -60 V

+3.3 V backup power

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E/O Converting Module The E/O converting module is responsible for E/O conversion.

Physical Layer Module The physical layer module mainly: l

Mappings ATM cells into SDH frames

l

Demappings SDH frames to ATM cells

l

Processes ATM service physical layer functions: cell delimitation, test and generation of header error control (HEC) sequence

ATM Module The ATM module mainly performs ATM layer functions in the ATM protocol. These functions include: l

Flow control

l

Extraction and generation of cell headers

l

ATM switching

IMA Module This module mainly performs IMA protocol functions. These functions are: l

Separation and re-creation of ATM cells

l

Frame synchronization

l

Insertion and extraction of IMA control protocol (ICP) cells

l

Management of IMA groups

Mapping Module The mapping module: l

Mappings ATM cells into SDH frame payload

l

Demappings SDH frame payload to ATM cells

l

Supports ATM physical layer functions

l

Supports VC-4-Xv (X≤4) virtual concatenation

Communication and Control Module The communication and control module:

7-116

l

Controls writing and reading of each chip

l

Communicates with the NE

l

Issues configured services

l

Reports alarms of each functional module

l

Checks R_LOS alarms of optical modules Huawei Technologies Proprietary

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7 Data Processing Boards

Controls the shutting of transmission

Clock Module This module mainly generates working clocks for each chip. The frequencies of the clocks are 50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.14.4 Front Panel On the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 7-36 shows the appearance of the front panel of the IDL4. Figure 7-36 Front panel of the IDL4

IDL4 STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT1 IN1 IDL4

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are one optical interface on the front panel of the IDL4. Table 7-59 lists the type and usage of the optical interface. Table 7-59 Optical interface of the IDL4 Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives STM-4 optical signals.

7.14.5 Valid Slots The IDL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.14.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the IDL4 indicates the optical interface type. Table 7-60 lists the relation between the board feature code and optical interface type for the IDL4. Table 7-60 Relation between the board feature code and the optical interface type Board

Feature Code

Optical Interface Type

SSN1IDL410

10

S-4.1

SSN1IDL411

11

L-4.1

SSN1IDL412

12

L-4.2

SSN1IDL413

13

Ve-4.2

7.14.7 Board Protection The IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should be housed in paired slots. 7-118

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The paired slots for the IDL4 are slots 13 and 12.

7.14.8 Board Configuration Reference You can use the T2000 to set parameters for the IDL4. You can use the T2000 to set the following parameters for the IDL4: l

Port type

l

Flow type

l

Service type

l

Peak cell rate (PCR)

l

Sustainable cell rate (SCR)

l

Maximum cell burst size

l

Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference.

7.14.9 Technical Specifications The technical specifications of the IDL4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 7-61 lists the specifications of the optical interfaces of the IDL4. Table 7-61 Specifications of the optical interfaces of the IDL4 Item

Specification

Optical interface type

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source type

MLM

SLM

SLM

SLM

Wavelength (nm)

1274 to 1356

1280 to 1335

1480 to 1580

1480 to 1580

Transmission distance (km)

2 to 15

15 to 40

40 to 80

80 to 100

Launched optical power (dBm)

–15 to –8

–3 to +2

–3 to +2

–3 to +2

Receiver sensitivity (dBm)

–28

–28

–28

–33

Overload optical power (dBm)

–8

–8

–8

–13

Laser Safety Class The safety class of the laser on the board is CLASS 1. Issue 02 (2007-09-10)

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The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the IDL4 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the IDL4 is 41 W.

7.15 IDQ1 This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.15.1 Version Description The functional version of the IDQ1 board is N1. 7.15.2 Function and Feature The IDQ1 supports the ATM switching, IMA, and ATM protection. 7.15.3 Working Principle and Signal Flow The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so on. 7.15.4 Front Panel On the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety class label. 7.15.5 Valid Slots The IDQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.15.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the IDQ1 indicates the optical interface type. 7.15.7 Board Protection The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be housed in paired slots. 7.15.8 Board Configuration Reference You can use the T2000 to set parameters for the IDQ1. 7.15.9 Technical Specifications The technical specifications of the IDQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

7.15.1 Version Description The functional version of the IDQ1 board is N1. 7-120

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7.15.2 Function and Feature The IDQ1 supports the ATM switching, IMA, and ATM protection. Table 7-62 lists the functions and features of the IDQ1. Table 7-62 Functions and features of the IDQ1 Function and Feature

IDQ1

Basic function

Accesses and processes 4 x STM-1 ATM services.

Optical interface type

Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types.

Connector type

LC.

Optical module type

SFP.

E3 ATM interface

Not supported.

IMA function (ATM Forum IMA 1.1 standard)

Accesses and processes IMA services when used with E1 service processing board N1PQ1/N1PQM. Supports a maximum of 63 IMA E1 services. One ATM port supports a maximum of 16 IMA groups. Each IMA group supports 1–32 E1 signals. One ATM port supports a maximum of E1 links of 16 non-IMA groups. The maximum IMA multichannel delay is 226 ms.

Max. uplink bandwidth

Supports 8 x VC-4, or 63 x VC-12 and 7 x VC-4.

ATM switching capability

1.0 Gbit/s.

Mapping granularity

Suppports VC-12, VC-4, or VC-4-Xc (X:1–4), VC-12-Xv (X:1–32).

IMA feature

Accesses and processes IMA services when used with E1 service processing board. Processes IMA services for a maximum of 63 x E1 signals. Supports a maximum of 16 IMA groups. Each IMA group supports 1– 32 E1 signals. The maximum IMA multichannel delay is 226 ms.

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Service type

Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection

2048.

Statistical multiplexing

Supported.

Flow type and QoS

Supports IETF RFC2514 and ATM forum TM4.0. Huawei Technologies Proprietary

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Function and Feature

IDQ1

ATM multicast connection

Supports spacial multicast and logical multicast.

ATM protection (ITU-T I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring protection schemes.

Board level 1+1 protection

Supported.

OAM function (ITU-T I.610)

Supports AIS, RDI, LB , and CC.

Maintenance feature

Supports inloop and outloop at the ATM layer levels, supports inloop at the optical interface, which are used for maintenance and fault locating.

Alarm and performance event

Provides rich alarms and performance events, which are used for maintenance and fault locating.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can coexist with single E1. The IMA group can dynamically increase or decrease the bandwidth to enhance the bandwidth utilization. The IMA group can also converge 2M services, and can connect to other IMA equipment.

7.15.3 Working Principle and Signal Flow The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so on. Figure 7-37 shows the block diagram for the functions of the IDQ1.

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Figure 7-37 Block diagram for the functions of the IDQ1

4 x 155 Mbit/s

4 x 155 Mbit/s

E/O

O/E

4 x 155 Mbit/s

4 x 155 Mbit/s

high speed bus Cross-connet unit A

PHY module

ATM module

Mapping module high speed bus

IMA module

LOS

Communication and control module

Laser shut down

Cross-connet unit B

Reference clock and frame header Communication

Cross-connet unit Scc unit

50 MHz 77 MHz 100 MHz

Clock module +3.3 V

+1.2 V +1.5 V +1.8 V +2.5 V

DC/DC converter

Fuse

-48 V/ -60 V Fuse

DC/DC converters

-48 V/ -60 V

+3.3 V backup power

E/O Converting Module The E/O converting module is responsible for E/O conversion.

Physical Layer Module The physical layer module mainly: l

Mappings ATM cells into SDH frames

l

Demappings SDH frames to ATM cells

l

Processes ATM service physical layer functions: cell delimitation, test and generation of header error control (HEC) sequence

ATM Module The ATM module mainly performs ATM layer functions in the ATM protocol. These functions include: l

Flow control

l

Extraction and generation of cell headers

l

ATM switching

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IMA Module This module mainly performs IMA protocol functions. These functions are: l

Separation and re-creation of ATM cells

l

Frame synchronization

l

Insertion and extraction of IMA control protocol (ICP) cells

l

Management of IMA groups

Mapping Module The mapping module: l

Mappings ATM cells into SDH frame payload

l

Demappings SDH frame payload to ATM cells

l

Supports ATM physical layer functions

l

Supports VC-4-Xv (X≤4) virtual concatenation

Communication and Control Module The communication and control module: l

Controls writing and reading of each chip

l

Communicates with the NE

l

Issues configured services

l

Reports alarms of each functional module

l

Checks R_LOS alarms of optical modules

l

Controls the shutting of transmission

Clock Module This module mainly generates working clocks for each chip. The frequencies of the clocks are 50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.15.4 Front Panel On the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 7-38 shows the appearance of the front panel of the IDQ1. 7-124

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Figure 7-38 Front panel of the IDQ1 IDQ1 STAT ACT PROG SRV CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 IDQ1

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four optical interfaces on the front panel of the IDQ1. Table 7-63 lists the type and usage of the optical interfaces.

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Table 7-63 Optical interfaces of the IDQ1 Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT2/IN2

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT3/IN3

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT4/IN4

LC (pluggable)

Transmits and receives STM-1 optical signals.

7.15.5 Valid Slots The IDQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.15.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the IDQ1 indicates the optical interface type. Table 7-64 lists the relation between the board feature code and optical interface type for the IDQ1. Table 7-64 Relation between the board feature code and the optical interface type Board Barcode

Feature Code

Optical Interface Type

SSN1IDQ110

10

S-1.1

SSN1IDQ111

11

L-1.1

SSN1IDQ112

12

L-1.2

SSN1IDQ113

13

Ve-1.2

SSN1IDQ114

14

Ie-1

7.15.7 Board Protection The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be housed in paired slots. The paired slots for the IDQ1 are slots 13 and 12.

7.15.8 Board Configuration Reference You can use the T2000 to set parameters for the IDQ1. You can use the T2000 to set the following parameters for the IDQ1:

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l

Port type

l

Flow type

l

Service type Huawei Technologies Proprietary

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Peak cell rate (PCR)

l

Sustainable cell rate (SCR)

l

Maximum cell burst size

l

Cell delay variation tolerance (CDVT)

7 Data Processing Boards

For details on the parameters, refer to F Board Configuration Reference.

7.15.9 Technical Specifications The technical specifications of the IDQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 7-65 lists the specifications of the optical interfaces of the IDQ1. Table 7-65 Specifications of the optical interfaces of the IDQ1 Item

Specification

Optical interface type

Ie-1

S-1.1

L-1.2

Ve-1.2

L-1.1

Optical source type

MLM

MLM

SLM

SLM

MLM, SLM

Wavelength (nm)

1260 to 1360

1261 to 1360

1480 to 1580

1480 to 1580

1263 to 1360

Transmission distance (km)

0 to 0.5

2 to 15

40 to 80

80 to 100

15 to 40

Launched optical power (dBm)

–19 to –14

–15 to –8

–5 to 0

–3 to 0

–5 to 0

Receiver sensitivity (dBm)

–31

–28

–34

–34

–34

Overload optical power (dBm)

–14

–8

–10

–10

–10

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the IDQ1 are as follows: Issue 02 (2007-09-10)

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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the IDQ1 is 41 W.

7.16 MST4 This section describes the MST4, a 4-channel multi-service transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.16.1 Version Description The functional version of the MST4 board is N1. 7.16.2 Function and Feature The MST4 is used to access multiple services, and to maintain alarms. 7.16.3 Working Principle and Signal Flow The MST4 consists of the client-side access module, FC protocol processing module, encapsulation and mapping module, Communication and control module and so on. 7.16.4 Front Panel On the front panel of the MST4, there are indicators, interfaces and barcode. 7.16.5 Valid Slots The MST4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The MST4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack. 7.16.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the MST4 indicates the service type, optical interface type and transmission distance. 7.16.7 Board Configuration Reference You can use the T2000 to set parameters for the MST4. 7.16.8 Technical Specifications The specifications of the MST4 cover the optical interface specifications, mechanical specifications and power consumption.

7.16.1 Version Description The functional version of the MST4 board is N1.

7.16.2 Function and Feature The MST4 is used to access multiple services, and to maintain alarms. Table 7-66 lists the functions and features of the MST4.

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Table 7-66 Functions and features of the MST4 Function and Feature

MST4

Basic function

Provides four independent ports to access multiple services, and supports the transparent transmission of the SAN and Video services.

Connector type

LC.

Optical module type

SFP.

Service type

Supports the FC100/FICON, FC200, ESCON, and DVB-ASI services.Table 7-67 lists types and rates of the services. Accesses four-channel FC services (FC100/FICON and FC200) at the same time, and the total bandwidth is less than 2.5 Gbit/s. Supports the full-rate transmission of the FC services (one-channel FC200 services or two-channel FC100 services). Accesses four-channel ESCON or DVB-ASI services, and the total bandwidth is less than 2.5 Gbit/s.

Distance extension

The first and second ports support the distance extension function at the SDH side. (FC100: 3000 km; FC200: 1500 km)

Max. uplink bandwidth

2.5 Gbit/s (Four 622 Mbit/s buses are present on the backplane to directly connect to the cross-connect unit.)

Mapping granularity

Supports VC-4-Xc (X: 4, 8, 16).

ESCON

Accesses four-channel ESCON services, and the total bandwidth is less than 2.5 Gbit/s.

DVB-ASI

Accesses four-channel DVB-ASI services, and the total bandwidth is less than 2.5 Gbit/s.

Encapsulation format

Supports GFP-T, compliant with ITU-T G.7041.

Maintenance feature

Supports the inloop and outloop at the port level of the client side. The loopack is used for maintenance and fault locating.

Alarm and performance event

Provides rich alarms and performance events, which are used for maintenance and fault locating.

Table 7-67 Services and service rates provided by the MST4

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Service Type

Rate

Remarks

FC100/FICON

1062.5 Mbit/s

SAN service

FC200

2125 Mbit/s

SAN service

ESCON

200 Mbit/s.

SAN service.

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Service Type

Rate

Remarks

DVB-ASI

270 Mbit/s

Video service

7.16.3 Working Principle and Signal Flow The MST4 consists of the client-side access module, FC protocol processing module, encapsulation and mapping module, Communication and control module and so on. Figure 7-39 shows the block diagram for the functions of the MST4. Figure 7-39 Block diagram for the functions of the MST4

FC50 FC100 FC200 FICON DVB-ASI ESCON

FC1_ RCV

Clientside access module

FC2

FC1_ SND

Cross-connect unit A/B

Encaps ulation Mapping

FC1_ SND

FC2

FC1_ RCV

Decaps ulation

Interface conversion module

Cross-connect unit A/B

FC processing module Encapsulation and mapping module Communication

Communication and control module

100 MHz 125 MHz 135 MHz 212.5 MHz 622 MHz

SCC unit

Reference clock and frame header

Crossconnect unit

Clock module +3.3 V +1.2 V +1.5 V +1.8 V +2.5 V

DC/DC converter DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

The function modules are described as follows:

Client-side Access Module The client-side access module accesses FC50, FC100, FC200, FICON, DVB-ASI and ESCON services. The client-side interface unit performs O/E conversion for services and monitors the optical signals at client side. In the upstream direction, the client-side data interface (CDI) receives serial data signals input by the SFP optical module. The serial data signals are then transmitted to the PCS function module for physical layer and 8B/10B line performance monitoring. In the downstream direction, 8B/ 10B conversion is performed to the signals from FC. The signals are then adapted into client reference clock by inserting or discarding idle packets. After being converted from parallel signals to serial signals, the signals are transmitted through the CDI interface to the optical module at client side.

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FC protocol Processing Module The FC protocol processing unit mainly extends the distance the FC services. This module supports transmitting 2 x FC100 services up to 3,000 km or 1 x FC200 services up to 1500 km. The FC protocol processing unit performs FC1 layer and FC2 layer functions. The FC1 layer functions include: l

8B/10B conversion

l

Synchronous processing

l

Extraction of primitive signal and primitive sequence

The FC2 layer functions include: l

Check and statistics of all special frames

l

Modification of values of some special frames (FLOG1, PLOG1 and ELP)

l

CRC check

Encapsulation and Mapping Module The encapsulation and mapping module mainly: l

Encapsulates and mappings data

l

Decapsulates and demappings data

According to signal flow direction, the function modules inside the chip can be classified into modules in ingress direction and ones in egress direction. The ingress direction is for processing from client side to line side. The egress direction is for line-side processing. Ingress direction: Through GFP-T encapsulation, 64B/65B conversion is performed to data bytes after decoding. The data bytes are then mapped under GFP-T protocol. Egress direction: SDH data frames are received from the line-side interface module. After the overhead is processed, GFP-T data frames are extracted from SDH concatenated channels and then are transmitted to the decapsulating module for decapsulation.

Communication and Control Module The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module manages and configures other modules of the boards. This module contains basic logic units: l

Writes and reads register

l

Provides interface for CPU

l

Checks and selects clock

l

Performs phase discrimination and frequency division to the clock

l

Checks the in-service state of the cross-connect, the SCC and the line boards

l

Checks reset control circuits of each chip

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Controls the shutting down of the optical module

l

Processes communications

l

Controls indicators

System Clock Module This module provides required reference clocks for boards. The clock frequencies are 100 MHz, 125 MHz and so on.

DC/DC Converter Module Through the DC/DC module, the power unit generates direct currents for each chip on the board. The –48 V/ –60 V powers are converted to the following direct currents: +1.2 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power.

7.16.4 Front Panel On the front panel of the MST4, there are indicators, interfaces and barcode.

Appearance of the Front Panel Figure 7-40 shows the appearance of the front panel of the MST4. Figure 7-40 Front panel of the MST4 MST4 STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

MST4

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four pairs of optical interfaces on the front panel of the MST4. Table 7-68 lists the type and usage of the optical interfaces. Table 7-68 Optical interfaces of the MST4 Interface

Interface Type

Usage

IN1-IN4

LC

Receives multi-service optical signals.

OUT1-OUT4

LC

Transmits multi-service optical signals.

7.16.5 Valid Slots The MST4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The MST4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.16.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the MST4 indicates the service type, optical interface type and transmission distance. Table 7-69 lists the relation between the board feature code and service type. Table 7-69 Relation between the board feature code and service type

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Board Barcode

Feature Code

Service Type (Optical Interface Type)

Transmission Distance

SSN1MST410

10

2 x FC (SM)

2 km

SSN1MST411

11

2 x FC (SM)

15 km

SSN1MST412

12

2 x FC (MM)

0.5 km

SSN1MST413

13

4 x ESCON/DVB-ASI (SM)

15 km

SSN1MST414

14

4 x ESCON/DVB-ASI (MM)

2 km

SSN1MST415

15

1 x FC2 (MM)

-

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Board Barcode

Feature Code

Service Type (Optical Interface Type)

Transmission Distance

ESCON/DVB-ASI (MM) SSN1MST416

16

1 x FC2 (MM)

-

ESCON/DVB-ASI (SM) SSN1MST417

SSN1MST418

17

18

1 x FC (SM)

2 km

2 x ESCON/DVB-ASI (SM)

-

1 x FC (SM)

2 km

2 x ESCON/DVB-ASI (MM)

-

7.16.7 Board Configuration Reference You can use the T2000 to set parameters for the MST4. You can use the T2000 to set the following parameters for the MST4: l

J1 byte

l

C2 byte

For details on the parameters, refer to F Board Configuration Reference.

7.16.8 Technical Specifications The specifications of the MST4 cover the optical interface specifications, mechanical specifications and power consumption.

Optical Interface Specifications The optical interfaces of the MST4 can use several types of the optical interfaces. Table 7-70 lists the specifications of the optical interfaces. Table 7-70 Specifications of the optical interfaces of the MST4 Item

Specification

Optical interface type

X3.296/(DVB-ASI ) EN50083-9 200-M5-SN-I

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200-SM-LC-I

Optical module code

34060277

34060287

34060325

34060288

Service type

ESCON/DVB

Service rate

STM-4

STM-1

2.125 Gbit/s

STM-16

Optical source type

SLM

LED

LED

MLM

34060278

FC200, FC100

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Item

Specification

Wavelength (nm)

1310

Transmission distance (km)

15

Max. launched optical power (dBm)

7 Data Processing Boards

850

1310

2

0.5

2

15

–8

–14

-2.5

-3

0

Min. launched optical power (dBm)

–15

–19

-9.5

-10

-5

Receiver sensitivity (dBm)

–31

–30

–17

–21

Overload optical power (dBm)

–8

–14

0

–3

0

Mechanical Specifications The mechanical specifications of the MST4 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.9

Power Consumption In the normal temperature (25℃), the maximum power consumption of the MST4 is 26 W.

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8 Interface Boards and Switching Boards

Interface Boards and Switching Boards

About This Chapter This chapter describes the interface and switching boards. The interface boards are used to access cables and fibers. The switching boards are used to provide the TPS protection. 8.1 L12S This section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.2 D12B This section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version, function, principle, front panel and specifications. 8.3 D12S This section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.4 L75S This section describes the L75S, a 16 x E1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.5 D75S This section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.6 D34S This section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.7 C34S This section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.8 EU04 This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version, function, working principle, front panel and specifications. 8.9 EU08 Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version, function, working principle, front panel and specifications. 8.10 OU08 This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 8.11 MU04 This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of the version, function, principle, front panel and specifications. 8.12 TSB8 This section describes the TSB8, an 8-channel optical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.13 EFF8 This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of the version, function, principle, front panel and specifications. 8.14 ETF8 This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms of the version, function, principle, front panel and specifications. 8.15 ETS8 This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board, in terms of the version, function, principle, front panel and specifications. 8.16 DM12 This section describes the DM12, a DDN interface board, in terms of the version, function, principle, front panel and specifications.

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8.1 L12S This section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.1.1 Version Description The functional version of the L12S is R1. 8.1.2 Function and Feature The L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must be used with the PD1. 8.1.3 Working Principle and Signal Flow The L12S consists of the interface module, switch matrix module, and power supply module. 8.1.4 Front Panel On the front panel of the L12S, there are interfaces and barcode. 8.1.5 Valid Slots As the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiX OSN 1500A subrack. 8.1.6 Technical Specifications The technical specifications of the L12S cover the board dimensions, weight and power consumption.

8.1.1 Version Description The functional version of the L12S is R1.

8.1.2 Function and Feature The L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must be used with the PD1.

8.1.3 Working Principle and Signal Flow The L12S consists of the interface module, switch matrix module, and power supply module. Figure 8-1 shows the block diagram for the functions of the L12S. Figure 8-1 Block diagram for the functions of the L12S Backplane Crossconnect board E1/T1

Swictch matrix module

Interface module

PD1

E1/T1

+3.3 V

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PD1

Power supply module

Fuse

+3.3 V

Power

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Interface Module The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PD1 board. When the TPS protection is performed, the switch matrix module transmits the signals to the protection board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.1.4 Front Panel On the front panel of the L12S, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-2 shows the appearance of the front panel of the L12S. Figure 8-2 Front panel of the L12S

L12S

1-16

Interfaces On the front panel of the L12S, there are two 2mmHM connectors, which are used to access 16 x E1/T1 electrical signals.

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8.1.5 Valid Slots As the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiX OSN 1500A subrack. Table 8-1 lists the valid slots for the PD1 and corresponding slots for the L12S. The L12S housed in the slot with a smaller number accesses the first 16 (1–16) channels of E1/T1 electrical signals. The L12S housed in the slot with a larger number accesses the last 16 (17–32) channels of E1/ T1 electrical signals. Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A subrack Valid Slot for the PD1

Corresponding Slot for the L12S

Slot 12

Slots 6 and 7

8.1.6 Technical Specifications The technical specifications of the L12S cover the board dimensions, weight and power consumption.

Mechanical Specifications The mechanical specifications of the L12S are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.27

Power Consumption In the normal temperature (25℃), the maximum power consumption of the L12S is 4.5 W.

8.2 D12B This section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version, function, principle, front panel and specifications. 8.2.1 Version Description The functional version of the D12B board is N1. 8.2.2 Function and Feature The D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must be used with the PQ1 or PQM. 8.2.3 Working Principle and Signal Flow The D12B consists of the interface module and power supply module. 8.2.4 Front Panel On the front panel of the D12B, there are interfaces and barcode. 8.2.5 Valid Slots Issue 02 (2007-09-10)

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The D12B can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12B can be used as the interface board for the PQ1 or PQM. 8.2.6 Technical Specifications The technical specifications of the D12B cover the board dimensions, weight and power consumption.

8.2.1 Version Description The functional version of the D12B board is N1.

8.2.2 Function and Feature The D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must be used with the PQ1 or PQM.

8.2.3 Working Principle and Signal Flow The D12B consists of the interface module and power supply module. Figure 8-3 shows the block diagram for the functions of the D12B. Figure 8-3 Block diagram for the functions of the D12B Backplane

PQ1/PQM

E1/T1

Interface module PQ1/PQM

E1/T1

+3.3 V

Power supply module

Fuse

+3.3 V Power

Interface Module The interface module receives and transmits the E1/T1 electrical signals.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.2.4 Front Panel On the front panel of the D12B, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-4 shows the appearance of the front panel of the D12B. 8-6

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Figure 8-4 Front panel of the D12B D12B

1～8 9～16 17～24 25～32

D12B

Interfaces There are four DB44 interfaces on the front panel of the D12B. Table 8-2 lists the type and usage of the interfaces. Table 8-2 Interfaces on the front panel of the D12B Interface

Interface Type

Usage

1–8

DB44

Receive eight channels (1–8) of E1/T1 signals.

9–16

DB44

Receive eight channels (9–16) of E1/T1 signals.

17–24

DB44

Receive eight channels (17–24) of E1/T1 signals.

25–32

DB44

Receive eight channels (25-32) of E1/T1 signals.

Table 8-3 lists the pins of the DB44 interfaces.

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Table 8-3 Pins of the DB44 interfaces of the D12B Front View 1

Pin

Usage

Pin

Usage

38

R1 to receive the first channel of signals.

34

R5 to receive the fifth channel of signals.

R2 to receive the second channel of signals.

33

R3 to receive the third channel of signals.

32

R4 to receive the fourth channel of signals.

31

T1 to transmit the first channel of signals.

11

T2 to transmit the second channel of signals.

10

T3 to transmit the third channel of signals.

9

T4 to transmit the fourth channel of signals.

8

23 37 22 36 21 35

44

20 15 30 14 29 13 28 12 27

19

18

17

16

26

25

24

7

R6 to receive the sixth channel of signals. R7 to receive the seventh channel of signals. R8 to receive the eighth channel of signals. T5 to transmit the fifth channel of signals. T6 to transmit the sixth channel of signals. T7 to transmit the seventh channel of signals. T8 to transmit the eighth channel of signals.

8.2.5 Valid Slots The D12B can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12B can be used as the interface board for the PQ1 or PQM. Table 8-4 lists the valid slots for the PQ1/PQM and corresponding slots for the D12B. The D12B housed in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electrical signals. The D12B housed in the slot with a larger number accesses the last 31 (33–63) channels of E1/T1 electrical signals. Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN 1500B subrack

8-8

Valid Slot for the PQ1/PQM

Corresponding Slot for the D12B

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

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8.2.6 Technical Specifications The technical specifications of the D12B cover the board dimensions, weight and power consumption.

Mechanical Specifications The mechanical specifications of the D12B are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.3

Power Consumption In the normal temperature (25℃), the maximum power consumption of the D12B is 0 W.

8.3 D12S This section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.3.1 Version Description The functional version of the D12S board is N1. 8.3.2 Function and Feature The D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must be used with the PQ1 or PQM. 8.3.3 Working Principle and Signal Flow The D12S consists of the interface module, switch matrix module, and power supply module. 8.3.4 Front Panel On the front panel of the D12S, there are interfaces and barcode. 8.3.5 Valid Slots The D12S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12S can be used as the interface board for the PQ1 or PQM. 8.3.6 Technical Specifications The technical specifications of the D12S cover the board dimensions, weight and power consumption.

8.3.1 Version Description The functional version of the D12S board is N1.

8.3.2 Function and Feature The D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must be used with the PQ1 or PQM.

8.3.3 Working Principle and Signal Flow The D12S consists of the interface module, switch matrix module, and power supply module. Issue 02 (2007-09-10)

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Figure 8-5 shows the block diagram for the functions of the D12S. Figure 8-5 Block diagram for the functions of the D12S Backplane Crossconnect board E1/T1

Swictch matrix module

Interface module

PQ1/ PQM

PQ1/ PQM

E1/T1

+3.3 V

Power supply module

Fuse

+3.3 V

Power

Interface Module The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PD1 or PQM board. When the TPS protection is performed, the switch matrix module transmits the signals to the protection board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.3.4 Front Panel On the front panel of the D12S, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-6 shows the appearance of the front panel of the D12S.

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Figure 8-6 Front panel of the D12S D12S

1～8 9～16 17～24 25～32

D12S

Interfaces There are four DB44 interfaces on the front panel of the D12S. Table 8-5 lists the type and usage of the optical interfaces. Table 8-5 Interfaces on the front panel of the D12S Interface

Interface Type

Usage

1–8

DB44

Receive eight channels (1–8) of E1/T1 signals.

9–16

DB44

Receive eight channels (9–16) of E1/T1 signals.

17–24

DB44

Receive eight channels (17–24) of E1/T1 signals.

25–32

DB44

Receive eight channels (25–32) of E1/T1 signals.

Table 8-6 lists the pins of the DB44 interfaces.

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Table 8-6 Pins of the DB44 interfaces of the D12S Front View 1

Pin

Usage

Pin

Usage

38

R1 to receive the first channel of signals.

34

R5 to receive the fifth channel of signals.

R2 to receive the second channel of signals.

33

R3 to receive the third channel of signals.

32

R4 to receive the fourth channel of signals.

31

T1 to transmit the first channel of signals.

11

T2 to transmit the second channel of signals.

10

T3 to transmit the third channel of signals.

9

T4 to transmit the fourth channel of signals.

8

23 37 22 36 21 44

35 20 15 30 14 29 13 28 12 27

19

18

17

16

26

25

24

7

R6 to receive the sixth channel of signals. R7 to receive the seventh channel of signals. R8 to receive the eighth channel of signals. T5 to transmit the fifth channel of signals. T6 to transmit the sixth channel of signals. T7 to transmit the seventh channel of signals. T8 to transmit the eighth channel of signals.

8.3.5 Valid Slots The D12S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12S can be used as the interface board for the PQ1 or PQM. Table 8-7 lists the valid slots for the PQ1/PQM and corresponding slots for the D12S. The D12S housed in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electrical signals. The D12S housed in the slot with a larger number accesses the last 31 (33–63) channels of E1/T1 electrical signals. Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN 1500B subrack

8-12

Valid Slot for the PQ1/PQM

Corresponding Slot for the D12S

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

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8.3.6 Technical Specifications The technical specifications of the D12S cover the board dimensions, weight and power consumption.

Mechanical Specifications The mechanical specifications of the D12S are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the D12S in the switching state is 9 W and that of the D12S in the normal state is 0 W.

8.4 L75S This section describes the L75S, a 16 x E1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.4.1 Version Description The functional version of the L75S is R1. 8.4.2 Function and Feature The L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be used with the PD1. 8.4.3 Working Principle and Signal Flow The L75S consists of the interface module, switch matrix module, and power supply module. 8.4.4 Front Panel On the front panel of the L75S, there are interfaces and barcode. 8.4.5 Valid Slots The L75S can be housed in any slots of 6–7 in the subrack. The L75S can be used as the interface board for the PD1. 8.4.6 Technical Specifications The technical specifications of the L75S cover the board dimensions, weight and power consumption.

8.4.1 Version Description The functional version of the L75S is R1.

8.4.2 Function and Feature The L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be used with the PD1. Issue 02 (2007-09-10)

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8.4.3 Working Principle and Signal Flow The L75S consists of the interface module, switch matrix module, and power supply module. Figure 8-7 shows the block diagram for the functions of the L75S. Figure 8-7 Block diagram for the functions of the L75S Backplane Crossconnect board E1

Swictch matrix module

Interface module

PD1

PD1

E1

+3.3 V

Power supply module

Fuse

+3.3 V

Power

Interface Module The interface module receives and transmits the E1 electrical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PD1 board. When the TPS protection is performed, the switch matrix module transmits the signals to the protection board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.4.4 Front Panel On the front panel of the L75S, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-8 shows the appearance of the front panel of the L75S.

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Figure 8-8 Front panel of the L75S

L75S

1-16

Interfaces On the front panel of the L75S, there are two 2mmHM connectors, which are used to access 16 x E1 electrical signals.

8.4.5 Valid Slots The L75S can be housed in any slots of 6–7 in the subrack. The L75S can be used as the interface board for the PD1. Table 8-8 lists the valid slots for the PD1 and corresponding slots for the L75S. The L75S housed in the slot with a smaller number accesses the first 16 (1–16) channels of E1 electrical signals. The L75S housed in the slot with a larger number accesses the last 16 (17–32) channels of E1 electrical signals. Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S Valid Slot for the PD1

Corresponding Slot for the L75S

Slot 12

Slots 6 and 7

8.4.6 Technical Specifications The technical specifications of the L75S cover the board dimensions, weight and power consumption.

Mechanical Specifications The mechanical specifications of the L75S are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.24

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Power Consumption In the normal temperature (25℃), the maximum power consumption of the L75S is 2.7 W.

8.5 D75S This section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.5.1 Version Description The functional version of the D75S board is N1. 8.5.2 Function and Feature The D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must be used with the PQ1 or PQM. 8.5.3 Working Principle and Signal Flow The D75S consists of the interface module, switch matrix module, and power supply module. 8.5.4 Front Panel On the front panel of the D75S, there are interfaces and barcode. 8.5.5 Valid Slots As the interface board for the PQ1 or PQM, the D75S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. 8.5.6 Technical Specifications The technical specifications of the D75S cover the board dimensions, weight and power consumption.

8.5.1 Version Description The functional version of the D75S board is N1.

8.5.2 Function and Feature The D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must be used with the PQ1 or PQM.

8.5.3 Working Principle and Signal Flow The D75S consists of the interface module, switch matrix module, and power supply module. Figure 8-9 shows the block diagram for the functions of the D75S.

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Figure 8-9 Block diagram for the functions of the D75S Backplane Crossconnect board E1/T1

Swictch matrix module

Interface module

PQ1/ PQM

PQ1/ PQM

E1/T1

+3.3 V

Power supply module

Fuse

+3.3 V

Power

Interface Module The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PQ1 or PQM board. When the TPS protection is performed, the switch matrix module transmits the signals to the protection board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.5.4 Front Panel On the front panel of the D75S, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-10 shows the appearance of the front panel of the D75S.

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Figure 8-10 Front panel of the D75S D75S

1～8 9～16 17～24 25 ～32

D75S

Interfaces There are four DB44 interfaces on the front panel of the D75S. Table 8-9 lists the type and usage of the DB44 interfaces. Table 8-9 Interfaces on the front panel of the D75S Interface

Interface Type

Usage

1–8

DB44

Receive eight channels (1–8) of E1/T1 signals.

9–16

DB44

Receive eight channels (9–16) of E1/T1 signals.

17–24

DB44

Receive eight channels (17–24) of E1/T1 signals.

25–32

DB44

Receive eight channels (25–32) of E1/T1 signals.

Table 8-10 lists the pins of the DB44 interface.

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Table 8-10 Pins of the DB44 interfaces of the D75S Front View 1

Pin

Usage

Pin

Usage

38

R1 to receive the first channel of signals.

34

R5 to receive the fifth channel of signals.

R2 to receive the second channel of signals.

33

R3 to receive the third channel of signals.

32

R4 to receive the fourth channel of signals.

31

T1 to transmit the first channel of signals.

11

T2 to transmit the second channel of signals.

10

T3 to transmit the third channel of signals.

9

T4 to transmit the fourth channel of signals.

8

23 37 22 36 21 44

35 20 15 30 14 29 13 28 12 27

19

18

17

16

26

25

24

7

R6 to receive the sixth channel of signals. R7 to receive the seventh channel of signals. R8 to receive the eighth channel of signals. T5 to transmit the fifth channel of signals. T6 to transmit the sixth channel of signals. T7 to transmit the seventh channel of signals. T8 to transmit the eighth channel of signals.

8.5.5 Valid Slots As the interface board for the PQ1 or PQM, the D75S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. Table 8-11 lists the valid slots for the PQ1/PQM and corresponding slots for the D75S. The D75S housed in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electrical signals. The D75S housed in the slot with a larger number accesses the last 31 (33– 63) channels of E1/T1 electrical signals. Table 8-11 Valid slots for the PQ1/PQM and corresponding slots for the D75S in the OptiX OSN 1500B subrack

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Valid Slot for the PQ1/PQM

Corresponding Slot for the D75S

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

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8.5.6 Technical Specifications The technical specifications of the D75S cover the board dimensions, weight and power consumption.

Mechanical Specifications The mechanical specifications of the D75S are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the D75S in the switching state is 6 W and that of the D75S in the normal state is 0 W.

8.6 D34S This section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.6.1 Version Description The functional version of the D34S board is N1. 8.6.2 Function and Feature The D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must be used with the PD3. 8.6.3 Working Principle and Signal Flow The D34S consists of the interface module, switch matrix module, and power supply module. 8.6.4 Front Panel On the front panel of the D34S, there are interfaces and barcode. 8.6.5 Valid Slots As the interface board for the PD3, the D34S can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.6.6 Technical Specifications The technical specifications of the D34S cover the electrical interface specifications, board dimensions, weight and power consumption.

8.6.1 Version Description The functional version of the D34S board is N1.

8.6.2 Function and Feature The D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must be used with the PD3. 8-20

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8.6.3 Working Principle and Signal Flow The D34S consists of the interface module, switch matrix module, and power supply module. Figure 8-11 shows the block diagram for the functions of the D34S. Figure 8-11 Block diagram for the functions of the D34S Backplane Crossconnect board E3/T3 Swictch matrix module

Interface module E3/T3

+3.3 V

Power supply module

Fuse

PD3 TSB8 TSB8 PD3

+3.3 V Power

Interface Module The interface module receives and transmits the E3/T3 electrical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PD3 board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.6.4 Front Panel On the front panel of the D34S, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-12 shows the appearance of the front panel of the D34S.

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Figure 8-12 Front panel of the D34S D34S

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6

D34S

Interfaces There are six pairs of electrical interfaces on the front panel of the D34S. Table 8-12 lists the type and usage of interfaces on the D34S. Table 8-12 Interfaces of the D34S Interface

Interface Type

Usage

IN1–IN6

SMB

Receive six channels (1–6) of E3/T3 electrical signals.

OUT1–OUT6

SMB

Transmit six channels (1–6) of E3/T3 electrical signals.

8.6.5 Valid Slots As the interface board for the PD3, the D34S can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-13 lists the valid slots for the PD3 and corresponding slots for the D34S.

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Table 8-13 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack Valid Slot for the PD3

Corresponding Slot for the D34S

Slot 12

Slot 14

Slot 13

Slot 16

8.6.6 Technical Specifications The technical specifications of the D34S cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications Table 8-14 lists the specifications of the electrical interfaces of the D34S. Table 8-14 Specifications of the electrical interfaces of the D34S Item

Specification

Interface type

34368 kbit/s and 44736k bit/s

Code

HDB3 (E3) and B3ZS (T3)

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency deviation Allowed input attenuation Input jitter tolerance

Mechanical Specifications The mechanical specifications of the D34S are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the D34S in the switching state is 2 W and that of the D34S in the normal state is 0 W.

8.7 C34S This section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.7.1 Version Description Issue 02 (2007-09-10)

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The functional version of the C34S board is N1. 8.7.2 Function and Feature The C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must be used with the PL3. 8.7.3 Working Principle and Signal Flow The C34S consists of the interface module, switch matrix module, and power supply module. 8.7.4 Front Panel On the front panel of the C34S, there are interfaces and barcode. 8.7.5 Valid Slots As the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.7.6 Technical Specifications The technical specifications of the C34S cover the electrical interface specifications, board dimensions, weight and power consumption.

8.7.1 Version Description The functional version of the C34S board is N1.

8.7.2 Function and Feature The C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must be used with the PL3.

8.7.3 Working Principle and Signal Flow The C34S consists of the interface module, switch matrix module, and power supply module. Figure 8-13 shows the block diagram for the functions of the C34S. Figure 8-13 Block diagram for the functions of the C34S Backplane Crossconnect board E3/T3

Interface module

Swictch matrix module

E3/T3

+3.3 V

Power supply module

Power supply module

Fuse

PL3 TSB8 TSB8 PL3

-48 V/-60 V -48 V/-60 V

Fuse

+3.3 V backeup power

Interface Module The interface module receives and transmits the E3/T3 electrical signals. 8-24

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Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PL3 board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.7.4 Front Panel On the front panel of the C34S, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-14 shows the appearance of the front panel of the C34S. Figure 8-14 Front panel of the C34S C34S

OUT1 IN1 OUT2 IN2 OUT3 IN3

C34S

Interfaces There are three pairs of electrical interfaces on the front panel of the C34S. Issue 02 (2007-09-10)

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Table 8-15 lists the type and usage of interfaces on the C34S. Table 8-15 Interfaces of the C34S Interface

Interface Type

Usage

IN1–IN3

SMB

Receive the first three channels (1–3) of E3/T3 electrical signals.

OUT1–OUT3

SMB

Transmit the first three channels (1–3) of E3/T3 electrical signals.

8.7.5 Valid Slots As the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-16 lists the valid slots for the PL3 and corresponding slots for the C34S. Table 8-16 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack Valid Slot for the PL3

Corresponding Slot for the C34S

Slot 12

Slot 14

Slot 13

Slot 16

8.7.6 Technical Specifications The technical specifications of the C34S cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications Table 8-17 lists the specifications of the electrical interfaces of the C34S. Table 8-17 Specifications of the electrical interfaces of the C34S Item

Specification

Interface type

34368 kbit/s and 44736 kbit/s

Code

HDB3 (E3) and B3ZS (T3)

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency deviation Allowed input attenuation Input jitter tolerance 8-26

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Mechanical Specifications The mechanical specifications of the C34S are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.3

Power Consumption In the normal temperature (25℃), the maximum power consumption of the C34S in the switching state is 2 W and that of the C34S in the normal state is 0 W.

8.8 EU04 This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version, function, working principle, front panel and specifications. 8.8.1 Version Description The functional version of the EU04 board is N1. 8.8.2 Function and Feature The EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must be used with the SEP. 8.8.3 Working Principle and Signal Flow The EU04 consists of the interface module, switch matrix module, and power supply module. 8.8.4 Front Panel On the front panel of the EU04, there are interfaces and barcode. 8.8.5 Valid Slots As the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.8.6 Technical Specifications The technical specifications of the EU04 cover the electrical interface specifications, board dimensions, weight and power consumption.

8.8.1 Version Description The functional version of the EU04 board is N1.

8.8.2 Function and Feature The EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must be used with the SEP.

8.8.3 Working Principle and Signal Flow The EU04 consists of the interface module, switch matrix module, and power supply module. Figure 8-15 shows the block diagram for the functions of the EU04 when it processes 1 x STM-1 signals. Issue 02 (2007-09-10)

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Figure 8-15 Block diagram for the functions of the EU04 Backplane Crossconnect board

STM-1(e)

Interface module STM-1(e)

Swictch matrix module

SEP TSB8 TSB8 SEP

+3.3 V

Power supply module

Power supply module

Fuse

-48 V/-60 V -48 V/-60 V

Fuse

+3.3 V backeup power

Interface Module The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the SEP board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.8.4 Front Panel On the front panel of the EU04, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-16 shows the appearance of the front panel of the EU04.

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Figure 8-16 Front panel of the EU04 EU04

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 EU04

Interfaces There are four pairs of electrical interfaces on the front panel of the EU04. Table 8-18 lists the type and usage of interfaces on the EU04. Table 8-18 Interfaces of the EU04 Interface

Interface Type

Usage

IN1–IN4

SMB

Receive four (1–4) channels of electrical interfaces.

OUT1–OUT4

SMB

Transmit four (1–4) channels of electrical interfaces.

8.8.5 Valid Slots As the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-19 lists the valid slots for the SEP and corresponding slots for the EU04.

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Table 8-19 Valid slots for the SEP and corresponding slots for the EU04 Valid Slot for the SEP

Corresponding Slot for the EU04

Slot 12

Slot 14

Slot 13

Slot 16

8.8.6 Technical Specifications The technical specifications of the EU04 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications Table 8-20 lists the specifications of the electrical interfaces of the EU04. Table 8-20 Specifications of the electrical interfaces of the EU04 Item

Specification

Interface Type

155520 kbit/s

Code

CMI

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency deviation Allowed input attenuation

Mechanical Specifications The mechanical specifications of the EU04 are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EU04 is 6 W.

8.9 EU08 This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version, function, working principle, front panel and specifications. 8.9.1 Version Description The functional version of the EU08 board is N1. 8.9.2 Function and Feature 8-30

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The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must be used with the SEP. 8.9.3 Working Principle and Signal Flow The EU08 consists of the interface module, switch matrix module, and power supply module. 8.9.4 Front Panel On the front panel of the EU08, there are interfaces and barcode. 8.9.5 Valid Slots As the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.9.6 Technical Specifications The technical specifications of the EU08 cover the electrical interface specifications, board dimensions, weight and power consumption.

8.9.1 Version Description The functional version of the EU08 board is N1.

8.9.2 Function and Feature The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must be used with the SEP.

8.9.3 Working Principle and Signal Flow The EU08 consists of the interface module, switch matrix module, and power supply module. Figure 8-17 shows the block diagram for the functions of the EU08. Figure 8-17 Block diagram for the functions of the EU08 Backplane Crossconnect board

STM-1(e)

Interface module STM-1(e)

Swictch matrix module

SEP TSB8 TSB8 SEP

+3.3 V

Power supply module

Fuse

+3.3 V backeup power

Interface Module The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals Issue 02 (2007-09-10)

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from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the SEP board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.9.4 Front Panel On the front panel of the EU08, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-18 shows the appearance of the front panel of the EU08. Figure 8-18 Front panel of the EU08 EU08

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8 EU08

Interfaces There are eight pairs of electrical interfaces on the front panel of the EU08. 8-32

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Table 8-21 lists the type and usage of interfaces on the EU08. Table 8-21 Interfaces of the EU08 Interface

Interface Type

Usage

IN1–IN8

SMB

Receive eight (1–8) channels of electrical interfaces.

OUT1–OUT8

SMB

Transmit eight (1–8) channels of electrical interfaces.

8.9.5 Valid Slots As the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-22 lists the valid slots for the SEP and corresponding slots for the EU08 in the OptiX OSN 1500B. NOTE

The OptiX OSN 1500A does not support the EU08 board.

Table 8-22 Valid slots for the SEP and corresponding slots for the EU08 Valid Slot for the SEP

Corresponding Slot for the EU08

Slot 12

Slot 14

Slot 13

Slot 16

8.9.6 Technical Specifications The technical specifications of the EU08 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications Table 8-23 lists the specifications of the electrical interfaces of the EU08. Table 8-23 Specifications of the electrical interfaces of the EU08 Item

Specification

Interface type

155520 kbit/s

Code

CMI

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency deviation Allowed input attenuation Input jitter tolerance Issue 02 (2007-09-10)

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Mechanical Specifications The mechanical specifications of the EU08 are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EU08 is 11 W.

8.10 OU08 This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 8.10.1 Version Description The OU08 has two versions, N1 and N2. The main difference between the two versions lies in the connector type for optical interfaces and the pluggability of the optical modules. 8.10.2 Function and Feature The OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must be used with the SEP. 8.10.3 Working Principle and Signal Flow The OU08 consists of the interface module and power supply module. 8.10.4 Front Panel On the front panel of the OU08, there are interfaces and barcode. 8.10.5 Valid Slots As the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.10.6 Technical Specifications The technical specifications of the OU08 cover the optical interface specifications, board dimensions, weight and power consumption.

8.10.1 Version Description The OU08 has two versions, N1 and N2. The main difference between the two versions lies in the connector type for optical interfaces and the pluggability of the optical modules. Table 8-24 lists the details on the two versions of the OU08 board. Table 8-24 Version description of the OU08

8-34

Item

Specification

Functional version

The OU08 has two versions, N1 and N2.

Commonness

The N1 and N2 versions share the same working principle.

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Item

Specification

Difference

The optical interface of the N1OU08 uses the LC connector. The optical interface of the N2OU08 uses the SC connector. The N1OU08 uses the pluggable optical module. The N2OU08 does not use the pluggable optical module.

Replaceability

None.

8.10.2 Function and Feature The OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must be used with the SEP.

8.10.3 Working Principle and Signal Flow The OU08 consists of the interface module and power supply module. Figure 8-19 shows the block diagram for the functions of the OU08. Figure 8-19 Block diagram for the functions of the OU08 Backplane

STM-1(o)

SEP Interface module

STM-1(o)

SEP

+3.3 V

Power supply module

Fuse

+3.3 V Power

Interface Module In the receive direction, the interface module performs O/E convertion for the STM-1 signals, and transmits the signals to the SEP board. In the transmit direction, the interface module performs the E/O convertion for the STM-1 signals, and transmits the signals to the optical interface.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.10.4 Front Panel On the front panel of the OU08, there are interfaces and barcode. Issue 02 (2007-09-10)

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Appearance of the Front Panel Figure 8-20 and Figure 8-21 show the appearance of the front panels of the N1OU08 and N2OU08 respectively. Figure 8-20 Front panel of the N1OU08 OU08

OUT1IN1OUT2 IN2 OUT3IN3 OUT4 IN4OUT5IN5 OUT6IN6 OUT7IN7OUT8 IN8 OU08

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Figure 8-21 Front panel of the N2OU08

OU08

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 OUT8 IN7 IN8 OU08

Interfaces There are eight pairs of optical interfaces on each front panel of the N1OU08 and N2OU08. Table 8-25 lists the interface type and usage for the N1OU08. Table 8-26 lists the interface type and usage for the N2OU08. Table 8-25 Interfaces of the N1OU08

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Interface

Interface Type

Usage

IN1–IN8

LC

Receive eight (1–8) channels of STM-1 optical signals.

OUT1–OUT8

LC

Transmit eight (1–8) channels of STM-1 optical signals.

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Table 8-26 Interfaces of the N2OU08 Interface

Interface Type

Usage

IN1–IN8

SC

Receive eight (1–8) channels of STM-1 optical signals.

OUT1–OUT8

SC

Transmit eight (1–8) channels of STM-1 optical signals.

8.10.5 Valid Slots As the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-27 lists the valid slots for the SEP and corresponding slots for the OU08. Table 8-27 Valid slots for the SEP and corresponding slots for the OU08 Valid Slot for the SEP

Corresponding Slot for the OU08

Slot 12

Slot 14

Slot 13

Slot 16

8.10.6 Technical Specifications The technical specifications of the OU08 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 8-28 lists the specifications of the optical interfaces of the OU08. Table 8-28 Specifications of the optical interfaces of the OU08

8-38

Item

Specification

Nominal bit rate

155520 kbit/s

Line code

NRZ

Optical interface type

S-1.1

Working wavelength (nm)

N1OU08 (1260–1360)

Optical source type

MLM

Mean launched optical power (dBm)

–15 to –8

Receiver sensitivity (dBm)

–28

N2OU08 (1261–1360)

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Mechanical Specifications The mechanical specifications of the OU08 are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the OU08 is 6 W.

8.11 MU04 This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of the version, function, principle, front panel and specifications. 8.11.1 Version Description The functional version of the MU04 board is N1. 8.11.2 Function and Feature The MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 must be used with the SPQ4. 8.11.3 Working Principle and Signal Flow The MU04 consists of the interface module, switch matrix module, and power supply module. 8.11.4 Front Panel On the front panel of the MU04, there are interfaces and barcode. 8.11.5 Valid Slots As the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.11.6 Technical Specifications The technical specifications of the MU04 cover the optical interface specifications, board dimensions, weight and power consumption.

8.11.1 Version Description The functional version of the MU04 board is N1.

8.11.2 Function and Feature The MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 must be used with the SPQ4.

8.11.3 Working Principle and Signal Flow The MU04 consists of the interface module, switch matrix module, and power supply module. Figure 8-22 shows the block diagram for the functions of the MU04.

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Figure 8-22 Block diagram for the functions of the MU04 Backplane Crossconnect board

E4/STM-1(e)

Interface module E4/STM-1(e)

+3.3 V

Swictch matrix module

Power supply module

Fuse

SPQ4 TSB8 TSB8 SPQ4 +3.3 V backeup power

Interface Module The interface module receives and transmits the E4/STM-1 electrical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the SPQ4 board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.11.4 Front Panel On the front panel of the MU04, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-23 shows the appearance of the front panel of the MU04.

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Figure 8-23 Front panel of the MU04 MU04

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

MU04

Interfaces There are four pairs of electrical interfaces on the front panel of the MU04. Table 8-29 lists the type and usage of interfaces on the MU04. Table 8-29 Interfaces of the MU04 Interface

Interface Type

Usage

IN1–IN4

SMB

Receive four (1–4) channels of E4/STM-1 electrical interfaces.

OUT1–OUT4

SMB

Transmit four (1–4) channels of E4/STM-1 electrical interfaces.

8.11.5 Valid Slots As the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-30 lists the valid slots for the SPQ4 and corresponding slots for the MU04.

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Table 8-30 Valid slots for the SPQ4 and corresponding slots for the MU04 Valid Slot for the SPQ4

Corresponding Slot for the MU04

Slot 12

Slot 14

Slot 13

Slot 16

8.11.6 Technical Specifications The technical specifications of the MU04 cover the optical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications Table 8-31 lists the specifications of the electrical interfaces of the MU04. Table 8-31 Specifications of the electrical interfaces of the MU04 Item

Specification

Interface Type

139264 kbit/s and 155520 kbit/s

Code

CMI

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency deviation Allowed input attenuation

Mechanical Specifications The mechanical specifications of the MU04 are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the MU04 is 2 W.

8.12 TSB8 This section describes the TSB8, an 8-channel optical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.12.1 Version Description The functional version of the TSB8 board is N1. 8.12.2 Function and Feature The TSB8, an eight-channel electrical interface switching board, is used to provide the TPS protection. 8-42

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8.12.3 Working Principle and Signal Flow The TSB8 consists of the switch matrix module and power supply module. 8.12.4 Front Panel On the front panel of the TSB8, there is the barcode. 8.12.5 Valid Slots When used with different processing boards and interface boards to realize the TPS protection, the TSB8 can be housed in different slots. The OptiX OSN 1500A does not support the TSB8. 8.12.6 Technical Specifications The technical specifications of the TSB8 cover the board dimensions, weight and power consumption.

8.12.1 Version Description The functional version of the TSB8 board is N1.

8.12.2 Function and Feature The TSB8, an eight-channel electrical interface switching board, is used to provide the TPS protection. l

When used with the MU04, the TSB8 provides the TPS protection for the SPQ4.

l

When used with the C34S, the TSB8 provides the TPS protection for the PL3.

l

When used with the D34S, the TSB8 provides the TPS protection for the PD3.

l

When used with the EU04, the TSB8 provides the TPS protection for the SEP1.

l

When used with the EU08, the TSB8 provides the TPS protection for the SLH1/SEP1.

l

When used with the ETS8, the TSB8 provides the TPS protection for the EFS0.

8.12.3 Working Principle and Signal Flow The TSB8 consists of the switch matrix module and power supply module. Figure 8-24 shows the block diagram for the functions of the TSB8 when it processes onechannel signals. Figure 8-24 Block diagram for the functions of the TSB8 Backplane

Backplane Crossconnect board

Interface board 1 Interface board 2 Interface board 3

Standby processing board Swictch matrix module +3.3 V

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Power module

Fuse

+3.3 V Power

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Switch Matrix Module In the receive direction, the switch matrix module selects signals from one of the three interface boards according to the TPS protection control signals from the cross-connect board, and outputs the signals to the backup processing board. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.12.4 Front Panel On the front panel of the TSB8, there is the barcode.

Appearance of the Front Panel Figure 8-25 shows the appearance of the front panel of the TSB8. Figure 8-25 Front panel of the TSB8 TSB8

TSB8

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8.12.5 Valid Slots When used with different processing boards and interface boards to realize the TPS protection, the TSB8 can be housed in different slots. The OptiX OSN 1500A does not support the TSB8. Table 8-32 lists the valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04. Table 8-32 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04 Valid Slot for the TSB8

Valid Slot for the SPQ4

Corresponding Slot for the MU04

Slot 14

Slot 13

Slot 16

Table 8-33 lists the valid slots for the TSB8 and corresponding slots for the PD3 and D34S. Table 8-33 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S Valid Slot for the TSB8

Valid Slot for the PD3

Corresponding Slot for the D34S

Slot 14

Slot 13

Slot 16

Table 8-34 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU04. Table 8-34 Valid slots for the TSB8 and corresponding slots for the SEP and EU04 Valid Slot for the TSB8

Valid Slot for the SEP

Corresponding Slot for the EU04

Slot 14

Slot 13

Slot 16

Table 8-35 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU08. Table 8-35 Valid slots for the TSB8 and corresponding slots for the SEP and EU08 Valid Slot for the TSB8

Valid Slot for the SEP

Corresponding Slot for the EU08

Slot 14

Slot 13

Slot 16

NOTE

On the T2000, the SEP is displayed as the SEP or SEP1. When interfaces are available on the front panel of the SEP, the SEP is displayed as the SEP1 on the T2000. When the SEP is used with the interface board to realize the TPS protection, the SEP is displayed as the SEP on the T2000.

Table 8-36 lists the valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.

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Table 8-36 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8 Valid Slot for the TSB8

Valid Slot for the EFS0

Corresponding Slot for the ETS8

Slot 14

Slot 13

Slot 16

Table 8-37 lists the valid slots for the TSB8 and corresponding slots for the PL3 and C34S. Table 8-37 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S Valid Slot for the TSB8

Valid Slot for the PL3

Corresponding Slot for the C34S

Slot 14

Slot 13

Slot 16

8.12.6 Technical Specifications The technical specifications of the TSB8 cover the board dimensions, weight and power consumption.

Mechanical Specifications The mechanical specifications of the TSB8 are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.3

Power Consumption In the normal temperature (25℃), the maximum power consumption of the TSB8 in the switching state is 5 W and that of the TSB8 in the normal state is 0 W.

8.13 EFF8 This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of the version, function, principle, front panel and specifications. 8.13.1 Version Description The functional version of the EFF8 board is N1. 8.13.2 Function and Feature The EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 must be used with the Ethernet processing board. 8.13.3 Working Principle and Signal Flow The EFF8 consists of the interface module, switch matrix module, and power supply module. 8.13.4 Front Panel On the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety class label. 8.13.5 Valid Slots 8-46

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When used with different Ethernet processing boards, the EFF8 can be housed in different slots. 8.13.6 Technical Specifications The technical specifications of the EFF8 cover the optical interface specifications, board dimensions, weight and power consumption.

8.13.1 Version Description The functional version of the EFF8 board is N1.

8.13.2 Function and Feature The EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 must be used with the Ethernet processing board.

8.13.3 Working Principle and Signal Flow The EFF8 consists of the interface module, switch matrix module, and power supply module. Figure 8-26 shows the block diagram for the functions of the EFF8 when it processes 1 x 100M Ethernet signals. Figure 8-26 Block diagram for the functions of the EFF8 Backplane

EFT8/ EFS0/EMS4/EMR0

100M

Interface module EFT8/EFS0/EMS4/EMR0

100M

+3.3 V

Power module

Fuse

+3.3 V Backup Power

Interface Module In the receive direction, the interface module performs the O/E convertion for the Ethernet signals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board. In the transmit direction, the interface module performs the E/O convertion for the Ethernet signals, and transmits the signals to the optical interface.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

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8.13.4 Front Panel On the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 8-27 shows the appearance of the front panel of the EFF8. Figure 8-27 Front panel of the EFF8

EFF8

1 2 3 4 5 6 7 8 LINKACT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8 CLASS 1 LASER PRODUCT

EFF8

Indicators For indication of indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are eight pairs of optical interfaces on the front panel of the EFF8. Table 8-38 lists the type and usage of interfaces on the EFF8.

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Table 8-38 Interfaces of the EFF8 Interface

Interface Type

Usage

IN1–IN8

LC

Receives eight (1–8) channels of Ethernet optical signals.

OUT1 – OUT8

LC

Transmits eight (1–8) channels of Ethernet optical signals.

8.13.5 Valid Slots When used with different Ethernet processing boards, the EFF8 can be housed in different slots. The slots valid for the EFF8 are as follows: l

As the interface board for the EFT8, the EFF8 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.

l

As the interface board for the EFS0, the EFF8 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.

l

As the interface board for the EMS4, the EFF8 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.

l

As the interface board for the EMR0, the EFF8 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.

Table 8-39 lists the valid slots for the EFT8 and corresponding slots for the EFF8. Table 8-39 Valid slots for the EFT8 and corresponding slots for the EFF8 Valid Slot for the EFT8

Corresponding Slot for the EFF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-40 lists the valid slots for the EFS0 and corresponding slots for the EFF8. Table 8-40 Valid slots for the EFS0 and corresponding slots for the EFF8 Valid Slot for the EFS0

Corresponding Slot for the EFF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-41 lists the valid slots for the EMS4 and corresponding slots for the EFF8. Table 8-41 Valid slots for the EMS4 and corresponding slots for the EFF8

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Corresponding Slot for the EFF8

Slot 12

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Valid Slot for the EMS4

Corresponding Slot for the EFF8

Slot 13

Slots 16 and 17

Table 8-42 lists the valid slots for the EMR0 and corresponding slots for the EFF8. Table 8-42 Valid slots for the EMR0 and corresponding slots for the EFF8 Valid Slot for the EMR0

Corresponding Slot for the EFF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

8.13.6 Technical Specifications The technical specifications of the EFF8 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 8-43 lists the specifications of the optical interfaces of the EFF8. Table 8-43 Specifications of the optical interfaces of the EFF8 Item

Specification

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code

Manchester encoding signal (10M) or MLT-3 encoding signal (100M)

Optical interface type

100Base-FX

Working wavelength (nm)

100Base-FX (15 km): 1261 to 1360

Optical source type

MLM

Mean launched optical power (dBm)

100Base-FX (15 km): –15 to –8

Receiver sensitivity (dBm)

100Base-FX (15 km): –28

Min. overload (dBm)

100Base-FX (15 km): –7

100Base-FX (2 km): 1270 to 1380

100Base-FX (2 km): –19 to –14

100Base-FX (2 km): –30

100Base-FX (2 km): –14 Min. extinction ratio (dB)

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Mechanical Specifications The mechanical specifications of the EFF8 are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EFF8 is 6 W.

8.14 ETF8 This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms of the version, function, principle, front panel and specifications. 8.14.1 Version Description The functional version of the ETF8 board is N1. 8.14.2 Function and Feature The ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8 must be used with the Ethernet processing board. 8.14.3 Working Principle and Signal Flow The ETF8 consists of the interface module, switch matrix module, and power supply module. 8.14.4 Front Panel On the front panel of the ETF8, there are interfaces and barcode. 8.14.5 Valid Slots When used with different Ethernet processing boards, the ETF8 can be housed in different slots. 8.14.6 Technical Specifications The technical specifications of the ETF8 cover the electrical interface specifications, board dimensions, weight and power consumption.

8.14.1 Version Description The functional version of the ETF8 board is N1.

8.14.2 Function and Feature The ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8 must be used with the Ethernet processing board.

8.14.3 Working Principle and Signal Flow The ETF8 consists of the interface module, switch matrix module, and power supply module. Figure 8-28 shows the block diagram for the functions of the ETF8 when it processes 1 x 100M Ethernet signals.

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Figure 8-28 Block diagram for the functions of the ETF8 Backplane

EFT8/ EFS0/EMS4/EMR0

100M

Interface module EFT8/EFS0/EMS4/EMR0

100M

+3.3 V

Power module

Fuse

+3.3 V Power

Interface Module In the receive direction, the interface module performs the O/E convertion for the Ethernet signals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board. In the transmit direction, the interface module performs the E/O convertion for the Ethernet signals, and transmits the signals to the optical interface.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.14.4 Front Panel On the front panel of the ETF8, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-29 shows the appearance of the front panel of the ETF8.

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Figure 8-29 Front panel of the ETF8

ETF8

FE1 FE2 FE3 FE4 FE5 FE6 FE7 FE8 ETF8

Interfaces There are eight electrical interfaces on the front panel of the ETF8. Table 8-44 lists the type and usage of interfaces on the ETF8. Table 8-44 Interfaces of the ETF8 Interface

Interface Type

Usage

FE1–FE8

RJ-45

Receive eight (1–8) channels of Ethernet electrical signals.

Table 8-45 lists the pins of the RJ-45 connector of the ETF8.

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Table 8-45 Pins of the RJ-45 connector of the ETF8 Front View

8 7

6 5

4

3 2

1

Pin

Specification

1

Transmitting positive

2

Transmitting negative

3

Receiving positive

4

Grounding

5

Grounding

6

Receiving negative

7

Grounding

8

Grounding

8.14.5 Valid Slots When used with different Ethernet processing boards, the ETF8 can be housed in different slots. The slots valid for the ETF8 are as follows: l

As the interface board for the EFT8, the ETF8 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.

l

As the interface board for the EFS0, the ETF8 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.

l

As the interface board for the EMS4, the ETF8 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.

l

As the interface board for the EMR0, the ETF8 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.

Table 8-46 lists the valid slots for the EFT8 and corresponding slots for the ETF8. Table 8-46 Valid slots for the EFT8 and corresponding slots for the ETF8 Valid Slot for the EFT8

Corresponding Slot for the ETF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-47 lists the valid slots for the EFS0 and corresponding slots for the ETF8.

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Table 8-47 Valid slots for the EFS0 and corresponding slots for the ETF8 Valid Slot for the EFS0

Corresponding Slot for the ETF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-48 lists the valid slots for the EMS4 and corresponding slots for the ETF8. Table 8-48 Valid slots for the EMS4 and corresponding slots for the ETF8 Valid Slot for the EMS4

Corresponding Slot for the ETF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-49 lists the valid slots for the EMR0 and corresponding slots for the ETF8. Table 8-49 Valid slots for the EMR0 and corresponding slots for the ETF8 Valid Slot for the EMR0

Corresponding Slot for the ETF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

8.14.6 Technical Specifications The technical specifications of the ETF8 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications Table 8-50 lists the specifications of the electrical interfaces of the ETF8. Table 8-50 Specifications of the electrical interfaces of the ETF8 Item

Specification

Rate

10 Mbit/s or 100 Mbit/s

Code

Manchester encoding signal (10M) or MLT-3 encoding signal (100M)

Interface standard

Compliant with IEEE 802.3u

Mechanical Specifications The mechanical specifications of the ETF8 are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

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Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the ETF8 is 2 W.

8.15 ETS8 This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board, in terms of the version, function, principle, front panel and specifications. 8.15.1 Version Description The functional version of the ETS8 board is N1. 8.15.2 Function and Feature The ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, and the ETS8 must be used with the EFS0. 8.15.3 Working Principle and Signal Flow The ETS8 consists of the interface module, switch matrix module, and power supply module. 8.15.4 Front Panel On the front panel of the ETS8, there are interfaces and barcode. 8.15.5 Valid Slots As the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.15.6 Technical Specifications The technical specifications of the ETS8 cover the electrical interface specifications, board dimensions, weight and power consumption.

8.15.1 Version Description The functional version of the ETS8 board is N1.

8.15.2 Function and Feature The ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, and the ETS8 must be used with the EFS0.

8.15.3 Working Principle and Signal Flow The ETS8 consists of the interface module, switch matrix module, and power supply module. Figure 8-30 shows the block diagram for the functions of the ETS8 when it processes 1 x 100M Ethernet signals.

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Figure 8-30 Block diagram for the functions of the ETS8 Backplane Crossconnect board

100M

Swictch matrix module

Interface module 100M

+3.3 V

Power supply module

Fuse

EFS0 TSB8 TSB8 EFS0 +3.3 V backeup power

Interface Module The interface module receives and transmits the Ethernet optical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the EFS0 board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.15.4 Front Panel On the front panel of the ETS8, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-31 shows the appearance of the front panel of the ETS8.

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Figure 8-31 Front panel of the ETS8

ETS8

FE1 FE2 FE3 FE4 FE5 FE6 FE7 FE8 ETS8

Interfaces There are eight electrical interfaces on the front panel of the ETS8. Table 8-51 lists the type and usage of interfaces on the ETS8. Table 8-51 Interfaces of the ETS8 Interface

Interface Type

Usage

FE1–FE8

RJ-45

Receive eight (1–8) channels of Ethernet electrical signals.

Table 8-52 lists the pins of the RJ-45 connector of the ETS8.

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Table 8-52 Pins of the RJ-45 connector of the ETS8 Front View

8 7

6 5

4

3 2

1

Pin

Specification

1

Transmitting positive

2

Transmitting negative

3

Receiving positive

4

Grounding

5

Grounding

6

Receiving negative

7

Grounding

8

Grounding

8.15.5 Valid Slots As the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-53 lists the valid slots for the EFS0 and corresponding slots for the ETS8. Table 8-53 Valid slots for the EFS0 and corresponding slots for the ETS8 Valid Slot for the EFS0

Corresponding Slot for the ETS8

Slot 12

Slot 14

Slot 13

Slot 16

8.15.6 Technical Specifications The technical specifications of the ETS8 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications Table 8-54 lists the specifications of the electrical interfaces of the ETS8. Table 8-54 Specifications of the electrical interfaces of the ETS8

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Item

Specification

Rate

10 Mbit/s or 100 Mbit/s

Code

Manchester encoding signal (10M) or MLT-3 encoding signal (100M)

Interface standard

Compliant with IEEE 802.3u Huawei Technologies Proprietary

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Mechanical Specifications The mechanical specifications of the ETS8 are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 0.37

Power Consumption In the normal temperature (25℃), the maximum power consumption of the ETS8 in the switching state is 3 W and that of the ETS8 in the normal state is 0 W.

8.16 DM12 This section describes the DM12, a DDN interface board, in terms of the version, function, principle, front panel and specifications. 8.16.1 Version Description The functional version of the DM12 board is N1. 8.16.2 Function and Feature The DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1 electrical signals, and the DM12 must be used with the DX1. 8.16.3 Working Principle and Signal Flow The DM12 consists of the interface module, switch matrix module, and power supply module. 8.16.4 Front Panel On the front panel of the DM12, there are interfaces and barcode. 8.16.5 Valid Slots As the interface board for the DX1, the DM12 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. 8.16.6 Technical Specifications The technical specifications of the DM12 cover the board dimensions, weight and power consumption.

8.16.1 Version Description The functional version of the DM12 board is N1.

8.16.2 Function and Feature The DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1 electrical signals, and the DM12 must be used with the DX1.

8.16.3 Working Principle and Signal Flow The DM12 consists of the interface module, switch matrix module, and power supply module. Figure 8-32 shows the block diagram for the functions of the DM12 when it processes one channel of N x 64 kbit/s or framed E1 electrical signals. 8-60

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Figure 8-32 Block diagram for the functions of the DM12 Backplane Crossconnect board

Nx64kbit/s / Frame E1

Nx64kbit/s / Frame E1

Swictch matrix module

Interface module

DX1

DX1

+3.3 V

Power supply module

Fuse

+3.3 V Power

Interface Module The interface module receives and transmits one channel of N x 64 kbit/s or framed E1 electrical signals.

Switch Matrix Module In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the DX1 board. When the TPS protection is performed, the switch matrix module transmits the signals to the DX1 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

8.16.4 Front Panel On the front panel of the DM12, there are interfaces and barcode.

Appearance of the Front Panel Figure 8-33 shows the appearance of the front panel of the DM12.

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Figure 8-33 Front panel of the DM12 DM12

E1(1-8) DDN1 DDN2 DDN3 DDN4 DM12

Interfaces On the front panel of the DM12, there are DB44 and DB28 interfaces. Table 8-55 lists the specifications of the interfaces. Table 8-55 Interfaces on the front panel of the DM12 Interface

Interface Type

Usage

E1 (1–8)

DB44

Access 8 x framed E1 signals.

DDN1–DDN4

DB28

Access four channels of N x 64 kbit/s signals.

Table 8-56 lists the pins of the DB44 interfaces.

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Table 8-56 Pins of the DB44 interfaces of the DM12 Front View 1

Pin

Specification

Pin

Specification

30

T1 to transmit the first channel of signals.

8

T8 to transmit the eighth channel of signals.

15 29 14 28 13 44

27 12 26 11 25 10 24 9 38 23 37 22

T2 to transmit the second channel of signals. T3 to transmit the third channel of signals. T4 to transmit the fourth channel of signals. T5 to transmit the fifth channel of signals. T6 to transmit the sixth channel of signals. T7 to transmit the seventh channel of signals. R1 to receive the first channel of signals.

7 36 21 35 20 34 19 33 18 32 17 31

R3 to receive the third channel of signals. R4 to receive the fourth channel of siganls. R5 to receive the fifth channel of signals. R6 to receive the sixth channel of signals. R7 to receive the seventh channel of signals.

16

R8 to receive the eighth channel of signals.

44–39, 6–1

Grounding

R2 to receive the second channel of signals.

Table 8-57 lists the pins of the DB28 interfaces.

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Table 8-57 Pins of the DB28 interfaces of the DM12 Front View 1

Pin

Specification

Pin

Specification

1

Transmits data signals.

19

Receives data signals.

Transmits the clock signals.

21

Grounds.

22

Loopbacks the control signals.

Detects the carrier.

23

Permits the transmission.

Requests for transmission.

25

Transmits the clock of the external equipment.

27

Receives the clock signals.

-

2 3 4 11 12 13

28

14 15 16 17 18

20

24

26

28

Prepares the terminating equipment. Prepares the terminal equipment.

-

8.16.5 Valid Slots As the interface board for the DX1, the DM12 can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. Table 8-58 lists the valid slots for the DX1 and corresponding slots for the DM12. The DM12 housed in the slot with a smaller number accesses the 8 x framed E1 signals and four channels of N x 64 kbit/s signals. The DM12 housed in the slot with a larger number accesses only four channels of N x 64 kbit/s signals. Table 8-58 Valid slots for the DX1 and corresponding slots for the DM12 Valid Slot for the DX1

Corresponding Slot for the DM12

Slot 12

Slots 1 and 2

Slot 13

Slots 3 and 4

8.16.6 Technical Specifications The technical specifications of the DM12 cover the board dimensions, weight and power consumption.

Mechanical Specifications The mechanical specifications of the DM12 are as follows: 8-64

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l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.5

Power Consumption In the normal temperature (25℃), the maximum power consumption of the DM12 in the switching state is 8 W and that of the DM12 in the normal state is 0 W.

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9 Cross-Connect and System Control Boards

Cross-Connect and System Control Boards

About This Chapter The chapter describes the integrated boards of the cross-connect, SCC and line units at different rates. 9.1 CXL1 This section describes the CXL1, an integrated board of the SCC, cross-connect and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.2 CXL4 This section describes the CXL4, an integrated board of the SCC, cross-connect and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.3 CXL16 This section describes the CXL16, an integrated board of the SCC, cross-connect and line units, in terms of the version, principle, function, principle, front panel and specifications.

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9.1 CXL1 This section describes the CXL1, an integrated board of the SCC, cross-connect and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.1.1 Version Description The functional version of the CXL1 is Q2. The Q1CXL1 is not manufactured any more. The OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL1. 9.1.2 Function and Feature The CXL1 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.1.3 Working Principle and Signal Flow The CXL1 consists of the SDH overhead processing module, RST, MST and so on. 9.1.4 Front Panel On the front panel of the CXL1, there are indicators, interfaces, barcode and laser safety class label. 9.1.5 Valid Slots The CXL1 can be housed in any of slots 4–5 in the subrack. 9.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXL1 indicates the optical interface type. 9.1.7 Board Configuration Reference The physical slot that houses the CXL1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL1. 9.1.8 Technical Specifications The technical specifications of the CXL1 cover the optical interface specifications, board dimensions, weight and power consumption.

9.1.1 Version Description The functional version of the CXL1 is Q2. The Q1CXL1 is not manufactured any more. The OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL1.

9.1.2 Function and Feature The CXL1 is used to process SDH signals, control communication, groom services, and to input and output the clock.

SDH Processing Unit Table 9-1 lists the function and feature of the SDH processing unit of the CXL1.

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Table 9-1 Function and feature of the SDH processing unit of the CXL1 Function and Feature

CXL1

Basic function

Transmits and receives 1 x STM-1 optical signals.

Specification of the optical interface

Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and Ve-1.2 types.

Specification of the optical module

l

Supports detection and query of the information on the optical module.

l

Supports the function of setting the on/off state of the laser and the ALS function.

Service processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing

l

Supports the processing of the SOH bytes of the STM-1 signals.

l

Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP.

Maintenance feature

l

Supports inloop and outloop for optical interfaces.

l

Supports the warm reset and cold reset. The warm reset does not affect services.

l

Supports the function of querying the manufacturing information of the board.

l

Supports the in-service loading of the FPGA.

l

Supports the upgrade of the board software without affecting services.

SCC Unit Table 9-2 lists the function and feature of the SCC unit of the CXL1. Table 9-2 Function and feature of the SCC unit of the CXL1

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Function and Feature

CXL1

Basic function

Configures and monitors services, monitors the service performance, and collects performance events and alarm information.

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Function and Feature

CXL1

Specification of the optical interface

l

Provides 10M/100M compatible Ethernet NMS interface.

l

Provides the F&f interface to manage the COA, and the F&f interface is present on the auxiliary interface board.

l

Provides one 10M/100M Ethernet interface, which is used for inter-board communication.

l

Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards.

l

Provides the RS232 OAM interface that is present on the auxiliary interface board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem.

DCC processing capability

Processes 40-channel DCC.

Fan alarm management

Manages fan alarms.

PIU management

Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU.

Protection scheme

Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit Table 9-3 lists the function and feature of the cross-connect unit of the CXL1. Table 9-3 Function and feature of the cross-connect unit of the CXL1 Function and Feature

CXL1

Basic function

Completes 20 Gbit/s non-blocking full cross-connection at the VC-4 level, and 20 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level.

Fast emergency channel

Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.

Service processing

l

Dynamically grooms services.

l

Adds or deletes services without interrupting services.

l

Supports the SNCP protection at the VC-3 and VC-12 levels.

l

Supports concatenation services at the VC-4-4c, VC-4-8c, and VC-4-16c levels.

Protection scheme

9-4

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

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Clock Unit Table 9-4 lists the function and feature of the clock unit of the CXL1. Table 9-4 Function and feature of the clock unit of the CXL1 Function and Feature

CXL1

Basic function

Provides standard system synchronization clock.

Other function

Supports the extraction, insertion and management of the SSM and clock ID.

Input and output

l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source.

l

Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.1.3 Working Principle and Signal Flow The CXL1 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-1 shows the block diagram for the functions of the CXL1.

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Figure 9-1 Block diagram for the functions of the CXL1 Time & synchronizaton (SETS)

38MHz OSC

T1 T2

SETG

T3 T4(Clock external output)

T0

Frame header T0 (reference clock)

155MHz PLL

Line units Tributary units PIU AUX

Service units Service units

155 MHz

STM-1

DEMUX

O/E

16x155 Mbit/s data

SDH overhead processing module

RST

MST

MSA

high speed bus

Cross-connect unit A

HPT

high speed bus

16x155 Mbit/s data

STM-1

MUX

K1/K2 insertion/ extration

Performance report

Laser shut down

O/E

K1/K2 bytes

XC Cross Connect (HPC) high speed bus SCC unit

K1/K2 bytes process

Another connect unit

XC Cross Connect (LPC)

DCC

Cross-connect unit B

high speed bus

Laser control

Another CXL unit

DCC

DCC process

Line unit

ETH channels comunication

Communication and control module

Master and slaver board comunication

ETH interface

Other unit Another CXL

AUX

OAM interface AUX F&f interface

FLASH

RAM

Power monitor

Boot ROM

Phone interface

NVRAM

+3.3 V +5V +1.6V +1.8V

EOW

S1-S4 interface

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

+1.2V

The function modules are described as follows:

Synchronous Timing Unit The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal: 9-6

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l

Timing signal (T1) from STM-N

l

Timing signal (T2) from PDH

l

Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs: l

T0, system clock (38 MHz)

l

T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module l

In receive direction, it converts the received optical signals into electrical signals.

l

In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time.

l

In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module It includes RST, MST, MSA and HPT, provides inloop and outloop function.

RST l

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

l

In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection.

l

In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion.

l

Provides extraction or insertion of K1 byte and K2 byte.

l

In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation.

MST

MSA

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HPT l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

Communication and Control Module l

Traces the clock signal from the active and the standby cross-connect unit.

l

Implements laser controlling function.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

l

CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on.

l

ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.

l

OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state.

l

F&f interface, which provides F&f interface to manage COA. This serial port multiplexes with the commissioning serial port and is the commissioning serial port in BIOS state.

l

COM interface for commissioning port

l

Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXL unit.

Cross-connect Module The cross-connect module consists of two parts: l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching

l

Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-2 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-2 Block diagram of higher and lower order cross-connect modules

high speed bus

high speed bus Input interface

Data

XC connection

Data

Ouput interface

Higher order connection

XC_TOP

TX_TOP

VC_DATA_ FIFO

RX_TOP

Lower order connection

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order services.

Other Functions l

Responses to and processes k bytes

l

Collects performance data of the optical module and shuts output of the optical module

l

Collects and processes DCC of each board

l

Inserts the DCC back into each line board after processing

l

Monitors the power supply of the board

l

Resets the unit

l

Cuts alarms

DC/DC Converter Module This module provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

9.1.4 Front Panel On the front panel of the CXL1, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 9-3 shows the front panel of the CXL1. Issue 02 (2007-09-10)

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Figure 9-3 Front panel of the CXL1 CXL1 STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC CLASS 1 LASER PRODUCT

OUT IN

RESET ALM CUT

CXL1

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit.

l

Active/standby state indicator for the SCC units (ACTC), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit.

l

Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit.

l

Synchronization clock state indicator (SYNC), which is red or green when lit.

l

Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces On the front panel of the CXL1, there are one optical interface and two switches. Table 9-5 lists the type and usage of the optical interface and switches on the CXL1.

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Table 9-5 Optical interface and switches on the CXL1 Interface

Interface Type

Usage

IN

LC

Receives optical signals. The pluggable optical module is used for easy maintenance.

OUT

LC

Transmits optical signals. The pluggable optical module is used for easy maintenance.

RESET

Warm reset switch

Press the switch to reset the SCC unit.

ALM CUT

Alarm cut switch

Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.1.5 Valid Slots The CXL1 can be housed in any of slots 4–5 in the subrack.

9.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXL1 indicates the optical interface type. Table 9-6 lists the relation between the board feature code and optical interface type for the CXL1. Table 9-6 Relation between the board feature code and the optical interface type Board Barcode

Feature Code

Optical Interface Type

SSQ2CXL110 or SSQ1CXL110

10

S-1.1 (LC)

SSQ2CXL111 or SSQ1CXL111

11

L-1.1 (LC)

SSQ2CXL112 or SSQ1CXL112

12

L-1.2 (LC)

SSQ2CXL113 or SSQ1CXL113

13

Ve-1.2 (LC)

SSQ2CXL114 or SSQ1CXL114

14

I-1 (LC)

9.1.7 Board Configuration Reference The physical slot that houses the CXL1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL1. Issue 02 (2007-09-10)

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Displayed Slot The CXL1 is housed in one slot in the subrack. The logical boards for the CXL1 are the Q1SL1, EXCL and GSCC. Table 9-7 lists the logical slots displayed on the T2000. Table 9-7 Logical slots displayed on the T2000 for the CXL1 Board

Logical Board

Logical Slot

CXL1

Q1SL1

Slots 4–5

ECXL

Slots 80–81

GSCC

Slots 82–83

Board Parameters l

J1 byte

l

C2 byte

l

Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.1.8 Technical Specifications The technical specifications of the CXL1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 9-8 lists the specifications of the optical interfaces of the CXL1. Table 9-8 Specifications of the optical interfaces of the CXL1

9-12

Item

Specification

Nominal bit rate

155520 kbit/s

Line code

NRZ

Optical interface type

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Working wavelength (nm)

1260 to 1360

1261 to 1360

1263 to 1360

1480 to 1580

1480 to 1580

Optical source type

MLM, LED

MLM

MLM, SLM

SLM

SLM

Mean launched optical power (dBm)

–15 to –8

–15 to –8

–5 to 0

–5 to 0

–3 to 0

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Item

Specification

Receiver sensitivity (dBm)

–23

–28

–34

–34

–34

Min. overload (dBm)

–8

–8

–10

–10

–10

Min. extinction ratio (dB)

8.2

8.2

10

10

10

Cross-Connect Capacity The cross-connect capacity of the CXL1 is as follows: l

Higher order cross-connect capacity: 20 Gbit/s

l

Lower order cross-connect capacity: 20 Gbit/s

l

Access capacity: 18.75 Gbit/s

Clock Access Capability The clock access capability of the CXL1 is described as follows: l

External input clock: two channels, 2048 kbit/s or 2048 kHz

l

External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the CXL1 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the CXL1 is 40 W.

9.2 CXL4 This section describes the CXL4, an integrated board of the SCC, cross-connect and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.2.1 Version Description The functional version of the CXL4 is Q2. The Q1CXL4 is not manufactured any more. The OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL4. Issue 02 (2007-09-10)

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9.2.2 Function and Feature The CXL4 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.2.3 Working Principle and Signal Flow The CXL4 consists of the SDH overhead processing module, RST, MST and so on. 9.2.4 Front Panel On the front panel of the CXL4, there are indicators, interfaces, barcode and laser safety class label. 9.2.5 Valid Slots The CXL4 can be housed in any of slots 4–5 in the subrack. 9.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXL4 indicates the optical interface type. 9.2.7 Board Configuration Reference The physical slot that houses the CXL4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL4. 9.2.8 Technical Specifications The technical specifications of the CXL4 cover the optical interface specifications, board dimensions, weight and power consumption.

9.2.1 Version Description The functional version of the CXL4 is Q2. The Q1CXL4 is not manufactured any more. The OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL4.

9.2.2 Function and Feature The CXL4 is used to process SDH signals, control communication, groom services, and to input and output the clock.

SDH Processing Unit Table 9-9 lists the function and feature of the SDH processing unit of the CXL4. Table 9-9 Function and feature of the SDH processing unit of the CXL4

9-14

Function and Feature

CXL4

Basic function

Transmits and receives 1 x STM-4 optical signals.

Specifications of optical interfaces

Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2 types.

Specifications of the optical module

l

Supports detection and query of the information on the optical module.

l

Supports the function of setting the on/off state of the laser and the ALS function.

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Function and Feature

CXL4

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenation services.

Overhead processing

l

Supports the processing of the SOH bytes of the STM-4 signals.

l

Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarms and performance events

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection schemes

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP.

Maintenance features

l

Supports inloop and outloop for optical interfaces.

l

Supports warm reset and cold reset. The warm reset does not affect services.

l

Supports the function of querying the manufacturing information of the board.

l

Supports the in-service loading of the FPGA.

l

Supports the upgrade of the board software without affecting services.

SCC Unit Table 9-10 lists the function and feature of the SCC unit of the CXL4 Table 9-10 Function and feature of the SCC unit of the CXL4 Function and Feature

CXL4

Basic function

Configures and monitors services, monitors the service performance, and collencts performance events and alarm information.

Specification of the optical interface

l

Provides 10M/100M compatible Ethernet NMS interface.

l

Provides the F&f interface to manage the COA, and the F&f interface is on the auxiliary interface board.

l

Provides one 10M/100M Ethernet interface, which is used for inter-board communication.

l

Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards.

l

Provides the RS232 OAM interface that is present on on the auxiliary interface board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem.

DCC processing capability Issue 02 (2007-09-10)

Processes 40-channel DCC.

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Function and Feature

CXL4

Fan alarm management

Manages fan alarms.

PIU management

Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU.

Protection scheme

Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit Table 9-11 lists the function and feature of the cross-connect unit of the CXL4. Table 9-11 Function and feature of the cross-connect unit of the CXL4 Function and Feature

CXL4

Basic function

Completes 20 Gbit/s non-blocking full cross-connection at the VC-4 level, and 20 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level.

Fast emergency channel

Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.

Service processing

l

Dynamically grooms services.

l

Adds or deletes services without interrupting services.

l

Supports the SNCP protection at the VC-3 and VC-12 levels.

l

Supports concatenation services at the VC-4-4c level.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit Table 9-12 lists the function and feature of the clock unit of the CXL4. Table 9-12 Function and feature of the clock unit of the CXL4

9-16

Function and Feature

CXL4

Basic function

Provides standard system synchronization clock.

Other function

Supports the extraction, insertion and management of the SSM and clock ID.

Input and output

l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source.

l

Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

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9.2.3 Working Principle and Signal Flow The CXL4 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-4 shows the block diagram for the functions of the CXL4. Figure 9-4 Block diagram for the functions of the CXL4 Time & synchronizaton (SETS)

38MHz OSC

T1 T2

SETG

T3 T4(Clock external output)

T0

Frame header T0 (reference clock)

155MHz PLL

Line units Tributary units PIU AUX

Service units Service units

155 MHz

STM-4

DEMUX

O/E

16x155 Mbit/s data

SDH overhead processing module

RST

MST

MSA

high speed bus

Cross-connect unit A

HPT

high speed bus

16x155 Mbit/s data

STM-4

MUX

K1/K2 insertion/ extration

Performance report

Laser shut down

O/E

K1/K2 bytes

XC Cross Connect (HPC) high speed bus SCC unit

K1/K2 bytes process

Another connect unit

XC Cross Connect (LPC)

DCC

Cross-connect unit B

high speed bus

Laser control

Another CXL unit

DCC

DCC process

ETH channels comunication

Communication and control module

Master and slaver board comunication

ETH interface

Line unit

Other unit Another CXL

AUX

OAM interface AUX F&f interface

FLASH

RAM

Power monitor

Boot ROM

Phone interface

NVRAM

+3.3 V +5V +1.6V +1.8V

EOW

S1-S4 interface

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

+1.2V

The function modules are described as follows:

Synchronous Timing Unit The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal: l

Timing signal (T1) from STM-N

l

Timing signal (T2) from PDH

l

Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs: l

T0, system clock (38 MHz)

l

T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module l

In receive direction, it converts the received optical signals into electrical signals.

l

In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time.

l

In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module It includes RST, MST, MSA and HPT, provides inloop and outloop function.

RST l

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

l

In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection.

l

In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion.

l

Provides extraction or insertion of K1 byte and K2 byte.

l

In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

MST

MSA

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l

In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

HPT

Communication and Control Module l

Traces the clock signal from the active and the standby cross-connect unit.

l

Implements laser controlling function.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

l

CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on.

l

ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.

l

OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state.

l

F&f interface, which provides F&f interface to manage COA. This serial port multiplexes with the commissioning serial port and is the commissioning serial port in BIOS state.

l

COM interface for commissioning port

l

Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXL unit.

Cross-connect Module The cross-connect module consists of two parts: l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching

l

Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-5 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-5 Block diagram of higher and lower order cross-connect modules

high speed bus

high speed bus Input interface

Data

XC connection

Data

Ouput interface

Higher order connection

XC_TOP

TX_TOP

VC_DATA_ FIFO

RX_TOP

Lower order connection

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order services.

Other Functions l

Responses to and processes k bytes

l

Collects performance data of the optical module and shuts output of the optical module

l

Collects and processes DCC of each board

l

Inserts the DCC back into each line board after processing

l

Monitors the power supply of the board

l

Resets the unit

l

Cuts alarms

DC/DC Converter Module This module provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

9.2.4 Front Panel On the front panel of the CXL4, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 9-6 shows the front panel of the CXL4. 9-20

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Figure 9-6 Front panel of the CXL4 CXL4 STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC CLASS 1 LASER PRODUCT

OUT IN

RESET

ALM CUT

CXL4

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit.

l

Active/standby state indicator for the SCC units (ACTC), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit.

l

Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit.

l

Synchronization clock state indicator (SYNC), which is red or green when lit.

l

Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces On the front panel of the CXL4, there are one optical interface and two switches. Table 9-13 lists the type and usage of the optical interface and switches on the CXL4. Issue 02 (2007-09-10)

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Table 9-13 Optical interface and switches on the CXL4 Interface

Interface Type

Usage

IN

LC

Receives optical signals. The pluggable optical module is used for easy maintenance.

OUT

LC

Transmits optical signals. The pluggable optical module is used for easy maintenance.

RESET

Warm reset switch

Press the switch to reset the SCC unit.

ALM CUT

Alarm cut switch

Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.2.5 Valid Slots The CXL4 can be housed in any of slots 4–5 in the subrack.

9.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXL4 indicates the optical interface type. Table 9-14 lists the relation between the board feature code and optical interface type for the CXL4. Table 9-14 Relation between the board feature code and the optical interface type Board Barcode

Feature Code

Optical Interface Type

SSQ2CXL410 or SSQ1CXL410

10

S-4.1 (LC)

SSQ2CXL411 or SSQ1CXL411

11

L-4.1 (LC)

SSQ2CXL412 or SSQ1CXL412

12

L-4.2 (LC)

SSQ2CXL413 or SSQ1CXL413

13

Ve-4.2 (LC)

SSQ2CXL414 or SSQ1CXL414

14

I-4 (LC)

9.2.7 Board Configuration Reference The physical slot that houses the CXL4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL4. 9-22

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Displayed Slot The CXL4 is housed in one slot in the subrack. The logical boards for the CXL4 are the Q1SL4, EXCL and GSCC. Table 9-15 lists the logical slots displayed on the T2000. Table 9-15 Logical slots displayed on the T2000 for the CXL4 Board

Logical Board

Logical Slot

CXL4

Q1SL4

Slots 4–5

ECXL

Slots 80–81

GSCC

Slots 82–83

Board Parameters l

J1 byte

l

C2 byte

l

Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.2.8 Technical Specifications The technical specifications of the CXL4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 9-16 lists the specifications of the optical interfaces of the CXL4. Table 9-16 Specifications of the optical interfaces of the CXL4

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Item

Specification

Nominal bit rate

622080 kbit/s

Line code

NRZ

Optical interface type

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Working wavelength (nm)

1261 to 1360

1274 to 1356

1280 to 1335

1480 to 1580

1480 to 1580

Optical source type

MLM

MLM

SLM

SLM

SLM

Mean launched optical power (dBm)

–15 to –8

–15 to –8

–3 to –2

–3 to –2

–3 to –2

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Item

Specification

Receiver sensitivity (dBm)

–23

–28

–28

–28

–34

Min. overload (dBm)

–8

–8

–8

–8

–13

Min. extinction ratio (dB)

8.2

8.2

10

10

10.5

Cross-Connect Capacity The cross-connect capacity of the CXL4 is described as follows: l

Higher order cross-connect capacity: 20 Gbit/s

l

Lower order cross-connect capacity: 20 Gbit/s

l

Access capacity: 18.75 Gbit/s

Clock Access Capability The clock access capability of the CXL4 is described as follows: l

External input clock: two channels, 2048 kbit/s or 2048 kHz

l

External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the CXL4 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the CXL4 is 40 W.

9.3 CXL16 This section describes the CXL16, an integrated board of the SCC, cross-connect and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.3.1 Version Description The functional version of the CXL16 is Q2. The Q1CXL16 is not manufactured any more. The OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL16. 9-24

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9.3.2 Function and Feature The CXL16 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.3.3 Working Principle and Signal Flow The CXL16 consists of the SDH overhead processing module, RST, MST and so on. 9.3.4 Front Panel On the front panel of the CXL16, there are indicators, interfaces, barcode and laser safety class label. 9.3.5 Valid Slots The CXL16 can be housed in any of slots 4–5 in the subrack. 9.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXL16 indicates the optical interface type. 9.3.7 Board Configuration Reference The physical slot that houses the CXL16 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL16. 9.3.8 Technical Specifications The technical specifications of the CXL16 cover the optical interface specifications, board dimensions, weight and power consumption.

9.3.1 Version Description The functional version of the CXL16 is Q2. The Q1CXL16 is not manufactured any more. The OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL16.

9.3.2 Function and Feature The CXL16 is used to process SDH signals, control communication, groom services, and to input and output the clock.

SDH Processing Unit Table 9-17 lists the function and feature of the SDH processing unit of the CXL16. Table 9-17 Function and feature of the SDH processing unit of the CXL16

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Function and Feature

CXL16

Basic function

Transmits and receives 1 x STM-16 optical signals.

Specification of the optical interface

Supports the optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2 types.

Specification of the optical module

l

Supports detection and query of the information on the optical module.

l

Supports the function of setting the on/off state of the laser and the ALS function. Huawei Technologies Proprietary

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Function and Feature

CXL16

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, and VC-4-16c concatenation services.

Overhead processing

l

Supports the processing of the SOH bytes of the STM-16 signals.

l

Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP.

Maintenance feature

l

Supports inloop and outloop for optical interfaces.

l

Supports warm reset and cold reset. The warm reset does not affect services.

l

Supports the function of querying the manufacturing information of the board.

l

Supports the in-service loading of the FPGA.

l

Supports the upgrade of the board software without affecting services.

SCC Unit Table 9-18 lists the function and feature of the SCC unit of the CXL16 Table 9-18 Function and feature of the SCC unit of the CXL16 Function and Feature

CXL16

Basic function

Configures and monitors services, monitors the service performance, and collects performance events and alarm information.

Specification of the optical interface

l

Provides 10M/100M compatible Ethernet NMS interface.

l

Provides the F&f interface to manage the COA, and the F&f interface is on the auxiliary interface board.

l

Provides one 10M/100M Ethernet interface, which is used for inter-board communication.

l

Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards.

l

Provides the RS232 OAM interface that is present on on the auxiliary interface board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem.

DCC processing capability 9-26

Processes 40-channel DCC.

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Function and Feature

CXL16

Fan alarm management

Manages fan alarms.

PIU management

Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU.

Protection scheme

Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit Table 9-19 lists the function and feature of the cross-connect unit of the CXL16. Table 9-19 Function and feature of the cross-connect unit of the CXL16 Function and Feature

CXL16

Basic function

Completes 20 Gbit/s non-blocking full cross-connection at the VC-4 level, and 20 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level.

Fast emergency channel

Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.

Service processing

l

Dynamically grooms services, such as the cross-connect and broadcast services.

l

Adds or deletes services without interrupting services.

l

Supports the SNCP protection at the VC-3 and VC-12 levels.

l

Supports concatenation services at the VC-4-4c, VC-4-8c, and VC-4-16c levels.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit Table 9-20 lists the function and feature of the clock unit of the CXL16. Table 9-20 Function and feature of the clock unit of the CXL16

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Function and Feature

CXL16

Basic function

Provides standard system synchronization clock.

Other function

Supports the extraction, insertion and management of the SSM and clock ID.

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Function and Feature

CXL16

Input and output

l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source.

l

Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.3.3 Working Principle and Signal Flow The CXL16 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-7 shows the block diagram for the functions of the CXL16. Figure 9-7 Block diagram for the functions of the CXL16 Time & synchronizaton (SETS)

38MHz OSC

T1 T2

SETG

T3 T4(Clock external output)

T0

Frame header T0 (reference clock)

155MHz PLL

Line units Tributary units PIU AUX

Service units Service units

155 MHz

STM-16

DEMUX

O/E

16x155 Mbit/s data

SDH overhead processing module

RST

MST

MSA

high speed bus

Cross-connect unit A

HPT

high speed bus

16x155 Mbit/s data

STM-16

MUX

K1/K2 insertion/ extration

Performance report

Laser shut down

O/E

K1/K2 bytes

XC Cross Connect (HPC) high speed bus SCC unit

K1/K2 bytes process

Another connect unit

XC Cross Connect (LPC)

DCC

Cross-connect unit B

high speed bus

Laser control

Another CXL unit

DCC

DCC process

Line unit

ETH channels comunication

Communication and control module

Master and slaver board comunication

ETH interface

Other unit Another CXL

AUX

OAM interface AUX F&f interface

FLASH

RAM

Power monitor

Boot ROM

Phone interface

NVRAM

+3.3 V +5V +1.6V +1.8V

EOW

S1-S4 interface

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

+1.2V

The function modules are described as follows: 9-28

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Synchronous Timing Unit The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal: l

Timing signal (T1) from STM-N

l

Timing signal (T2) from PDH

l

Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs: l

T0, system clock (38 MHz)

l

T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module l

In receive direction, it converts the received optical signals into electrical signals.

l

In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission.

l

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time.

l

In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module It includes RST, MST, MSA and HPT, provides inloop and outloop function.

RST l

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l

In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

l

In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection.

MST

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l

In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion.

l

Provides extraction or insertion of K1 byte and K2 byte.

l

In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.

l

In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation.

l

OH termination

l

J1 path trace message recovery

l

REI information recovering

l

HP_RDI detection (path status monitoring

l

UNEQ and AIS detection (signal label monitoring)

l

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module l

Traces the clock signal from the active and the standby cross-connect unit.

l

Implements laser controlling function.

l

Selects the clock and frame header from the active or the standby cross-connect units.

l

Controls the indicator on the board.

l

CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on.

l

ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.

l

OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state.

l

F&f interface, which provides F&f interface to manage COA. This serial port multiplexes with the commissioning serial port and is the commissioning serial port in BIOS state.

l

COM interface for commissioning port

l

Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXL unit.

Cross-connect Module The cross-connect module consists of two parts: l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching

l

Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-8 illustrates the block diagram of higher and lower order cross-connect modules. 9-30

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Figure 9-8 Block diagram of higher and lower order cross-connect modules

high speed bus

high speed bus Input interface

Data

XC connection

Data

Ouput interface

Higher order connection

XC_TOP

TX_TOP

VC_DATA_ FIFO

RX_TOP

Lower order connection

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order services.

Other Functions l

Responses to and processes k bytes

l

Collects performance data of the optical module and shuts output of the optical module

l

Collects and processes DCC of each board

l

Inserts the DCC back into each line board after processing

l

Monitors the power supply of the board

l

Resets the unit

l

Cuts alarms

DC Converter Module This module provides the board with required DC voltages. It converts the –48/–60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

9.3.4 Front Panel On the front panel of the CXL16, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel Figure 9-9 shows the front panel of the CXL16. Issue 02 (2007-09-10)

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Figure 9-9 Front panel of the CXL16

CXL16 STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC CLASS 1 LASER PRODUCT

OUT IN

RESET ALM CUT

CXL16

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit.

l

Active/standby state indicator for the SCC units (ACTC), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit.

l

Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit.

l

Synchronization clock state indicator (SYNC), which is red or green when lit.

l

Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

9-32

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Interfaces On the front panel of the CXL16, there are one optical interface and two switches. Table 9-21 lists the type and usage of the optical interface and switches on the CXL16. Table 9-21 Optical interface and switches on the CXL16 Interface

Interface Type

Usage

IN

LC

Receives optical signals. The pluggable optical module is used for easy maintenance.

OUT

LC

Transmits optical signals. The pluggable optical module is used for easy maintenance.

RESET

Warm reset switch

Press the switch to reset the SCC unit.

ALM CUT

Alarm cut switch

Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.3.5 Valid Slots The CXL16 can be housed in any of slots 4–5 in the subrack.

9.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXL16 indicates the optical interface type. Table 9-22 lists the relation between the board feature code and optical interface type for the CXL16. Table 9-22 Relation between the board feature code and the optical interface type Board Barcode

Feature Code

Optical Interface Type

SSQ2CXL1601

01

I-16

SSQ2CXL1602

02

S-16.1

SSQ2CXL1603

03

L-16.1

SSQ2CXL1604

04

L-16.2

9.3.7 Board Configuration Reference The physical slot that houses the CXL16 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL16.

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The logical boards for the CXL16 are the Q1SL16, EXCL and GSCC. Table 9-23 lists the logical slots displayed on the T2000. Table 9-23 Logical slots displayed on the T2000 for the CXL16 Board

Logical Board

Logical Slot

CXL16

Q1SL16

Slots 4–5

ECXL

Slots 80–81

GSCC

Slots 82–83

Board Parameters l

J1 byte

l

C2 byte

l

Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.3.8 Technical Specifications The technical specifications of the CXL16 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 9-24 lists the specifications of the optical interfaces of the CXL16. Table 9-24 Specifications of the optical interfaces of the CXL16

9-34

Item

Specification

Nominal bit rate

2488320 kbit/s

Line code

NRZ

Optical interface type

I-16

S-16.1

L-16.1

L-16.2

Working wavelength (nm)

1266 to 1360

1260 to 1360

1280 to 1335

1500 to 1580

Optical source type

MLM

SLM

SLM

SLM

Mean launched optical power (dBm)

–10 to –3

–5 to 0

–2 to 3

–2 to 3

Receiver sensitivity (dBm)

–18

–18

–27

–28

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Item

Specification

Min. overload (dBm)

–3

0

–9

–9

Min. extinction ratio (dB)

8.2

8.2

8.2

8.2

Cross-Connect Capacity The cross-connect capacity of the CXL16 described as follows: l

Higher order cross-connect capacity: 20 Gbit/s

l

Lower order cross-connect capacity: 20 Gbit/s

l

Access capacity: 18.75 Gbit/s

Clock Access Capability The clock access capability of the CXL16 is described as follows: l

External input clock: two channels, 2048 kbit/s or 2048 kHz

l

External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the CXL16 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the CXL16 is 40 W.

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10 Auxiliary Boards

Auxiliary Boards

About This Chapter This chapter describes the auxiliary boards, such as the EOW, AUX, AMU, and FANA. 10.1 EOW This section describes the EOW, an orderwire processing board, in terms of the version, function, principle, front panel and specifications. 10.2 AUX This section describes the AUX, a system auxiliary interface board, in terms of the version, function, working principle, front panel and specifications. 10.3 AMU This section describes the AMU, an orderwire processing and alarm concatenation board, in terms of the version, function, principle, front panel and specifications. 10.4 FAN This section describes the FAN, a fan control board, in terms of the version, function, principle, front panel, configuration and specifications.

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10.1 EOW This section describes the EOW, an orderwire processing board, in terms of the version, function, principle, front panel and specifications. 10.1.1 Version Description The functional version of the EOW is R1. 10.1.2 Function and Feature The EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other data bytes. 10.1.3 Working Principle and Signal Flow The EOW consists of the clock module, switch module, OHP module, and DC/DC converter module. 10.1.4 Front Panel On the front panel of the EOW, there are indicators and interfaces. 10.1.5 Valid Slots The EOW can be housed in slot 9 in the subrack. 10.1.6 Technical Specifications The technical specifications of the EOW cover the board dimensions, weight and power consumption.

10.1.1 Version Description The functional version of the EOW is R1.

10.1.2 Function and Feature The EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other data bytes. Table 10-1 lists the functions and features of the EOW. Table 10-1 Functions and features of the EOW Function and Feature

EOW

Auxiliary interface

Provides four broadcast data interfaces (Serial 1–4).

Orderwire interface

Provides one orderwire interface.

Overhead processing

Processes the E1, E2, and Serial 1–4 bytes.

10.1.3 Working Principle and Signal Flow The EOW consists of the clock module, switch module, OHP module, and DC/DC converter module. 10-2

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Figure 10-1 shows the block diagram for the functions of the EOW. Figure 10-1 Block diagram for the functions of the EOW Clock module

S1~S4 interface

Reference clock and frame header

CXL unit A/B

S1~S4

Phone interface

SLIC

Switch module

OHP module E1/E2

+3.3 V

+3.3 V +5 V +1.8 V

DC/DC converter

DC/DC converter

CXL unit A/B

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power from AUX

Clock Module The clock module first divides frequencies of the system clock and header sent from the crossconnect board. The system clock and header are then transmitted to other modules as OHP Process module and the switch module.

Switch Module The switch module performs non-blocking switching of 4096 x 4096 or 1024 x 1024 timeslots under control of micro processor. The switch module can switch any timeslot of overhead signal sent from the SCC to any timeslot of output overhead signals.

OHP Module l

Processes E1 and E2 bytes sent by the CXL board.

l

Realizes interconnection between orderwire audio interface.

l

Interconnects with orderwire phone port through SLIC unit.

l

Processes serial1–serial4 sent from the CXL board.

l

Provides S1–S4 as RS232/RS422 serial transparent data interfaces, the level of which can be set by software.

DC/DC Converter Through the DC/DC converter module, the power converting module generates required DC voltages for each chip. The following DC voltages are provided: +1.8 V, +3.3 V, +5 V. In addition, protection is provided to board +3.3 V power supply.

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Appearance of the Front Panel Figure 10-2 shows the appearance of the front panel of the EOW. Figure 10-2 Front panel of the EOW

EOW STAT PROG

PHONE S1 S2 S3 S4 EOW

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are five interfaces on the front panel of the EOW. Table 10-2 lists the type and usage of these interfaces. Table 10-2 Interfaces on the front panel of the EOW

10-4

Interface

Interface Type

Usage

PHONE

RJ-11

Orderwire phone interface

S1

RJ-45

Broadcast data interface S1

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Interface

Interface Type

Usage

S2

RJ-45

Broadcast data interface S2

S3

RJ-45

Broadcast data interface S3

S4

RJ-45

Broadcast data interface S4

Table 10-3 lists the pins of the PHONE interface. Table 10-3 Pins of the PHONE interface of the EOW Front View

8

7

6

5

4

3

2

Pin

Usage

4

Signal 1

5

Signal 2

1–3 and 6–8

Not defined

1

Table 10-4 lists the pins of the S1, S2, S3 and S4 interfaces. Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW Front View

8

7

6

5

4

3

2

1

Pin

Usage

1

RS-422 data transmitting positive

2

RS-422 data transmitting negative

3

RS-422 data receiving positive

4

RS232 data receive end

5

Grounding

6

RS-422 data receiving negative

7

Not defined

8

RS232 data transmit end

10.1.5 Valid Slots The EOW can be housed in slot 9 in the subrack.

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Mechanical Specifications The mechanical specifications of the EOW are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.4

Power Consumption In the normal temperature (25℃), the maximum power consumption of the EOW is 10 W.

10.2 AUX This section describes the AUX, a system auxiliary interface board, in terms of the version, function, working principle, front panel and specifications. 10.2.1 Version Description The AUX has two versions, R1 and R2. 10.2.2 Function and Feature The AUX is used to provide various management and auxiliary interfaces, and to provide the central backup of the +3.3 V power supply for the boards in the subrack. 10.2.3 Working Principle and Signal Flow The AUX consists of the control module, communication module, DC/DC converter module and so on. 10.2.4 Jumper A jumper, J9, is present on the lower right of the AUX. The jumper is used to set the subrack as the main subrack or extended subrack. 10.2.5 Front Panel On the front panel of the AUX, there are many types of interfaces. 10.2.6 Valid Slots The AUX can be housed in slot 10 in the subrack. 10.2.7 Technical Specifications The technical specifications of the AUX cover the board dimensions, weight and power consumption.

10.2.1 Version Description The AUX has two versions, R1 and R2. The R1AUX and R2AUX are two versions developed in different periods. The two versions can be replaced by each other.

10.2.2 Function and Feature The AUX is used to provide various management and auxiliary interfaces, and to provide the central backup of the +3.3 V power supply for the boards in the subrack. Table 10-5 lists the functions and features of the AUX. 10-6

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Table 10-5 Functions and features of the AUX Item

AUX

Management interface

Provides the OAM/F&f interface, which supports the X.25 protocol.

Clock interface

Provides two BITS clock input interfaces and two BITS clock output interfaces (impedance: 120 ohms).

Alarm interface

Provides three alarm input and one alarm output interfaces.

Commissioning interface

Provides one commissioning COM interface.

Internal communication

Realizes the inter-board communication among boards in the subrack.

Backup and check of the power supply

Monitors the two independent –48 power supplies in the subrack, and performs the overvoltage (–72 V) check and undervoltage (–38.4 V) check.

Provides the ETH NMS interface.

Provides the central backup of the +3.3 V power supply for the boards in the subrack, which is the 1:N protection for the secondary power supply of each board. The power of the +3.3 V power supply is 80 W. Performs the overvoltage (3.8 V) check and undervoltage (3.1 V) check on the output of the +3.3 V backup power supply. Audible alarm

Supports the audible alarm and the clearing of the audible alarm.

10.2.3 Working Principle and Signal Flow The AUX consists of the control module, communication module, DC/DC converter module and so on. Figure 10-3 shows the block diagram for the functions of the R1AUX.

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Figure 10-3 Block diagram for the functions of the R1AUX F&f/OAM interface

CXL

CLK interface

CXL

Housekeeping input/output

3 x input and 1 x output

-48 V/BAK 3.3 V power test & thunder-proof test

-48 V/ -60 V

Control module

COM interface ETH interface

2 X 100/10 Mbit/s

100/10 Mbit/s

CXL

Communication module 100/10 Mbit/s

100/10 Mbit/s Ehernet bus Other unit +3.3 V

+1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V +3.3 V backup power

Figure 10-4 shows the block diagram for the functions of the R2AUX.

10-8

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Figure 10-4 Block diagram for the functions of the R2AUX F&f/OAM interface

CXL

CLK interface

CXL

Housekeeping input/output

3 x input and 1 x output

-48 V/BAK 3.3 V power test & thunder-proof test

-48 V/ -60 V

Control module

COM interface

CXL

2 x 100/10 Mbit/s

100/10 Mbit/s

CXL

Communication module ETH interface

100/10 Mbit/s

100/10 Mbit/s Ehernet bus

+3.3 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

Other unit -48 V/ -60 V -48 V/ -60 V +3.3 V backup power

The function modules of the R1AUX board are described below:

Communication Module This module applies LAN Switch principle to construct inter-board communication for the OptiX OSN 1500. This module provides: l

13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connect the SCC, the cross-connect, the line and the tributary boards for inter-board communication of the OptiX OSN 1500.

l

2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioning network interface for service slots, which forms a VLAN with the 13 inter-board communication network interfaces. The other interface is the interface for network management.

l

2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLB boards. These two interfaces and one network interface on the front panel are of the same VLAN.

Control Module The control module mainly consists of CPUs and monitors the running state of the board.

Alarm Input and Output Module This module reads and sets 3 x input and 1 x output alarms. Issue 02 (2007-09-10)

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Detection of –48 V and Backup +3.3 V Powers and Lightening Protection Module This module detects: l

Over-voltage and under-voltage of –48 V and backup +3.3 V powers

l

System lightening protection fault

Other Function l

F&f interface

l

OAM serial interface for network management

l

Two-in and two-out BITS clock interface (120 ohms)

l

COM, ETH, F&f and OAM interfaces

DC/DC Converter Module Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides 40 W/+3.3 V backup power supply for the system. The function modules of the R2AUX board are described below:

Communication Module This module applies LAN Switch principle to construct inter-board communication for the OptiX OSN 1500. This module provides: l

13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connect the SCC, the cross-connect, the line and the tributary boards for inter-board communication of the OptiX OSN 1500.

l

2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioning network interface for service slots, which forms a VLAN with the 13 inter-board communication network interfaces. The other interface is the interface for network management.

l

2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLB boards. These two interfaces and one network interface on the front panel are of the same VLAN.

Control Module The control module mainly consists of CPLDs and reports the local board state to the CXL board through the control bus with the CXL board. This module also obtains the control information of the local board.

Alarm Input and Output Module This module reads and sets 3 x input and 1 x output alarms.

Detection of –48 V and Backup +3.3 V Powers and Lightening Protection Module This module detects: 10-10

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Over-voltage and under-voltage of –48 V and backup +3.3 V powers

l

System lightening protection fault

10 Auxiliary Boards

Other Function l

F&f interface

l

OAM serial interface for network management

l

Two-in and two-out BITS clock interface (120 ohms)

l

COM, ETH, F&f and OAM interfaces

DC/DC Converter Module Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides 40 W/+3.3 V backup power supply for the system.

10.2.4 Jumper A jumper, J9, is present on the lower right of the AUX. The jumper is used to set the subrack as the main subrack or extended subrack. Figure 10-5 shows where the jumper J9 is located on the AUX board. Figure 10-5 Position of J9 on the AUX

Power Module J9

Use the J9 to set the subrack as follows: l

Cap the jumper to set the subrack as the main subrack.

l

Remove the cap from the jumper to set the subrack as the extended subrack.

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Appearance of the Front Panel Figure 10-6 shows the appearance of the front panel of the AUX. Figure 10-6 Front panel of the AUX

AUX

ETH COM CLK ALM OAM/F&f AUX

Interfaces There are five interfaces on the front panel of the AUX. Table 10-6 lists the type and usage of these interfaces. Table 10-6 Interfaces on the front panel of the AUX Interface

Interface Type

Usage

ETH

RJ-45

NM interface

COM

RJ-45

Commissioning interface

CLK

RJ-45

120-ohm external clock input/output interface

ALM

RJ-45

3 x input and 1 x output alarm interface

OAM/F&f

RJ-45

Serial NM and management interface

Table 10-7 lists the pins of the CLK interface.

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Table 10-7 Pins of the CLK interface of the AUX Front View

8

7

6

5

4

3

2

1

Pin

Usage

1

Receiving negative for 120-ohm clock 1

2

Receiving positive for 120-ohm clock 1

3

Receiving negative for 120-ohm clock 2

4

Transmitting negative for 120-ohm clock 1

5

Transmitting positive for 120-ohm clock 1

6

Receiving positive for 120-ohm clock 2

7

Transmitting negative for 120-ohm clock 2

8

Transmitting positive for 120-ohm clock 2

Table 10-8 lists the pins of the ETH and COM interfaces. Table 10-8 Pins of the ETH and COM interfaces of the AUX Front View

8

7

6

5

4

3

2

1

Pin

Usage

1

Transmitting positive

2

Transmitting negative

3

Receiving positive

4

Not defined

5

Not defined

6

Receiving negative

7–8

Not defined

Table 10-9 lists the pins of the ALM interface. Table 10-9 Pins of the ALM interface of the AUX Front View

8

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7

6

5

4

3

2

Pin

Usage

1

Positive for critical and major alarm signal output

2

Negative for critical and major alarm signal output

3

Positive for minor and warning alarm signal output

4

Positive for alarm signal output 1

1

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Front View

Pin

Usage

5

Negative for alarm signal output 1

6

Negative for minor and warning alarm signal output

7

Positive for alarm signal output 2

8

Negative for alarm signal output 2

Controlled by the software, a specific interface can be used as the OAM or F&f interface. Table 10-10 lists pins of the interface used as the OAM interface. Table 10-10 Pins of the OAM interface of the AUX Front View

8

7

6

5

4

3

2

1

Pin

Usage

1

Requests for transmission.

2

Prepares the DTE.

3

Transmits data.

4

Grounds.

5

Grounds.

6

Receives data.

7

Prepare the DCE.

8

Prepares for the receiving of signals.

Table 10-11 lists the pins of the interface used as the F&f interface. Table 10-11 Pins of the F&f interface of the AUX Front View

8

7

6

5

4

3

2

Pin

Usage

4

RS232 receive end

5

Grounding end

8

RS232 transmit end

1–3 and 6–7

Not defined

1

10.2.6 Valid Slots The AUX can be housed in slot 10 in the subrack. 10-14

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10.2.7 Technical Specifications The technical specifications of the AUX cover the board dimensions, weight and power consumption.

Mechanical Specifications The mechanical specifications of the AUX are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the AUX is 19 W.

10.3 AMU This section describes the AMU, an orderwire processing and alarm concatenation board, in terms of the version, function, principle, front panel and specifications. 10.3.1 Version Description The functional version of the AMU board is R1. 10.3.2 Function and Feature The AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for the equipment. 10.3.3 Working Principle and Signal Flow The AMU consists of the clock module, overhead processing module and power supply module. 10.3.4 Front Panel On the front panel of AMU, there are board indicators and interfaces of many types. 10.3.5 Valid Slots The AMU can be housed in slot 9 in the subrack. 10.3.6 Technical Specifications The technical specifications of the AMU cover the board dimensions, weight and power consumption.

10.3.1 Version Description The functional version of the AMU board is R1.

10.3.2 Function and Feature The AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for the equipment. Table 10-12 lists the functions and features of the AMU.

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Table 10-12 Functions and features of the AMU Item

AMU

Auxiliary interface

Provides two broadcast data interfaces (Serial 1–2).

Cabinet alarm indicator

Drives and concatenates the four cabinet indicators.

Orderwire interface

Provides one orderwire interface.

Commissioning interface

Supports the commissioning serial port and 100M commissioning network port, when connected to the AUX.

Overhead processing

Processes the E1, E2, and Serial 1–2 bytes.

Backup and check of the power supply

Performs the overvoltage/undervoltage check on the output of the power supply modules.

10.3.3 Working Principle and Signal Flow The AMU consists of the clock module, overhead processing module and power supply module. Figure 10-7 shows the block diagram for the functions of the AMU. Figure 10-7 Block diagram for the functions of the AMU Backplane Clock module

S1~S4 E1/E2

Reference clock

Overhead process module

CXL unit

CXL unit

Power supply module ＋3.3 V

-48 V

+3.3 V power backup from AUX

Clock Module The clock module extracts and processes the reference clock signals from the CXL.

Overhead Processing Module The overhead processing module processes the E1 and E2 bytes transmitted by the CXL, and uses the orderwire bytes for the connection of the orderwire phones. This module also processes Serial1 and Serial2 bytes, provides transparent data interfaces RS232 and RS422, drives and concatenates the cabinet indicators. Figure 10-8 shows the positions of the orderwire bytes in the SDH frame. 10-16

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Figure 10-8 Positions of orderwire bytes in the SDH frame A1

A1

A1

A2

B1

E1

D1

D2

A2

A2

J0

D3

Serial 1 Serial 2

AU_PTR B2

B2

B2

K1

K2

D4

D5

D6

D7

D8

D9

D10

D11

D12

S1

M1

E2

Power Supply Module The power supply module provides supplies power to the AMU board and provides centralized +3.3 V power backup for other boards.

10.3.4 Front Panel On the front panel of AMU, there are board indicators and interfaces of many types.

Appearance of the Front Panel Figure 10-9 shows the appearance of the front panel of the AMU.

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Figure 10-9 Front panel of the AMU

AMU STAT PROG

PHONE S1 S2 LAMP1 LAMP2 AMU

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Connection status indicator (LINK), which is green when lit.

l

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are five interfaces on the front panel of the AMU. Table 10-13 lists the type and usage of these interfaces. Table 10-13 Interfaces on the front panel of the AMU

10-18

Interface

Interface Type

Usage

PHONE

RJ-11

Orderwire phone interface

S1

RJ-45

Broadcast data interface S1

S2

RJ-45

Broadcast data interface S2

LAMP1

RJ-45

Cabinet alarm indicator output interface

LAMP2

RJ-45

Cabinet concatenated alarm indicator input interface

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Table 10-14 lists the pins of the PHONE interface. Table 10-14 Pins of the PHONE interface of the AMU Front View

8

7

6

5

4

3

2

Pin

Usage

4

Signal 1

5

Signal 2

1–3 and 6–8

Not defined

1

Table 10-15 lists the pins of the S1 and S2 interfaces. Table 10-15 Pins of the S1 and S2 interfaces of the AMU Front View

8

7

6

5

4

3

2

Pin

Usage

1

RS-422 data transmitting positive

2

RS-422 data transmitting negative

3

RS-422 data receiving positive

4

RS232 data receive end

5

Grounding

6

RS-422 data receiving negative

7

Not defined

8

RS232 data transmit end

1

Table 10-16 lists the pins of the LAMP1 and LAMP2 interfaces. Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU Front View

8

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7

6

5

4

3

2

Pin

Usage

1

Positive for critical alarm signals

2

Negative for critical alarm signals

3

Positive for major alarm signals

1

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Front View

Pin

Usage

4

Positive for power indicator signals

5

Negative for power indicator signals

6

Negative for major alarm signals

7

Positive for minor alarm signals

8

Negative for minor alarm signals

Connection for Alarm Concatenation The AMU provides the concatenation interface for the cabinet alarm indicators. Connect the LAMP1 of the subrack 2 to the LAMP2 of the subrack 1. Finally, connect the LAMP1 of the subrack 1 to the indicator interface on the top of the cabinet. Figure 10-10 shows how to connect the cabinet alarm indicators. Figure 10-10 Connection of the cabinet alarm indicators Cabinet indicators LAMP1

LAMP2

Subrack 2 LAMP1

LAMP2

Subrack 1 Cabinet

10.3.5 Valid Slots The AMU can be housed in slot 9 in the subrack.

10.3.6 Technical Specifications The technical specifications of the AMU cover the board dimensions, weight and power consumption.

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Mechanical Specifications The mechanical specifications of the AMU are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 0.5

Power Consumption In the normal temperature (25℃), the maximum power consumption of the AMU is 8 W.

10.4 FAN This section describes the FAN, a fan control board, in terms of the version, function, principle, front panel, configuration and specifications. 10.4.1 Version Description The functional version of the FAN board is R1. 10.4.2 Function and Feature The FAN is used to adjust the fan speed, check the fan status, report the fault of the fan control board, and to report the off-service alarm of the fan. 10.4.3 Working Principle and Signal Flow The FAN consists of the power interface unit, soft start unit, state detecting unit and fans. 10.4.4 Front Panel There are no indicators on the front panel of the FAN. 10.4.5 Valid Slots The FAN can be housed in slot 20 in the subrack. 10.4.6 Technical Specifications The technical specifications of the FAN cover the board dimensions, weight, power consumption and working voltage.

10.4.1 Version Description The functional version of the FAN board is R1.

10.4.2 Function and Feature The FAN is used to adjust the fan speed, check the fan status, report the fault of the fan control board, and to report the off-service alarm of the fan. Table 10-17 lists the functions and features of the FAN. Table 10-17 Functions and features of the FAN

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Function and Feature

FAN

Hot swap function

Provides the hot swap function for the fan frame. Huawei Technologies Proprietary

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Function and Feature

FAN

Status check function

Provides the function of fan status check.

Alarm check function

Reports the fan alarm and in-service information.

10.4.3 Working Principle and Signal Flow The FAN consists of the power interface unit, soft start unit, state detecting unit and fans. Figure 10-11 shows the block diagram for the functions of the FAN. Figure 10-11 Block diagram for the functions of the FAN - 48 V 1

GND1 GND2

GND Power access unit

GND

- 48 V

Delay start unit

Fan - 48 V

48 V

GND

-

- 48 V 2

Fan alarm signals Voltage drop unit

- 48 V

Status detection unit

GND

Power Interface Unit The power interface unit accesses the –48 V power supply for the FAN.

State Detecting Unit This unit detects the on/off state of the fans. If any of the six fans stops, the unit reports the alarm to the CXL to indicate the off state of the fan and drives the alarm indicator.

10.4.4 Front Panel There are no indicators on the front panel of the FAN.

Appearance of the Front Panel The OptiX OSN equipment applies a modular fan platform. One OptiX OSN 1500 subrack uses one fan tray assembly. Figure 10-12 shows the appearance of the front panel of the FAN. 10-22

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Figure 10-12 Front panel of the FAN

FAN RUN ALM

Indicators The following indicators are present on the front panel of the board: l

Board running state (RUN), which is green when lit.

l

Fan alarm indicator (ALM), which is red when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

10.4.5 Valid Slots The FAN can be housed in slot 20 in the subrack.

10.4.6 Technical Specifications The technical specifications of the FAN cover the board dimensions, weight, power consumption and working voltage.

Mechanical Specifications The mechanical specifications of the FAN are as follows: l

Board dimensions (mm): 120 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃) and with –48 V input voltage, the maximum power consumption of the FAN is 20 W.

Working Voltage The working voltage for the FAN can be –48 V±20% DC. Issue 02 (2007-09-10)

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11 WDM Processing Boards

WDM Processing Boards

About This Chapter This chapter describes the WDM processing boards, such as the CMR2, CMR4, MR2, MR2A, MR2B, MR2C, MR4, LWX, OBU1, and FIB. 11.1 CMR2 This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.2 CMR4 This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.3 MR2 This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.4 MR2A This section describes the MR2A, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.5 MR2B This section describes the MR2B, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.6 MR2C This section describes the MR2C, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.7 MR4 This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.8 LWX This section describes the LWX, an arbitrary rate wavelength converting board, in terms of the version, function, principle, front panel, configuration and specifications. 11.9 OBU1 Issue 02 (2007-09-10)

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This section describes the TN11OBU1, an optical booster amplifier board, in terms of the version, function, principle, front panel, configuration and specifications. 11.10 FIB This section describes the FIB, a wavelength filter and isolation board, in terms of the version, function, principle, front panel, configuration and specifications.

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11.1 CMR2 This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.1.1 Version Description The functional version of the CMR2 board is TN11. 11.1.2 Function and Feature The CMR2 is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.1.3 Working Principle and Signal Flow The CMR2 consists of the OADM optical module, control and communication module, and DC/ DC converter module. 11.1.4 Front Panel On the front panel of the CMR2, there are board indicators, interfaces and laser safety class label. 11.1.5 Valid Slots The CMR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack. 11.1.6 Board Feature Code The board feature code of the CMR2 contains eight characters, which indicate the wavelengths for the 2-channel optical signals processed by the board. 11.1.7 Technical Specifications The technical specifications of the CMR2 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.1.1 Version Description The functional version of the CMR2 board is TN11.

11.1.2 Function and Feature The CMR2 is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-1 lists the functions and features of the CMR2. Table 11-1 Functions and features of the CMR2

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Function and Feature

CMR2

Basic function

Adds/Drops two wavelengths to/from the multiplexed signals.

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Function and Feature

CMR2

Channel expansion

Provides the intermediate port used for expansion. Under certain conditions, the capacity of upstream and downstream channels can be expanded when the intermediate port is connected to other optical add/drop multiplexing boards.

Wavelength query

Specifies and queries the added/dropped wavelengths.

11.1.3 Working Principle and Signal Flow The CMR2 consists of the OADM optical module, control and communication module, and DC/ DC converter module. Figure 11-1 shows the block diagram for the functions of the CMR2. Figure 11-1 Block diagram for the functions of the CMR2 D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module +5 V

DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The CMR2 mainly includes the optical add/drop multiplexer (OADM) module adding/dropping two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also provides concatenation interfaces to connect other add/drop multiplexing boards for more powerful add/drop capability. The CMR2 is a passive board that has no interface with the backplane.

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OADM module The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module l

Controls the entire board operation.

l

Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board.

l

Communicates data with the SCC.

DC/DC converter module Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.1.4 Front Panel On the front panel of the CMR2, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel Figure 11-2 shows the appearance of the front panel of the CMR2.

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Figure 11-2 Front panel of the CMR2

CMR2 STAT

LASER RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

OUT IN MO MI D1 A1 D2 A2

CMR2

Indicator On the front panel of the CMR2, there is one board hardware state indicator (STAT), which is red or green when lit. For indication of the indicator, see A Equipment and Board Alarm Indicators.

Interfaces There are eight optical interfaces on the front panel of the CMR2. Table 11-2 lists the type and usage of the optical interfaces.

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Table 11-2 Optical interfaces of the CMR2 Interface

Interface Type

Usage

A1–A2

LC

Receive the signals output from the optical wavelength converting board or centralized client-side equipment.

D1–D2

LC

Transmit signals to the optical wavelength converting board or centralized client-side equipment.

IN

LC

Receives multiplexed signals.

OUT

LC

Transmits multiplexed signals.

MO

LC

Acts as a concatenation output optical interface and connects to the input optical interfaces of other OADM boards.

MI

LC

Acts as a concatenation input optical interface and connects to the output optical interfaces of other OADM boards.

11.1.5 Valid Slots The CMR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack.

11.1.6 Board Feature Code The board feature code of the CMR2 contains eight characters, which indicate the wavelengths for the 2-channel optical signals processed by the board. Table 11-3 lists the details on the board feature code. Table 11-3 Feature code of the CMR2 Barcode

Indication

Description

First four characters

Wavelength for the optical signals

The wavelength is for the first channel of optical signals processed by the board.

Last four characters

Wavelength for the optical signals

The wavelength is for the second channel of optical signals processed by the board.

For example, the feature code of the TN11CMR2 is 14711571. l

"1471" indicates that the wavelength for the first channel of optical signals is 1471 nm.

l

"1571" indicates that the wavelength for the second channel of optical signals is 1571 nm.

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11.1.7 Technical Specifications The technical specifications of the CMR2 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications Table 11-4 lists the specifications of optical interfaces of the CMR2. Table 11-4 Specifications of the optical interfaces of the CMR2 Optical Interface

Item

Specification

-

Working wavelength range (nm)

1271–1611

-

Channel spacing (GHz)

20

IN-D1 IN-D2

0.5 dB passband bandwidth (nm)

≥ ±6.5

Insertion loss (dB) in the channel for dropping wavelengths

≤ 1.5

Adjacent channel isolation (dB)

> 25

Non-adjacent channel isolation (dB)

> 35

0.5 dB passband bandwidth (nm)

≥ ±6.5

Insertion loss (dB) in the channel for adding wavelengths

≤ 1.5

IN-MO MI-OUT

Insertion loss (dB)

≤ 1.0

Isolation (dB)

> 13

-

Return loss (dB)

> 40

A1-OUT A2-OUT

Laser Safety Class The safety class of the laser on the board is CLASS 1M. The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications l

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Weight (kg): 0.8

Power Consumption l

In the normal temperature (25℃), the maximum power consumption of the CMR2 is 0.2 W.

l

In the high temperature (55℃), the maximum power consumption of the CMR2 is 0.3 W.

11.2 CMR4 This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.2.1 Version Description The functional version of the CMR4 board is TN11. 11.2.2 Function and Feature The CMR4 is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.2.3 Working Principle and Signal Flow The CMR4 consists of the OADM optical module, control and communication module, and DC/ DC converter module. 11.2.4 Front Panel On the front panel of the CMR4, there are board indicators, interfaces and laser safety class label. 11.2.5 Valid Slots The CMR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack. 11.2.6 Board Feature Code The board feature code of the CMR4 contains eight characters, which indicate the wavelengths for the 4-channel optical signals processed by the board. 11.2.7 Technical Specifications The technical specifications of the CMR4 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.2.1 Version Description The functional version of the CMR4 board is TN11.

11.2.2 Function and Feature The CMR4 is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-5 lists the functions and features of the CMR4.

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Table 11-5 Functions and features of the CMR4 Function and Feature

CMR4

Basic function

Adds/Drops four wavelengths to/from the multiplexed signals.

Channel expansion

Provides the intermediate port used for expansion. Under certain conditions, the capacity of upstream and downstream channels can be expanded when the intermediate port is connected to other optical add/drop multiplexing boards.

Wavelength query

Specifies and queries the added/dropped wavelengths.

11.2.3 Working Principle and Signal Flow The CMR4 consists of the OADM optical module, control and communication module, and DC/ DC converter module. Figure 11-3 shows the block diagram for the functions of the CMR4. Figure 11-3 Block diagram for the functions of the CMR4 D01 D02 D03 D04

MO

MI

A01 A02 A03 A04

Drop

IN

Add

OUT

OADM module

Control and communication module

Power supply module +5 V

DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

OADM module The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01–D04 four wavelengths from the signal. These four dropped wavelengths are output from the MO optical interface. 11-10

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The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds four wavelengths through optical interfaces A01–A04 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module l

Controls the entire board operation.

l

Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board.

l

Communicates data with the SCC.

DC/DC converter module Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.2.4 Front Panel On the front panel of the CMR4, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel Figure 11-4 shows the appearance of the front panel of the CMR4.

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Figure 11-4 Front panel of the CMR4

CMR4 STAT

LASER RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

OUT IN MO MI D1 A1 D2 A2 D3 A3 D4 A4

CMR4

Indicator One the front panel of the CMR4, there is one board hardware state indicator (STAT), which is red or green when lit. For indication of the indicator, see A Equipment and Board Alarm Indicators.

Interfaces There are twelve optical interfaces on the front panel of the CMR4. Table 11-6 lists the type and usage of these optical interfaces.

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Table 11-6 Optical interfaces of the CMR4 Interface

Interface Type

Usage

A1–A4

LC

Receive the signals output from the optical wavelength converting board or centralized client-side equipment.

D1–D4

LC

Transmit signals to the optical wavelength converting board or centralized client-side equipment.

IN

LC

Receives multiplexed signals.

OUT

LC

Transmits multiplexed signals.

MI

LC

Acts as a concatenation input optical interface and connects to the output optical interfaces of other OADM boards.

MO

LC

Acts as a concatenation output optical interface and connects to the input optical interfaces of other OADM boards.

11.2.5 Valid Slots The CMR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack.

11.2.6 Board Feature Code The board feature code of the CMR4 contains eight characters, which indicate the wavelengths for the 4-channel optical signals processed by the board. Table 11-7 lists the details on the board feature code. Table 11-7 Feature code of the CMR4

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Barcode

Indication

Description

Characters 1–2

Wavelength for the optical signals

The characters are two middle characters of the four that indicate the wavelength for the first channel of optical signals.

Characters 3–4

Wavelength for the optical signals

The characters are two middle characters of the four that indicate the wavelength for the second channel of optical signals.

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Barcode

Indication

Description

Characters 5–6

Wavelength for the optical signals

The characters are two middle characters of the four that indicate the wavelength for the third channel of optical signals.

Characters 7–8

Wavelength for the optical signals

The characters are two middle characters of the four that indicate the wavelength for the fourth channel of optical signals.

For example, the feature code of the TN11CMR4 is 47495961. l

"47" indicates that the wavelength for the first channel of optical signals is 1471 nm.

l

"49" indicates that the wavelength for the second channel of optical signals is 1491 nm.

l

"59" indicates that the wavelength for the third channel of optical signals is 1591 nm.

l

"61" indicates that the wavelength for the fourth channel of optical signals is 1611 nm.

11.2.7 Technical Specifications The technical specifications of the CMR4 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications Table 11-8 lists the specifications of the optical interfaces of the CMR4. Table 11-8 Specifications of the optical interfaces of the CMR4

11-14

Optical Interface

Item

Specification

–

Working wavelength range (nm)

1291 to 1611 (1371 nm excluded)

–

Channel spacing (GHz)

20

IN-D1 IN-D2 IN-D3 IN-D4

0.5 dB passband bandwidth (nm)

≥ ±6.5

Insertion loss (dB) in the channel for dropping wavelengths

≤2

Adjacent channel isolation (dB)

> 25

Non-adjacent channel isolation (dB)

> 35

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Optical Interface

Item

Specification

A1-OUT A2-OUT A3-OUT A4-OUT

0.5 dB passband bandwidth (nm)

≥ ±6.5

Insertion loss (dB) in the channel for adding wavelengths

≤2

IN-MO MI-OUT

Insertion loss (dB)

≤ 1.5

Isolation (dB)

> 13

–

Return loss (dB)

> 40

Laser Safety Class The safety class of the laser on the board is CLASS 1M. The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.9

Power Consumption l

In the normal temperature (25℃), the maximum power consumption of the CMR4 is 0.2 W.

l

In the high temperature (55℃), the maximum power consumption of the CMR4 is 0.3 W.

11.3 MR2 This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.3.1 Version Description The functional version of the MR2 board is TN11. 11.3.2 Function and Feature The MR2 is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.3.3 Working Principle and Signal Flow The MR2 consists of the OADM optical module, control and communication module, and DC/ DC converter module. 11.3.4 Front Panel On the front panel of the MR2, there are board indicators, interfaces and laser safety class label. Issue 02 (2007-09-10)

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11.3.5 Valid Slots The MR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack. 11.3.6 Board Feature Code The board feature code of the MR2 contains eight characters, which indicate the frequency for the 2-channel optical signals processed by the board. 11.3.7 Technical Specifications The technical specifications of the MR2 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.3.1 Version Description The functional version of the MR2 board is TN11.

11.3.2 Function and Feature The MR2 is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-9 lists the functions and features of the MR2. Table 11-9 Functions and features of the MR2 Function and Feature

MR2

Basic function

Adds/Drops two wavelengths to/from the multiplexed signals.

Channel expansion

Provides the intermediate port used for expansion. Under certain conditions, the capacity of upstream and downstream channels can be expanded when the intermediate port is connected to other optical add/drop multiplexing boards.

Wavelength query

Specifies and queries the added/dropped wavelengths.

11.3.3 Working Principle and Signal Flow The MR2 consists of the OADM optical module, control and communication module, and DC/ DC converter module. Figure 11-5 shows the block diagram for the functions of the MR2.

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Figure 11-5 Block diagram for the functions of the MR2 D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module +5 V

DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

OADM module The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module l

Controls the entire board operation.

l

Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board.

l

Communicates data with the SCC.

DC/DC converter module Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.3.4 Front Panel On the front panel of the MR2, there are board indicators, interfaces and laser safety class label. Issue 02 (2007-09-10)

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Appearance of the Front Panel Figure 11-6 shows the appearance of the front panel of the MR2. Figure 11-6 Front panel of the MR2

MR2 STAT

LASER RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

OUT IN MO MI D1 A1 D2 A2

MR2

Indicator On the front panel of the MR2, there is one board hardware state indicator (STAT), which is red or green when lit. For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are eight optical interfaces on the front panel of the MR2. Table 11-10 lists the type and usage of the optical interfaces.

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Table 11-10 Optical interfaces of the MR2 Interface

Interface Type

Usage

A1–A2

LC

Receive the signals output from the optical wavelength converting board or centralized client-side equipment.

D1–D2

LC

Transmit signals to the optical wavelength converting board or centralized client-side equipment.

IN

LC

Receives multiplexed signals.

OUT

LC

Transmits multiplexed signals.

MO

LC

Acts as a concatenation output optical interface and connects to the input optical interfaces of other OADM boards.

MI

LC

Acts as a concatenation input optical interface and connects to the output optical interfaces of other OADM boards.

11.3.5 Valid Slots The MR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack.

11.3.6 Board Feature Code The board feature code of the MR2 contains eight characters, which indicate the frequency for the 2-channel optical signals processed by the board. Table 11-11 lists the details on the board feature code. Table 11-11 Feature code of the MR2 Barcode

Indication

Description

First four (1–4) characters

Frequency of optical signals

The four characters are the last four characters of the figure that marks the frequency of the first channel of optical signals.

Last four (5–8) characters

Frequency of optical signals

The four characters are the last four characters of the figure that marks the frequency of the second channel of optical signals.

For example, the feature code of the TN11MR2 is 93609370. l

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"9360" indicates that the frequency of the first channel of optical signals is 193.60 THz. Huawei Technologies Proprietary

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"9370" indicates that the frequency of the second channel of optical signals is 193.70 THz.

11.3.7 Technical Specifications The technical specifications of the MR2 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications Table 11-12 lists the specifications of the optical interfaces of the MR2. Table 11-12 Specifications of the optical interfaces of the MR2 Optical Interface

Item

Specification

-

Working wavelength range (nm)

1529 to 1561

-

Channel spacing (GHz)

100

IN-D1 IN-D2

0.5 dB passband bandwidth (nm)

≥ ±0.11

Insertion loss (dB) in the channel for dropping wavelengths

≤ 1.5

Adjacent channel isolation (dB)

> 25

Non-adjacent channel isolation (dB)

> 35

0.5 dB passband bandwidth (nm)

≥ ±0.11

Insertion loss (dB) in the channel for adding wavelengths

≤ 1.5

IN-MO MI-OUT

Insertion loss (dB)

≤ 1.0

Isolation (dB)

> 13

-

Return loss (dB)

> 40

A1-OUT A2-OUT

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications l

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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Huawei Technologies Proprietary

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Weight (kg): 0.9

Power Consumption l

In the normal temperature (25℃), the maximum power consumption of the MR2 is 0.2 W.

l

In the high temperature (55℃), the maximum power consumption of the MR2 is 0.3 W.

11.4 MR2A This section describes the MR2A, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.4.1 Version Description The functional version of the MR2A board is N1. 11.4.2 Function and Feature The MR2A is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.4.3 Working Principle and Signal Flow The MR2A consists of the OADM module, control and communication module, and DC/DC converter module. 11.4.4 Front Panel On the front panel of the MR2A, there are interfaces and laser safety class label. 11.4.5 Valid Slots The MR2A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack. 11.4.6 Technical Specifications The technical specifications of the MR2A cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.4.1 Version Description The functional version of the MR2A board is N1.

11.4.2 Function and Feature The MR2A is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-13 lists the functions and features of the MR2A.

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Table 11-13 Functions and features of the MR2A Function and Feature

MR2A

Basic function

Adds/Drops two arbitrary adjacent wavelengths, which are compliant with ITU-T G.692 (DWDM). The signals are transparently transmitted, and the working wavelength ranges from 1535.82 nm to 1560.61 nm.

OTM function

The MR2A can be used as the two-channel wavelength adding/ dropping OTM station. Two MR2C boards can be concatenated and upgraded to the four-channel wavelength adding/dropping OTM station. See Figure 11-7.

OADM function

Realizes the two-channel wavelength adding/dropping OADM station, when used with the LWX. See Figure 11-8.

Central wavelength

Supports the ITU-T-compliant standard wavelength with a channel spacing of 100 GHz.

Figure 11-7 MR2A used as the OTM station D2

D1

IN

D1

MO IN

Drop

OUT

MI

Add MR2A

D2

D1

MO IN

Drop

OUT MR2A

A1

A2

MO

Drop

MI OUT

Add

D2

MI

Add MR2A

A1

A2

(1)

A1

A2

(2)

(1)

MR2A can serve as an OTM station adding/dropping two channels.

(2)

Two MR2A boards connected in serial can serve as an OTM station adding/dropping four channels.

Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM station

LWX A2

D2 MO

Out MR2A

In D1

MI A1

LWX

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11.4.3 Working Principle and Signal Flow The MR2A consists of the OADM module, control and communication module, and DC/DC converter module. Figure 11-9 shows the block diagram for the functions of the MR2A. Figure 11-9 Block diagram for the functions of the MR2A D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module +5 V

DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The MR2A mainly includes the optical add/drop multiplexer (OADM) module adding/dropping two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also provides concatenation interfaces to connect other add/drop multiplexing boards for more powerful add/drop capability. The MR2A is a passive board that has no interface with the backplane.

OADM module The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

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Control and communication module l

Controls the entire board operation.

l

Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board.

l

Communicates data with the SCC.

DC/DC converter module Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.4.4 Front Panel On the front panel of the MR2A, there are interfaces and laser safety class label.

Appearance of the Front Panel Figure 11-10 shows the appearance of the front panel of the MR2A. Figure 11-10 Front panel of the MR2A MR2A

CLASS 1 LASER PRODUCT

OUT AO1 AO2 M I M O DO2 DO1 IN MR2A

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Interfaces There are four pairs of LC optical interfaces on the front panel of the MR2A. Table 11-14 lists the type and usage of the optical interfaces. Table 11-14 Optical interfaces of the MR2A Interface

Interface Type

Usage

A01–A02

LC

Adds two wavelengths of signals from the local.

D01–D02

LC

Drops two wavelengths of signals to the local.

IN

LC

Receives multiplexed signals of two wavelengths.

OUT

LC

Transmits multiplexed signals of two wavelengths.

MO/MI

LC

Acts as a concatenation optical interface and concatenates several MR2A boards.

11.4.5 Valid Slots The MR2A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack.

11.4.6 Technical Specifications The technical specifications of the MR2A cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications Table 11-15 lists the specifications of the optical interfaces of the MR2A. Table 11-15 Specifications of the optical interfaces of the MR2A

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Item

Description

Working wavelength

1535.82 nm to 1560.61 nm. The working wavelengths can be any two adjacent standard wavelengths defined in ITU-T G.692 (DWDM).

Line code

NRZ

Channel spacing (GHz)

100

Insertion loss (dB) in the channel for adding or dropping wavelengths

<2

Adjacent channel isolation (dB)

> 25

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Item

Description

Non-adjacent channel isolation (dB)

> 35

–0.5 dB channel bandwidth (nm)

< ±0.11

Laser Safety Class The safety class of the laser on the board is CLASS 1M. The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications The mechanical specifications of the MR2A are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the MR2A does not consume power.

11.5 MR2B This section describes the MR2B, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.5.1 Version Description The functional version of the MR2B board is N1. 11.5.2 Function and Feature The MR2B is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.5.3 Working Principle and Signal Flow The MR2B consists of the OADM module, control and communication module, and DC/DC converter module. 11.5.4 Front Panel On the front panel of the MR2B, there are interfaces and laser safety class label. 11.5.5 Valid Slots The MR2B can be housed in any of slots 2–3, 6–9, and 12–13 in the OptiX OSN 1500A subrack, or any of slots 1–3, 6–9, and 11–13 in the OptiX OSN 1500B subrack. 11.5.6 Technical Specifications The technical specifications of the MR2B cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class. 11-26

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11.5.1 Version Description The functional version of the MR2B board is N1.

11.5.2 Function and Feature The MR2B is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-16 lists the functions and features of the MR2B. Table 11-16 Functions and features of the MR2B Function and Feature

MR2B

Basic function

Adds/Drops two arbitrary adjacent wavelengths, which are compliant with ITU-T G.692 (DWDM). The signals are transparently transmitted, and the working wavelength ranges from 1535.82 nm to 1560.61 nm.

OTM function

The MR2B can be used as the two-channel wavelength adding/ dropping OTM station. Two MR2B boards can be concatenated and upgraded to the four-channel wavelength adding/dropping OTM station. See Figure 11-11.

OADM function

Realizes the two-channel wavelength adding/dropping OADM station, when used with the LWX. See Figure 11-12.

Central wavelength

Supports the ITU-T-compliant standard central wavelength with a channel spacing of 100 GHz.

Figure 11-11 MR2B used as the OTM station D2

D1

IN

D1

MO IN

Drop

OUT

MI

Add MR2B

D2

D1

MO IN

Drop

OUT MR2B

A1

A2

MO

Drop

MI OUT

Add

D2

MI

Add MR2B

A1

A2

(1)

A1

A2

(2)

(1) MR2B can serve as an OTM station adding/dropping two channels. (2) Two MR2B boards connected in serial can serve as an OTM station adding/dropping four channels.

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Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM station

LWX A2

D2 MO

Out

MI

MR2B

In D1

A1 LWX

11.5.3 Working Principle and Signal Flow The MR2B consists of the OADM module, control and communication module, and DC/DC converter module. Figure 11-13 shows the block diagram for the functions of the MR2B. Figure 11-13 Block diagram for the functions of the MR2B D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module +5 V

DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The MR2B mainly includes the optical add/drop multiplexer (OADM) module adding/dropping two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also 11-28

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provides concatenation interfaces to connect other add/drop multiplexing boards for more powerful add/drop capability. The MR2B is a passive board that has no interface with the backplane.

OADM module The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module l

Controls the entire board operation.

l

Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board.

l

Communicates data with the SCC.

DC/DC converter module Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.5.4 Front Panel On the front panel of the MR2B, there are interfaces and laser safety class label.

Appearance of the Front Panel Figure 11-14 shows the appearance of the front panel of the MR2B. Figure 11-14 Front panel of the MR2B MR 2B

MR2B CLASS 1 LASER PRODUCT

OUT AO1 AO2 M I MO DO2 DO1 IN MR2B

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Interfaces There are four pairs of optical interfaces on the front panel of the MR2B. Table 11-17 lists the type and usage of the optical interfaces. Table 11-17 Optical interfaces of the MR2B Interface

Interface Type

Usage

A01–A02

LC

Adds two wavelengths of signals from the local.

D01–D02

LC

Drops two wavelengths of signals to the local.

IN

LC

Receives multiplexed signals of two wavelengths.

OUT

LC

Transmits multiplexed signals of two wavelengths.

MO/MI

LC

Acts as a concatenation optical interface and concatenates several MR2B boards.

11.5.5 Valid Slots The MR2B can be housed in any of slots 2–3, 6–9, and 12–13 in the OptiX OSN 1500A subrack, or any of slots 1–3, 6–9, and 11–13 in the OptiX OSN 1500B subrack.

11.5.6 Technical Specifications The technical specifications of the MR2B cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications Table 11-18 lists the specifications of the optical interfaces of the MR2B. Table 11-18 Specifications of the optical interfaces of the MR2B

11-30

Item

Description

Working wavelength

1535.82 nm to 1560.61 nm. The working wavelengths can be any two adjacent standard wavelengths defined in ITU-T G. 692.

Line code

NRZ

Channel spacing (GHz)

100

Insertion loss in the wavelength-adding channel (dB)

<2

Adjacent channel isolation (dB)

> 25

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Item

Description

Non-adjacent channel isolation (dB)

> 35

–0.5 dB channel bandwidth (nm)

< ±0.11

11 WDM Processing Boards

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the MR2B are as follows: l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the MR2B does not consume power.

11.6 MR2C This section describes the MR2C, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.6.1 Version Description The functional version of the MR2C board is N1. 11.6.2 Function and Feature The MR2C is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.6.3 Working Principle and Signal Flow The MR2C consists of the OADM module, control and communication module, and DC/DC converter module. 11.6.4 Front Panel On the front panel of the MR2C, there are interfaces and laser safety class label. 11.6.5 Valid Slots The MR2C can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.The MR2C can be housed in any of slots 19–26 and 29–36 in the subrack. If an extended subrack is used, the MR2C can also be housed in any of slots 69–76 and 79–86. 11.6.6 Technical Specifications The technical specifications of the MR2C cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class. Issue 02 (2007-09-10)

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11.6.1 Version Description The functional version of the MR2C board is N1.

11.6.2 Function and Feature The MR2C is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-19 lists the functions and features of the MR2C. Table 11-19 Functions and features of the MR2C Function and Feature

MR2C

Basic function

Adds/Drops two arbitrary adjacent wavelengths, which are compliant with ITU-T G.692 (DWDM). The signals are transparently transmitted, and the working wavelength ranges from 1535.82 nm to 1560.61 nm.

OTM function

The MR2C can be used as the two-channel wavelength adding/ dropping OTM station. Two MR2C boards can be concatenated and upgraded to the four-channel wavelength adding/dropping OTM station. See Figure 11-15.

OADM function

Realizes the two-channel wavelength adding/dropping OADM station, when used with the LWX. See Figure 11-16.

Central wavelength

Supports the ITU-T-compliant standard wavelength with a channel spacing of 100 GHz.

Figure 11-15 MR2C used as the OTM station D2

D1

IN

D1

MO IN

Drop

OUT

MI

Add MR2C

D2

D1

MO IN

Drop

OUT MR2C

A1

A2

MO

Drop

MI OUT

Add

D2

MI

Add MR2C

A1

A2

(1)

A1

A2

(2)

(1) MR2C can serve as an OTM station adding/dropping two channels. (2) Two MR2C boards connected in serial can serve as an OTM station adding/dropping four channels.

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Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C and LWX

LWX A2

D2 MO

Out

MI

MR2C

In D1

A1 LWX

11.6.3 Working Principle and Signal Flow The MR2C consists of the OADM module, control and communication module, and DC/DC converter module. Figure 11-17 shows the block diagram for the functions of the MR2C. Figure 11-17 Block diagram for the functions of the MR2C D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module +5 V

DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The MR2C mainly includes the optical add/drop multiplexer (OADM) module adding/dropping two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also Issue 02 (2007-09-10)

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provides concatenation interfaces to connect other add/drop multiplexing boards for more powerful add/drop capability. The MR2C is a passive board that has no interface with the backplane.

OADM module The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module l

Controls the entire board operation.

l

Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board.

l

Communicates data with the SCC.

DC/DC converter module Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.6.4 Front Panel On the front panel of the MR2C, there are interfaces and laser safety class label.

Appearance of the Front Panel Figure 11-18 shows the appearance of the front panel of the MR2C.

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Figure 11-18 Front panel of the MR2C MR2C

CLASS 1 LASER PRODUCT

OUT AO1 AO2 M I M O DO2 DO1 IN MR2C

Interfaces There is four pairs of optical interfaces on the front panel of the MR2C. Table 11-20 lists the type and usage of the optical interfaces. Table 11-20 Optical interfaces of the MR2C

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Interface

Interface Type

Usage

A01–A02

LC

Adds two wavelengths of signals from the local.

D01–D02

LC

Drops two wavelengths of signals to the local.

IN

LC

Receives multiplexed signals of two wavelengths.

OUT

LC

Transmits multiplexed signals of two wavelengths.

MO/MI

LC

Acts as a concatenation optical interface and concatenates several MR2C boards.

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11.6.5 Valid Slots The MR2C can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.The MR2C can be housed in any of slots 19–26 and 29–36 in the subrack. If an extended subrack is used, the MR2C can also be housed in any of slots 69–76 and 79–86.

11.6.6 Technical Specifications The technical specifications of the MR2C cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications Table 11-21 lists the specifications of the optical interfaces of the MR2C. Table 11-21 Specifications of the optical interfaces of the MR2C Item

Description

Working wavelength

1535.82 nm to 1560.61 nm. The working wavelengths can be any two adjacent standard wavelengths defined in ITU-T G. 692.

Line code

NRZ

Channel spacing (GHz)

100

Insertion loss in the add/ drop channel (dB)

<2

Adjacent channel isolation (dB)

> 25

Non-adjacent channel isolation (dB)

> 35

–0.5 dB channel bandwidth (nm)

< ±0.11

Laser Safety Class The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications The mechanical specifications of the MR2C are as follows: l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the MR2C does not consume power. 11-36

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11.7 MR4 This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.7.1 Version Description The functional version of the MR4 board is TN11. 11.7.2 Function and Feature The MR4 is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.7.3 Working Principle and Signal Flow The MR4 consists of the OADM optical module, control and communication module, and DC/ DC converter module. 11.7.4 Front Panel On the front panel of the MR4, there are board indicators, interfaces and laser safety class label. 11.7.5 Valid Slots The MR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack. 11.7.6 Board Feature Code The feature code of the MR4 has eight numbers, which identify the frequency of the first and fourth channels of optical signals the board process. 11.7.7 Technical Specifications The technical specifications of the MR4 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.7.1 Version Description The functional version of the MR4 board is TN11.

11.7.2 Function and Feature The MR4 is used to the coarse code division multiple access (CDMA) system. The spacing wavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-22 lists the functions and features of the MR4. Table 11-22 Functions and features of the MR4

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Function and Feature

MR4

Basic function

Adds/Drops four wavelengths to/from the multiplexed signals.

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Function and Feature

MR4

Channel expansion

Provides the intermediate port used for expansion. Under certain conditions, the capacity of upstream and downstream channels can be expanded when the intermediate port is connected to other optical add/drop multiplexing boards.

Wavelength query

Specifies and queries the added/dropped wavelengths.

11.7.3 Working Principle and Signal Flow The MR4 consists of the OADM optical module, control and communication module, and DC/ DC converter module. Figure 11-19 shows the block diagram for the functions of the MR4. Figure 11-19 Block diagram for the functions of the MR4 D01 D02 D03 D04

MO

MI

A01 A02 A03 A04

Drop

IN

Add

OUT

OADM module

Control and communication module

Power supply module +5 V

DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

OADM module The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01–D04 four wavelengths from the signal. These four dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds four wavelengths through optical interfaces A01–A04 and 11-38

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multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module l

Controls the entire board operation.

l

Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board.

l

Communicates data with the SCC.

DC/DC converter module Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.7.4 Front Panel On the front panel of the MR4, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel Figure 11-20 shows the appearance of the front panel of the MR4.

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Figure 11-20 Front panel of the MR4

MR4 STAT

LASER RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

OUT IN MO MI D1 A1 D2 A2 D3 A3 D4 A4

MR4

Indicator On the front panel of the MR4, there is one board hardware state indicator (STAT), which is red or green when lit. For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are twelve optical interfaces on the front panel of the MR4. Table 11-23 lists the type and usage of the optical interfaces.

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Table 11-23 Optical interfaces of the MR4 Interface

Interface Type

Usage

A1–A4

LC

Receive the signals output from the optical wavelength converting board or centralized client-side equipment.

D1–D4

LC

Transmit signals to the optical wavelength converting board or centralized client-side equipment.

IN

LC

Receives multiplexed signals.

OUT

LC

Transmits multiplexed signals.

MI

LC

Acts as a concatenation input optical interface and connects to the output optical interfaces of other OADM boards.

MO

LC

Acts as a concatenation output optical interface and connects to the input optical interfaces of other OADM boards.

11.7.5 Valid Slots The MR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack.

11.7.6 Board Feature Code The feature code of the MR4 has eight numbers, which identify the frequency of the first and fourth channels of optical signals the board process. Table 11-24 lists the details on the board feature code. Table 11-24 Board feature code Barcode

Indication

Description

First four characters

Frequency of optical signals

The four characters are the last four characters of the figure that marks the frequency of the first channel of optical signals.

Last four characters

Frequency of optical signals

The four characters are the last four characters of the figure that marks the frequency of the fourth channel of optical signals.

For example, the feature code of the TN11MR4 is 92109240. l

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"9240" indicates that the frequency of the fourth channel of optical signals is 192.40 THz.

The four channels of optical signals the MR4 processes are successive: l

The frequency of the second channel of optical signals is 192.20 THz.

l

The frequency of the third channel of optical signals is 192.30 THz.

11.7.7 Technical Specifications The technical specifications of the MR4 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications Table 11-25 lists the specifications of the optical interfaces of the MR4. Table 11-25 Specifications of the optical interfaces of the MR4 Optical Interface

Item

Specification

-

Working wavelength range (nm)

1529 to 1561

-

Channel spacing (GHz)

100

IN-D1 IN-D2 IN-D3 IN-D4

0.5 dB passband bandwidth (nm)

≥ ±0.11

Insertion loss in the wavelength-dropping channel (dB)

≤ 2.2

Adjacent channel isolation (dB)

> 25

Non-adjacent channel isolation (dB)

> 35

A1-OUT A2-OUT A3-OUT A4-OUT

0.5 dB passband bandwidth (nm)

≥ ±0.11

Insertion loss in the wavelength-adding channel (dB)

≤ 2.2

IN-MO MI-OUT

Insertion loss (dB)

≤ 1.5

Isolation (dB)

> 13

-

Return loss (dB)

> 40

Laser Safety Class The safety class of the laser on the board is CLASS 1M. 11-42

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The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.9

Power Consumption l

In the normal temperature (25℃), the maximum power consumption of the MR4 is 0.2 W.

l

In the high temperature (55℃), the maximum power consumption of the MR4 is 0.3 W.

11.8 LWX This section describes the LWX, an arbitrary rate wavelength converting board, in terms of the version, function, principle, front panel, configuration and specifications. 11.8.1 Version Description The functional version of the LWX board is N1. 11.8.2 Function and Feature The LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/ s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength. 11.8.3 Working Principle and Signal Flow The LWX consists of the O/E conversion module, cross-connect module, CDR module and so on. 11.8.4 Front Panel On the front panel of the LWX, there are indicators and interfaces. 11.8.5 Valid Slots The LWX can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack. 11.8.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The feature code of the LWX indicates the schemes the optical interfaces use to receive and transmit signals. 11.8.7 Technical Specifications The technical specifications of the LWX cover the optical interface specifications, board dimensions, weight and power consumption.

11.8.1 Version Description The functional version of the LWX board is N1.

11.8.2 Function and Feature The LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/ s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength. The LWX supports the optical wavelength convertion, 3R, protection, and loopback. Issue 02 (2007-09-10)

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Table 11-26 lists the functions and features of the LWX. Table 11-26 Functions and features of the LWX Function and Feature

LWX

Basic function

Realizes the convertion between the wavelength at an arbitrary rate at the client side and the wavelength compliant with ITU-T G.692 (DWDM). Transparently transmits signals.

3R function

Provides the 3R function for the signals at the client side ranging from 10 Mbit/s to 2.7 Gbit/s. Recovers the clock, and monitors the rate.

Protection scheme

Single fed and single receiving

Supports the inter-board protection and 1+1 interboard hot backup. The switching time is less than 50 ms.

Dual fed and selective receiving

Supports the intra-board protection. The optical channel protection can be realized by one board. The switching time is less than 50 ms.

ALS function

Supports the ALS function. When no signals are received, the corresponding optical transmit module is automatically turned off.

Loopback function

Provides the inloop and outloop at the optical interface level, which are used for locating faults.

Performance and alarm monitoring

Provides rich alarms and performance events for easy maintenance.

Central wavelength

Supports the ITU-T-compliant standard wavelength with a channel spacing of 100 GHz.

11.8.3 Working Principle and Signal Flow The LWX consists of the O/E conversion module, cross-connect module, CDR module and so on. Figure 11-21 shows the block diagram for the functions of the LWX.

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Figure 11-21 Block diagram for the functions of the LWX Loopback control

10 Mbit/s~2.7 Gbit/s Optical module at

O/ E

WDM side loopback

Multi-rate

2×2 Crossconnection

CDR

client side 10 Mbit/s~2.7 Gbit/s

O/ E

Data LOS Laser shut down

LOS

10 Mbit/s~2.7 Gbit/s

communication and control module

Client side loopback

O/ E

Optical module 2 at WDM side

2×2 Crossconnection

Multi-rate CDR

Loopback control

10 Mbit/s~2.7 Gbit/s Optical module 1 at WDM side

Reference clock

Reference clock

O/ E Clock

10 Mbit/s~2.7 Gbit/s

Optical splitter

O/ E

Data

LOS

communication and control module

Laser shut down

+3.3 V +1.5 V +5V +1.8 V

DC/DC converter module

DC/DC converter module

Communication

Fuse

SCC Unit

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

O/E Conversion Module l

The optical module at client side applies SFP encapsulation and can be configured as different types of optical module. This module supports accessing optical signals at the rate of 10 Mbit/s-2.7 Gbit/s.

l

At WDM side, the module can be configured as an optical tranceiver module or an optical tranceiver module and an optical receiver module. When two modules are configured at WDM side, an optical splitter is used to realize dual feeding.

l

In the receive direction, the module converts the received optical signals into electrical signals.

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In the transmit direction, the module converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission.

l

Detect the R_LOS alarm and provide the function to shut down the laser.

Cross-connect Module l

Supports data selection from client side to WDM side and from WDM side to client side

l

Supports WDM side optical module selection

l

Supports loopback of client side signals

l

Supports loopback of WDM side signals

l

Supports recovering data and clock signals from 10 Mbit/s to 2.7 Gbit/s

l

Supports reading rates of accessed services

CDR Module

Communication and Control Module l

Supports Ethernet communication

l

Supports reference clock of the CDR module

l

Selects and configures services of other modules

l

Implements laser controlling function

l

Selects the clock from the active or the standby cross-connect board

l

Control the indicator on the board

DC/DC Converter Module Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. The –48 V/–60 V voltage is converted to the following voltages: +1.5 V, +3.3 V, +1.8 V and ±5 V. In addition, this module provides protection for the board +3.3 V power supply.

11.8.4 Front Panel On the front panel of the LWX, there are indicators and interfaces.

Appearance of the Front Panel Figure 11-22 shows the appearance of the front panel of the LWX.

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Figure 11-22 Front panel of the LWX

LWX STAT ACT PROG SRV CLASS 1 LASER PRODUCT

TX RX OUT1 IN1 OUT2 IN2 LWX

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are six optical interfaces on the front panel of the LWX. Table 11-27 lists the type and usage of the optical interfaces.

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Table 11-27 Optical interfaces on the front panel of the LWX Interface

Interface Type

Usage

IN1/IN2

LC

Receives signals from the optical add/drop multiplexing board, MR2A.

OUT1/OUT2

LC

Transmits signals to the optical add/drip multiplexing board, MR2A.

TX

LC

Transmits signals to the client-side equipment.

RX

LC

Receives signals from the client-side equipment.

Note: IN1/OUT1 and IN2/OUT2 are two pairs of optical interfaces.

11.8.5 Valid Slots The LWX can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack.

11.8.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The feature code of the LWX indicates the schemes the optical interfaces use to receive and transmit signals. Table 11-28 lists the relation between the board feature code and the receive/transmit scheme. Table 11-28 Relation between the board feature code and the receive/transmit scheme Board Barcode

Feature Code

Receive/Transmit Scheme

SSN1LWX01

01

Single-fed single selective

SSN1LWX02

02

Dual-fed single selective

11.8.7 Technical Specifications The technical specifications of the LWX cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 11-29 and Table 11-30 list the specifications of the client-side and WDM-side optical interfaces of the LWX. Table 11-29 Specifications of the client-side optical interfaces of the LWX

11-48

Item

Specification

Nominal bit rate

10 Mbit/s to 2.7 Gbit/s

Line code

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Item

Specification

Optical source type

SLM

SLM

SLM

Transmission distance (km)

15

40

80

Feature of the transmitter at S point Working wavelength range (nm)

1260 to 1360

1260 to 1360

1500 to 1580

Max. mean launched optical power (dBm)

0

+3

+3

Min. mean launched optical power (dBm)

–5

–2

–2

Min. extinction ratio (dB)

+8.2

+8.2

+8.2

Side mode suppression ratio (dB)

30

30

30

Eye pattern

Compliant with the template defined in ITU-T G.957 Recommendations

Compliant with the template defined in ITU-T G.957 Recommendations

Compliant with the template defined in ITU-T G.957 Recommendations

Feature of the receiver at S point Receiver type

PIN

PIN

APD

Wavelength range (nm) of the received signals

1200 to 1600

1200 to 1600

1200 to 1600

Receiver sensitivity (dBm)

–18

–18

–28

Min. overload (dBm)

0

–9

–9

Max. reflection coefficient (dB)

–27

–27

–27

Table 11-30 Specifications of the WDM-side optical interfaces of the LWX Item

Specification

Channel spacing (GHz)

100

Line code

NRZ

Feature of the transmitter at Sn point

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Item

Specification

Target transmission distance (km) of optical interfaces

640

170 (2 mW)

170 (10 mW)

360

Max. mean launched optical power (dBm)

–2

–2

+7

–2

Min. mean launched optical power (dBm)

+3

+3

+5

+3

Min. extinction ratio (dB)

+10

+10

+10

+10

Nominal central frequency (THz)

192.10 to 196.00

192.10 to 196.00

192.10 to 196.00

192.10 to 196.00

Central frequency deviation (GHz)

±12.5

±12.5

±12.5

±12.5

Max. –20 dB spectral width (nm)

0.2

0.4

0.4

0.4

Min. side mode suppression ratio (dB)

35

35

35

35

Dispersion compensation (ps/nm)

12800

2400

3200

1600

Eye pattern

Compliant with the template defined in ITUT G.957 Recommendati ons

Compliant with the template defined in ITUT G.957 Recommendati ons

Compliant with the template defined in ITUT G.957 Recommendati ons

Compliant with the template defined in ITUT G.957 Recommendati ons

Feature of the receiver at Rn point

11-50

Receiver type

APD

PIN

Receiving wavelength range (nm)

1200 to 1600

1200 to 1600

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Item

Specification

Receiver sensitivity (dBm)

–28

–18

Min. overload (dBm)

–9

0

Max. reflection coefficient (dB)

–27

–27

Mechanical Specifications The mechanical specifications of the LWX are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.1

Power Consumption In the normal temperature (25℃), the maximum power consumption of the LWX is 30 W.

11.9 OBU1 This section describes the TN11OBU1, an optical booster amplifier board, in terms of the version, function, principle, front panel, configuration and specifications. 11.9.1 Version Description The functional version of the OBU1 is TN11. 11.9.2 Function and Feature The OBU1 supports the in-service optical performance monitoring, gain-locking technology, and transient control technology. 11.9.3 Working Principle and Signal Flow The OBU1 consists of the EDFA optical module, optical splitter, and the control and communication module. 11.9.4 Front Panel On the front panel of the OBU1, there are indicators, interfaces, and laser safety class label. 11.9.5 Valid Slots The OBU1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack. 11.9.6 Board Feature Code The feature code of the OBU1 contains six characters and indicates the gain and maximum nominal input optical power of the optical signals. 11.9.7 Technical Specifications The technical specifications of the OBU1 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class. Issue 02 (2007-09-10)

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11.9.1 Version Description The functional version of the OBU1 is TN11.

11.9.2 Function and Feature The OBU1 supports the in-service optical performance monitoring, gain-locking technology, and transient control technology. Table 11-31 lists the functions and features of the OBU1. Table 11-31 Functions and features of the OBU1 Function and Feature

OBU1

Basic function

Amplifies a maximum of 40-channel optical signals (channel spacing: 100 GHz) at the same time. Supports the transmission without electrical trunks for different spans.

Typical gain

The typical gain of the OBU101 is 20 dB. The typical gain of the OBU102 is 23 dB.

In-service optical performance monitoring

Provides in-service performance monitoring optical interface. A small volume of optical signals are output at the optical interface to the optical spectrum analyzer or optical spectrum analyzing board. The optical spectrum analyzer or optical spectrum analyzing board monitors the multiplexed optical signals and optical performance without interrupting services.

Gain-locking technology

The EDFA of the board has the gain-locking function. When one or more channels are added or dropped, or optical signals of certain channels fluctuate, the signal gains of other channels are not affected.

Transient control technology

The EDFA of the board has the transient control function. When channels are added or dropped, the system can be upgraded or expanded without interrupting services if the optical power fluctuation is suppressed.

Performance and alarm monitoring

Checks and reports the optical power. Controls the temperature of the pumping laser. Checks the pumping drive current, back facet current, cooling current, temperature of the pumping laser, and the ambient temperature of the board.

NOTE

The OBU1 is of two types: OBU101 and OBU102. The OBU101 is used at the receive end. The OBU102 is used at the transmit end.

11.9.3 Working Principle and Signal Flow The OBU1 consists of the EDFA optical module, optical splitter, and the control and communication module. 11-52

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Figure 11-23 shows the block diagram for the functions of the OBU1. Figure 11-23 Block diagram for the functions of the OBU1 EDFA optical module

Splitter

IN

Pumping current

Detecting for temperature and pumping current

PIN

Pumping and detection module

Control and communication module

Power supply module +5 V

DC/DC converter

+5 V

DC/DC converter

+5 V

Delayed startup Fuse

Backplane -48 V/-60 V

-48 V/-60 V

SCC

Signal Flow The OBU1 accesses the multiplexed optical signals, which are amplified by the EDFA optical module. The OBU1 then outputs the amplified optical signals through the OUT port. The OBU1 also outputs few monitoring signals to the test instrument for performance analysis.

EDFA Optical Module The EDFA module is used to amplify the input optical signals. The EDFA optical module applies the gain auto-adjustment technology. With this technology, the EDFA can change the gain of working wavelength signals in the allowed range.

Optical Splitter The splitter is used to split the optical signals received from the EDFA optical module into two channels of signals with different power. One channel of signlas are output from OUT optical interface and then transmitted in the main optical channel. The other channel of signals are output to the MON port for sepctrum detection and monitoring. The power of signals at the MON is one ninety-nineth of that at the OUT interface. In other words, the power of signals at MON is 20 dB lower than that at the OUT interface.

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Control and Communication Module The control and communication module is used to control and monitor the functional modules of the board, and to manage the communication. This module collects the information on alarms and performance events, and data of working status and voltage detection of each functional module. This module then reports the information and data to the SCC. The control and communication module receives commands from the SCC to control and coordinate the working of each functional module.

11.9.4 Front Panel On the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.

Appearance of the Front Panel Figure 11-24 shows the appearance of the front panel of the OBU1. Figure 11-24 Front panel of the OBU1

OBU1 STAT ACT PROG SRV LASER RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

MON OUT IN

OBU1

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Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are three pairs of optical interfaces on the front panel of the OBU1. Table 11-32 lists the type and usage of the optical interfaces. Table 11-32 Optical interfaces of the OBU1 Interface

Interface Type

Usage

IN

LC

Inputs multiplexed signals to be amplified.

OUT

LC

Outputs the amplified multiplexed signals.

MON

LC

Connects to the test instrument to monitor the inservice performance.

11.9.5 Valid Slots The OBU1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack.

11.9.6 Board Feature Code The feature code of the OBU1 contains six characters and indicates the gain and maximum nominal input optical power of the optical signals. Table 11-33 lists the details on the board feature code. Table 11-33 Feature code of the OBU1

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Barcode

Indication

Description

First character

–

Fixed as G

Next two (2–3) characters

Gain

Gain

Fourth character

–

Fixed as I

Last two (5–6) characters

Maximum nominal input optical power

Maximum nominal input optical power

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For example, the feature code of the TN11OBU1 is G23I-3. The feature code indicates that the gain is 23 dB and the maximum nominal input optical power is –3 dBm.

11.9.7 Technical Specifications The technical specifications of the OBU1 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications Table 11-34 lists the specifications of the optical interfaces of the OBU1. Table 11-34 Specifications of optical interfaces of the OBU1 Item

Specification OBU1C01

OBU1C02

Working wavelength range (nm)

1529 to 1561

1529 to 1561

Range of input optical power (dBm)

–32 to –4

–32 to –3

Range of output optical power (dBm)

–12 to 16

–9 to 20

Input power (dBm) of a typical single wavelength

–20

–19

Maximum nominal output optical power (dBm) of a single wavelength

0

4

Path gain (dB)

20±1.5

23±1.5

Noise figure (dB)

≤ 5.5

≤ 6.0

Gain flatness (dB)

≤ 2.0

≤ 2.0

Pre-incline of the gain spectral form

0±0.2

1.0±0.2

Laser Safety Class The safety class of the laser on the board is CLASS 1M. The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications

11-56

l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.3

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Power Consumption l

The power consumption of OBU101: –

In the normal temperature (25℃), the maximum power consumption of the OBU1 is 16 W.

In the high temperature (55℃), the maximum power consumption of the OBU1 is 17.6 W. The power consumption of OBU102: –

l

–

In the normal temperature (25℃), the maximum power consumption of the OBU1 is 18 W.

–

In the high temperature (55℃), the maximum power consumption of the OBU1 is 19.8 W.

11.10 FIB This section describes the FIB, a wavelength filter and isolation board, in terms of the version, function, principle, front panel, configuration and specifications. 11.10.1 Version Description The functional version of the FIB board is N1. 11.10.2 Function and Feature The FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals. 11.10.3 Working Principle and Signal Flow The FIB consists of an isolator and a filter. 11.10.4 Front Panel On the front panel of the FIB, there are two pairs of optical interfaces. 11.10.5 Valid Slots The FIB can be housed in any of slots 12–13 in the subrack. 11.10.6 Technical Specifications The technical specifications of the FIB cover the optical interface specifications, board dimensions, weight and power consumption.

11.10.1 Version Description The functional version of the FIB board is N1.

11.10.2 Function and Feature The FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals. The FIB is used in the remote optical pump amplifier (ROPA) system. Used with the ROP, a single-wavelength long distance board, the FIB can realize long-distance optical regeneration transmission. Figure 11-25 shows the position of the FIB in an optical transmission system. Figure 11-25 Location of the FIB in the optical transmission system. C (single span)

Single span

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BA17

G.652

FIB

b(18dB)

a(54dB)

Erbium doped

G.652

ROP

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à ISO

Filter 1550.12

Optical receiver

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Table 11-35 lists the functions and features of the FIB. Table 11-35 Functions and features of the FIB Function and Feature

FIB

Optical isolator

The isolator lets optical signals pass in a unidirectional manner. The working wavelength ranges from 1529 nm to 1561 nm.

Optical filter

The filter filters all signals carried in wavelengths except those in the 1550.12 nm wavelength.

11.10.3 Working Principle and Signal Flow The FIB consists of an isolator and a filter. Figure 11-26 shows the block diagram for the functions of the FIB. Figure 11-26 Block diagram for the working principle of the FIB Isolator

Filter

After travelling for a long distance in fibers, optical signals are heavily attenuated and then degraded. The degraded signals cannot be normally received by optical receiver. In this case, the ROP should be used to amplify the gain of the optical signals. The ROP has high optical power. To prevent other factors from affecting the ROP, use the FIB to filter wavelengths. The filter of the FIB lets optical signals pass in a unidirectional manner. The filter filters all signals carried in other wavelengths except those in the 1550.12 nm wavelength. In this way, the optical receiver can normally receive optical signals.

11.10.4 Front Panel On the front panel of the FIB, there are two pairs of optical interfaces.

Appearance of the Front Panel Figure 11-27 shows the appearance of the front panel of the FIB.

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Figure 11-27 Front panel of the FIB FIB

CLASS1 LASER PRODUCT

OUT IN FIB

Interfaces On the front panel of the FIB, there are a LC optical interface and a E2000 optical interface, which are used to receive and transmit 1-channel 2.5 Gbit/s optical signals. The optical interfaces use pluggable optical modules for easy maintenance. Table 11-36 Optical interfaces of the FIB Interface

Interface Type

Usage

IN

E2000

Receive 1-channel 2.5 Gbit/s optical signals.

OUT

LC

Transmit 1-channel 2.5 Gbit/s optical signals.

11.10.5 Valid Slots The FIB can be housed in any of slots 12–13 in the subrack.

11.10.6 Technical Specifications The technical specifications of the FIB cover the optical interface specifications, board dimensions, weight and power consumption. Issue 02 (2007-09-10)

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Optical Interface Specifications Table 11-37 lists the specifications of the optical interfaces of the FIB. Table 11-37 Specifications of the optical interfaces of the FIB Item

Specification

Nominal bit rate

2488320 kbit/s

Line code

NRZ

Central wavelength (nm)

1550.12±0.05

–0.5 dB bandwidth (nm)

> 0.4

Mechanical Specifications The mechanical specifications of the FIB are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 0.4

Power Consumption The FIB does not consume power.

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12 Optical Amplifier Boards and Dispersion Compensation Boards

Optical Amplifier Boards and

Dispersion Compensation Boards

About This Chapter This chapter describes the optical amplifier boards, such as the BA2, BPA, and COA, and the dispersion compensation boards, such as the DCU. 12.1 BA2 This section describes the BA2, 2-channel optical booster amplifier board, in terms of the version, function, working principle, front panel and specifications. 12.2 BPA This section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, in terms of the version, function, principle, front panel and specifications. 12.3 COA This section describes the COA, a case-shaped optical amplifier, in terms of the version, function, principle, front panel, installation position and specifications.

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12.1 BA2 This section describes the BA2, 2-channel optical booster amplifier board, in terms of the version, function, working principle, front panel and specifications. 12.1.1 Version Description The functional version of the BA2 board is N1. 12.1.2 Function and Feature During the long-haul transmission of optical signals, the attenuation of signals is high. The BA should be used, and thus the optical receiver can normally receive optical signals. 12.1.3 Working Principle and Signal Flow The BA2 consists of the EDFA module, control module, communication module, and DC/DC converter module. 12.1.4 Front Panel On the front panel of the BA2, there are indicators and interfaces. 12.1.5 Valid Slots The BA2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack. 12.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the BA2 indicates the output optical power of the optical interfaces. 12.1.7 Technical Specifications The technical specifications of the BA2 cover the optical interface specifications, board dimensions, weight and power consumption.

12.1.1 Version Description The functional version of the BA2 board is N1.

12.1.2 Function and Feature During the long-haul transmission of optical signals, the attenuation of signals is high. The BA should be used, and thus the optical receiver can normally receive optical signals. Figure 12-1 shows the location of the BA in the optical transmission system. Figure 12-1 Location of the BA in the optical transmission system Transmit

BA

Receive

The BA2 amplifies the power of two-channel optical signals. Table 12-1 lists the functions and features of the BA2.

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Table 12-1 Functions and features of the BA2 Function and Feature

BA2

Basic function

Increases the launched optical power of the line board to 13–15 dBm or 15–18 dBm. Thus, when the G.652 optical fiber with a loss of 0.275 dB/km is used, the transmission distance can be 120 km, 130 km, or above.

EDFA

Automatically controls the optical power and laser temperature of the EDFA module. Automatically monitors the input and output optical power of the EDFA module and queries the optical power. Protects the EDFA module. When no optical signals are input, the laser is automatically turned off. When optical signals are input, the laser is automatically turned on.

Performance and alarm monitoring

Reports the performance parameters of the laser. Provides rich alarms and performance events for easy management and maintenance of the equipment.

Software upgrade

Supports the software upgrade and expansion without interrupting services.

NOTE

The BA2 provides the IPA function. When the IPA function is enabled, the pumping laser is turned off if no input signals are detected on the receive end of the line board. Thus, this function is used to prevent the high laser power from damaging eyes.

12.1.3 Working Principle and Signal Flow The BA2 consists of the EDFA module, control module, communication module, and DC/DC converter module. Figure 12-2 shows the block diagram for the functions of the BA2.

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Figure 12-2 Block diagram for the functions of the BA2 Optical input

EDFA module Doped erbium fiber

Input isolate

Fiber distributor

WDM coupler

Input power monitor (Pin1)

Output isolate

Pump current

Pump current Temperature detect

Laser shutdown

Manual control

Optical output

Output power monitor (Pin2)

Laser pump

Input power

Optical splitter

Filter

Output power

Pump temperature control

LOS in

AD/DA

Control&Generation alarms Control module

Communication module

+3.3 V 5V

DC/DC converter module

DC/DC converter module

Communication SCC unit

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

EDFA Module The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central wavelength is added to the optical output end of the module. A booster amplifier (BA) does not have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the erbium fiber through an optical coupler. The input and output optical signals of the module are led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA module are determined as per the optical signals. The module also applies optical isolating measures at the input and the output ends to improve the performance of the module.

Control Module The control module: l

Detects and drives bump electricity

l

Controls the pump temperature of laser

l

Detects input and output power

l

Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D converting unit converts the temperature value of the cooling electricity and the input/output 12-4

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optical power from analog values to digital values. The converted values are then sent to CPU, which generates performance reporting event or alarm. The A/D converting unit also converts bump electricity from analog values to digital values. The converted values are then sent to CPU. After the CPU processes the converted values, the D/A converting unit controls precisely the driving analog circuit of the bump laser of the EDFA optical module. The internal temperature of the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputs temperature change to drive cooler to keep the internal temperature of the bump laser module at 25℃.

Communication Module The communication module supports ethernet communication.

DC/DC Converter Module Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. In addition, this module provides protection to the board +3.3 V power supply.

12.1.4 Front Panel On the front panel of the BA2, there are indicators and interfaces.

Appearance of the Front Panel Figure 12-3 shows the appearance of the front panel of the BA2.

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Figure 12-3 Front panel of the BA2 BA2 STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2 BA2

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces On the front panel of the BA2, there are two pairs of LC optical interfaces, which use the pluggable optical modules for easy maintenance. Table 12-2 lists the type and usage of these optical interfaces.

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Table 12-2 Optical interfaces of the BA2 Interface

Interface Type

Usage

IN1

LC

Receives the first channel of optical signals.

OUT1

LC

Transmits the first channel of optical signals.

IN2

LC

Receives the second channel of optical signals.

OUT2

LC

Transmits the second channel of optical signals.

12.1.5 Valid Slots The BA2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack.

12.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the BA2 indicates the output optical power of the optical interfaces. Table 12-3 lists the relation between the board feature code and the output optical power. Table 12-3 Relation between the board feature code and output optical power for the BA2 Board Barcode

Feature Code

Output Optical Power

SSN1BA201

01

14 dBm for dual-channel optical power amplification

SSN1BA202

02

17 dBm for dual-channel optical power amplification

SSN1BA203

03

14 dBm for optical power amplification

SSN1BA204

04

17 dBm for optical power amplification

SSN1BA205

05

14 or 17 dBm for dual-channel optical power amplification

12.1.7 Technical Specifications The technical specifications of the BA2 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 12-4 lists the specifications of the optical interfaces of the BA2.

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Table 12-4 Specifications of the optical interfaces of the BA2 Item

Specification

Nominal bit rate

2488320 kbit/s and 9953280 kbit/s

Optical interface type

V-16.2, U-16.2, L-64.2, V-64.2, U-64.2

Line code

NRZ

Input wavelength (nm)

BA: 1530 to 1565

Range of input optical power (dBm)

BA: –6 to +3

Output optical power (dBm)

BA: 13 to 15 or 15 to 17

Noise figure (dB)

BA: < 6.5

Mechanical Specifications The mechanical specifications of the BA2 are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the BA2 is 20 W.

12.2 BPA This section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, in terms of the version, function, principle, front panel and specifications. 12.2.1 Version Description The functional version of the BPA board is N1. 12.2.2 Function and Feature During the long-haul transmission of optical signals, the attenuation of signals is high. The BA and PA should be used, and thus the optical receiver can normally receive optical signals. 12.2.3 Working Principle and Signal Flow The BPA consists of the EDFA module, control module, communication module, and DC/DC converter module. 12.2.4 Front Panel On the front panel of the BPA, there are indicators and interfaces. 12.2.5 Valid Slots The BPA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack. 12.2.6 Board Feature Code 12-8

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The code behind the board name in the barcode is the board feature code. The board feature code of the BPA indicates the output optical power of the optical interfaces. 12.2.7 Technical Specifications The technical specifications of the BPA cover the optical interface specifications, board dimensions, weight and power consumption.

12.2.1 Version Description The functional version of the BPA board is N1.

12.2.2 Function and Feature During the long-haul transmission of optical signals, the attenuation of signals is high. The BA and PA should be used, and thus the optical receiver can normally receive optical signals. Figure 12-4 shows the location of the BA and PA in the optical transmission system. Figure 12-4 Location of the BA and PA in the optical transmission system Transmit

Receive

BA

Transmit

PA

Receive

Table 12-5 lists the functions and features of the BPA. Table 12-5 Functions and features of the BPA

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Function and Feature

BPA

Basic function

Increases the launched optical power of the line board to 13–15 dBm or 15–18 dBm. Thus, when the G.652 optical fiber with a loss of 0.275 dB/km is used, the transmission distance can be 120 km, 130 km, or above.

Function of the PA

Provides the PA module to preamplify the received optical signals. Increases the power of the small volume of optical signals by 22–25 dB, and thus enhances the sensitivity of the receiver to –37 dBm.

EDFA

l

Automatically controls the optical power and laser temperature of the EDFA module.

l

Automatically monitors the input and output optical power of the EDFA module and queries the optical power.

l

Protects the EDFA module. When no optical signals are input, the laser is automatically turned off. When optical signals are input, the laser is automatically turned on. Huawei Technologies Proprietary

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Function and Feature

BPA

Performance and alarm monitoringa

Reports the performance parameters of the laser. Provides rich alarms and performance events for easy management and maintenance of the equipment.

Software upgrade

Supports the software upgrade and expansion without interrupting services.

a:The BPA does not support the alarm in the test state and the query of the power supply voltage.

12.2.3 Working Principle and Signal Flow The BPA consists of the EDFA module, control module, communication module, and DC/DC converter module. Figure 12-5 shows the block diagram for the functions of the BPA. Figure 12-5 Block diagram for the working principle of the BPA Optical input

EDFA module Doped erbium fiber

Input isolate

Fiber distributor

WDM coupler

Input power monitor (Pin1)

Output isolate

Pump current

Pump current Temperature detect

Laser shutdown

Manual control

Optical output

Output power monitor (Pin2)

Laser pump

Input power

Optical splitter

Filter

Output power

Pump temperature control

LOS in

AD/DA

Control&Generation alarms Control module

Communication module

+3.3 V 5V

DC/DC converter module

DC/DC converter module

Communication SCC unit

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

EDFA Module The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central wavelength is added to the optical output end of the module. A booster amplifier (BA) does not 12-10

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have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the erbium fiber through an optical coupler. The input and output optical signals of the module are led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA module are determined as per the optical signals. The module also applies optical isolating measures at the input and the output ends to improve the performance of the module.

Control Module The control module: l

Detects and drives bump electricity

l

Controls the pump temperature of laser

l

Detects input and output power

l

Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D converting unit converts the temperature value of the cooling electricity and the input/output optical power from analog values to digital values. The converted values are then sent to CPU, which generates performance reporting event or alarm. The A/D converting unit also converts bump electricity from analog values to digital values. The converted values are then sent to CPU. After the CPU processes the converted values, the D/A converting unit controls precisely the driving analog circuit of the bump laser of the EDFA optical module. The internal temperature of the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputs temperature change to drive cooler to keep the internal temperature of the bump laser module at 25℃.

Communication Module The communication module supports ethernet communication.

DC/DC Converter Module Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. In addition, this module provides protection to the board +3.3 V power supply.

12.2.4 Front Panel On the front panel of the BPA, there are indicators and interfaces.

Appearance of the Front Panel Figure 12-6 shows the appearance of the front panel of the BPA.

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Figure 12-6 Front panel of the BPA BPA STAT ACT PROG SRV

BOUT BIN POUT PIN BPA

Indicators The following indicators are present on the front panel of the board: l

Board hardware state indicator (STAT), which is green or red when lit.

l

Service activating state indicator (ACT), which is green when lit.

l

Board software state indicator (PROG), which is green or red when lit.

l

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces On the front panel of the BPA, there are two pairs of LC optical interfaces, which use the pluggable optical modules for easy maintenance. Table 12-6 lists the type and usage of these optical interfaces.

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Table 12-6 Optical interfaces of the BPA Interface

Interface Type

Usage

BIN

LC

Receives one channel of optical signals for amplification.

BOUT

LC

Transmits one channel of amplified optical signals.

PIN

LC

Receives one channel of optical signals for preamplification.

POUT

LC

Transmits one channel of pre-amplified optical signals.

12.2.5 Valid Slots The BPA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots 11–13 in the OptiX OSN 1500B subrack.

12.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the BPA indicates the output optical power of the optical interfaces. Table 12-7 lists the relation between the board feature code and the output optical power. Table 12-7 Relation between the board feature code and output optical power for the BPA Board Barcode

Feature Code

Description

SSN1BPA01

01

Receiver sensitivity of the PA module: –37 dBm Output optical power of the BA module: 14 dBm

SSN1BPA02

02

Receiver sensitivity of the PA module: –37 dBm Output optical power of the BA module: 17 dBm

12.2.7 Technical Specifications The technical specifications of the BPA cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications Table 12-8 lists the specifications of the optical interfaces of the BPA.

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Table 12-8 Specifications of the optical interfaces of the BPA Item

Specification

Nominal bit rate

2488320 kbit/s and 9953280 kbit/s

Optical interface type

V-16.2, U-16.2, L-64.2, V-64.2, U-64.2

Line code

NRZ

Input wavelength (nm)

BA: 1530 to 1565 PA: 1550.12

Range of input optical power (dBm)

BA: –6 to +3

Output optical power (dBm)

BA: +13 to +15 or +15 to +17

Sensitivity (dBm)

PA: –37

Noise figure (dB)

BA: < 6.5

PA: –10 to –37

PA: < 6 NOTE

When performing loopback to the PA module of the BPA, prevent the damage caused by high input optical power to the optical module.

Mechanical Specifications The mechanical specifications of the BPA are as follows: l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the BPA is 20 W.

12.3 COA This section describes the COA, a case-shaped optical amplifier, in terms of the version, function, principle, front panel, installation position and specifications. 12.3.1 Version Description The COA has three versions, 61, 62 and N1. 12.3.2 Function and Feature The COA is used to integrate the EDFA module, drive circuit, and communication circuit in an aluminium case. 12.3.3 Working Principle and Signal Flow The 61COA and N1COA consist of the EDFA module, control module, communication module, and DC/DC converter module. 12-14

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12.3.4 Front Panel On the front panel of the COA, there are indicators and interfaces. 12.3.5 Installation Position The COA is case-shaped, and thus it is does not occupy a slot in the subrack. 12.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the 61COA indicates the output optical power of the optical interfaces. 12.3.7 Technical Specifications The technical specifications of the COA cover the dimensions, weight and power consumption.

12.3.1 Version Description The COA has three versions, 61, 62 and N1. The 62COA, 61COA and N1COA share the working principle. The difference among them lies in the optical amplifier modules they use. The 62COA uses the Raman optical amplifier module. The 61COA and N1COA use the EDFA optical amplifier module. Table 12-9 lists the details on the versions of the COA. Table 12-9 Version Description of the COA Item

Description

Functional version

The COA has three versions, 61, 62, and N1.

Difference

The 61COA is the EDFA optical amplifier in the 1550-nm fiber communication window. The N1COA is the EDFA optical amplifier in the 1530 nm to 1560 nm fiber communication window. The N1COA does not have the filter and is a multi-wavelength amplifier. The 62COA uses the Raman optical amplifier module.

Replaceability

The versions cannot be replaced by each other.

12.3.2 Function and Feature The COA is used to integrate the EDFA module, drive circuit, and communication circuit in an aluminium case. The COA is an external and independent amplifier, which does not occupy a slot and can work independently. The maximum numbers of the 61COA, N1COA, and 62COA that can be configured in a system are two, two, and one respectively.

61COA and N1COA The 61COA and N1COA, erbium doped amplifiers, can be configured with only one EDFA optical module and be used as the BA, PA, or LA. Figure 12-7 shows the appearance of the 61COA and N1COA. The optical features of the 61COA are the same as those of the BPA and BA2. The main difference is that the 61COA and N1COA are external optical amplifier units, which are directly Issue 02 (2007-09-10)

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installed in the ETSI cabinetwithout occupying slots in the subrack and are independently powered. Figure 12-7 Appearance of the case-shaped 61COA and N1COA (PA)

The application of the 61COA and N1COA in the optical transmission system is the same as that of the BA2 and BPA. Table 12-10 lists the functions and features of the 61COA and N1COA. Table 12-10 Functions and features of the 61COA and N1COA Function and Feature

61COA and N1COA

Function of the BA

The 61COA enhances the launched optical power to 13–15 dBm or 15–17 dBm, and thus the valid transmission distance of optical signals can be extended.

Function of the PA

The N1COA is a PA, with a receiver sensitivity of –38 dBm.

Automatic laser shutdown

Supports the ALS function.

Function of the serial communication

Communicates with the CXL through the RS232 serial port, reports the alarms and performance events from the COA to the T2000, and receives the configuration commands issued by the T2000.

62COA The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the SDH equipment. The 62COA inputs counter-propagated pumping optical signals to fibers for distributed Raman amplification. Different from that of the 61COA, the gain medium of Raman amplification is the line fiber that can realize better noise performance. Thus, the 62COA can extend the transmission distance, lower the signal-to-noise ratio and realize ultra long hop transmission for a single span. Figure 12-8 lists the appearance of the 62COA.

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Figure 12-8 Appearance of the case-shaped 62COA 4

1

2 3

5

1. Captive screw 4. ESD jack

2. Ejector lever 5. Power access board

3. COA board

The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the transmission system. During the transmission, the 62COA amplifies optical signals based on the stimulated Raman scattering of the fiber. The 62COA provides optical transmission for more than 170 km, when used with the EDFA. See Figure 12-9. Figure 12-9 Application of the optical Raman amplifier (62COA) Raman Amplifier Signal light EDFA

Pump light Fiber

Transmitting end

Pump light

Optical receiver

Laser

Coupler

Receiving end

During the optical transmission, the Raman amplifier amplifies optical signals by inputing counter-propagated pumping optical signals to fibers for distributed Raman amplification. Thus, the phase of optical signals is significantly different from that of pumping signals. The power fluctuation of the Raman pumping is offset in the counter-propagation, and thus the noise caused by the pumping can be effectively suppressed. Table 12-11 lists the functions and features of the 62COA.

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Table 12-11 Functions and features of the 62COA Function and Feature

62COA

Basic function

Configured at the receive end of the SDH system, and provides extra long-haul transmission (more than 170 km), when used with an EDFA at the transmit end with an output power of 17 dBm.

Function of the PA

The 62COA is a PA, with a receiver sensitivity of -39 dBm.

Automatic laser shutdown

Supports the ALS function.

Function of the serial communication

Communicates with the CXL through the RS232 serial port, reports the alarms and performance events from the COA to the T2000, and receives the configuration commands issued by the T2000.

12.3.3 Working Principle and Signal Flow The 61COA and N1COA consist of the EDFA module, control module, communication module, and DC/DC converter module. The working principle of the N1COA is similar to that of the 61COA. The 61COA has the filter unit but the N1COA does not. Figure 12-10 shows the block diagram for the functions of the 61COA and N1COA. Figure 12-10 Block diagram for the functions of the 61COA and N1COA Optical input

EDFA module Doped erbium fiber

Input isolate

Fiber distributor

WDM coupler

Input power monitor (Pin1)

Output isolate

Pump current

Pump current Temperature detect

Laser shutdown

Manual control

Optical output

Output power monitor (Pin2)

Laser pump

Input power

Optical splitter

Filter

Output power

Pump temperature control

LOS in

AD/DA

Control&Generation alarms Control module

Communication module

+3.3 V 5V

12-18

DC/DC converter module

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DC/DC converter module

Communication SCC unit

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

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EDFA Module The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central wavelength is added to the optical output end of the module. A booster amplifier (BA) does not have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the erbium fiber through an optical coupler. The input and output optical signals of the module are led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA module are determined as per the optical signals. The module also applies optical isolating measures at the input and the output ends to improve the performance of the module.

Control Module The control module: l

Detects and drives bump electricity

l

Controls the pump temperature of laser

l

Detects input and output power

l

Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D converting unit converts the temperature value of the cooling electricity and the input/output optical power from analog values to digital values. The converted values are then sent to CPU, which generates performance reporting event or alarm. The A/D converting unit also converts bump electricity from analog values to digital values. The converted values are then sent to CPU. After the CPU processes the converted values, the D/A converting unit controls precisely the driving analog circuit of the bump laser of the EDFA optical module. The internal temperature of the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputs temperature change to drive cooler to keep the internal temperature of the bump laser module at 25℃.

Communication Module The communication module supports ethernet communication.

DC/DC Converter Module Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. In addition, this module provides protection to the board +3.3 V power supply.

12.3.4 Front Panel On the front panel of the COA, there are indicators and interfaces.

Appearance of the Front Panel Figure 12-11 shows the appearance of the front panels of the 61COA and N1COA. Issue 02 (2007-09-10)

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Figure 12-11 Front panel of the 61COA and N1COA 9

8

1

2

3

1. ID DIP switch 5. RS232-2 9. OUT optical port

4

5

2. Running indicator 6. MONITOR-1 10. Power switch

6

10

7

11

3. Alarm indicator 4. RS232-1 7. MONITOR-2 8. IN optical port 11. –48 V power interface

Figure 12-12 shows the appearance of the front panel of the 62COA. Figure 12-12 Front panel of the 62COA

1. SC/PC optical interface 4. Fan board 7. RS232 -2 10. Power input interface

2. E2000 optical interface 5. RJ-45 8. DIP switch (8–5 bits) 11. Power switch

3. Air filter 6. RS232-1 9. DIP switch (4–1 bits)

Indicators The following indicators are present on the front panel of the board: l

Board running state (RUN), which is green when lit.

l

Fan alarm indicator (ALM), which is red when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces On the front panel of the 61COA and N1COA, there are one pair of SC/PC optical interfaces, which are used to input or output one channel of optical signals. The input optical interface of the 62COA is connected to the E2000 flange and the output optical interface is connected to the SC flange. Figure 12-13 shows the SC/PC optical interfaces of the 61COA and N1COA. 12-20

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Figure 12-13 SC/PC fiber connector

Figure 12-14 shows the flange and fiber connector used at the input optical interface of the 62COA. Figure 12-14 E2000 flange and fiber connector

NOTE

The dust cap is specially designed for the E2000 fiber jumper. Do not remove the cap during fiber connection. For normal fiber connection, directly insert the fiber jumper into the E2000 flange.

The COA has two RS232 serial interfaces, which are connected to the SCC unit for reporting of alarms and performance events. Table 12-12 lists the pins of the RS232 interface.

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Table 12-12 Pins of the RS232 interface Front View

9

RS232-2

Definition

2

2

Pin for receiving data

3

3

Pin for transmitting data

5

5

Pin for common grounding

1

RS232-1

TIP

For the communication with the CXL, the RS232-1 interface of the COA is connected to the F&f interface through the serial control cable.

The RS232-2 interface is used in the case of several COA on one NE. Use the serial interface cable to connect the RS232-2 interface of the COA numbered 1 to the RS232-1 interface of the COA numbered 2. Then connect the RS232-2 interface of the COA numbered 2 to the RS232-1 of the COA numbered 1. Connect the RS232-1 and RS232-2 interfaces in this way. All the COA use the RS232-1 interface of the COA numbered 1 to communicate with the SCC unit in the subrack. The COA has two MONITOR interfaces. The MONITOR-1 and MONITOR-2 interfaces are the alarm output interfaces when the 61COA is used separately. The two interfaces are the same. Table 12-13 lists the pins of the MONITOR-1 and MONITOR-2 interfaces. Table 12-13 Pins of the MONITOR-1 and MONITOR-2 interfaces Front View

9

MONITOR-2

Definition

1, 6

1, 6

The input optical power of the EDFA module is too low.

2, 7

2, 7

The working current of the pump laser of the EDFA module crosses the threshold.

3, 8

3, 8

The cooling current of the pump laser of the EDFA module crosses the threshold.

4, 9

4, 9

The ambient temperature of the EDFA crosses the threshold.

5

5

Digital ground.

1

MONITOR1

The 62COA has one RJ-45 connector, through which the 62COA is connected to the computer for software loading. Table 12-14 lists the pins of the RJ-45 connector of the 62COA.

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Table 12-14 Pins of the RJ-45 connector of the 62COA Front View

8 7 6 5 4 3 2 1

Pin

Description

1

Transmitting positive

2

Transmitting negative

3

Receiving positive

4

Not defined

5

Not defined

6

Receiving negative

7–8

Not defined

The COA has a DIP switch. l

The DIP switch of the 61COA or N1COA is on the lower left panel and is used to set the ID for 61COA or N1COA. When you turn it upside, it is OFF. When you turn it downside, it is ON. The SCC uses the IDs to identify and communicate with the 61COA or N1COA.

l

The DIP switch of the 62COA is used to set the ID of 62COA and the type of fibers. The DIP switch has eight bits, from the left to right. The most left one is 8 and the most right one is 1. For each bit, when you turn it upside, it means 0; when you turn it downside, it means 1. The first four bits (1–4) are used to set the board ID, which ranges from 20 to 35 and from 20 to 27 in actual using. The fifth bit is used to set the fiber type. If it is turned as 0, it indicates the fiber is of the G.652 type. If it is turned as 1, it indicates the fiber is of the G.655 type.

12.3.5 Installation Position The COA is case-shaped, and thus it is does not occupy a slot in the subrack. In an ETSI cabinet, the 61COA or N1COA is intalled in a special bracket, and the 62COA is installed directly in the cabinet with the mounting ears. On the T2000, the logical slots of the 61COA, N1COA, and 62COA are slots 101–102.

Installation of the 61COA or N1COA The installation of the 61COA is taken as an example. The bracket with guide rails is fixed on the crossbars on both sides the cabinet. The 61COA is pushed into the brackets along the guide rails and then fixed. One bracket can house two 61COA horizontally. The front panel of the 61COA is at the front side of the cabinet. Figure 12-15 shows the installation of the 61COA.

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Figure 12-15 Position of the 61COA in the ETSI cabinet

Installation of the 62COA The case-shaped 62COA can be installed in the 300 mm or 600 mm ETSI cabinet with mounting ears and screws. If the upward-wiring scheme is applied, the 62COA is installed at the bottom of the ETSI cabinet (first and third floating nuts). If the downward-wiring scheme is applied, the 62COA is installed in any idle place of the 2.6 m high cabinet or in the ETSI cabinet which is not fully configured.

12.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the 61COA indicates the output optical power of the optical interfaces. Table 12-15 lists the relation between the board feature code and the output optical power. Table 12-15 Relation between the board feature code and output optical power for the 61COA Board Barcode

Feature Code

Output Optical Power

SS61COA01

01

14 dBm

SS61COA02

02

17 dBm

12.3.7 Technical Specifications The technical specifications of the COA cover the dimensions, weight and power consumption.

Optical Interface Specifications Table 12-16 lists the specifications of the optical interfaces of the COA. Table 12-16 Specifications of the optical interfaces of the COA Item

Specification 61COA

Line code 12-24

N1COA

62COA

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12 Optical Amplifier Boards and Dispersion Compensation Boards

Specification 61COA

N1COA

62COA

Working wavelength (nm)

1550

1550.12

Range of input optical power (dBm)

BA: -6 to +3

Output optical power (dBm)

+13 to +15

Pump wavelength (nm)

NA

1451.2

Max. on/off gain (dB)

NA

> 15 (for the G.652 fiber)

Noise figure (dB)

NA

< –1.5

-10 to -37

–39 to –20 (2.5 Gbit/s signals without FEC)

+15 to +17

NA

PA: -10 to -37

Mechanical Specifications The mechanical specifications of the 61COA and N1COA are as follows: l

Board dimensions (mm): 50 (H) x 190 (D) x 240 (W)

l

Weight (kg): 3.5

The mechanical specifications of the 62COA are as follows: l

Board dimensions (mm): 86 (H) x 436 (D) x 294 (W)

l

Weight (kg): 8.0

Power Consumption In the normal temperature (25℃), the maximum power consumption of the 61COA and N1COA is 10 W. In the normal temperature (25℃), the maximum power consumption of the 62COA is 75 W.

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13 Power Interface Boards

Power Interface Boards

About This Chapter This chapter describes the power interface boards, such as the UPM (CAU), PIU, and PIUA. 13.1 UPM This section describes the UPM, an uninterruptable power module, in terms of the version, function, principle, front panel and specifications. 13.2 PIU This section describes the PIU, a power interface unit, in terms of the version, function, principle, front panel, configuration and specifications. 13.3 PIUA This section describes the PIUA, a power interface unit, in terms of the version, function, principle, front panel, configuration and specifications.

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13.1 UPM This section describes the UPM, an uninterruptable power module, in terms of the version, function, principle, front panel and specifications. 13.1.1 Version Description None 13.1.2 Function and Feature The UPM, a special power supply system, is coded GIE4805S. 13.1.3 Working Principle and Signal Flow The UPM receives power from one channel of 220 V AC mains supply, which is rectified to – 48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DC power supplies and one channel of battery power supply. 13.1.4 Rear Panel On the rear panel of UPM, there are indicators and interfaces of many types. 13.1.5 Valid Slots The UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, the logical slot of the UPM is slot 50. 13.1.6 Technical Specifications The technical specifications of the UPM cover dimensions and weight.

13.1.1 Version Description None

13.1.2 Function and Feature The UPM, a special power supply system, is coded GIE4805S. The UPM directly converts the 110 V or 220 V AC mains to the –48 DC communication voltage. As a result, the requirements of telecommunication carriers who cannot provide the –48 DC power to communication equipment or who require the usage of the storage battery can be met. The UPM consists of the power supply case (110 V or 220 V to –48 V) and storage battery. The output power of one UPM is 2 x 270 W. Figure 13-1 shows the appearance of the power supply case with a height of 1U. The power supply case of the UPM can be directly installed in a 19inch or ETSI cabinet. Figure 13-1 Appearance of the power supply case

80 E4 GI

13-2

5S

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NOTE

One the T2000, the UPM is displayed as a CAU board. Thus, add a CAU on the T2000 to manage and maintain the UPM.

The storage battery of the UPM is used with the power supply case. If the external AC current normally charges the storage battery, the storage battery can provide power for four hours when the external 110 V or 220 V AC current is interrupted. When the UPM provides power supply for the OptiX OSN equipment, only one power supply case should be connected to the storage battery group. The OptiX OSN equipment requires two power supply cases and one storage battery group composed of four 12 V –40 Ah storage batteries. If the equipment does not require the storage battery, only configure one power supply case. The standard full configuration for each power supply case requires two rectifier modules and one monitoring module. Table 13-1 lists the functions and features of the UPM. Table 13-1 Functions and features of the UPM Item

UPM

Two-channel hot backup

The converting portion of the UPM has the hot backup function of two-channel AC/DC rectifier modules. In addition, the two rectifier modules with the function of load balance can work at the same. If one rectifier module fails, the other one immediately takes over the entire load. As a result, the working equipment is not affected, and the system stability is enhanced.

Hot swap function

In the UPM power supply system, the AC/DC rectifier modules have the hot swap function. When the faulty rectifier module is removed, the other rectifier module is not affected. Thus, the system maintainability is enhanced.

Protection function for the storage battery

The UPM can protect the storage battery. When the mains supply is interrupted, the power supply system can automatically switch to the storage battery. Thus, the normal running of equipment is not affected. The capacity of the storage battery module is 40 Ah.

Function of monitoring

The UPM integrates the monitoring module and T2000 monitoring module. The monitoring module monitors and controls the parameters and states of the rectifier module, AC/DC power distribution, and storage battery group in real time, and then reports the parameters and states to the T2000. The storage battery automaticallly realizes the floating charging and current limiting management.

Band loading capacity

The band loading capacity of each rectifier module is 270 W.

13.1.3 Working Principle and Signal Flow The UPM receives power from one channel of 220 V AC mains supply, which is rectified to – 48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DC power supplies and one channel of battery power supply. Issue 02 (2007-09-10)

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When the UPM works normally, the monitoring module controls the rectifier module, battery loop circuit and loading loop circuit, which then work according to the preset parameters and user settings. The monitoring module also monitors their status and data. When the mains power supply goes faulty, the battery power supply system supplies power to the equipment. Before the mains power supply goes faulty, the battery power supply system must be present. When the mains power supply fails and the battery starts discharging, the monitoring module reports the alarms indicating the fault of the mains power supply. As the battery discharges, the battery voltage decreases. When the battery voltage decreases to 45 V, the monitoring module reports the alarm indicating the undervoltage. When the battery voltage decreases to 43 V, the battery cuts off the connection to the equipment and protects itself. When the mains power supply recovers, the UPM works normally.

13.1.4 Rear Panel On the rear panel of UPM, there are indicators and interfaces of many types.

Appearance of the Front Panel Figure 13-2 shows the rear view of the UPM (subject to the UPM on site ). Figure 13-2 Rear view of the UPM 4 BAT

! CAUTION

BAT-

DO NOT INVERT POLARITY 注意极性防止反接

BAT+ 48V+ 48VLOAD1

LOAD2

5 AC100~240

6 RUN

ALM Vout

ALM

ALM Vout RS232

2

1 1. AC input 5. Load

2. Rectifier module/air outlet 6. Load

3 3. Communication interface

4. Battery interface

Indicators The following indicators are for the rectifier module on the left of the UPM. l

Rectifier module fault indicator (ALM), which is red when lit.

l

Rectifier module output state indicator (Vout), which is green when lit.

The following indicators are for the monitoring module on the top panel of the UPM. l

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Power supply system fault indicator (ALM), which is red when lit. Huawei Technologies Proprietary

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Power supply system indicator (RUN), which is green when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are four interfaces on the rear panel of the UPM. Table 13-2 lists the type and usage of these interfaces. Table 13-2 Interfaces on the rear panel of the UPM Interface

Interface Type

Usage

AC100–240

Power interface

Acts as a socket for the AC mains supply and accesses 110 V or 220 V AC power supply.

Red switch button

Button

Locates on the right of the panel of the rectifier module. Press the switch button to enable or disable the functioning of the rectifier module.

RS232 communication interface

RS232

The power supply system can connect to the SCC of the OptiX OSN equipment through this interface to realize the functions such as the alarm reporting and remote control. Connect the RS232 serial interface of one power box to the F&f interface of the OptiX OSN equipment. The T2000 then can monitor the battery and the power box. Connect the RS232 interface of the other power box to the ALM1 interface of the OptiX OSN equipment. The T2000 then can monitor the other power box.

Power output interface

Power interface

Three power output interfaces are on the most right of the power box. The top interface is a battery interface, which can be connected to the socket on the battery by using battery cables. The bottom two are loading interfaces, which can be connected to the OptiX OSN equipment and supply power to the equipment.

Table 13-3 lists the pins of the RS232 interface. Table 13-3 Pins of the RS232 interface of the UPM

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Item

Pin

Usage or on/off State

Pin for receiving data

2

Receives data.

Pin for transmitting data

3

Transmits data.

Pin for common grounding

5

Grounds.

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Item

Pin

Usage or on/off State

Pins for alarms indicating faults of the rectifier module

8–9

On

Pins for normal state of the rectifier module

8–9

Off

Pins for alarms indicating the off state of the AC power supply

8–7

On

Pins for the normal state of the AC power supply

8–7

Off

Pins for the alarm indicating undervoltage discharged from the battery

8–6

On

Pins for the alarm indicating no discharge from the battery

8–6

Off

13.1.5 Valid Slots The UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, the logical slot of the UPM is slot 50.

13.1.6 Technical Specifications The technical specifications of the UPM cover dimensions and weight.

Specifications of the power supply Table 13-4 lists the specifications of the power supply of the UPM. Table 13-4 Specifications of the power supply of the UPM

13-6

Item

Specification

Input AC voltage range

90–264 V AC

AC input

One channel of monophase three-wire AC power: 47 Hz– 63 Hz

Rated input current

≤ 3.5 A

Nominal output voltage

54.0±0.5 V

Rated output current

8 A (Two loading outputs, each of which has the loading voltage not more than 5 A)

Number of backup battery groups

1 (40 Ah)

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Item

Specification

Charging current of the backup battery

≤3A

Fuse of the backup battery

10 A

Undervoltage DC point of the battery

46±0.5 V

Termination voltage point of the battery

43.5±0.5V

Floating charge voltage of the battery

-54.0±0.5 V

Regulated voltage precision

≤ ±1%

Non-balance of load sharing

≤ ±5% (50%–100% loading)

Rated efficiency of the integrated ≥ 80% device Peak stray noise voltage

≤ 200 mV

Voltage drop in the power panel (20℃)

≤ 500 mV

Electrical network adjustment rate

≤ ±0.1%

Mechanical Specifications The mechanical specifications of the UPM are as follows: l

Dimensions of the UPM (mm): 438 (H) x 240 (D) x 44 (W)

l

Dimensions of a battery (mm): 197 (H) x 165 (D) x 170 (W)

13.2 PIU This section describes the PIU, a power interface unit, in terms of the version, function, principle, front panel, configuration and specifications. The OptiX OSN 1500B supports the PIU and the OptiX OSN 1500A does not. 13.2.1 Version Description The functional version of the PIU is R1. 13.2.2 Function and Feature The PIU is used to access the power supply, and to provide the lightning protection and filtering. 13.2.3 Working Principle and Signal Flow The PIU consists of the protecting unit, filter unit, power detecting unit and clock protecting unit. 13.2.4 Front Panel On the front panel of the PIU, there are indicators and power interfaces. Issue 02 (2007-09-10)

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13.2.5 Valid Slots The PIU can be housed in any of slots 18–19 in the OptiX OSN 1500B subrack. 13.2.6 Technical Specifications The technical specifications of the PIU cover the dimensions, weight, power consumption, input voltage and fuse tube.

13.2.1 Version Description The functional version of the PIU is R1.

13.2.2 Function and Feature The PIU is used to access the power supply, and to provide the lightning protection and filtering. Table 13-5 lists the functions and features of the PIU. Table 13-5 Functions and features of the PIU Function and Feature

PIU

Function of lightning protection

Provides the lightning protection, and reports the alarm indicating the failure of the lightning protection module.

Function of filtering

Enhances the electromagnetic compatibility of the system by filtering the power supply port and shielding the board.

Power supply interface

Provides one 50 W power interface for external devices, such as the COA.

Power supply of the FAN

Provides –48 V ± 20% voltage for the FAN.

Clock interface

Provides 75-ohm clock input and output interfaces, and protects clock signals.

Alarm monitoring

Reports the board in-service alarm.

Power supply backup

Supports the 1+1 hot backup. Any one PIU can provide power for the entire subrack by itself.

13.2.3 Working Principle and Signal Flow The PIU consists of the protecting unit, filter unit, power detecting unit and clock protecting unit. Figure 13-3 shows the block diagram for the functions of the PIU.

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Figure 13-3 Block diagram for the functions of the PIU NEG(-)

NEG(-) Filter unit

Protecting unit

RTN(+)

RTN(+)

Power detecting unit

Clock input LED indication

Clock protecting unit

Clock output

Filter Unit The filter unit uses the electromagnetic interference (EMI) filter to filter the electromagnetic interference signals and thus to keep the equipment running in a stable manner.

Protecting Unit This unit is used to prevent the equipment from overcurrent and lightning.

Power Detecting Unit The power detecting unit checks whether the input power supply is valid and uses indicators to indicate the status of the input power supply.

Clock Protecting Unit This unit is used to protect the input clock signals.

13.2.4 Front Panel On the front panel of the PIU, there are indicators and power interfaces.

Appearance of the Front Panel Figure 13-4 shows the appearance of the front panel of the PIU.

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Figure 13-4 Front panel of the PIU

PIU

O I POWER

PWS

RTN(+)

PWR

NEG(-)

CLK IN

CLK OUT

PIU

Indicators A power supply indicator (POWER) is present on the front panel of the board and is green when lit.. For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces There are three power interfaces on the front panel of the PIU. Table 13-6 lists the type and usage of the interfaces. Table 13-6 Interfaces on the front panel of the PIU Interface

Interface Type

Usage

PWR

Power input interface

Inputs the –48 V power supply.

ClK IN

SMB

75-ohm clock input interface (SMB)

ClK OUT

SMB

75-ohm clock output interface (SMB)

13.2.5 Valid Slots The PIU can be housed in any of slots 18–19 in the OptiX OSN 1500B subrack.

13.2.6 Technical Specifications The technical specifications of the PIU cover the dimensions, weight, power consumption, input voltage and fuse tube. 13-10

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Mechanical Specifications The mechanical specifications of the PIU are as follows: l

Board dimensions (mm): 108 (H) x 110 (D) x 41.5 (W)

l

Weight (kg): 1.3

Power Consumption In the normal temperature (25℃), the maximum power consumption of the PIU is 1.5 W.

Input Voltage The input voltage of the PIU ranges from –38.4 V to –72 V.

Fuse Tube The main loop fuse of the PIU is 250 V-10 A-0.006 ohm.

13.3 PIUA This section describes the PIUA, a power interface unit, in terms of the version, function, principle, front panel, configuration and specifications. The OptiX OSN 1500A supports the PIUA and the OptiX OSN 1500B does not. 13.3.1 Version Description The functional version of the PIUA is R1. 13.3.2 Function and Feature The PIUA is used to access the power supply, and to provide the lightning protection and filtering. 13.3.3 Working Principle and Signal Flow The PIUA consists of the power interface unit, protecting unit, filter unit, power supply detecting unit, fan power supply unit and external power supply interface unit. 13.3.4 Front Panel On the front panel of the PIUA, there are indicators and power interfaces. 13.3.5 Valid Slots The PIUA can be housed in any of slots 1–11 in the subrack. 13.3.6 Technical Specifications The technical specifications of the PIUA cover the dimensions, weight, power consumption, input voltage and fuse tube.

13.3.1 Version Description The functional version of the PIUA is R1.

13.3.2 Function and Feature The PIUA is used to access the power supply, and to provide the lightning protection and filtering. Issue 02 (2007-09-10)

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Table 13-7 lists the functions and features of the PIUA. Table 13-7 Functions and features of the PIUA Function and Feature

PIUA

Function of lightning protection

Provides the lightning protection, and reports the alarm indicating the failure of the lightning protection module.

Function of filtering

Enhances the electromagnetic compatibility of the system by filtering the power supply port and shielding the board.

Power supply interface

Provides one 50 W power interface for external devices, such as the COA.

Power supply of the FAN

Provides 48 V ± 20% voltage for the FAN.

Alarm monitoring

Reports the board in-service alarm.

Power supply backup

Supports the 1+1 hot backup. Any one PIU can provide power for the entire subrack by itself.

13.3.3 Working Principle and Signal Flow The PIUA consists of the power interface unit, protecting unit, filter unit, power supply detecting unit, fan power supply unit and external power supply interface unit. Figure 13-5 shows the block diagram for the functions of the PIUA. Figure 13-5 Block diagram for the functions of the PIUA External power supply interface NEG(-) RTN(+)

Lightning protection module

Filter module

Power detection

NEG(-) RTN(+)

Fan power module

LED indication

Power Interface Unit This unit accesses the –48 V or –60 V power supply for the system.

Protection Unit This unit is used to prevent the equipment from overcurrent and lightning. 13-12

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Filter Unit The filter unit uses the electromagnetic interference (EMI) filter to filter the electromagnetic interference signals and thus to keep the equipment running in a stable manner.

Power Detecting Unit The power detecting unit checks whether the input power supply is valid and uses indicators to indicate the status of the input power supply.

Fan Power Supply Unit This unit is used to supply stable power to the fans.

External Power Supply Interface Unit This unit supplies –48 V power to the external equipment, such as the COA. The interfaces are present on the panel.

13.3.4 Front Panel On the front panel of the PIUA, there are indicators and power interfaces.

Appearance of the Front Panel Figure 13-6 shows the appearance of the front panel of the PIUA. Figure 13-6 Front panel of the PIUA

PIUA POWER

PWS I O NEG(-) RTN(+)

PIUA

Indicators A power supply indicator (POWER) is present on the front panel of the board and is green when lit.. For indication of these indicators, see A Equipment and Board Alarm Indicators. Issue 02 (2007-09-10)

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Interfaces On the front panel of the PIUA, there are two interfaces and one switch. Table 13-8 lists the type and usage of the interfaces and switch. Table 13-8 Interfaces and switch on the front panel of the PIUA Interface

Interface Type

Usage

PWR

Inputs the –48 V power supply.

Inputs the –48 V power supply.

PWS

Output interface for the 50 W power supply

Outputs the 50 W power supply for the COA or HUB.

Power switch

Switch

Turn the switch to position 1 or ON to supply power to the equipment. Turn the switch to position 0 or OFF to shut the power supply to the equipment.

13.3.5 Valid Slots The PIUA can be housed in any of slots 1–11 in the subrack.

13.3.6 Technical Specifications The technical specifications of the PIUA cover the dimensions, weight, power consumption, input voltage and fuse tube.

Mechanical Specifications The mechanical specifications of the PIUA are as follows: l

Board dimensions (mm): 111.8 (H) x 220 (D) x 25.4 (W)

l

Weight (kg): 1.5

Power Consumption In the normal temperature (25℃), the maximum power consumption of the PIUA is 3 W.

Input Voltage The input voltage of the PIUA ranges from –38.4 V to –72 V.

Fuse tube The main loop fuse of the PIU is 250 V-10 A-0.006 ohm.

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14

Cables

About This Chapter This chapter describes the cables used for the equipment. The cables include the fiber jumpers, power cables, alarm cables, management cables, signal cables and clock cables. 14.1 Fiber Jumper The following section describes the types of fiber jumpers and connectors. 14.2 Power Cables and Grounding Cables The power cables and grounding cables include the cabinet power cable, equipment supply cable, and UPM power cable. 14.3 Alarm Cable The alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable, alarm concatenation cable and alarm input/output cable. 14.4 Management Cable The management cable includes the serial port cable, ordinary phone wire, COA concatenating cable and network cable. 14.5 Signal Cable The signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signal cable. The OptiX OSN 1500A supports only the E1/E3 signal cable. 14.6 Clock Cable The clock cable includes the clock cable and clock transfer cable.

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14.1 Fiber Jumper The following section describes the types of fiber jumpers and connectors. 14.1.1 Types of Fiber Jumpers The OptiX OSN equipment can use various types of fiber jumpers. 14.1.2 Connector The OptiX OSN equipment can use various types of connectors.

14.1.1 Types of Fiber Jumpers The OptiX OSN equipment can use various types of fiber jumpers. Table 14-1 lists the types of fiber jumpers used by the OptiX OSN equipment. Table 14-1 Types of fiber jumpers Usage

Connector 1

Connector 2

Cable

Length

Optical fiber that connects the OptiX OSN equipment to the ODF or connects the interface board of the OptiX OSN equipment to the optical fiber of other equipment

LC/PC

FC/PC

2 mm SLM optical fiber

6 m, 10 m, 20 m, 30 m, 50 m

2 mm MLM optical fiber

3 m, 5 m, 10 m, 20 m, 30 m, 50 m

2 mm SLM optical fiber

5m, 10 m, 20 m, 30 m, 50 m

2 mm MLM optical fiber

10 m, 20 m, 30 m, 50 m

SC/PC

SC/PC

2 mm SLM optical fiber

2m, 5 m, 10 m, 20 m, 30 m, 50 m, 80 m

Optical fiber that interconnects the OptiX OSN equipment

LC/PC

LC/PC

2 mm SLM optical fiber

1.5 m, 3 m, 5 m, 10 m, 20 m, 30 m

2 mm MLM optical fiber

3 m, 5 m, 10 m, 20 m, 30 m

LC/PC

SC/PC

LC/PC

FC/PC

2 mm SLM optical fiber

6 m, 10 m, 20 m, 30 m, 50 m

LC/PC

SC/PC

2 mm SLM optical fiber

5m, 10 m, 20 m, 30 m, 50 m

Select the fiber connector and the fiber length according to the on-site survey.

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CAUTION When selecting the fiber connector, make sure that the single-longitudinal mode or multilongitudinal mode optical transmitting module is connected to the single-mode fiber.

14.1.2 Connector The OptiX OSN equipment can use various types of connectors. The four types of fiber connectors are listed as follows: l

Interfaces on the front panel of boards are mostly the LC/PC optical interfaces. See Figure 14-1.

l

The N2OU08 and 61COA provide the SC/PC optical interfaces.

l

The "IN" interface on the externally-installed case-shaped 62COA uses the E2000/APC connector. See Figure 14-4.

l

The ODF at the client side uses the FC/PC or SC/PC optical interface. Figure 14-3 and Figure 14-2 show the corresponding FC/PC and SC/PC optical connectors.

Table 14-2 lists the description of the four optical connectors. Table 14-2 Types of connectors Internal Fiber Connector

Description

LC/PC

Plug-in square fiber connector/protruding polished

E2000/APC

Connector with dust-proof cover/protruding polished (8 degrees)

FC/PC

Round fiber connector/protruding polished

SC/PC

Square fiber connector/protruding polished

LC/PC Optical Connector Figure 14-1 shows the appearance of the LC/PC optical connector. Figure 14-1 LC/PC optical connector

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The axial operation instead of rotation is required to insert or remove the LC/PC optical interface. Align the head of the fiber jumper with the optical interface with proper strength to insert the fiber jumper into the LC/PC connector. To remove the LC/PC fiber jumper, first press the clip, and then push fiber connector inward slightly, and pull out the connector.

SC/PC Optical Connector Figure 14-2 shows the appearance of the SC/PC optical connector. Figure 14-2 SC/PC optical connector

FC/PC Optical Connector Figure 14-3 shows the appearance of the FC/PC optical connector. Figure 14-3 FC/PC optical connector

E2000/APC Optical Interface Figure 14-4 shows the appearance of the E2000/APC optical interface.

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Figure 14-4 E2000/APC optical connector

14.2 Power Cables and Grounding Cables The power cables and grounding cables include the cabinet power cable, equipment supply cable, and UPM power cable. 14.2.1 Cabinet –48 V/BGND/PGND Power Cable The –48 V, BGND and PGND power cables are used to supply power to the equipment in the cabinet. One end of the power cable connects to the power distribution cabinet and grounding bar in the equipment room, and the other end connects to the power distribution unit at the cabinet top. 14.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding Cable The equipment –48 V/–60 V power cable/PGND grounding cable directly connects to the external –48 V/–60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinet top and the PIU board on the subrack. The external –48 V/–60 V power supply is led out to the OptiX OSN 1500 equipment. 14.2.3 UPM Power Cable This section describes the UPM power cable in terms of the structure, connection and technical specifications.

14.2.1 Cabinet –48 V/BGND/PGND Power Cable The –48 V, BGND and PGND power cables are used to supply power to the equipment in the cabinet. One end of the power cable connects to the power distribution cabinet and grounding bar in the equipment room, and the other end connects to the power distribution unit at the cabinet top.

Structure Figure 14-5 shows the structure of the –48 V cabinet power cable/BGND power grounding cable. Figure 14-6 and Figure 14-7 show the structure of the PGND protection grounding cable.

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Figure 14-5 Cabinet –48 V power cable and BGND power grounding cable 1

2

3 1. Cord end terminal

2. Bare connector-OT type

3. Cable tie

Figure 14-6 Cabinet PGND protection grounding cable (JG2)

1. Bare connector-OT type

2. Cable tie

3. Bare connector (JG2)

4. Heat-shrink tube

5. Main tag

6. Wire

7. Heat-shrink tube

Figure 14-7 Cabinet PGND protection grounding cable (OT)

1. Bare connector-OT type

2. Cable tie

3. Bare connector (OT)

4. Heat-shrink tube

5. Main tag

6. Wire

7. Heat-shrink tube

Pin Assignment None 14-6

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Technical Specifications Item –48 V cabinet power cable

Cabinet BGND power grounding cable

Cabinet PGND protection grounding cable

Description Connector 2

Bare crimping terminal-OT type-16 mm2-M8-tin platingbare ring terminal

Connector 1

Single cord end terminal-16 mm2-length 24 mm-inserted 12 mm deep-80A-green

Cable type

Power cable-450 V/750 V-16 mm2-round and bllue-85A

Connector 2

Bare crimping terminal-OT type-16 mm2-M8-tin platingbare ring terminal

Connector 1

Single cord end terminal-16 mm2-length 24 mm-inserted 12 mm deep-80A-green

Cable type

Power cable-450 V/750 V-16 mm2-round and black-85A

Connector 1

Bare crimping terminal-OT type-25mm2-M8-tin platingbare ring terminal

Connector 3

Bare crimping connector-JG2-25 mm2-M6-95A-tin plating, or bare crimping connector-JG2-25 mm2-M8-95Atin plating, or bare crimping terminal-OT type-25 mm2-M8tin plating-bare ring terminal

Cable type

Power cable-450 V/750 V-25 mm2-yellow and green-85 A

Fireproof level

CM

Length

10 m, 20 m, 30 m

14.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding Cable The equipment –48 V/–60 V power cable/PGND grounding cable directly connects to the external –48 V/–60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinet top and the PIU board on the subrack. The external –48 V/–60 V power supply is led out to the OptiX OSN 1500 equipment.

Structure Figure 14-8 shows the structure of the equipment –48 V/–60 V power cable. Figure 14-9 shows the structure of the PGND grounding cable.

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Figure 14-8 Structure of the equipment –48 V/–60 V Power Cable

A3

A

A2 A1

Figure 14-9 PGND power cable

1. Bare connector-OT type

2. Cable tie

3. Bare connector

5. Main tag

6. Wire

7. Heat-shrink tube

4. Heat-shrink tube

Pin Assignment For details on the pin assignment, refer to Table 14-3. Table 14-3 Equipment –48 V/–60 V power cable Cable connector

Corresponding cable

Core color

A1

W1

Blue (–48 V/–60 V power)

A3

W2

Black (power ground)

Technical Specifications

14-8

Item

Equipment –48 V/–60 V power cable

PGND grounding cable

Cable connector

Cable connector-D type-3PIN-female

Bare crimping connector-OT-6 mm2M4-tin plating-pre-insulated ring terminal-12–10AWG bare crimping connector-OT-6 mm2-M8-tin platinginsulated ring terminal-12–10AWG

Cable

Wire-300 V-16AWGblack (the core is blue and black)-13A

Wire-600 V-10AWG-yellow/green-50A

Type

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Equipment –48 V/–60 V power cable

PGND grounding cable

Number of cores

2

1

Fireproof level

CM

CM

Color

Blue or black

Yellow and green

Length

15 m, 30 m

15 m, 30 m

14.2.3 UPM Power Cable This section describes the UPM power cable in terms of the structure, connection and technical specifications.

Structure Figure 14-10 shows the power cable that is used to connect the UPM to the OptiX OSN 1500. Figure 14-10 Structure of the UPM power cable A A1 A2

A

B

B 1 2

A3

X2

X1

Connection of the UPM Power Cable Table 14-4 lists the connections of the UPM power cables. Table 14-4 Connection of the UPM power cable

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Cable Connector X1

Correspondi ng Cable

Cable Connector X2

Core Color

A1

W1

1

Blue (–48 V/–60 V power supply)

A3

W2

2

Black (ground for the power supply)

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Specifications of the UPM Power Cable Table 14-5 Specifications of the UPM power cable Item

UPM Power Cable

Cable connector X1

Cable connector-D type-3PIN-female (two female and one male)

Cable connector X2

Common plug-2PIN-single row

Cable

Type

Cable-300 V-1.31 mm2-16 AWG-black (core: blue or black)-13 A

Number of cores

2

Fireproof class

CM

Color

Core: blue or black

Length

2.5 m

14.3 Alarm Cable The alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable, alarm concatenation cable and alarm input/output cable. 14.3.1 Alarm Input/Output Cable The alarm input cable is used to input the alarm signals of the external equipment to the OptiX OSN equipment. The alarm output cable is used to output the alarm signals to the central alarm monitoring equipment.

14.3.1 Alarm Input/Output Cable The alarm input cable is used to input the alarm signals of the external equipment to the OptiX OSN equipment. The alarm output cable is used to output the alarm signals to the central alarm monitoring equipment. One end of the alarm input/output cable uses an RJ-45 connector to connect to the alarm input/ output interface of the equipment. The other end uses a connector to connect to the external equipment or central alarm monitoring equipment. The connector should be made according to the on-site equipment. Each alarm input/output alarm cable can transmits four channels of alarm signals.

Structure Figure 14-11 shows the structure of the alarm input/output cable.

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Figure 14-11 Structure of the alarm input/output cable

1. Network interface connector–RJ-45

2. Main tag

A-A. Sectional view in direction A

Pin Assignment Table 14-6 lists the pin assignment of the alarm input/output cable. Table 14-6 Pin assignment of the alarm input/output cable Connect or X1

Color

Relation

Alarm Output

Alarm Input

X1.1

Blue

Twisted pair

Positive for critical and major alarms

SW_INPUT 1+

X1.2

White

Negative for critical and major alarms

SW_INPUT 1–

X1.3

Orange

Positive for minor and warning alarms

SW_INPUT 2+

X1.6

White

Negative for minor and warning alarms

SW_INPUT 2–

X1.4

Green

Positive for alarm signal output 1

SW_INPUT 3+

X1.5

White

Negative for alarm signal output 1

SW_INPUT 3–

X1.7

Brown

Positive for alarm signal output 2

SW_INPUT 4+

X1.8

White

Negative for alarm signal output 2

SW_INPUT 4–

Twisted pair

Twisted pair

Twisted pair

Technical Specifications

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Item

Description

Connector X1

Network interface connector-8PIN-8 bit-shielded-crystal plug Huawei Technologies Proprietary

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Item

Description

Cable type

Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 coresPANTONE 430U Twisted pair cable-100±15 ohms-shielded enhanced type 5 CAT5E SFTP-24AWG-8 core-PANTONE445U

Number of cores

8

Fireproof class

CM

Core diameter

0.5 mm

Length

10 m, 20 m, 30 m

14.4 Management Cable The management cable includes the serial port cable, ordinary phone wire, COA concatenating cable and network cable. 14.4.1 OAM Serial Port Cable The OAM serial port cable is used for management and remote maintenance of the OptiX OSN equipment. 14.4.2 Serial 1–4/F1/F&f Serial Port Cable Use the RJ-45 connector to connect one end of the serial port cable to the Serial 1–4 interface, F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detecting device or managed external device. 14.4.3 RS232/RS-422 Serial Port Cable The RS232/RS-422 serial port cable is used to transmit the management signaling between different subnets. 14.4.4 Ordinary Telephone Wire The telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends. Connect one end to PHONE interface of the equipment and connect the other end to the interface of the orderwire phone. 14.4.5 COA Concatenating Cable When several COA are installed in one cabinet, use the RS232 or RS-422 serial port cables to connect these COA. 14.4.6 Straight Through Cable The straight through cable is used for the communication between the OptiX OSN equipment, the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends. 14.4.7 Crossover Cable The crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.

14.4.1 OAM Serial Port Cable The OAM serial port cable is used for management and remote maintenance of the OptiX OSN equipment. 14-12

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Use the RJ-45 connector to connect one end of the cable to the OAM interface of the equipment. Use the DB25 or DB9 connector to connect the other end to a laptop, T2000 computer or modem.

Structure Figure 14-12 shows the structure of the OAM serial port cable (DB25 connector). Figure 14-12 Structure of the OAM serial port cable

1. Network interface connector–RJ-45

2. Main tag 3. Cable connectorDB25 male

A-A. Sectional view in B-B. Sectional view in direction A direction B

Pin Assignment Table 14-7 lists the pin assignment of the alarm input/output cable. Table 14-7 Pin assignment of the OAM serial port cable Connector X1

Connector X2

Relation

Description

X1.2

X2.20

Single

Data terminal ready (DTR)

X1.3

X2.2

Single

Transmit data (TD)

X1.6

X2.3

Single

Receive data (RD)

X1.4

X2.7

Twisted pair

Signaling ground (SG)

X1.5

Technical Specifications

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Item

Description

Connector X1

Network interface connector-8PIN-8 bit-shielded-crystal plug

Connector X2

Cable connector-D type-25PIN-male or cable connector-D type-9PINmale

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Item

Description

Type

Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 corePANTONE 430U

Number of cores

8

Fireproof class

CM

Length

5000 mm

14.4.2 Serial 1–4/F1/F&f Serial Port Cable Use the RJ-45 connector to connect one end of the serial port cable to the Serial 1–4 interface, F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detecting device or managed external device. The Serial 1–4/F1/F&f serial port cable is used for the following functions: l

Transparently transmits the environment detecting data signals.

l

Manages the external device such as the COA.

Structure Figure 14-13 shows the structure of the Serial 1–4/F1/F&f serial port cable. Figure 14-13 Structure of the Serial 1–4/F1/F&f serial port cable

1. Network interface connector–RJ-45

2. Main tag 3. Cable connectorDB25 male

A-A. Sectional view in B-B. Sectional view in direction A direction B

Pin Assignment Table 14-8 lists the pin assignment of the Serial 1–4/F1/F&f cable.

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Table 14-8 Pin assignment of the Serial 1–4/F1/F&f serial port cable Connector X1

Connector X2

Relation

Description

X1.1

X2.8

Twisted pair

RS-422RX+

X1.2

X2.9

X1.3

X2.6

X1.6

X2.7

X1.4

X2.3

X1.8

X2.2

X1.5

X2.5

RS-422RX– Twisted pair

RS-422TX+ RS-422TX–

Twisted pair

RS232RX RS232TX

Single

SG

Technical Specifications Item

Description

Connector X1

Network interface connector-8PIN-8 bit-shielded-crystal plug

Connector X2

Cable connector-D type-9 PIN-male

Cable type

1. Twisted pair-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE 430U 2. Twisted pair-100 ohms-SEYVP-0.48 mm-26AWG-8 core-black

Number of cores

8

Fireproof class

CM

Length

15 m for cable type 1 and 3 m for cable type 2

14.4.3 RS232/RS-422 Serial Port Cable The RS232/RS-422 serial port cable is used to transmit the management signaling between different subnets. Use the RJ-45 connectors at both ends. Connect one end to the RS232 or RS-422 serial port of the equipment. Connect the other end to the RS232 or RS-422 serial port of the equipment that requires the orderwire phone communication.

Structure Figure 14-14 shows the structure of the RS232/RS-422 serial port cable.

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Figure 14-14 Structure of the RS232/RS-422 serial port cable

1. Network interface connector–RJ-45

2. Main tag

A-A. Sectional view in direction A

Pin Assignment Table 14-9 lists the pin assignment of the RS232/RS-422 serial port cable. Table 14-9 Pin assignment of the RS232/RS-422 serial port cable Connector X1

Connector X2

Relation

Description

X1.3

X2.1

Twisted pair

RX+

X1.6

X2.2

X1.1

X2.3

X1.2

X2.6

X1.5

X2.5

X1.4

X2.8

X1.8

X2.4

RX– Twisted pair

TX+ TX–

Twisted pair

SG 232RX

Single

232TX

Technical Specifications

14-16

Item

Description

Connector X1/X2

Network interface connector-8PIN-8 bit-shielded-crystal plug

Cable type

Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 corePANTONE 430U

Number of cores

8

Fireproof class

CM

Length

15 m

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14.4.4 Ordinary Telephone Wire The telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends. Connect one end to PHONE interface of the equipment and connect the other end to the interface of the orderwire phone.

Structure Figure 14-15 shows the structure of the ordinary telephone wire. Figure 14-15 Structure of the ordinary telephone wire

1. Phone connector-RJ-11crystal plug

2. Main tag

Pin Assignment Table 14-10 lists the pin assignment of the ordinary telephone wire. Table 14-10 Pin assignment of the ordinary telephone wire Connector X1

Connector X2

Description

X1.1

X2.1

No connected

X1.2

X2.2

No connected

X1.3

X2.3

TIP

X1.4

X2.4

RING

X1.5

X2.5

No connected

X1.6

X2.6

No connected

Technical Specifications

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Item

Description

Connector X1/X2

Network interface connector-6PIN-26 to 28AWG

Cable type

Power cable-150 V-UL20251-0.08 mm2-28AWG-black-1A-2-core telephone wire

Number of cores

2

Fireproof class

CM

Length

15 m Huawei Technologies Proprietary

14-17

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

14.4.5 COA Concatenating Cable When several COA are installed in one cabinet, use the RS232 or RS-422 serial port cables to connect these COA. Use the DB9 connectors at both ends. Connect one end to the RS232-1 of one COA and connect the other end to the RS232-2 of another COA.

Structure Figure 14-16 shows the structure of the COA concatenating cable. Figure 14-16 Structure of the COA concatenating cable

1. Cable connector-DB25 male

2. Tag

A-A. Sectional view in direction A

Pin Assignment Table 14-11 lists the pin assignment of the COA concatenating cable. Table 14-11 Pin assignment of the COA concatenating cable Connector X1

Connector X2

Remarks

3

2

One pair

2

3

5

5

Grounding

Technical Specifications

14-18

Item

Description

Connector X1/X2

Cable connector-D type-9 PIN-male

Cable type

Twisted pair-100 ohms-UL2464-0.32 mm-28AWG-2P-Huawei gray

Number of cores

Two pairs

Fireproof class

CM

Length

0.6 m, 2.5 m Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

14.4.6 Straight Through Cable The straight through cable is used for the communication between the OptiX OSN equipment, the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.

Structure Figure 14-17 shows the structure of the straight through cable. Figure 14-17 Structure of the straight through cable

1. Network interface connector–RJ-45

2. Tag 1

3. Main tag

4. Tag 2

Pin Assignment Table 14-12 lists the pin assignment of the straight through cable. Table 14-12 Pin assignment of the straight through cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Color

Relation

X1.1

X2.1

White or orange

Twisted pair

X1.2

X2.2

Orange

X1.3

X2.3

White or orange

X1.6

X2.6

Green

X1.4

X2.4

Blue

X1.5

X2.5

White or orange

X1.7

X2.7

White or brown

X1.8

X2.8

Brown

Huawei Technologies Proprietary

Twisted pair

Twisted pair

Twisted pair

14-19

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Technical Specifications Item

Description

Connector X1/X2

Network interface connector-crystal plug-8PIN-8bit-shielded-24 to 26AWG-CAT 6/used with SFTP network cable

Cable type

Communication cable-10015 ohms-shielded enhance type 5CAT5E-SFTP 24AWG-8 cores-PANTONE 445U

Number of cores

8

Fireproof class

CM

Length

5 m, 10 m, 20 m, 30 m

14.4.7 Crossover Cable The crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment. Uses the RJ-45 connectors at both ends. Connect one end to the ETH interface of the equipment and connect the other end to the network interface of the computer.

Structure Figure 14-18 shows the structure of the crossover cable. Figure 14-18 Structure of the crossover cable

1. Network interface connector–RJ-45

2. Tag 1

3. Main tag

4. Network cable

5. Tag 2

Pin Assignment Table 14-13 lists the pin assignment of the crossover cable. Table 14-13 Pin assignment of the crossover cable

14-20

Connector X1

Connector X2

Color

Relation

X1.6

X2.2

Orange

Twisted pair

X1.3

X2.1

White or orange

X1.1

X2.3

White or green

X1.2

X2.6

Green

Huawei Technologies Proprietary

Twisted pair

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Connector X1

Connector X2

Color

Relation

X1.4

X2.4

Blue

Twisted pair

X1.5

X2.5

White or blue

X1.7

X2.7

White or brown

X1.8

X2.8

Brown

Twisted pair

Technical Specifications Item

Description

Connector X1/X2

Network interface connector-crystal plug-8PIN-8bit-shielded-24 to 26AWG-CAT 6/used with SFTP network cable

Cable type

Communication cable-1005 ohms-CAT5E-SFTP 24AWG-8 coresPANTONE 445U

Number of cores

8

Fireproof class

CM

Length

5 m, 30 m

14.5 Signal Cable The signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signal cable. The OptiX OSN 1500A supports only the E1/E3 signal cable. 14.5.1 75-ohm 8 x E1 Cable The 75-ohm 8 x E1 cable is used to input and output E1 signals. 14.5.2 75-ohm 16 x E1 Cable The 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected to the interface of the L75S interface board. 14.5.3 120-ohm 8 x E1 Cable The 120-ohm 8 x E1 cable is used to input and output E1 signals. 14.5.4 120-ohm 16 x E1 Cable The 120-ohm 8 x E1 cable is used to input and output E1 signals. 14.5.5 E3/T3/STM-1 Cable The E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMB connector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements. 14.5.6 Framed E1 Cable The framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1 signals. 14.5.7 N x 64 kbit/s Cables Issue 02 (2007-09-10)

Huawei Technologies Proprietary

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channel of N x 64 kbit/s services.

14.5.1 75-ohm 8 x E1 Cable The 75-ohm 8 x E1 cable is used to input and output E1 signals. Use the DB44 connector at one end to connect the cable to the 75-ohm 8 x E1 electrical interface board. Use a connector to connect the other end to the digital distribution frame (DDF). The connector should be made according to the on-site requirements. Each cable can transmit eight channels of E1 signals.

Structure Figure 14-19 shows the structure of the 75-ohm 8 x E1 cable. Figure 14-19 Structure of the 75-ohm 8 x E1 cable

1. Cable connector-D type-44 PIN-male

2. Tag 1, marked: "W1 (E1:1 to 4)"

3. Tag 3, marked: "W2 (E1:5 to 8)"

4. Main tag

Pin Assignment Table 14-14 lists the pin assignment of the 75-ohm 8 x E1 cable. Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable

14-22

Conne ctor

Cable W1 Core

No.

38

Ring

1

23

Tip

37

Ring

22

Tip

36

Ring

21

Tip

3

5

Remarks

R1

R2

R3

Huawei Technologies Proprietary

Connector

Cable W2

Remark s

Core

No.

34

Ring

1

R5

19

Tip

33

Ring

3

R6

18

Tip

32

Ring

5

R7

17

Tip Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Conne ctor

Cable W1 Core

No.

35

Ring

7

20

Tip

15

Ring

30

Tip

14

Ring

29

Tip

13

Ring

28

Tip

12

Ring

27 Shell

14 Cables

Remarks

Connector

Cable W2

Remark s

Core

No.

31

Ring

7

R8

16

Tip

11

Ring

2

T5

26

Tip

10

Ring

4

T6

25

Tip

9

Ring

6

T7

24

Tip

8

Ring

8

T8

Tip

7

Tip

External braid shield layer

Shell

External braid shield layer

R4

2

T1

4

T2

6

T3

8

T4

Technical Specifications Item

Description

Connector X

Cable connector-D type-44 PIN-male

Cable type

Coaxial cable-SYFVZP-75-1-1x8(A)-75 ohm-9.65 mm-1.2 mm-0.252 mm-Huawei white

Fireproof class

CM

Number of cores

8 x E1

Cover diameterinsulation diameterconductor diameter

9.65 mm-1.2 mm-0.252 mm

Length

3 m, 10 m, 15 m, 20 m, 25 m, 30 m, 40 m

CAUTION The pin assignment table for the E1 cable is placed in the same packing case with the cable. Do not discard it before installation.

14.5.2 75-ohm 16 x E1 Cable The 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected to the interface of the L75S interface board. Issue 02 (2007-09-10)

Huawei Technologies Proprietary

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Use the 2mmHM connector at one end to connect the cable to the 75-ohm E1 electrical interface board. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements. Each cable can transmit 16 channels of E1 signals.

Structure Figure 14-20 shows the structure of the 75-ohm 16 x E1 cable. Figure 14-20 Structure of the 75-ohm 16 x E1 cable Main tag

1. Cable connector

2. Terminal

Pin Assignment Table 14-15 lists the pin assignment of the 75-ohm 16 x E1 cable. Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable

14-24

Connec tor X

Cable W Core

No.

a1

Tip

1

a2

Ring

a3

Tip

a4

Ring

a6

Tip

a7

Ring

a8

Tip

a9

Ring

b1

Tip

b2

Ring

b3

Tip

b4

Ring

2

3

4

5

6

Remar ks

Connec tor X

Cable W Core

No.

R1

a10

Tip

17

R9

a11

Ring

a12

Tip

18

T9

a13

Ring

a15

Tip

19

R10

a16

Ring

a17

Tip

20

T10

a18

Ring

b10

Tip

21

R11

b11

Ring

b12

Tip

22

T11

b13

Ring

T1

R2

T2

R3

T3

Huawei Technologies Proprietary

Remark s

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Connec tor X

Cable W Core

No.

b6

Tip

7

b7

Ring

b8

Tip

b9

Ring

c1

Tip

c2

Ring

c3

Tip

c4

Ring

c6

Tip

c7

Ring

c8

Tip

a9

Ring

d1

Tip

d2

Ring

d3

Tip

d4

Ring

d6

Tip

d7

Ring

d8

Tip

d9

Ring

8

14 Cables

Remar ks

Connec tor X

Cable W Core

No.

R4

b15

Tip

23

R12

b16

Ring

b17

Tip

24

T12

b18

Ring

c10

Tip

25

R13

c11

Ring

c12

Tip

26

T13

c13

Ring

c15

Tip

27

R14

c16

Ring

c17

Tip

28

T14

c18

Ring

d10

Tip

29

R15

d11

Ring

d12

Tip

30

T15

d13

Ring

d15

Tip

31

R16

d16

Ring

d17

Tip

32

T16

d18

Ring

T4

9

R5

10

T5

11

R6

12

T6

13

R7

14

T7

15

R8

16

T8

Remark s

Technical Specifications

Issue 02 (2007-09-10)

Item

Description

Connector X

2mmHM conductor connector-4 x 18PIN-28 to 30AWG-crimp

Cable type W

Coaxial cable-SYFVZP-75-1-1x32(A)-75 ohms-18 mm-1.2 mm-0.254 mm-Huawei gray

Fireproof class

CM

Number of cores

16 x E1

Huawei Technologies Proprietary

14-25

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Item

Description

Cover diameterinsulation diameterconductor diameter

18mm-1.2 mm-0.254mm

Length

10 m, 15 m, 20 m, 25 m, 30 m

CAUTION The pin assignment table for the E1 cable is placed in the same packing case with the cable. Do not discard it before installation.

14.5.3 120-ohm 8 x E1 Cable The 120-ohm 8 x E1 cable is used to input and output E1 signals. Use the DB44 connector at one end to connect the cable to the 120-ohm E1 electrical interface board. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements. Each cable can transmit 8 channels of E1 signals.

Structure Figure 14-21 shows the structure of the 120-ohm 8 x E1 cable. Figure 14-21 Structure of the 120-ohm 8 x E1 cable

1. Cable connector-D type-44PIN-male

2. Tag 1, marked:" W1 (TX1~8) "

3. Tag 3, marked:" W2 (RX1~8) "

4. Main tag

Pin Assignment Table 14-16 lists the pin assignment of the 120-ohm 8 x E1 cable.

14-26

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Table 14-16 Pin assignment of the 120-ohm E1 cable Connecto r

Cable W1

Remar ks

Connecto r

Cable W2 Core

No.

38

Blue

Rx1

23

White

Twisted pair

37

Orang e

Twisted pair

R×2

22

White

36

Green

R×3

21

White

Twisted pair

35

Brown

Twisted pair

R×4

20

White

34

Grey

R×5

19

White

Twisted pair

33

Blue

R×6

18

Red

Twisted pair

32

Orang e

Twisted pair

R×7

17

Red

31

Green

R×8

16

Red

Twisted pair

Shell

External braid shield layer

Core

No.

15

Blue

Tx1

30

White

Twisted pair

14

Orang e

Twisted pair

T×2

29

White

13

Green

28

White

12

Brow n

27

White

11

Grey

26

White

10

Blue

25

Red

9

Orang e

24

Red

8

Green

7

Red

Shell

External braid shield layer

Twisted pair

T×3

Twisted pair

T×4

Twisted pair

T×5

Twisted pair

T×6

Twisted pair

T×7

Twisted pair

T×8

Remar ks

Technical Specifications

Issue 02 (2007-09-10)

Item

Description

Connector X

Cable connector-D type-44PIN-male

Cable type

Communication cable-120 ohms-SEYPVPV-0.5 mm-24AWG-16 core-PANTONE 430U

Number of cores

16

Inner conductor diameter

0.5 mm

Fireproof class

CM

Huawei Technologies Proprietary

14-27

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Item

Description

Length

10 m, 15 m, 20 m, 30 m, 40 m

14.5.4 120-ohm 16 x E1 Cable The 120-ohm 8 x E1 cable is used to input and output E1 signals. Use the 2mmHM connector at one end to connect the cable to the 120-ohm E1 electrical interface board, L12S or PL1B. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements. Each cable can transmit 16 channels of E1 signals.

Structure Figure 14-22 shows the structure of the 120-ohm 16 x E1 cable. Figure 14-22 Structure of the 120-ohm 16 x E1 cable 3 W2

X

W1

2

1

1. Cable connector

2. Terminal

3. Main tag

Pin Assignment Table 14-17 lists the pin assignment of the 120-ohm 16 x E1 cable. Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable Conne ctor X

14-28

Cable W1

Remark s

Connect or X

Cable W2 Core

No.

a3

Blue

Tx1

a4

White

Twiste d pair

a8

Orange

Tx2

a9

White

Twiste d pair

b3

Green

Tx3

b4

White

Twiste d pair

Core

No.

a1

Blue

Rx1

a2

White

Twiste d pair

a6

Orange

Rx2

a7

White

Twiste d pair

b1

Green

Rx3

b2

White

Twiste d pair

Huawei Technologies Proprietary

Remarks

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Issue 02 (2007-09-10)

Conne ctor X

Cable W1 Core

No.

b6

Brown

b7

White

c1

Grey

c2

White

c6

Blue

c7

Red

d1

Orange

d2

Red

d6

Green

d7

Red

a10

Brown

a11

Red

a15

Grey

a16

Red

b10

Blue

b11

Black

b15

Orange

b16

Black

c10

Green

c11

Black

c15

Brown

c16

Black

d10

Grey

d11

Black

d15

Blue

d16

Yellow

a5

Shell

14 Cables

Remark s

Connect or X

Cable W2 Core

No.

Twiste d pair

Rx4

b8

Brown

Tx4

b9

White

Twiste d pair

Twiste d pair

Rx5

c3

Grey

Tx5

c4

White

Twiste d pair

Twiste d pair

Rx6

c8

Blue

Tx6

c9

Red

Twiste d pair

Twiste d pair

Rx7

d3

Orange

Tx7

d4

Red

Twiste d pair

Twiste d pair

Rx8

d8

Green

Tx8

d9

Red

Twiste d pair

Twiste d pair

Rx9

a12

Brown

Tx9

a13

Red

Twiste d pair

Twiste d pair

Rx10

a17

Grey

Tx10

a18

Red

Twiste d pair

Twiste d pair

Rx11

b12

Blue

Tx11

b13

Black

Twiste d pair

Twiste d pair

Rx12

b17

Orange

Tx12

b18

Black

Twiste d pair

Twiste d pair

Rx13

c12

Green

Tx13

c13

Black

Twiste d pair

Twiste d pair

Rx14

c17

Brown

Tx14

c18

Black

Twiste d pair

Twiste d pair

Rx15

d12

Grey

Tx15

d13

Black

Twiste d pair

Twiste d pair

Rx16

d17

Blue

Tx16

d18

Yellow

Twiste d pair

a14

Shell

External braid shield layer

Huawei Technologies Proprietary

Remarks

External braid shield layer

14-29

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Technical Specifications Item

Description

Connector X

2mmHM conductor connector-4 x 18PIN-24 to 26AWG-crimp

Cable type W1/W2

Nominal twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-32 core-PANTONE 430U

Number of cores

32

Inner conductor diameter

0.5 mm

Fireproof class

CM

Length

10 m, 15 m, 20 m, 25 m, 30 m

14.5.5 E3/T3/STM-1 Cable The E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMB connector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements.

Structure Figure 14-23 shows the structure of the E3/T3/STM-1 cable. Figure 14-23 Structure of the E3/T3/STM-1 cable

1. Coaxial connector-SMB

2. Main tag

3. Coaxial cable

Pin Assignment None

Technical Specifications

14-30

Item

Description

Connector

Coaxial connector-SMB-75 ohms-straight and female

Cable I

Coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Item

14 Cables

Description Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34 mm Length: 10 m, 15 m, 20 m, 30 m

Cable II

Coaxial cable-75 ohms-4.4 mm-2.4 mm-0.4 mm-shielded-gray Cover diameter 4.4 mm-insulation diameter 2.4 mm-conductor diameter 0.4 mm Length: 15 m, 20 m, 25 m, 30 m, 40 m

Cable III

Coaxial cable-75 ohms-6.7 mm-3.8 mm-0.61 mm-shielded-gray Cover diameter 6.7 mm-insulation diameter 3.8 mm-conductor diameter 0.61 mm Length: 15 m, 20 m, 25 m, 30 m, 130 m

Cable IV

Coaxial cable-75 ohms-5.80 mm-3.71 mm-0.643 mm-black Cover diameter 5.80 mm-insulation diameter 3.71 mm-conductor diameter 0.643 mm Length: 30 cm

Fireproof class

CM

14.5.6 Framed E1 Cable The framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1 signals. The framed E1 cables of 75 ohms and 120 ohms are available. l

See the section that describes the 75-ohm 8 x E1 cable for details on the structure, pin assignment and technical specifications of the 75-ohm framed E1 cable.

l

See the section that describes the 120-ohm 8 x E1 cable for details on the structure, pin assignment and technical specifications of the 120-ohm framed E1 cable.

14.5.7 N x 64 kbit/s Cables The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channel of N x 64 kbit/s services. Table 14-18 lists the pin assignment of the DB28 connector. Table 14-18 Pin assignment of the DB28 connector of the DM12

Issue 02 (2007-09-10)

Pin

Signal

Directi on

Description

1

TXD+

--->

Transmits data.

Huawei Technologies Proprietary

14-31

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

14-32

Pin

Signal

Directi on

Description

2

TXD–

--->

Transmits data.

3

TXC+

<-->

The DCE provides the transmitting clock to the DTE.

4

TXC–

<-->

The DCE provides the transmitting clock to the DTE.

5

NC

-

-

6

GND

-----

Circuit_GND

7

MODE0

<---

Identifies the cable type.

8

MODE1

<---

Identifies the cable type.

9

MODE2

<---

Identifies the cable type.

10

MODE_DCE

<---

Identifies the DCE/DTE cable type.

11

DCD+

<-->

Detects the carrier.

12

DCD–

<-->

Detects the carrier.

13

RTS+

--->

Requests for transmission.

14

RTS–

--->

Requests for transmission.

15

TXCE+

--->

Transmitting data clock for DCE and loopback clock for DTE.

16

TXCE–

--->

Transmitting data clock for DCE and loopback clock for DTE.

17

RXC+

<---

Receives clock.

18

RXC–

<---

Receives clock.

19

RXD+

<---

Receives data.

20

RXD–

<---

Receives data.

21

GND

-----

Shield_GND

22

LL

<-->

Loopback control signals.

23

CTS+

<---

Prepares for transmission.

24

CTS–

<---

Prepares for transmission.

25

DSR+

<---

Prepares the DCE.

26

DSR–

<---

Prepares the DCE.

27

DTR+

--->

Prepares the DTE.

28

DTR–

--->

Prepares the DTE.

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

According to the protocols for the N x 64 kbit/s signals, the N x 64 kbit/s cables are classified into the following ten types. l

V.35 DCE cable

l

V.35 DTE cable

l

V.24 DCE cable

l

V.24 DTE cable

l

X.21 DCE cable

l

X.21 DTE cable

l

RS449 DCE cable

l

RS449 DTE cable

l

RS530 DCE cable

l

RS530 DTE cable

V.35 DCE Cable Figure 14-24 shows the structure of the V.35 DCE cable. Figure 14-24 Structure of the V.35 DCE cable A-A

1

2

B-B

3

Pos.28 W

A

B

Pos.1 A

C

E

H

X1

X2

M S W AA EE KK

K P U Y CC HH MM

1. Cable connector-D28 male

D J N T X BB FF LL

B F L R V Z DD JJ NN

2. Main tag

3. Cable connector-D34 female + D34 plastic shell

Table 14-19 lists the pin assignment of the V.35 DCE cable. Table 14-19 Pin assignment of the V.35 DCE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

19

P

Twisted pair

20

S

1

R

2

T Huawei Technologies Proprietary

Twisted pair

14-33

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Connector X1

Connector X2

Relation

15

V

Twisted pair

16

X

3

Y

4

AA

17

U

18

W

11

F

-

22

J

-

23

C

-

13

D

-

25

H

-

27

E

-

21

B

-

6+7+8

A

Short circuiting for 6–8

Twisted pair

Twisted pair

The technical specifications of the V.35 DCE cable are as follows. Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exclusively used for OEM

Connector X2

Cable connector-V35 plug-34PIN-injection molding shell-tube, exclusively used for OEM Cable connector-V35 DCE plug-34PIN-female-cable crimping-core, exclusively used for OEM

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of cores

5 pairs and 8 cores

Core diameter

0.32 mm

Length

3m

V.35 DTE Cable Figure 14-25 shows the structure of the V.35 DTE cable.

14-34

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Figure 14-25 Structure of the V.35 DTE cable A-A

B-B

1

2

3

4

5

Pos.28

W

A

B

Pos.1

X1

X2

1. Cable connector-D28 male

2. Main tag

4. Ordinary terminal

5. Cable connector-D34 male

A B C D E F H J L N K M R T P S V X U W Z BB Y AA DD FF CC EE JJ LL HH KK NN MM

3. Cable connector-D34 plastic shell

Table 14-20 lists the pin assignment of the V.35 DTE cable. Table 14-20 Pin assignment of the V.35 DTE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

1

P

Twisted pair

2

S

19

R

20

T

17

V

18

X

3

Y

4

AA

15

U

16

W

11

F

-

22

J

-

13

C

-

23

D

-

27

H

-

25

E

-

21

B

-

6+10+7+8

A

Short circuiting 6, 7, 8 and 10

Huawei Technologies Proprietary

Twisted pair

Twisted pair

Twisted pair

Twisted pair

14-35

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

The technical specifications of the V.35 DTE cable are as follows. Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-V35 plug-34PIN-injection molding shell-tube, exclusively used for OEM Cable connector-V35 DTE plug-34PIN-male-cable crimping-core, exclusively used for OEM

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of cores

5 pairs and 8 cores

Core diameter

0.32 mm

Length

3m

V.24 DCE Cable Figure 14-26 shows the structure of the V.24 DCE cable. Figure 14-26 Structure of the V.24 DCE cable A-A

B-B

2

1

3

Pos.25 Pos.1

W

A

B

Pos.28 Pos.1

X1

X2

1. Cable connector-D25 female

2. Main tag

3. Cable connector-D28 male

Table 14-21 lists the pin assignment of the V.24 DCE cable. Table 14-21 Pin assignment of the V.24 DCE cable

14-36

Connector X1

Connector X2

Relation

19

2

Twisted pair

1

3

23

4

13

5 Huawei Technologies Proprietary

Twisted pair

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14 Cables

Connector X1

Connector X2

Relation

25

20

Twisted pair

27

6

11

8

22

18

3

15

17

24

15

17

-

21

1

Single

6+7

7

Short circuiting 6 and 7

Twisted pair

Twisted pair

The technical specifications of the V.24 DCE cable are as follows. Table 14-22 Technical specifications of the V.24 DCE cable Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-25PIN-female-cable solder

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of cores

5 pairs and 8 cores

Core diameter

0.32 mm

Length

3m

V.24 DTE Cable Figure 14-27 shows the structure of the V.24 DTE cable.

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14 Cables

Figure 14-27 Structure of the V.24 DTE cable A-A

B-B 1

2

3

Pos.1 Pos.1

W

A

B

Pos.28 Pos.25

X1

X2

1. Cable connector-D25 male

2. Main tag

3. Cable connector-D28 male

Table 14-23 lists the pin assignment of the V.24 DTE cable. Table 14-23 Pin assignment of the V.24 DTE cable Connector X1

Connector X2

Relation

1

2

Twisted pair

19

3

13

4

23

5

27

20

25

6

11

8

22

18

3

15

15

24

17

17

-

21

1

Single

6+10+7

7

Short circuiting 6, 10 and 7

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the V.24 DTE cable are as follows. Table 14-24 Technical specifications of the V.24 DTE cable

14-38

Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-25PIN-male-cable solder

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Item

Description

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of cores

5 pairs and 8 cores

Core diameter

0.32 mm

Length

3m

X.21 DCE Cable Figure 14-28 shows the structure of the X.21 DCE cable. Figure 14-28 Structure of the X.21 DCE cable A-A

B-B 2

1

3

Pos.15

Pos.1

W

B

A

Pos.28

Pos.1

X1

X2

1. Cable connector-D15 female

2. Main tag

3. Cable connector-D28 male

Table 14-25 lists the pin assignment of the X.21 DCE cable. Table 14-25 Pin assignment of the X.21 DCE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

13

5

Twisted pair

14

12

23

3

24

10

19

2

20

9

1

4

2

11

15

6 Huawei Technologies Proprietary

Twisted pair

Twisted pair

Twisted pair

Twisted pair 14-39

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Connector X1

Connector X2

Relation

16

13

21

1

–

6+9

8

Short circuiting 6 and 9

The technical specifications of the X.21 DCE cable are as follows. Table 14-26 Technical specifications of the X.21 DCE cable Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-15PIN-female-cable solder

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of cores

5 pairs and 8 cores

Core diameter

0.32 mm

Length

3m

X.21 DTE Cable Figure 14-29 shows the structure of the X.21 DTE cable. Figure 14-29 Structure of the X.21 DTE cable A-A

B-B 2

1

3

Pos.1

Pos.1

W

B

A

Pos.28

Pos.15

X2

1. Cable connector-D15 male

X1

2. Main tag

3. Cable connector-D28 male

Table 14-27 lists the pin assignment of the X.21 DTE cable.

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Table 14-27 Pin assignment of the X.21 DTE cable Connector X1

Connector X2

Relation

13

3

Twisted pair

14

10

23

5

24

12

19

4

20

11

1

2

2

9

15

6

16

13

17

6

18

13

21

1

–

6+10+9

8

Short circuiting 6, 10 and 9

Twisted pair

Twisted pair

Pair

Twisted pair

Twisted pair

The technical specifications of the X.21 DTE cable are as follows. Table 14-28 Technical specifications of the X.12 DTE cable Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-15PIN-male-cable solder

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of cores

5 pairs and 8 cores

Core diameter

0.32 mm

Length

3m

RS449 DCE Cable Figure 14-30 shows the structure of the RS449 DCE cable.

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14 Cables

Figure 14-30 Structure of the RS449 DCE cable A-A

B-B 2

1

3

Pos.1

Pos.1

W

B

A

Pos.28

Pos.15

X2

X1

1. Cable connector-D28 male

2. Main tag

3. Cable connector-D37 female-I

Table 14-29 lists the pin assignment of the RS449 DCE cable. Table 14-29 Pin assignment of the RS449 DCE cable

14-42

Connector X1

Connector X2

Relation

27

11

Twisted pair

28

29

25

12

26

30

13

9

14

27

23

7

24

25

11

13

12

31

19

4

20

22

1

6

2

24

15

8

16

26

17

17

18

35

3

5

4

23 Huawei Technologies Proprietary

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

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14 Cables

Connector X1

Connector X2

Relation

22

10

–

21

1

–

6+8

19

Short circuiting 6 and 8

The technical specifications of the RS449 DCE cable are as follows. Table 14-30 Specifications of the RS449 DCE cable Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-37PIN-female-cable solder-exclusively used for OEM

Cable type

Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 core-PANTONE 296U-exclusively used for OEM

Number of cores

26

Core diameter

0.32 mm

Length

3m

RS449 DTE Cable Figure 14-31 shows the structure of the RS449 DTE cable. Figure 14-31 Structure of the RS449 DTE cable A-A

B-B 1

2

3 Pos.37

Pos.28

W

A

Pos.1

B

X1 X2

1. Cable connector-D28 male

2. Main tag

Pos.1

3. Cable connector-D37 male-I

Table 14-31 lists the pin assignment of the RS449 DTE cable. Table 14-31 Pin assignment of the RS449 DTE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

27

12

Twisted pair

Huawei Technologies Proprietary

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Connector X1

Connector X2

Relation

28

30

25

11

26

29

13

7

14

25

23

9

24

27

11

13

12

31

19

6

20

24

1

4

2

22

15

17

16

35

17

8

18

26

3

5

4

23

22

10

-

21

1

-

6+8+10

19

Short circuiting 6, 8 and 10

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the RS449 DTE cable are as follows. Table 14-32 Specifications of the RS449 DTE cable

14-44

Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-SUB plug-37PIN-straight male-cable solder-2 row, standard installation hole, exclusively used for OEM

Huawei Technologies Proprietary

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14 Cables

Item

Description

Cable type

Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 corePANTONE 296U-exclusively used for OEM

Number of cores

26

Core diameter

0.32 mm

RS530 DCE Cable Figure 14-32 shows the structure of the RS530 DCE cable. Figure 14-32 Structure of the RS530 DCE cable A-A Pos.25

B-B 3

2

1

Pos.1

W

A

B

X1 Pos.1

Pos.28

X2

1. Cable connector-D25 female

2. Main tag

3. Cable connector-D28 male

Table 14-33 lists the pin assignment of the RS530 DCE cable. Table 14-33 Pin assignment of the RS530 DCE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

28

22

Twisted pair

27

6

26

23

25

20

24

19

23

4

22

18

Single

21

1

Single

20

14

Twisted pair

19

2 Huawei Technologies Proprietary

Twisted pair

Twisted pair

14-45

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Connector X1

Connector X2

Relation

18

11

Twisted pair

17

24

16

9

15

17

14

13

13

5

12

10

11

8

4

12

3

15

2

16

1

3

6+7+9

7

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Short circuiting 6, 7 and 9

The technical specifications of the RS530 DCE cable are as follows. Table 14-34 Specifications of the RS530 DCE cable Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-25PIN-female-cable solder

Cable type

Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 corePANTONE 296U-exclusively used for OEM

Number of cores

26

Core diameter

0.32 mm

Length

3m

RS530 DTE Cable Figure 14-33 shows the structure of the RS530 DTE cable.

14-46

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14 Cables

Figure 14-33 Structure of the RS530 DTE cable B-B

A-A 1

2

3

Pos.1 Pos.1

W

A

B

X1 Pos.25

Pos.28

X2

1. Cable connector-D25 male

2. Main tag

3. Cable connector-D28 male

Table 14-35 lists the pin assignment of the RS530 DTE cable. Table 14-35 Pin assignment of the RS530 DTE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

27

20

Twisted pair

28

23

25

6

26

22

13

4

14

19

23

5

24

13

11

8

12

10

19

3

20

16

1

2

2

14

15

24

16

11

17

17

18

9

3

15

4

12 Huawei Technologies Proprietary

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

14-47

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Connector X1

Connector X2

Relation

22

18

–

21

1

–

6+7+9+10

7

Short circuiting 6, 7, 9 and 10

The technical specifications of the RS530 DTE cable are as follows. Table 14-36 Specifications of the RS530 DTE cable Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-25PIN-male-cable solder

Cable type

Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 corePANTONE 296U-exclusively used for OEM

Number of cores

26

Core diameter

0.32 mm

Length

3m

14.6 Clock Cable The clock cable includes the clock cable and clock transfer cable. 14.6.1 Clock Cable The clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to input and output external clock signals. 14.6.2 One-Channel and Two-Channel Clock Transfer Cables The clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) and two-channel clock transfer cable (75 ohms to 120 ohms).

14.6.1 Clock Cable The clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to input and output external clock signals. For the 75-ohm clock cable, use the SMB connector at one end to connect the cable to the external clock interface of the OptiX OSN equipment. Use a connector to connect the other end to the external clock equipment. The connector should be made according to the on-site requirements. For the 120-ohm clock cable, use the RJ-45 connector at one end to connect the cable to the external clock interface of the OptiX OSN equipment. Use a connector to connect the other end to the external clock equipment. The connector should be made according to the on-site requirements. 14-48

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14 Cables

Structure Figure 14-34 and Figure 14-35 show the structure of the 75-ohm clock cable and the 120-ohm clock cable respectively. Figure 14-34 Structure of the 75-ohm clock cable

1. Coaxial connector-SMB

2. Tag

Figure 14-35 Structure of the 120-ohm 8 x E1 cable

1. Tag 1 (R) and Tag2 (T)

2. Communication cable

3. Main tag 4. Network interface connector-RJ-45

Pin Assignment Table 14-37 lists the pin assignment of the 120-ohm clock cable. Table 14-37 Pin assignment of the 120-ohm clock cable X1

W

Remark

X1.1

Blue

W1

X1.2

White

X1.4

Orange

X1.5

White

W2

Technical Specifications Item

Description

75-ohm clock cable

Connector: coaxial connector-SMB-75 ohms-straight and female Cable type: coaxial cable-75 ohms-3.9 mm-2.1mm-0.34 mm-shielded Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34 mm

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

14 Cables

Item

Description Length: 10 m, 15 m, 20 m, 30 m

120-ohm clock cable

Connector X: network interface connector-8PIN-8 bit-shielded-crystal model connector Cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2 pairsPantone 430U Inner conductor diameter: 0.4 mm/26AWG Length: 5 m, 10 m, 20 m, 30 m, 40 m, 50 m, 70 m, 100 m

14.6.2 One-Channel and Two-Channel Clock Transfer Cables The clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) and two-channel clock transfer cable (75 ohms to 120 ohms).

Structure Figure 14-36 and Figure 14-37 show the structure of the one-channel clock transfer cable and two-channel clock transfer cable respectively. Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female

2. Main tag 3. 75 ohms/120 ohms transfer PCB

Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female

2. Tag 1:"1#" 3. Tag 2:"2#" 4. Main tag

5. 75 ohms/120 ohms transfer PCB

6. Tag 3:"1#" 7. Tag 4:"2#"

Pin Assignment Table 14-38 lists the pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms). 14-50

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Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms) Connector

75-ohm Cable

Color

120-ohm Cable

X1

Core

Blue

W3

Shielding layer

White

Core

Blue

Shielding layer

White

X2

W4

Technical Specifications Item

Description

One channel

Connector: coaxial connector-SMB-75 ohms-straight and female 75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded 75 ohms Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34 mm 120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2 pairs-Pantone 430U Inner conductor diameter: 0.4 mm/26AWG Length: 30 m

Two channels

Connector X1/X2: coaxial connector-SMB-75 ohms-straight and female 75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded 75 ohms cable: cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34 mm 120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2 pairs-Pantone 430U Inner conductor diameter of the 120-ohm cable: 0.4 mm/26AWG Length: 30 m

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

A

A Equipment and Board Alarm Indicators

Equipment and Board Alarm Indicators This chapter describes the equipment and board alarm indicators for the OptiX OSN equipment. A.1 Indicators on the Cabinet This section describes the indicators on the cabinet for the OptiX OSN equipment. A.2 Board Alarm Indicator This section describes the board alarm indicators and their indications.

Issue 02 (2007-09-10)

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A-1

A Equipment and Board Alarm Indicators

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

A.1 Indicators on the Cabinet This section describes the indicators on the cabinet for the OptiX OSN equipment. Indicator

Indication

Normal power supply indicator: Power (green)

When it is lit, it indicates that the power is supplied to the equipment. When it is unlit, it indicates that no power is supplied to the equipment.

Critical alarm indicator: Critical (red)

When it is lit, it indicates that critical alarms are generated in the equipment. When it is unlit, it indicates that no critical alarms are generated in the equipment.

Major alarm indicator: Major (orange)

When it is lit, it indicates that major alarms are generated in the equipment. When it is unlit, it indicates that no major alarms are generated in the equipment.

Minor alarm indicator: Minor (yellow)

When it is lit, it indicates that minor alarms are generated in the equipment. When it is unlit, it indicates that no minor alarms are generated in the equipment.

A.2 Board Alarm Indicator This section describes the board alarm indicators and their indications.

Board Hardware State Indicator (STAT) Status Description

Indication

Lit (green)

The board is working normally.

Lit (red)

The board hardware is faulty.

Unlit

No power is supplied to the board.

Service Activating State Indicator (ACT)

A-2

Status Description

Indication

Lit (green)

The service is in the activating state and the board is working.

Unlit

The service is in the non-activating state.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

A Equipment and Board Alarm Indicators

Board Software State Indicator (PROG) Status Description

Indication

Lit (green)

The board software or software for FPGA is loaded successfully, or the board software is initialized normally.

Circularly lit for 100 ms and unlit for 100 ms (green)

The board software or FPGA is being loaded to the FLASH.

Circularly lit for 300 ms and unlit for 300 ms (green)

The board software is being initialized and is in the BIOS boot state.

Lit (red)

The board software or FPGA in the FLASH is lost. The loading and initialization of the board software fails.

Unlit

No power is input.

Service Alarm Indicator (SRV) Status Description

Indication

Lit (green)

The service is running normally and no service alarms are generated.

Lit (red)

Critical or major alarms occur to the service.

Lit (yellow)

Minor or remote alarms occur to the service.

Unlit

The board is not configured with services and no alarms is generated, or no power is supplied to the board.

Synchronization Clock State Indicator Status Description

Indication

Lit (green)

l

The clock is working in the free-run mode and the system clock priority list is not set. By default, the system clock priority list contains only the internal source.

l

The clock is working in the tracing mode and tracing the clock source rather than the internal source in the priority list.

Lit (red)

Issue 02 (2007-09-10)

The system clock priority list is set. Except the internal clock source, all clock sources are lost. The clock is working in the hold-over or free-run mode.

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A-3

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

A Equipment and Board Alarm Indicators

Alarm Cutting Indicator (ALMC) Status Description

Indication

Lit (yellow)

The board is in the alarm cutting state.

Unlit

Sound is generated to indicate the alarm.

Ethernet Indicator Indicator

Status Description

Indication

Connection status indicator (LINK), which is green when lit.

Lit

The network cable is successfully connected to the equipment.

Unlit

The network cable is not connected to the equipment.

Data receiving and transmitting indicator (ACT), which is orange when lit.

Flashing

The data is being transmitted or received.

Unlit

No data is being transmitted or received.

Service activating state indicator of the cross-connect unit (ACTX) Status Description

Indication

Lit (green)

The cross-connect unit is in the active state.

Unlit

The cross-connect unit is in the standby state.

Active/standby state indicator (ACTC) of the SCC unit Status Description

Indication

Lit (green)

The cross-connect unit is in the active state.

Unlit

The cross-connect unit is in the standby state.

Service alarm indicator of the line unit (SRVL)

A-4

Status Description

Indication

Lit (green)

The line service is normal and no alarms are generated.

Lit (red)

Critical alarms or major alarms occur to the line service.

Lit (yellow)

Minor or remote alarms occur to the line service.

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

A Equipment and Board Alarm Indicators

Status Description

Indication

Unlit

The unit is not configured with services and no alarms is generated, or no power is supplied to the unit.

Fan tray assembly indicator Indicator

Status Description

Indication

Board running state indicator (RUN)

Lit (green)

The board is working normally.

Unlit

The board is not powered on.

Fan alarm indicator (ALM)

Lit (red)

The fan stops.

Unlit

The fan is running normally.

Indicator on the panel of the COA Indicator

Status Description

Indication

Green running indicator (RUN)

Flash once every two seconds (green)

The COA is running normally.

Flash once every four seconds (green)

The COA in in the database protection mode. The communication between the COA and the SCC fails.

Flash five times every second (green)

The program is starting or being loaded.

Lit (red)

The self-check of the memory fails.

Flash thrice every other second (red)

Critical alarms are generated.

Flash twice every other second (red)

Major alarms are generated.

Flash once every other second (red)

Minor alarms are generated.

Alarm indicator (ALM)

Power indicator (POWER)

Issue 02 (2007-09-10)

Status Description

Indication

Lit (green)

The input of the power supply is normal.

Unlit

No power supply is input or the power supply fails.

Huawei Technologies Proprietary

A-5

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

A Equipment and Board Alarm Indicators

Indicator on the UPM

A-6

Module

Indicator

Status Description

Indication

Rectifier module

ALM

Lit (red)

The rectifier module fails. Normally, it is unlit.

Vout

Lit (green)

The output of the rectifier module is normal.

Monitorin g module

RUN

Flashes (green)

The entire power supply system is normal.

ALM

Lit (red)

The entire power supply system becomes faulty. Normally, it is unlit.

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Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

B Labels

B

Labels

This chapter describes various labels for the OptiX OSN equipment, including the safety labels, optical module labels, and cable labels. B.1 Safety Label Many safety labels are stuck on the equipment. This section describes the suggestions and locations of these safety labels. B.2 Optical Module Labels Optical module labels are used to recognize different types of optical modules. Optical module label is stuck to the optical module. B.3 Engineering Labels The engineering labels should be made according to the the local engineering specifications or Huawei engineering specifications.

Issue 02 (2007-09-10)

Huawei Technologies Proprietary

B-1

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

B Labels

B.1 Safety Label Many safety labels are stuck on the equipment. This section describes the suggestions and locations of these safety labels. B.1.1 Label Description On the subrack, there are labels such as the ESD protection label, subrack grounding label and fan warning label. B.1.2 Label Position The ESD protection label and the subrack grounding label are stuck on the subrack. The laser class label and the APD warning label are stuck on the front panel of each board.

B.1.1 Label Description On the subrack, there are labels such as the ESD protection label, subrack grounding label and fan warning label. Table B-1 Labels on the equipment Label

LASER RADIATION

CLASS 1 LASER PRODUCT

Type

Suggestion

ESD protection label

The equipment is electrostatic sensitive.

Laser safety class

The label suggests the class of the laser source.

Subrack grounding label

This label suggests the grounding position.

Regular cleaning label

Regularly clean the air filter.

Fan warning label

Do not the fan leaves before the fan stops.

APD warning label

The overload point of the indicator is –9 dBm.

DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

! ATTENTION 警告 CLEAN PERIODICALLY 定期清洗

严禁在风扇高速旋转时接触叶片 DON'T TOUCH THE FANLEAVESBEFORE THEYSLOW DOWN !

!

APD

Receiver MAX:-9dBm

B-2

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Label

OptiX OSN 1500A 电源额定值 POWER RATING:

B Labels

Type

Suggestion

RoHS label

The equipment is in line with the RoHS-related environment-friendly requirements.

Product nameplate label

The label suggests the product name and certification.

Qualification card label

The equipment is qualified.

-48－ -60V ; 4.5A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. N14036

华为技术有限公司

中国制作

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500 电源额定值

POWER RATING:

-48－ -60V ; 6A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. N14036

华为技术有限公司

中国制作

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

For the enhanced subrack: OptiX OSN 1500A 电源额定值 POWER RATING:

-48－ -60V ; 8.2A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. N14036

华为技术有限公司

中国制作

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500 电源额定值

POWER RATING:

-48－ -60V ; 10.4A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. N14036

华为技术有限公司

中国制作

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

合格证/QUALIFICATION CARD

HUAWEI 华为技术有限公司

中国制作

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

B.1.2 Label Position The ESD protection label and the subrack grounding label are stuck on the subrack. The laser class label and the APD warning label are stuck on the front panel of each board.

Issue 02 (2007-09-10)

Huawei Technologies Proprietary

B-3

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

B Labels

Figure B-1 Labels on the OptiX OSN 1500B subrack

合格证/QUALIFICATION CARD

HUAWEI 华为技术有限公司

中国制作

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500 电源额定值

POWER RATING:

-48－ -60V ; 6A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. N14036

华为技术有限公司

中国制作

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

严禁在风扇高速旋转时接触叶片 DON'T TOUCH THE FAN LEAVES BEFORE THEY SLOW DOWN !

ATTENTION 警告 CLEAN PERIODICALLY 定期清洗

Figure B-2 Labels on the OptiX OSN 1500A subrack

合格证/QUALIFICATION CARD

HUAWEI 华为技术有限公司

中国制作

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500A 电源额定值 POWER RATING:

-48－ -60V ; 4.5A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. N14036

华为技术有限公司

中国制作

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

严禁在风扇高速旋转时接触叶片 DON'T TOUCH THE FAN LEAVES BEFORE THEY SLOW DOWN !

ATTENTION 警告 CLEAN PERIODICALLY 定期清洗

B-4

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Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

B Labels

Figure B-3 Labels on a board SL16

!

CLASS 1 LASER PRODUCT

APD

Receiver MAX:-9dBm

BA2

LASER RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS CLASS 1M LASER PRODUCT

B.2 Optical Module Labels Optical module labels are used to recognize different types of optical modules. Optical module label is stuck to the optical module. Figure B-4 shows the optical module labels. Figure B-4 Optical module labels

As shown in Table B-2, different types of optical module have different codes. Table B-2 Optical module code and type mapping table

Issue 02 (2007-09-10)

Optical Module Code

Optical Type

34060288

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-16-–3 dBm-–10 dBm-–21 dBm-LC-2 km

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B-5

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

B Labels

B-6

Optical Module Code

Optical Type

34060278

Optical transceiver-ESFP (internal and external alignment)-1310STM-16-0 dBm-–5 dBm-–21 dBm-LC-15 km

34060289

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-16-3 dBm-–2 dBm-–30 dBm-LC-40 km

34060279

Optical transceiver-ESFP (internal and external alignment)-1550STM-16-3 dBm-–2 dBm-–30 dBm-LC-80 km

34060277

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-4-–8 dBm-–15 dBm-–31 dBm-LC-15 km

34060280

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-4-2 dBm-–3 dBm-–30 dBm-LC-40 km

34060284

Optical transceiver-ESFP (internal and external alignment)-1550 nmSTM-4-2 dBm-–3 dBm-–30 dBm-LC-80km

34060285

Optical transceiver-ESFP (internal and external alignment)-1550 nmSTM-4-2 dBm-–3 dBm--36 dBm-LC-100km

34060276

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-1-–8 dBm-–15 dBm-–31 dBm-LC-15 km

34060281

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM–1-0 dBm-–5 dBm-–37 dBm-LC-40 km

34060282

Optical transceiver-ESFP (internal and external alignment)-1550STM-1-0 dBm-–5 dBm-–37 dBm-LC-80 km

34060299

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-1-–8 dBm-–15 dBm-–31 dBm-LC (private)-15 km

34060286

Optical transceiver-ESFP (internal and external alignment)-850 nm-2.125G multirate-–2.5 dBm-–9.5 dBm-–17 dBm-LC-0.5 km

34060219

Optical transceiver-ESFP (internal and external alignment)-1310 nm-1.25 Gbit/s-–3 dBm-–9.5 dBm-–20 dBm-LC-10 km

34060298

Optical transceiver-ESFP (internal and external alignment)-1310 nm-1.25 Gbit/s-3 dBm-–4.5 dBm-–22.5 dBm-LC-40 km

34060274

Optical transceiver-ESFP (internal and external alignment)-1550 nm-1.25 Gbit/s-5 dBm-–2 dBm-–23 dBm-LC-80 km

34060325

Optical transceiver-ESFP (internal and external alignment)-850 nm-2.125 G multirate-–2.5 dBm-–9.5dBm-–17 dBm-LC (private)multimode-0.5 km

34060049

Optical transceiver-SFP-850 nm-1.25 Gbit/s-0 dBm-–9.5 dBm-–17 dBm-LC-–0.55 km

34060050

Optical transceiver-SFP-1310 nm-1.25 Gbit/s-–3 dBm-–9 dBm-–20 dBm-LC-–10 km

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Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

B Labels

Optical Module Code

Optical Type

34060207

Optical transceiver-SFP-1310 nm-1.25 Gbit/s-5 dBm-–2 dBm-–23 dBmLC-–40 km

34060051

Optical transceiver-SFP-1550 nm-1.25 Gbit/s-2 dBm-–4 dBm-–22 dBmLC-–70 km

34060287

Optical transceiver-SFP-1310 nm-STM-1-–14 dBm-–19 dBm-–30 dBmLC (TX disable)-2 km

34060053

Optical transceiver-SFP-1310 nm-STM-1-–8 dBm-–15 dBm-–28 dBmLC-15 km

34060209

Optical transceiver-SFP-1310 nm-STM-1-0 dBm-–5 dBm-–34 dBmLC-40 km

B.3 Engineering Labels The engineering labels should be made according to the the local engineering specifications or Huawei engineering specifications. The engineering labels should be made according to the the local engineering specifications or Huawei engineering specifications. Table B-3 lists the Huawei engineering specifications for engineering labels. For details on how to make and stick cable labels, see the OptiX OSN 1500 Intelligent Optical Transmission System Installation Guide. Table B-3 Huawei specifications for engineering labels Label Engineer ing labels for power cables

Illustration TO: A01 B08

(1)

-48V2

Suggestion TO: B03

-48V2

(2)

(1) Indicates the label on the loaded cabinet side, which carries the information about the position of the cable on the power distribution unit. (2) Indicates the label on the distribution unit side, which carries the information about the position of the cable on the loaded cabinet side.

Issue 02 (2007-09-10)

(1) On the loaded cabinet side, the label marked "A01/B08-–48V2" on the cable indicates that the cable is –48V2 DC power supply, which is from the eighth connecter on the second row of the –48V bus bar in the cabinet on Row A, and Column 1 in the equipment room. (2) On the distribution unit side, the label marked "B03--48V2" indicates that the cable is –48V2 DC power supply, which is from the loaded cabinet on Row B, Column 03 in the equipment room. For PGND and BGND, it is only necessary to give the row and column of the power distribution unit, instead of the specific serial number of the terminal block on the copper bar.

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B-7

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

B Labels

Label

Illustration

Engineer ing labels for alarm external cables

Suggestion The external alarm cables are connected to the first subscriber cabinet of each row (used for power distribution). Engineering labels posted on the first cabinet of each row should indicate which equipment is using the access terminal. Engineering labels are not needed on the equipment side unless there are special requirements. The label marked "A01" indicates that the alarm cable connects the first cabinet and the cabinet on Row A, Column 01 in the equipment room. "A01-03-06-05" indicates that on the local end of the Ethernet cable is connected to Ethernet Port 05, Slot 6, Frame 03 of the cabinet on Row A, Column 01 in the equipment room.

Engineer ing labels for Ethernet cables

"B02-03-12" indicates that the other end of the Ethernet cable is connected to Ethernet Port 12, Frame 03 of the cabinet on Row B, Column 02 in the equipment room. No slot number is specified.

B-8

Engineer ing labels for fibers that connect equipme nt

"A01-01-05-05-R" indicates that the local end of the fiber jumper is connected with Optical Receiving Interface 05 on Slot 5, Frame 01 in the cabinet on Row A, Column 01 in the equipment room.

Labels for fibers that connect the equipme nt to the ODF

"ODF-G01-01-01-R" indicates that the local end of the fiber jumper is connected to the optical receiving terminal on Row 01, Column 01 of the ODF in Row G Column 01 in the equipment room.

"G01-01-01-01-T" indicates that the opposite end of the fiber jumper is connected with optical transmitting interface 01 on Slot 01, Frame 01 in the cabinet on Row G, Column 01 in the equipment room.

"A01-01-05-05-R" indicates that the other end of the fiber jumper is connected to optical receiving interface 5 on Slot 05, frame 01 in the cabinet on Row A, Column 01 in the equipment room.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Label

Illustration

B Labels

Suggestion

Labels for trunk cables that connect the equipme nt to the ODF

"A01-03-01-01-R" indicates that local end of the trunk cable connects with the receiving terminal of Trunk Cable 01 in Slot 01, Frame 03 of the cabinet on Row A, Column 01 in the equipment room.

Engineer ing labels for subscrib er cables

"A01-03-01-01" indicates that the local end of the subscriber cable connects with Terminal 01 on Slot 1, Frame 03 of the cabinet on Row A, Column 01 in the equipment room.

"DDF-G01-01-01-AR" indicates that the opposite end of the trunk cable connects the receiving terminal of Direction A (connected to optical network equipment) on Row 01, Column 01 of the DDF on Row G and Column 01 in the equipment room.

TO:

"MDF-G01-01-01" indicates that the opposite end of the cable connects with the terminal on Row 01, Column 01 of the MDF on Row G, Column 01 in the equipment room.

Issue 02 (2007-09-10)

Huawei Technologies Proprietary

B-9

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

C

C Power Consumption and Weight

Power Consumption and Weight

This chapter describes the power consumption and weight of each board for the OptiX OSN 1500. Table C-1 Power consumption and weight of each board for the OptiX OSN 1500

Issue 02 (2007-09-10)

Board

Consumpti on (W)

Weight (kg)

Board

Consumpt ion (W)

Weight (kg)

N1ADL4

41

0.9

N1LWX

30

1.1

N1ADQ1

41

1.0

N1MR2B

0

1.0

AUX

19

1.0

N1MR2C

0

1.0

R1AMU

8

0.5

N1FIB

0

0.4

N1BA2

20

1.0

N1MST4

26

0.9

N1BPA

20

1.0

N1MU04

2

0.4

Q2CXL16

40

1.1

N1OU08

6

0.4

Q2CXL4

40

1.1

N2OU08

6

0.4

Q2CXL1

40

1.1

R1PD1

15

0.5

N1EFT8A

26

1.0

N3SL16

22

1.1

N3SL16A

17

0.9

N2PQ3

13

0.9

N2PD3

12

0.9

N2PL3

12

0.9

N2PL3A

12

0.9

TN11OBU1

16

1.3

TN11MR2

0.2

0.9

TN11MR4

0.2

0.9

TN11CMR 2

0.2

0.8

TN11CMR4

0.2

0.9

N1D12B

0

0.3

N1PD3

19

1.1

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C-1

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

C Power Consumption and Weight

Board

Consumpti on (W)

Weight (kg)

Board

Consumpt ion (W)

Weight (kg)

N1D12S

9 (switching),

0.4

PIU

1.5

1.3

0.4

R1PL1A

6.7

0.5

0.4

R1PL1B

6.7

0.5

0 (normal) 9 N1D34S

2 (switching), 0 (normal)

N1D75S

6 (switching), 0 (normal)

N1EFF8

6

0.4

N1PL3

15

1.0

N1EFS0

35

1.0

N1PQ1

19

1.0

N2EFS0

35

1.0

N1PQM

22

1.0

N4EFS0

35

1.0

R2PD1

10

0.6

N1EFS4

30

1.0

N1PL3A

15

1.1

N2EFS4

30

1.0

N1SEP1

17

1.0

R1EFT4

14

0.5

N1SF16

26

1.1

N1EFT8

26

1.0

N1SL1

14

1.0

N1EGS2

40

1.0

N2SL1

14

1.0

N2EGS2

43

1.0

N1SL16, N1SL16A

20

1.1

N1EGT2

29

0.9

N2SL16

20

1.1

N1EMR0

50

1.2

N1SL4

15

1.0

N2EMR0

50

1.2

N2SL4

15

1.0

EOW

10

0.4

N1SLD4

15

1.0

N1ETF8

2

0.4

N2SLD4

15

1.0

N1ETS8

3 (switching),

0.4

N1SLQ1

15

1.0

0 (normal)

C-2

N1EU04

6

0.4

N2SLQ1

15

1.0

N1EU08

11

0.4

N1SLQ4

16

1.0

R1FAN

20

1.0

N2SLQ4

16

1.0

N1IDL4

41

1.0

N1SLT1

15

1.2

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

C Power Consumption and Weight

Board

Consumpti on (W)

Weight (kg)

Board

Consumpt ion (W)

Weight (kg)

N1IDQ1

41

1.0

N1SPQ4

24

0.9

R1L12S

2.7

0.2

N2SPQ4

24

0.9

R1L75S

4.5

0.3

R1SL1

10

0.5

N1TSB4

2.5

0.3

R1SL4

10

0.5

N1C34S

2 (switching),

0.3

R1SLD4

11

0.5

0.3

R1SLQ1

12

0.5

0 (normal) N1TSB8

5 (switching), 0 (normal)

Issue 02 (2007-09-10)

N1EGS4

70

1.1

N1DX1

15

1.0

N1EMS4

65 (not used with the interface board), 75 (used with the interface board)

1.1

N2PQ1

13

1.0

N1DXA

10

0.8

-

-

-

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C-3

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

D

D Board Version Configuration

Board Version Configuration

This chapter describes the version compatibility for each board. Table D-1 lists the board versions that are compatible with the OptiX OSN products. Table D-1 Board versions that are compatible with the OptiX OSN products

Issue 02 (2007-09-10)

Product

OptiX OSN 7500

OptiX OSN 3500

OptiX OSN 3500T

OptiX OSN 2500

OptiX OSN 2500 REG

OptiX OSN 1500A

OptiX OSN 1500B

N1SL64

Y

Y

Y

N

Y

N

N

N2SL64

N

Y

Y

N

Y

N

N

T2SL64

Y

N

N

N

N

N

N

T2SL64A

Y

N

N

N

N

N

N

N1SF64

Y

Y

Y

N

Y

N

N

N1SLD64

Y

Y

Y

N

N

N

N

N1SL16

Y

Y

Y

Y

N

Y

Y

N2SL16

Y

Y

Y

Y

Y

Y

Y

N3SL16

Y

Y

Y

Y

Y

Y

Y

N1SL16A

Y

Y

Y

Y

N

Y

Y

N2SL16A

Y

Y

Y

Y

N

Y

Y

N3SL16A

Y

Y

Y

Y

Y

Y

Y

N1SLD16

N

Y

Y

N

N

N

N

N2SLQ16

Y

Y

Y

N

N

N

N

N1SF16

Y

Y

Y

Y

Y

Y

Y

N1SL4

Y

Y

Y

Y

N

Y

Y

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D-1

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

D Board Version Configuration

D-2

Product

OptiX OSN 7500

OptiX OSN 3500

OptiX OSN 3500T

OptiX OSN 2500

OptiX OSN 2500 REG

OptiX OSN 1500A

OptiX OSN 1500B

N2SL4

Y

Y

Y

Y

N

Y

Y

R1SL4

N

N

N

Y

N

Y

Y

N1SLQ4

Y

Y

Y

Y

N

Y

Y

N2SLQ4

Y

Y

Y

Y

N

Y

Y

N1SLD4

Y

Y

Y

Y

N

Y

Y

N2SLD4

Y

Y

Y

Y

N

Y

Y

R1SLD4

N

N

N

Y

N

Y

Y

N1SLT1

Y

Y

Y

Y

N

Y

Y

N1SLQ1

Y

Y

Y

Y

N

Y

Y

N2SLQ1

Y

Y

Y

Y

N

Y

Y

R1SLQ1

N

N

N

Y

N

Y

Y

N1SL1

Y

Y

Y

Y

N

Y

Y

N2SL1

Y

Y

Y

Y

N

Y

Y

R1SL1

N

N

N

Y

N

Y

Y

N1SLH1

Y

Y

Y

N

N

N

N

N1SEP1

Y

Y

Y

Y

N

Y

Y

N2SLO1

Y

Y

Y

Y

N

Y

Y

R1PL1

N

N

N

N

N

Y

Y

R1PD1

N

N

N

Y

N

Y

Y

R2PD1

N

N

N

Y

N

Y

Y

N1PQ1

Y

Y

Y

Y

N

N

Y

N2PQ1

Y

Y

Y

Y

N

N

Y

N1PQM

Y

Y

Y

Y

N

N

Y

N1PL3

Y

Y

Y

Y

N

N

Y

N2PL3

Y

Y

Y

Y

N

N

Y

N1PL3A

Y

Y

Y

Y

N

Y

Y

N2PL3A

Y

Y

Y

Y

N

Y

Y

N1PD3

Y

Y

Y

Y

N

N

Y

N2PD3

Y

Y

Y

Y

N

N

Y

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Issue 02 (2007-09-10)

D Board Version Configuration

Product

OptiX OSN 7500

OptiX OSN 3500

OptiX OSN 3500T

OptiX OSN 2500

OptiX OSN 2500 REG

OptiX OSN 1500A

OptiX OSN 1500B

N2PQ3

Y

Y

Y

Y

N

N

Y

N1DX1

Y

Y

Y

Y

N

N

Y

N1DXA

Y

Y

Y

Y

N

Y

Y

N1SPQ4

N

Y

Y

Y

N

N

Y

N2SPQ4

Y

Y

Y

Y

N

N

Y

R1EFT4

N

N

N

Y

N

Y

Y

N1EFT8

Y

Y

Y

Y

N

Y

Y

N1EFT8A

Y

Y

Y

Y

N

Y

Y

N1EGT2

Y

Y

Y

Y

N

Y

Y

N1EFS0

N

Y

Y

Y

N

N

Y

N2EFS0

Y

Y

Y

Y

N

N

Y

N4EFS0

Y

Y

Y

Y

N

N

Y

N1EFS4

Y

Y

Y

Y

N

Y

Y

N2EFS4

Y

Y

Y

Y

N

Y

Y

N1EGS2

N

Y

Y

Y

N

Y

Y

N2EGS2

Y

Y

Y

Y

N

Y

Y

N1EMS4

Y

Y

Y

Y

N

Y

Y

N1EGS4

Y

Y

Y

Y

N

Y

Y

N2EGR2

Y

Y

Y

Y

N

Y

Y

N1EMR0

N

Y

Y

Y

N

Y

Y

N2EMR0

Y

Y

Y

Y

N

Y

Y

N1ADL4

Y

Y

Y

Y

N

Y

Y

N1ADQ1

Y

Y

Y

Y

N

Y

Y

N1IDL4

Y

Y

Y

Y

N

Y

Y

N1IDQ1

Y

Y

Y

Y

N

Y

Y

N1MST4

Y

Y

Y

Y

N

Y

Y

N1EU08

Y

Y

Y

Y

N

N

Y

N1OU08

Y

Y

Y

Y

N

N

Y

N2OU08

Y

Y

Y

Y

N

N

Y

Huawei Technologies Proprietary

D-3

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

D Board Version Configuration

D-4

Product

OptiX OSN 7500

OptiX OSN 3500

OptiX OSN 3500T

OptiX OSN 2500

OptiX OSN 2500 REG

OptiX OSN 1500A

OptiX OSN 1500B

N1D75S

Y

Y

Y

Y

N

N

Y

N1MU04

Y

Y

Y

Y

N

N

Y

N1D34S

Y

Y

Y

Y

N

N

Y

N1C34S

Y

Y

Y

Y

N

N

Y

N1EU04

N

Y

Y

Y

N

N

Y

N1D12S

Y

Y

Y

Y

N

N

Y

N1D12B

Y

Y

Y

Y

N

N

Y

R1L12S

N

N

N

N

N

Y

N

R1L75S

N

N

N

N

N

Y

N

N1EFF8

Y

Y

Y

Y

N

N

Y

N1ETF8

Y

Y

Y

Y

N

N

Y

N1ETS8

Y

Y

Y

Y

N

N

Y

N1DM12

Y

Y

Y

Y

N

N

Y

N1TSB4

N

Y

Y

Y

N

N

Y

N1TSB8

Y

Y

Y

Y

N

N

Y

Q2CXL1

N

N

N

Y

N

Y

Y

Q2CXL4

N

N

N

Y

N

Y

Y

Q2CXL16

N

N

N

Y

N

Y

Y

T1GXCSA

Y

N

N

N

N

N

N

N1GXCSA

N

Y

Y

N

N

N

N

T1EXCSA

Y

N

N

N

N

N

N

N1EXCSA

N

Y

Y

N

N

N

N

T2UXCSA

Y

N

N

N

N

N

N

N1UXCSA

N

Y

Y

N

N

N

N

N1UXCSB

N

Y

Y

N

N

N

N

T1SXCSA

Y

N

N

N

N

N

N

T2SXCSA

Y

N

N

N

N

N

N

N1SXCSA

N

Y

Y

N

N

N

N

N1SXCSB

N

Y

Y

N

N

N

N

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Issue 02 (2007-09-10)

D Board Version Configuration

Product

OptiX OSN 7500

OptiX OSN 3500

OptiX OSN 3500T

OptiX OSN 2500

OptiX OSN 2500 REG

OptiX OSN 1500A

OptiX OSN 1500B

T1IXCSA

Y

N

N

N

N

N

N

N1IXCSA

N

Y

Y

N

N

N

N

N1IXCSB

N

Y

Y

N

N

N

N

N1XCE

N

Y

Y

N

N

N

N

N1GSCC

N

Y

N

N

N

N

N

N2GSCC

Y

N

N

N

N

N

N

N3GSCC

Y

Y

Y

N

N

N

N

CRG

N

N

N

N

Y

N

N

T1EOW

Y

N

N

N

N

N

N

R1EOW

N

N

N

N

N

Y

Y

T1AUX

Y

N

N

N

N

N

N

N1AUX

N

Y

Y

N

N

N

N

R1AUX

N

N

N

N

N

Y

Y

R2AUX

N

N

N

N

N

Y

Y

R1AMU

N

N

N

N

N

Y

Y

Q1SAP

N

N

N

Y

Y

N

N

Q2SAP

N

N

N

Y

Y

N

N

Q1SEI

N

N

N

Y

Y

N

N

N1FAN

N

Y

Y

Y

Y

N

N

R1FAN

N

N

N

N

N

Y

Y

N1FANA

Y

Y

Y

N

N

N

N

TN11CMR 2

Y

Y

Y

Y

N

Y

Y

TN11CMR 4

Y

Y

Y

Y

N

Y

Y

TN11MR2

Y

Y

Y

Y

N

Y

Y

TN11MR4

Y

Y

Y

Y

N

Y

Y

N1MR2A

Y

Y

Y

Y

N

Y

Y

N1MR2B

N

N

N

Y

N

Y

Y

N1MR2C

Y

Y

Y

Y

N

N

Y

Huawei Technologies Proprietary

D-5

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

D Board Version Configuration

D-6

Product

OptiX OSN 7500

OptiX OSN 3500

OptiX OSN 3500T

OptiX OSN 2500

OptiX OSN 2500 REG

OptiX OSN 1500A

OptiX OSN 1500B

N1LWX

Y

Y

Y

Y

N

Y

Y

TN11OBU 1

Y

Y

Y

Y

Y

Y

Y

N1FIB

Y

Y

Y

Y

Y

Y

Y

N1BA2

Y

Y

Y

Y

Y

Y

Y

N1BPA

Y

Y

Y

Y

Y

Y

Y

61COA

Y

Y

Y

Y

Y

Y

Y

62COA

Y

Y

Y

Y

Y

Y

Y

N1COA

Y

Y

Y

Y

Y

Y

Y

N1DCU

Y

Y

Y

N

Y

N

N

N2DCU

Y

Y

Y

N

Y

N

N

UPM

N

N

N

Y

Y

Y

Y

T1PIU

Y

N

N

N

N

N

N

N1PIU

N

Y

Y

N

N

N

N

Q1PIU

N

N

N

Y

Y

N

N

R1PIU

N

N

N

N

N

Y

Y

R1PIUA

N

N

N

N

N

Y

N

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

E Board Loopbacks

E

Board Loopbacks

The SDH, PDH, data processing board for the OptiX OSN equipment support various types of loopbacks. In the case of the SDH boards for the OptiX OSN equipment, Table E-1 lists the capability of supporting the loopbacks. Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment

Issue 02 (2007-09-10)

Board

Port Inloop

Port Outloop

VC-4 Inloop

VC-4 Outloop

Q2SL1

Supported.

Supported.

Supported.

Not supported.

Q2SL4

Supported.

Supported.

Supported.

Not supported.

Q2SL16

Supported.

Supported.

Supported.

Not supported.

N1SL64

Supported.

Supported.

Supported.

Supported.

N2SL64

Supported.

Supported.

Not supported.

Not supported.

T2SL64

Supported.

Supported.

Not supported.

Not supported.

T2SL64A

Supported.

Supported.

Not supported.

Not supported.

N1SF64

Supported.

Supported.

Supported.

Supported.

N1SLD64

Supported.

Supported.

Supported.

Supported.

N1SL16

Supported.

Supported.

Supported.

Not supported.

N2SL16

Supported.

Supported.

Not supported.

Not supported.

N3SL16

Supported.

Supported.

Supported.

Supported.

N1SL16A

Supported.

Supported.

Supported.

Not supported.

N2SL16A

Supported.

Supported.

Not supported.

Not supported.

N3SL16A

Supported.

Supported.

Supported.

Supported.

N1SLD16

Supported.

Supported.

Supported.

Supported.

Huawei Technologies Proprietary

E-1

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

E Board Loopbacks

Board

Port Inloop

Port Outloop

VC-4 Inloop

VC-4 Outloop

N2SLQ16

Supported.

Supported.

Not supported.

Not supported.

N1SF16

Supported.

Supported.

Supported.

Not supported.

N1SL4

Supported.

Supported.

Supported.

Not supported.

N2SL4

Supported.

Supported.

Not supported.

Not supported.

R1SL4

Supported.

Supported.

Supported.

Not supported.

N1SLQ4

Supported.

Supported.

Supported.

Not supported.

N2SLQ4

Supported.

Supported.

Not supported.

Not supported.

N1SLD4

Supported.

Supported.

Supported.

Not supported.

N2SLD4

Supported.

Supported.

Not supported.

Not supported.

R1SLD4

Supported.

Supported.

Supported.

Not supported.

N1SLT1

Supported.

Supported.

Supported.

Not supported.

N1SLQ1

Supported.

Supported.

Supported.

Not supported.

N2SLQ1

Supported.

Supported.

Not supported.

Not supported.

R1SLQ1

Supported.

Supported.

Supported.

Not supported.

N1SL1

Supported.

Supported.

Supported.

Not supported.

N2SL1

Supported.

Supported.

Not supported.

Not supported.

R1SL1

Supported.

Supported.

Supported.

Not supported.

N1SLH1

Supported.

Supported.

Supported.

Not supported.

N1SEP1

Supported.

Supported.

Supported.

Not supported.

N2SLO1

Supported.

Supported.

Not supported.

Not supported.

In the case of the PDH boards for the OptiX OSN equipment, Table E-2 lists the capability of supporting the loopbacks. Table E-2 Loopbacks of the PDH boards for the OptiX OSN equipment

E-2

Board

Port Inloop

Port Outloop

R1PL1

Supported.

Supported.

R1PD1

Supported.

Supported.

N1PQ1

Supported.

Supported.

N1PQM

Supported.

Supported.

N1PD3

Supported.

Supported.

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

E Board Loopbacks

Board

Port Inloop

Port Outloop

N1PL3

Supported.

Supported.

N2SPQ4

Supported.

Supported.

In the case of the Ethernet boards for the OptiX OSN equipment, Table E-3 lists the capability of supporting the loopbacks. Table E-3 Loopbacks of the Ethernet boards for the OptiX OSN equipment

Issue 02 (2007-09-10)

Board

MAC Layer Outloo p

MAC Layer Inloop

PHY Layer Outloop

PHY Layer Inloop

VC-4 Inloop, VC-4 Outloop

VC-3 Inloop, VC-3 Outloop

N1EFS4

Not supporte d.

Supported.

Not supported.

Supported.

Not supported.

Supported .

N2EFS4

Not supporte d.

Supported.

Not supported.

Supported.

Not supported.

Supported .

N1EFS0

Not supporte d.

Supported.

Not supported.

Supported.

Not supported.

Supported .

N2EFS0

Not supporte d.

Supported.

Not supported.

Supported.

Not supported.

Supported .

N4EFS0

Not supporte d.

Supported.

Not supported.

Supported.

Not supported.

Supported .

N1EGS2

Not supporte d.

Supported.

Not supported.

Supported.

Not supported.

Supported .

N1EGT2

Support ed.

Supported.

Not supported.

Supported.

Not supported.

Not supported.

N1EFT8

Support ed.

Supported.

Not supported.

Supported.

Not supported.

Supported .

N1EFT8 A

Support ed.

Supported.

Not supported.

Supported.

Not supported.

Supported .

R1EFT4

Support ed.

Supported.

Not supported.

Supported.

Not supported.

Supported .

N1EMS4

Not supporte d.

Not supported.

Not supported.

Supported.

Not supported.

Not supported.

Huawei Technologies Proprietary

E-3

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

E Board Loopbacks

Board

MAC Layer Outloo p

MAC Layer Inloop

PHY Layer Outloop

PHY Layer Inloop

VC-4 Inloop, VC-4 Outloop

VC-3 Inloop, VC-3 Outloop

N1EGS4

Not supporte d.

Not supported.

Not supported.

Supported.

Not supported.

Not supported.

N2EGS4

Not supporte d.

Not supported.

Not supported.

Supported.

Not supported.

Not supported.

N2EGR2

Not supporte d.

Supported.

Not supported.

Supported.

Not supported.

Not supported.

N1EMR0

Not supporte d.

Supported.

Not supported.

Supported.

Not supported.

Not supported.

N2EMR0

Not supporte d.

Supported.

Not supported.

Supported.

Not supported.

Not supported.

N1MST4

Not supporte d.

Not supported.

Supported.

Supported.

Not supported.

Not supported.

In the case of the ATM/IMA boards for the OptiX OSN equipment, Table E-3 lists the capability of supporting the loopbacks. Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment

E-4

Board

External Port Outloop

External Port Inloop

Internal Port Outloop

Internal Port Inloop

N1ADL4

Not supported.

Supported.

Supported.

Supported.

N1ADQ1

Not supported.

Supported.

Supported.

Supported.

N1IDL4

Not supported.

Supported.

Supported.

Supported.

N1IDQ1

Not supported.

Supported.

Supported.

Supported.

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

F

F Board Configuration Reference

Board Configuration Reference

The T2000 can be used to configure various parameters for SDH boards, PDH boards, data processing boards, and cross-connect and timing boards. F.1 SDH Processing Boards The parameters that can be configured for the SDH processing boards include the J0 byte, J1 byte, C2 byte and V5 byte. F.2 PDH Processing Board The parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2 byte , V5 byte and tributary loopback. F.3 Data Processing Board The parameters that should be set for data processing boards include SDH parameters, Ethernet parameters and ATM parameters. F.4 Cross-Connect and Timing Unit The clock parameters should be set on the cross-connect and timing unit.

Issue 02 (2007-09-10)

Huawei Technologies Proprietary

F-1

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

F Board Configuration Reference

F.1 SDH Processing Boards The parameters that can be configured for the SDH processing boards include the J0 byte, J1 byte, C2 byte and V5 byte.

J0 Byte J0 is the section trace byte, the J0 are transmitted in a successive manner. Hence, the receive end learns that it is in the continuous connection with the specified transmit end. The value of J1 is "0" by default.

J1 Byte The J1 byte is the path tracing byte. The transmit end uses the J1 byte to transmit the higher order access point identifiers in a successive manner. Hence, the receive end learns that it is in the continuous connection with the specified transmit end in this channel. When the receive end detects the J1 mismatch, the corresponding VC-4 channel generates an HP_TIM alarm. Set the J1 byte as " HuaWei SBS

" for the SL01 and as "0" for all other boards.

NOTE

By default, the J1 byte is " HuaWei SBS

". One space is present before "HuaWei SBS" and five behind.

C2 Byte The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the VC frames and the payload property. The received C2 should be the same as the transmitted C2. If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm. Table F-1 lists the mapping relation between the service type and setting of the C2. Table F-1 Mapping relation between the service type and setting of the C2 Input Service Type

C2 Byte (in Hex)

TUG structure

02

34M/45M asynchronously mapped into a C-3

04

140M asynchronously mapped into a C-4

12

Unequipped

00

F.2 PDH Processing Board The parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2 byte , V5 byte and tributary loopback. F-2

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

F Board Configuration Reference

J1 Byte The J1 byte is the path tracing byte. The transmit end transmits the higher order access point identifiers in a successive manner. Hence, the receive end learns that it is in the continuous connection with the specified transmit end. When the receive end detects the J1 mismatch, the corresponding VC-4 channel generates an HP_TIM alarm. By default, the J1 byte is set to "0". NOTE

By default, the J1 byte is "HuaWei SBS ".

C2 Byte The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the VC frames and the payload property. The received C2 should be the same as the transmitted C2. If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm. Table F-2 lists the mapping relation between the service type and setting of the C2. Table F-2 Mapping relation between the service type and setting of the C2 Input Service Type

C2 Byte (in Hex)

TUG structure

02

34M/45M asynchronously mapped into a C-3

04

140M asynchronously mapped into a C-4

12

Unequipped

00

J2 Byte The J2 is a VC-12 channel tracing byte. The transmit end uses the J2 byte to transmit the lower order access point identifiers in a successive manner. Hence, the receive end learns that it is in the continuous connection to the specified transmit end in this channel.

V5 Byte The V5 is a channel status and signal identification byte. This byte is used to detect bit error and indicate remote faults or defect in lower order channel. The LP_REI and LP_RFI alarms are generated accordingly. Table F-3 lists the mapping relation between the service type and setting of the V5. Table F-3 Mapping relation between the service type and setting of the V5

Issue 02 (2007-09-10)

Input Service Type

V5 Byte (in Hex)

Asynchronization

02

Byte synchronization

04 Huawei Technologies Proprietary

F-3

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

F Board Configuration Reference

Input Service Type

V5 Byte (in Hex)

HDLC/PPP mapping

0A

Unequipped or Supervisory-Unequipped

00

Equipping Indication When a service channel just carries the service and does not process the service, select Unequipped or Supervisory-Unequipped. When a service channel carries the service and also processes the service, select EquippedUnspecific Payload.

Tributary Loopback The tributary loopback function is used to locate faults in the service channels. The tributary loopback is also a diagnosis function. When the tributary loopback is performed, related services are interrupted.

Path Service Type This parameter is set to specify service type for the channel. l

Select E1 or T1 for E1/T1 processing boards according to the actual service type in the channel.

l

Select E3 or T3 for E3/T3 processing boards according to the actual service type in the channel.

Serial Port Protocol Mode For the DX1, select the protocol mode of the N x 64 kbit/s signals. The protocol mode includes V.35, V.24, X.21, RS449, RS530 and RS530A.

DDN Clock Source Management The timing scheme and working clock source can be set for the DX1. Set the timing scheme of the DDN channels 10–12 and 14–16 to the DCE internal scheme, DCE slave scheme or DTE external scheme. Set the timing scheme of the DDN channels 9 and 13 to the DCE internal scheme, DCE slave scheme, DTE external scheme, DTE internal scheme, DTE slave scheme or DCE external scheme. By default, the timing scheme is the DCE internal scheme for channels 9 and 13 is the DCE internal scheme.

F.3 Data Processing Board The parameters that should be set for data processing boards include SDH parameters, Ethernet parameters and ATM parameters. F.3.1 SDH Parameters The SDH parameters that should be set for data processing boards include the J1 byte, C2 byte, J2 byte and V5 byte. F-4

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

F Board Configuration Reference

F.3.2 Ethernet Parameters The Ethernet parameters that should be set for the Ethernet boards include the working mode and LCAS state. F.3.3 ATM Parameter The ATM parameters that the ATM boards should be set include port type and flow type.

F.3.1 SDH Parameters The SDH parameters that should be set for data processing boards include the J1 byte, C2 byte, J2 byte and V5 byte.

J1 Byte The J1 byte is the path tracing byte. The transmit end transmits the J1 byte in a successive manner. Hence, the receive end learns that it is in the continuous connection to the specified transmit end in this path. When detecting the J1 mismatch, the receive end generates the LP_TIM_VC3 alarm in the VC-3 path and the HP_TIM_VC4 in the VC-4 path. If the J1 byte is of the default value, "0", these alarms are not reported. NOTE

l

For the N1EFS4 and MST4, the J1 byte is " HuaWei SBS " by default. For other boards, the J1 byte is "0".

l

For the EMS4 and EGS4, set the J1 byte as " HuaWei SBS ".

C2 Byte The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the VC frames and the payload property. The received C2 should be the same as the transmitted C2. In case of the C2 mismatch, the LP_SLM_VC3 alarm is generated in the VC-3 path and the HP_SLM_VC4 alarm is generated in the VC-4 path.

J2 Byte The J2 is a VC-12 path tracing byte. The transmit end uses the J2 byte to transmit the lower order access point identifiers in a successive manner. Hence, the receive end learns that it is in the continuous connection to the specified transmit end in this path. In case of the J2 mismatch, the LP_TIM_VC12 alarm is generated in the VC-12 path. If the J1 byte is of the default value, "0", these alarms are not reported.

V5 Byte The V5 is a path status and signal identification byte. This byte is used to detect bit error and indicate remote faults or defect in lower order path. The LP_REI and LP_RFI alarms are generated accordingly. When detecting the V5 mismatch, the receive end generates the LP_SLM_VC12 in the VC-12 path. Table F-4 lists the mapping relation between the service type and setting of the V5. Issue 02 (2007-09-10)

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F Board Configuration Reference

Table F-4 Mapping relation between the service type and setting of the V5 Input Service Type

V5 Byte (in Hex)

Asynchronization

02

Byte synchronization

04

HDLC/PPP mapping

0A

Unequipped or Supervisory-Unequipped

00

F.3.2 Ethernet Parameters The Ethernet parameters that should be set for the Ethernet boards include the working mode and LCAS state.

Working Mode Generally, the interconnected equipment should work in the same fixed working mode. If the working modes at both ends mismatch, packets may be lost or the rate becomes less. In case of large volume of data, services may be even interrupted. For EGT2, EGS2 and EGS4, set the working mode to auto-negotiation or 1000M full-duplex. For the EFT8 and EFT8A, set the working mode to auto-negotiation or 10/100M full-duplex. For the EFS4 and EFS0, set the working mode to auto-negotiation, 10M half-duplex, 10M fullduplex, 100M half full-duplex or 100M full-duplex. For the GE ports of the EMS4, EMR0 and EGR2, set the working mode to auto-negotiation or 1000M full-duplex. For the FE ports, set the working mode to auto-negotiation, 10M half-duplex, 10M full-duplex, 100M half full-duplex or 100M full-duplex.

LCAS State Enable or disable the LCAS.

Maximum Packet Length For external ports, set the maximum packet length, which is 1522-byte by default.

Mapping Protocol The mapping protocols of the interconnected equipment should be the same. For the EGT2, EFT8, EFT8A, EFF8 and ETF8, set the mapping protocol to HDLC, LAPS and GFP-F. By default, the mapping protocol is GFP-F. Choose the GFP-F mapping protocol for the EGS2, EFS4 and EFS0. For the EMR0 and EGR2, set the mapping protocol to LAPS and GFP. By default, the mapping protocol is GFP. F-6

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F Board Configuration Reference

TAG Flag The TAG flag is used to identify the type of packets. The TAG flag can be set to TAG Aware, Access and Hybrid. 1.

When the TAG flag is set as the TAG Aware for a port, the port transparently transmits the packets with a TAG and discards the packets without a TAG.

2.

When the TAG flag is set as Access for a port, the port adds a TAG to the received packets that does not contain any TAG according to the VLAN ID of the port, and discards the packets that contain a TAG.

3.

When the TAG flag is set as Hybrid for a port, the port can process the packets with a TAG or without any TAG. In this case, the port adds a TAG to the received packets that does not contain any TAG according to the VLAN ID of the port.

VLAN ID Set the default VLAN ID of the local port.

Port Type For the boards that support the MPLS function, set the port type to P or PE. Provider edge (PE) indicates the edge port of the service provider and provider (P) indicates the core network port of the service provider. When configuring the EVPL and EVPLAN services, set this parameter. Set the external port to PE and the internal port to P.

Port Encapsulation Format The encapsulation format can be set to MartinioE or stack VLAN. When the port is of the P type, this attribute is valid. For EVPL services, set the encapsulation format to MartinioE. For EVPLAN services, set the encapsulation format to stack VLAN.

Port Attribute For boards that support the QinQ function, set the port attribute to UNI, NNI, U-NNI, S-Aware or C-Aware.

F.3.3 ATM Parameter The ATM parameters that the ATM boards should be set include port type and flow type.

Port Type The port types include NNI and UNI (default).

Flow Type The flow type should meet the requirements of the port.

Service Type There are four service types, CBR, rt-VBR, nrt-VBR, and UBR. Issue 02 (2007-09-10)

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F Board Configuration Reference

Peak Cell Rate Set the peak cell rate (PCR) on ATM services. The PCR should be set on all service types.

Sustainable Cell Rate Set the sustainable cell rate (SCR) on ATM services. The SCR should be set on rt-VBR and nrtVBR services.

Maximum Cell Burst Size Set the maximum cell burst size (MCBS) on ATM serivces. The MCBS should be set on rt-VBR and nrt-VBR services.

Cell Delay Variation Tolerance Set the cell delay variation tolerance (CDVT) on ATM serivces. The CDVT should be set on CBR, rt-VBR and UBR services.

F.4 Cross-Connect and Timing Unit The clock parameters should be set on the cross-connect and timing unit. Set the following parameters when synchronization status message (SSM) is not enabled and the external clock is unavailable. l

Reference clock source

l

Reference clock source level

Set the following parameters when the external clock is configured and the SSM is enabled.

F-8

l

Reference clock source

l

Reference clock source level

l

Building integrated timing supply (BITS) type

l

S1 byte

l

Threshold for selecting the clock in case of the switching protection

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G Glossary

G

Glossary

This document defines the following terms: 1 1:N protection

A 1:N protection architecture has N normal traffic signals, N working SNCs/trails and one protection SNC/trail. It may have one extra traffic signal.

1+1 protection

A 1+1 protection architecture has one normal traffic signal, one working SNC/trail, one protection SNC/trail and a permanent bridge.

100Base-TX

Physical Layer specification for a 100 Mbit/s CSMA/CD local area network over two pairs of Category 5 unshielded twisted-pair (UTP) or shielded twisted-pair (STP) wire.

10BASE-T

Physical Layer specification for a 10 Mb/s CSMA/CD local area network over two pairs of twisted-pair telephone wire.

19-inch cabinet

A cabinet which is 19 inches in width and 600mm in depth, compliant with the standards of the IEC297.

A

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Add/Drop Multiplexer

A multiplexer capable of extracting and inserting lower-rate signals from a higher-rate multiplexed signal without completely demultiplexing the signal.

ADM

add/drop multiplexer. see add/drop multiplexer.

Administrator

A user who has authority to access all the Management Domains of the EML Core product. He has access to the whole network and to all the management functionalities.

AIS

Alarm Indication Signal. A signal sent downstream in a digital network if an upstream failure has been detected and persists for a certain time.

Alarm cable

The cable which is used to transmit alarm signals.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

G Glossary

Alarm

A visible or an audible indication to notify the person concerned that a failure or an emergency has occurred. See also Event.

AMI

Alternate Mark Inversion. The line-coding format in transmission systems where successive ones (marks) are alternatively inverted (sent with polarity opposite that of the preceding mark).

APD

Avalanche Photodiode. A semiconductor photodetector with integral detection and amplification stages. Electrons generated at a p/n junction are accelerated in a region where they free an avalanche of other electrons. APDs can detect faint signals but require higher voltages than other semiconductor electronics.

Asynchronous

A network where transmission system payloads are not synchronized and each network terminal runs on its own clock.

ATM

Asynchronous Transfer Mode. A transfer mode in which the information is organized into cells. It is asynchronous in the sense that the recurrence of cells containing information from an individual user is not necessarily periodic. It is a protocol within the OSI layer 1. An ATM cell consists of a 5 octet header followed by 48 octets of data.

Attenuation

Reduction of signal magnitude or signal loss, usually expressed in decibels.

Attenuator

A passive component that attenuates an electrical or optical signal.

Attribute

Property of an object.

AU

administrative unit. see administrative unit

Auto-negotiation

The rate/work mode of the communication party set as self-negotiation is specified through negotiation according to the transmission rate of the opposite party.

B

G-2

Back up

A method to copy the important data into a backing storage in case that the original is damaged or corrupted.

Backplane

A PCB circuit board in the subrack, which is connected with all the boards in position.

Bandwidth

Information-carrying capacity of a communication channel. Analog bandwidth is the range of signal frequencies that can be transmitted by a communication channel or network.

BITS

Building Integrated Timing Supply. A building timing supply that minimises the number of synchronization links entering an office. Sometimes referred to as a synchronization supply unit.

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G Glossary

Board Version Replacement Function

A function that enables a board supporting several board IDs. Generally, a board of an old version is used to the NE also of an old version, which does not support the board of a new version. When a board of a new version is used to replace a board of an old version, the former should work with the ID of the board of the old version. The board of a new version works on the NE of a new version with the ID of the board of new version. In this way, the board of the new version has several board IDs.

Bridge

The action of transmitting identical traffic (SPE contents) on both the working and protection channels.

Broadcast

The act of sending a frame addressed to all stations on the network

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Cable tie

The tape used to bind the cables.

CBR

Constant Bit Rate. The Constant Bit Rate service category is used by connections that request a static amount of bandwidth that is continuously available during the connection lifetime. This amount of bandwidth is characterized by a peak cell Rate (PCR) value.

CDVT

Cell Delay Variation Tolerance. Information sent in the forward and backward direction to determine the upper bound of the tolerance admitted for the time interval between cells pertaining to a given cell flow. The backward CDVT values included in the IAM and MOD shall be interpreted as maximum acceptable values for the cell flow in the backward direction.

Channel spacing

The center to center difference in frequency or wavelength between adjacent channels in a WDM device.

Channel

The smallest subdivision of a circuit that provides a type of communication service; usually a path with only one direction.

Circuit

A communications path or network; usually a pair of channels providing bi-directional communication.

Client

A kind of terminal (PC or workstation) connected to a network that can send instructions to a server and get results through a user interface. See also server.

Coded Mark Inversion

This is the STS-3 line code. This is a two level non-return to zero code. A binary 1 is coded by either of the amplitude levels, +A or -A, for one full unit time interval (T) in such a way that the level alternates for successive binary ones. For a binary zero there is always a positive transition (-A to +A) at the mid point of the binary unit interval (T/2).

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Configuration data

The data that configures the NE hardware for coordination between this NE and other NEs in the entire network, and for operation of specified services. Configuration data is the instruction file of NEs, and it is a key element to ensure that the network runs efficiently. The typical configuration data includes board configuration, clock configuration and protection relationship.

Configure

To set the basic parameters of an operation object.

Connection

A "transport entity" which consists of an associated pair of "unidirectional connections" capable of simultaneously transferring information in opposite directions between their respective inputs and outputs.

Convergence

The process of developing a model of the echo path which will be used in the echo estimator to produce the estimate of the circuit echo.

Conversion

In the context of message handling, a transmittal event in which an MTA transforms parts of a message content from one encoded information type to another, or alters a probe so it appears that the described messages were so modified.

Cyclic Redundancy Check

A technique for using overhead bits to detect transmission errors.

D DDF

Digital Distribution Frame. A frame which is used to transfer cables.

Dense Wavelength Division Multiplexing

The higher capacity version of WDM, which is a means of increasing the capacity of fiber-optic data transmission systems through the multiplexing of multiple wavelengths of light. Commercially available DWDM systems support the multiplexing of from 8 to 40 wavelengths of light.

Drop

The port on a network element where the service to an end customer may be connected, e.g., a tributary card on a SONET ADM. For example, a drop for a DS1 customer service may be provided by a VT1.5 card terminating a VT1.5 trail.

Dual-Fed

A description of a ring that has entry nodes that add traffic to the ring via the bridging function.

DWDM

Dense Wavelength Division Multiplexing. The technology utilizes the characteristics of broad bandwidth and low attenuation of single mode optical fiber, employs multiple wavelengths with specific frequency spacing as carriers, and allows multiple channels to transmit simultaneously in the same fiber.

E

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G Glossary

E13

A funciton used to multiplex E1 signals into E3 signals or to demultipex E3 signals into E1 signals.

ECC

Embedded Control Channel. An ECC provides a logical operations channel between SDH NEs, utilizing a data communications channel (DCC) as its physical layer.

EDFA

Erbium-Doped Fiber Amplifier. The optical amplifier that its fiber doped with the rare earth element erbium, which can amplify at 1530 to 1610 nm when the optical amplifier is pumped by an external light source.

Ejector lever

A component at the two ends of the front panel of a board, which is used for inserting or removing the board.

Encapsulation

In 1000BASE-X, the process by which a MAC packet is enclosed within a PCS code-group stream

EPL

Ethernet Private Line. An EPL service is a point-to-point interconnection between two UNIs without SDH bandwidth sharing.Transport bandwidth is never shared between different customers.

ESCON

Enterprise System Connection. A path protocol which connects the host with various control units in an storage system. It is a serial bit stream transmission protocol. The transmission rate is 200 Mbit/s.

ESD jack

Electrostatic discharge jack. A hole in the cabinet or subrack, which connect the subrack or cabinet to the insertion of ESD wrist strap.

ESD

Electrostatic Discharge. The phenomena the energy being produced by electrostatic resource discharge instantly.

Ethernet

A data link level protocol comprising the OSI model's bottom two layers. It is a broadcast networking technology that can use several different physical media, including twisted pair cable and coaxial cable. Ethernet usually uses CSMA/CD. TCP/IP is commonly used with Ethernet networks.

ETSI

European Telecommunications Standards Institute

EVPL

Ethernet Virtual Private Line. An EVPL service is a service that is both a line service and a virtual private service.

Eye pattern

A graphic presentation formed by the superimposition of the waveforms of all possible pulse sequences.

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Fan tray assembly

A module which contains fans used for heat dissipation.

Fault

A fault is the inability of a function to perform a required action. This does not include an inability due to preventive maintenance, lack of external resources, or planned actions.

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FC

Fiber Channel. A standard of data storage network for transmitting signals at 100 Mbit/s to 4.25Gbit/s over fiber or (at slow speeds) copper.

Fiber connector

A device mounted on the end of a fiber-optic cable, light source, receiver, or housing that mates to a similar device to couple light into and out of optical fibers. A connector joins two fiber ends, or one fiber end and a light source or detector.

Fiber jumper

The fiber which is used to connect the subrack with the ODF.

FICON

Fibre Connect. A new generation connection protocol which connects the host with various control units. It carries single byte command protocol through the physical path of fiber channel, and provides higher rate and better performance than ESCON.

Flow

An aggregation of packets that have the same characteristics. On the T2000 or NE software, flow is a group of classification rules. On boards, it is a group of packets that have the same quality of service (QoS) operation. At present, two flows are supported: port flow and port + VLAN flow. Port flow is based on port ID and port + VLAN flow is based on port ID and VLAN ID. The two flows cannot coexist in the same port.

Frame

A cyclic set of consecutive time slots in which the relative position of each time slot can be identified.

Free-run mode

An operating condition of a clock, the output signal of which is strongly influenced by the oscillating element and not controlled by servo phaselocking techniques. In this mode the clock has never had a network reference input, or the clock has lost external reference and has no access to stored data, that could be acquired from a previously connected external reference. Free-run begins when the clock output no longer reflects the influence of a connected external reference, or transition from it. Free-run terminates when the clock output has achieved lock to an external reference.

Full duplex

Pertaining to both parties that can send and receive data at the same time on the communication link.

G Gain

The ratio between the optical power from the input optical interface of the optical amplifier and the optical power from the output optical interface of the jumper fiber, which expressed in dB.

Grooming

Consolidating or segregating traffic for efficiency.

Guide rail

A groove in the subrack, which ensures the correct connection of a board to the backplane.

H

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Half duplex

G Glossary

Pertaining to, both parties that only one party can send data, while the other party can only receive data on the communication link.

I IMA frame

The IMA frame is used as the unit of control in the IMA protocol. It is a logical frame defined as M consecutive cells, numbered 0 to M-l, transmitted on each of the N links in an IMA group.

IMA

Inverse Multiplexing for ATM. The ATM inverse multiplexing technique involves inverse multiplexing and de-multiplexing of ATM cells in a cyclical fashion among links grouped to form a higher bandwidth logical link whose rate is approximately the sum of the link rates. This is referred to as an IMA group.

Interface board area

The area for the interface boards on the subrack.

Isolation

A nonreciprocal optical device intended to suppress backward reflections along an optical fiber transmission line while having minimum insertion loss in the forward direction.

J Jitter

Short waveform variations caused by vibration, voltage fluctuations, control system instability, etc.

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Label

A mark on a cable, a subrack, or a cabinet for identification.

Laser

The device that generates the directional light covering a narrow range of wavelengths. Laser light is more coherent than ordinary light. Semiconductor diode lasers are the used light source in fiber-optic system.

Layer

A concept used to allow the transport network functionality to be described hierarchically as successive levels; each layer being solely concerned with the generation and transfer of its characteristic information.

LCAS

Link Capacity Adjustment Scheme. A solution features flexible bandwidth and dynamic adjustment. In addition, it provides a failure tolerance mechanism, which enhances the viability of virtual concatenations and enables the dynamic adjustment to bandwidth (nonservice affecting).

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G Glossary

Link

A "topological component" that provides transport capacity between two endpoints in different subnetworks via a fixed (i.e., inflexible routing) relationship. The endpoints are "subnetwork termination point pools" for SONET, and link termination points for ATM. Multiple links may exist between a pair of subnetworks. A link also represents a set of "link connections".

Loopback

The fault of each path on the optical fiber can be located by setting loopback for each path of the line. There are three kinds of loopback modes: No loopback, Outloop, Inloop.

Lower subrack

The subrack close to the bottom of the cabinet when a cabinet contains several subracks.

M

G-8

M13

A function used to multiplex T1 signals into T3 signals or to demultiplex T3 signals into T1 signals.

MAC

Media Access Control. The data link sublayer that is responsible for transferring data to and from the Physical Layer.

Mapping

A procedure by which tributaries are adapted into virtual containers at the boundary of an SDH network.

Mean launched power

The average power of a pseudo-random data sequence coupled into the fiber by the transmitter.

Mounting ear

A component on the side of a subrack, which is used to install the subrack in a cabinet.

MPLS

Multiprotocol Label Switching. Multi-protocol label switching. It is a standard routing and switching technology platform, capable of supporting various high level protocols and services. The data transmission over an MPLS network is independent of route calculating. MPLS, as a connection-oriented transmission technology, guarantees QoS effectively, supports various network level technologies, and is independent of the link layer.

MSP

The MSP function provides capability for switching a signal between and including two MST functions, from a working to a protection channel.

Multicast

Transmission of a frame to stations specified by a group address.

Multiplex section protection

A function provides capability for switching a signal between and including two MST functions, from a working to a protection channel.

Multiplex

To transmit two or more signals over a single channel.

Multiplexer

An equipment which combines a number of tributary channels onto a fewer number of aggregate bearer channels, the relationship between the tributary and aggregate channels being fixed.

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Multiplexing

G Glossary

A procedure by which multiple lower order path layer signals are adapted into a higher order path or the multiple higher order path layer signals are adapted into a multiplex section.

N NNI

Network Node Interface. NNI identifies the interface between the ATM network nodes. Compare SDH NNI.

Noise figure

The specification to scale the random signal in the system presenting in addition to any wanted signal.

Non-revertive

In non-revertive mode, when a protection switch occurs, the working service will be switched to the protection service and the status will remain after it returns normal.

NRZ

Non Return to Zero. A digital code in which the signal level is low for a 0 bit and high for a 1 bit and dose not return to 0 between successive 1 bits.

O

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OADM

Optical Add/Drop Multiplexer. A device that can be used to add the optical signals of various wavelengths to one channel and drop the optical signals of various wavelengths from one channel.

ODF

Optical Distribution Frame. A frame which is used to transfer and spool fibers.

ONE

Optical Network Element. A stand-alone physical entity in an optical transmission network that supports at least network element functions.

Optical add/drop multiplexing

A process that add the optical signals of various wavelengths to one channel and drop the optical signals of various wavelengths from one channel.

Optical Amplifier

A device or subsystem in which optical signals can be amplified by means of stimulated emission taking place in an suitable active medium. It is used to amplify the optical signal of the optical transmission system.

Optical connector

A component normally attached to an optical cable or piece of apparatus for the purpose of providing frequent optical interconnection/ disconnection of optical fibers or cables.

Optical interface

A device to allow two or more corresponding optical transmitting units to be connected.

OTM

Optical Terminal Multiplexer. A device that multiplex or demultiplex optical signals into a transmission link or into the client side.

OTU

Optical Transponder Unit. A device that access service signals compliant with standards at the client side and convert them into standard DWDM or CWDM wavelengths.

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G Glossary

Output optical power

The ranger of optical energy level of output signals.

Overhead

Extra bits in a digital stream used to carry information besides traffic signals. Orderwire, for example, would be considered overhead information.

P

G-10

Packing case

A case which is used for packing the board or subrack.

Paired Slots

When SDH boards are used to configure the MSP ring, the two boards forming a ring must be inserted in paired slots.

Pass-Through

The action of transmitting by a node exactly what is received by that node for any given direction of transmission. A pass-through can be unidirectional or bidirectional. For BLSRs, a pass-through refers to the K1 and the K2 bytes and the protection channels. Three types of passthrough are used in BLSRs: K byte pass through, unidirectional full pass-through, and bidirectional full pass-through.

Path protection

The working principle of path protection: When the system works in path protection mode, the PDH path uses the dual-fed and signal selection mode. Through the tributary unit and cross-connect unit, the tributary signal is sent simultaneously to the east and west lines. Meanwhile, the cross-connect matrix sends the signal dually sent from the opposite end to the tributary board through the active and standby buses, and the hardware of the tributary board automatically and selectively receive the signal from the two groups of buses automatically according to the AIS number of the lower order path.

Path

A logical connection between the point at which a standard frame format for the signal at the given rate is assembled, and the point at which the standard frame format for the signal is disassembled.

PCR

Peak Cell Rate. An upper limit on the rate at which cells can be submitted on an ATM connection.

PDH

Plesiochronous Digital Hierarchy. PDH is the digital networking hierarchy that was used before the advent of Sonet/SDH.

PIN

Photodiode. A semiconductor detector with an intrinsic (i) region separating the p- and n-doped regions. It has fast linear response and is used in fiber-optic receivers.

Plesiochronous

A network with nodes timed by separate clock sources with almost the same timing.

Pointer

An indicator whose value defines the frame offset of a virtual container with respect to the frame reference of the transport entity on which it is supported.

Power unit

A direct current power distribution unit at the upper part of a cabinet, which supplies power for the subracks in the cabinet.

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G Glossary

PRBS

When there are cross-connections between a line board and a tributary/ data board, many alarms are raised on the tributary/data board if alarms are raised on the line board. These alarms are all reported to the T2000. Such a large number of alarms can disturb the troubleshooting and affect the problem solution efficiency. Therefore, the inter-board alarm suppression function is used to solve this problem.

Private line

Both communication parties are connected permanently.

Procedure

A generic term for an action.

Process

A generic term for a collection of actions.

Processing board area

An area for the processing boards on the subrack.

Provisioning

The process of making available various telecommunications resources (such as switching systems and transport facilities) for telecommunication services. Provisioning includes forecasting the demand for services, determining the additions or changes to the network that will be needed, determining where and when they will be needed, and installing all the necessary network elements to provide such services.

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Receiver overload

Receiver overload is the maximum acceptable value of the received average power at point R to achieve a 1 x 10-10 BER.

Receiver sensitivity

Receiver sensitivity is defined as the minimum acceptable value of average received power at point R to achieve a 1 x 10-10 BER.

Reference clock

A clock of very high stability and accuracy that may be completely autonomous and whose frequency serves as a basis of comparison for the frequency of other clocks.

REG

A device that performs regeneration.

Regeneration

The process of receiving and reconstructing a digital signal so that the amplitudes, waveforms and timing of its signal elements are constrained within specified limits.

Revertive switching

In revertive switching, there is a working and protection line, board and so on. Services always revert back to the original working line or board if the switch requests are terminated; that is, when the working line or board has recovered from the fault or the external request is cleared.

RPR

Resilient Packet Ring. A metropolitan area network (MAN) technology supporting data transfer among stations interconnected in a dual-ring configuration.

RS232

In the asynchronous transfer mode and there is no hand-shaking signal. It can communicate with RS232 and RS422 of other stations in pointto-point mode and the transmission is transparent. Its highest speed is 19.2 kbit/s. Huawei Technologies Proprietary

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S S1 byte

The byte defined in ITU-T to transmit the network synchronization status information.

SAN

Storage Area Network. A dedicated high-speed data storage network which interconnects multiple independent storage systems with multiple servers through fiber path switch or other switch equipment.

SDH

Synchronous Digital Hierarchy. A hierarchical set of digital transport structures, standardized for the transport of suitably adapted payloads over physical transmission networks.

Section

The portion of a SONET transmission facility, including terminating points, between (i) a terminal network element and a regenerator or (ii) two regenerators. A terminating point is the point after signal regeneration at which performance monitoring is (or may be) done.

Settings

Parameters of an operation that can be selected by the user.

SF

signal fail.See signal fail.

SFP

small form-factor pluggable.see small form-factor pluggable.

Side mode suppression ratio

The ratio of the largest peak of the total source spectrum to the second largest peak.

Side panel

The panel on the side of the cabinet.

Signal cable

The cable which is used to transmit electrical signals, different from the power cable or fiber.

Signal fail

A signal indicating the associated data has failed in the sense that a nearend defect condition (not being the degraded defect) is active.

SNCMP

The SNCMP is an N+1 protection scheme, which means multiple protection paths protect a working path.

SNCTP

The SNCTP provides protection paths at the VC-4 level. When the working path is faulty, all its services can be switched to the protection path.

Span

The set of SONET lines between two adjacent nodes on a ring.

SSM

Synchronization Status Message. ITU-T defines S1 byte to transmit the network synchronization status information. It uses the lower four bits of the multiplex section overhead S1 byte to indicate 16 types of synchronization quality grades.

Synchronous

A network where transmission system payloads are synchronized to a master (network) clock and traced to a reference clock.

T

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

G Glossary

T2000

The T2000 is a subnet management system (SNMS). In the telecommunication management network architecture, the T2000 is located between the NE level and network level, which can supports all NE level functions and part of the network level management functions. See also NM.

TCM

Tandem Connection Monitor. In the SDH transport hierarchy, the TCM is located between the AU/TU management layer and HP/LP layer. It uses the N1/N2 byte of POH overhead to monitor the quality of the transport channels on a transmission section (TCM section).

TPS

Tributary Protection Switching. A function provided by the equipment, is intended to protect N tributary processing boards through a standby tributary processing board.

Tray

A discal component in the cabinet, which is used to place the chassis or other equipment.

Tributary loopback

A fault location method. A fault can be located for each service path by performing loopback on each path of the tributary board. There are three types of loopback modes: Non-loopback, Outloop and Inloop.

TUG

tributary unit group.see tributary unit group.

U Upload

To report all or part of the configuration data of the NE to the T2000 and overwrite the configuration data saved in the NE layer on the T2000.

Upper subrack

The subrack close to the top of the cabinet when a cabinet contains several subracks.

V

Issue 02 (2007-09-10)

VC

virtual container. see virtual container.

Virtual concatenation

The payload whose transmission bandwidth is bigger than VC4. Virtual concatenation combines multiple VC4 payloads (successive or nonsuccessive) to form a virtual large structure VC4-Xv in cascade mode for transmission. The transmission of the broadband cascaded payload is implemented via the virtual cascade, thus improving the SDH transmission payload bandwidth capability from VC4 to VC4-4C.

VLAN

Virtual local area network. A subset of the active topology of a Bridged Local Area Network. Associated with each VLAN is a VLAN Identifier (VID).

VPN

Virtual Private Network. Enables IP service to be transmitted securely over a public TCP/IP network by encrypting all service from one network to another.

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G-13

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

G Glossary

W Wavelength Division Multiplexing

G-14

A means of increasing the capacity of fiber-optic data transmission systems through the multiplexing of multiple wavelengths of light. WDM systems support the multiplexing of as many as four wavelengths.

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

H

H Acronyms and Abbreviations

Acronyms and Abbreviations

A ADM

Add/Drop Multiplexer

AMI

Alternate Mark Inversion

APS

Automatic Protection Switching

ATM

Asynchronous Transfer Mode

B BITS

Building Integrated Timing Supply

C CAR

Committed Access Rate

CBR

Constant Bit Rate

CC

Continuity Check

CMI

Coded Mark Inversion

COA

Case-shaped Optical Amplifier

CPU

Central Processing Unit

CRC

Cyclic Redundancy Check

D

Issue 02 (2007-09-10)

DC

Direct Current

DCC

Data Communication Channel

DCE

Data Circuit-terminal Equipment

DCU

Dispersion Compensation Unit

DDF

Digital Distribution Frame

DTR

Data Terminal Ready

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H-1

H Acronyms and Abbreviations

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

DVB-ASI

Digital Video Broadcast-Asynchronous Serial Interface

DWDM

Dense Wavelength Division Multiplexing

E ECC

Embedded Control Channel

EDFA

Erbium-Doped Fiber Amplifier

EMC

Electromagnetic Compatibility

EMI

Electro Magnetic Interference

EPL

Ethernet Private Line

EPLAN

Ethernet Private LAN

ESCON

Enterprise Systems Connection

ETS

European Telecommunication Standards

ETSI

European Telecommunications Standards Institute

EVPL

Ethernet Virtual Private Line

EVPLAN

Ethernet Virtual Private LAN

F FC

Fiber Channel

FE

Fast Ethernet

FEC

Forward Error Correction

FICON

Fiber Connection

FPGA

Field Programmable Gate Array

G GE

Gigabit Ethernet

GFP

Generic Framing Procedure

H HDB3

High Density Bipolar of order 3 code

HDLC

High level Data Link Control

I

H-2

IEEE

Institute of Electrical and Electronics Engineers

IS-IS

Intermedia System-Intermedia System

ITU-T

International Telecommunication Union - Telecommunication Standardization Sector

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

H Acronyms and Abbreviations

L LAPS

Link Access Procedure-SDH

LB

LoopBack

LCAS

Link Capacity Adjustment Scheme

LCT

Local Craft Terminal

M MPLS

Multi-protocol Label Switch

MSP

Multiplex Section Protection

MLM

Multi-Longitudinal Mode

N NA

Not available

NRZ

Non Return to Zero

O OAM

Operation Administration and Maintenance

OSPF

Open Shortest Path First

P PA

Power Amplifier

PDH

Plesiochronous Digital Hierarchy

RAM

Random-access Memory

R RD

Receive Data

RIP

Routing Information Protocol

RSTP

Rapid Spanning Tree Protocol

S SDH

Synchronous Digital Hierarchy

SG

Signaling Ground

SLM

Single- Longitudinal Mode

SNCP

Sub-Network Connection Protection

SSM

Synchronization Status Message

T TD

Issue 02 (2007-09-10)

Transmit Data

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H-3

H Acronyms and Abbreviations

TPS

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Tributary Protection Switching

U UBR

Unspecified Bit Rate

UPM

Uninterruptible Power Modules

V VBR

Variable Bit Rate

VLAN

Virtual Local Area Network

VPN

Virtual Private Network

W WDM

H-4

Wavelength Division Multiplexing

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Index

Index A ADL4 configuration reference, 7-104 feature code, 7-104 front panel, 7-103 function and feature, 7-100 principle and signal flow, 7-101 technical specifications, 7-105 valid slots, 7-104 version, 7-100 ADQ1 configuration reference, 7-111 feature code, 7-111 front panel, 7-109 function and feature, 7-106 principle and signal flow, 7-107 technical specifications, 7-112 valid slots, 7-111 version, 7-106 AMU front panel, 10-17 function and feature, 10-15 principle and signal flow, 10-16 technical specification, 10-20 valid slot, 10-20 version, 10-15 AUX front panel, 10-12 function and feature, 10-6 jumper, 10-11 principle and signal flow, 10-7 technical specification, 10-15 valid slot, 10-14 version, 10-6

B BA2 board feature code, 12-7 front panel, 12-5 function and feature, 12-2 principle and signal flow, 12-3 technical specification, 12-7 Issue 02 (2007-09-10)

valid slot, 12-7 version, 12-2 board barcode, 4-3 classification Amplifier, 4-11 Auxiliary, 4-10 Compensation, 4-11 Control, 4-10 Data, 4-7 Interface, 4-9 PDH, 4-6 Power, 4-12 SDH, 4-4 Switching, 4-9 WDM, 4-11 loopbacks, E-1 version configuration, D-1 BPA board feature code, 12-13 Front Panel, 12-11 function and feature, 12-9 principle and signal flow, 12-10 technical specification, 12-13 valid slot, 12-13 version, 12-9

C C34S front panel, 8-25 function and feature, 8-24 principle and signal flow, 8-24 technical specification, 8-26 valid slot, 8-26 version, 8-24 cabinet configuration, 2-2 DC PDU, 2-3 indicator, 2-3 technical specifications, 2-5 type, 2-2 Cabinet Configuration Other, 2-4 Huawei Technologies Proprietary

i-1

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Index

CMR2 feature code, 11-7 front panel, 11-5 function and feature, 11-3 principle and signal flow, 11-4 technical specification, 11-8 valid slot, 11-7 version, 11-3 CMR4 board feature code, 11-13 front panel, 11-11 function and feature, 11-9 principle and signal flow, 11-10 technical specification, 11-14 valid slot, 11-13 version, 11-9 COA board feature code, 12-24 front panel, 12-19 function and feature, 12-15 installation position, 12-23 principle and signal flow, 12-18 technical specification, 12-24 version, 12-15 CXL1 board configuration reference, 9-11 board feature code, 9-11 front panel, 9-9 function and feature, 9-2 principle and signal flow, 9-5 technical specification, 9-12 valid slot, 9-11 version, 9-2 CXL16 board configuration reference, 9-33 board feature code, 9-33 front panel, 9-31 function and feature, 9-25 principle and signal flow, 9-28 technical specification, 9-34 valid slot, 9-33 version, 9-25 CXL4 board configuration reference, 9-22 board feature code, 9-22 front panel, 9-20 function and feature, 9-14 principle and signal flow, 9-17 technical specification, 9-23 valid slot, 9-22 version, 9-14

technical specification, 8-9 valid slot, 8-8 version, 8-6 D12S front panel, 8-10 function and feature, 8-9 principle and signal flow, 8-10 technical specification, 8-13 valid slot, 8-12 version, 8-9 D34S front panel, 8-21 function and feature, 8-20 principle and signal flow, 8-21 technical specification, 8-23 valid slot, 8-22 version, 8-20 D75S front panel, 8-17 function and feature, 8-16 principle and signal flow, 8-16 technical specification, 8-20 valid slot, 8-19 version, 8-16 DM12 front panel, 8-61 function and feature, 8-60 principle and signal flow, 8-60 technical specification, 8-64 valid slot, 8-64 version, 8-60 DX1 board configuration reference, 6-70 board feature code, 6-68 front panel, 6-67 function and feature, 6-65 principle and signal flow, 6-66 technical specification, 6-70 TPS Protection, 6-69 valid slot, 6-68 version, 6-65 DXA board configuration reference, 6-75 front panel, 6-73 function and feature, 6-72 principle and signal flow, 6-72 technical specification, 6-75 valid slot, 6-74 version, 6-71

D

EFF8 front panel, 8-48 function and feature, 8-47 principle and signal flow, 8-47 technical specification, 8-50 valid slot, 8-49

D12B front panel, 8-6 function and feature, 8-6 principle and signal flow, 8-6 i-2

E

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

version, 8-47 EFS0 configuration reference, 7-37 front panel, 7-35 function and feature, 7-30 principle and signal flow, 7-32 technical specifications, 7-37 TPS protection, 7-36 valid slots, 7-36 version, 7-29 EFS4 configuration reference, 7-45 front panel, 7-43 function and feature, 7-38 principle and signal flow, 7-40 technical specifications, 7-45 valid slots, 7-45 version, 7-38 EFT4 configuration reference, 7-8 front panel, 7-6 function and feature, 7-3 principle and signal flow, 7-4 technical specifications, 7-8 valid slots, 7-8 version, 7-3 EFT8 configuration reference, 7-15 front panel, 7-12 function and feature, 7-9 principle and signal flow, 7-10 technical specifications, 7-15 valid slots, 7-14 version, 7-9 EFT8A configuration reference, 7-22 front panel, 7-19 function and feature, 7-16 principle and signal flow, 7-17 technical specifications, 7-22 valid slots, 7-21 version, 7-16 EGR2 configuration reference, 7-86 feature code, 7-86 front panel, 7-84 function and feature, 7-79 principle and signal Flow, 7-82 technical specifications, 7-86 valid slots, 7-86 version, 7-79 EGS2 configuration reference, 7-53 feature code, 7-53 front panel, 7-51 function and feature, 7-46 principle and signal flow, 7-49 technical specifications, 7-53 Issue 02 (2007-09-10)

Index

valid slots, 7-53 version, 7-46 EGS4 configuration reference, 7-77 feature code, 7-74 front panel, 7-72 function and feature, 7-67 principle and signal flow, 7-69 protection, 7-74 technical specifications, 7-78 valid slots, 7-74 version, 7-67 EGT2 configuration reference, 7-28 feature code, 7-27 front panel, 7-26 function and feature, 7-23 principle and signal flow, 7-24 technical specifications, 7-28 valid slots, 7-27 version, 7-23 EMR0 configuration reference, 7-98 feature code, 7-98 front panel, 7-94 function and feature, 7-89 principle and pignal Flow, 7-92 technical Specifications, 7-98 valid slots, 7-97 version, 7-88 EMS4 configuration reference, 7-65 feature code, 7-62 front panel, 7-60 function and feature, 7-55 principle and signal flow, 7-57 protection, 7-63 technical specifications, 7-66 valid slots, 7-62 version, 7-55 EOW front panel, 10-3 function and feature, 10-2 principle and signal flow, 10-2 technical specification, 10-6 valid slot, 10-5 version, 10-2 ETF8 front panel, 8-52 function and feature, 8-51 principle and signal flow, 8-51 technical specification, 8-55 valid slot, 8-54 version, 8-51 ETS8 front panel, 8-57 function and feature, 8-56 principle and signal flow, 8-56 Huawei Technologies Proprietary

i-3

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Index

technical specification, 8-59 valid slot, 8-59 version, 8-56 EU04 front panel, 8-28 function and feature, 8-27 principle and signal flow, 8-27 technical specification, 8-30 valid slot, 8-29 version, 8-27 EU08 front panel, 8-32 function and feature, 8-31 principle and signal flow, 8-31 technical specification, 8-33 valid slot, 8-33 version, 8-31

F FAN front panel, 10-22 function and feature, 10-21 principle and signal flow, 10-22 technical specification, 10-23 valid slot, 10-23 version, 10-21 FIB front panel, 11-58 function and feature, 11-57 principle and signal flow, 11-58 technical specification, 11-60 valid slot, 11-59 version, 11-57

I IDL4 board protection, 7-119 configuration reference, 7-119 feature code, 7-118 front panel, 7-117 function and feature, 7-113 principle and signal flow, 7-115 technical specifications, 7-119 valid slots, 7-118 version, 7-113 IDQ1 configuration reference, 7-126 feature code, 7-126 front panel, 7-124 function and feature, 7-121 principle, 7-122 protection, 7-126 signal flow, 7-122 technical specifications, 7-127 valid slots, 7-126 version, 7-120 i-4

indicators alarm, A-2 cabinet, A-2

L L12S front panel, 8-4 function and feature, 8-3 principle and signal flow, 8-3 technical specification, 8-5 valid slot, 8-5 version, 8-3 L75S front panel, 8-14 function and feature, 8-13 principle and signal flow, 8-14 technical specification, 8-15 valid slot, 8-15 version, 8-13 Label description, B-2 Position, B-3 Safety Label, B-2 LWX board feature code, 11-48 front panel, 11-46 function and feature, 11-43 principle and signal flow, 11-44 technical specification, 11-48 valid slot, 11-48 version, 11-43

M MR2 board feature code, 11-19 front panel, 11-17 function and feature, 11-16 principle and signal flow, 11-16 technical specification, 11-20 valid slot, 11-19 version, 11-16 MR2A front panel, 11-24 function and feature, 11-21 principle and signal flow, 11-23 technical specification, 11-25 valid slot, 11-25 version, 11-21 MR2B front panel, 11-29 function and feature, 11-27 principle and signal flow, 11-28 technical specification, 11-30 valid slot, 11-30 version, 11-27 MR2C

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

front panel, 11-34 function and feature, 11-32 principle and signal flow, 11-33 technical specification, 11-36 valid slot, 11-36 version, 11-32 MR4 board feature code, 11-41 front panel, 11-39 function and feature, 11-37 principle and signal flow, 11-38 technical specification, 11-42 valid slot, 11-41 version, 11-37 MST4 configuration reference, 7-134 feature code, 7-133 front panel, 7-132 function and feature, 7-128 principle and pignal Flow, 7-130 technical specifications, 7-134 valid slots, 7-133 version, 7-128 MU04 front panel, 8-40 function and feature, 8-39 principle and signal flow, 8-39 technical specification, 8-42 valid slot, 8-41 version, 8-39

O OBU1 feature code, 11-55 front panel, 11-54 function and feature, 11-52 principle and signal flow, 11-52 technical specification, 11-56 valid slot, 11-55 version, 11-52 OU08 front panel, 8-35 function and feature, 8-35 principle and signal flow, 8-35 technical specification, 8-38 valid slot, 8-38 version, 8-34

P PD1 board configuration reference, 6-17 board feature code, 6-14 front panel, 6-13 function and feature, 6-9 principle and signal flow, 6-10 technical specification, 6-17 Issue 02 (2007-09-10)

Index

TPS protection, 6-15 valid slot, 6-13 version, 6-9 PD3 board configuration reference, 6-56 front panel, 6-53 function and feature, 6-50 principle and signal flow, 6-51 technical specification, 6-57 TPS protection, 6-55 valid slot, 6-54 version, 6-50 PIU front panel, 13-9 function and feature, 13-8 principle and signal flow, 13-8 technical specifications, 13-10 valid slot, 13-10 version, 13-8 PIUA front panel, 13-13 function and feature, 13-12 principle and signal flow, 13-12 technical specifications, 13-14 valid slot, 13-14 version, 13-11 PL1 board configuration reference, 6-7 board feature code, 6-7 front panel, 6-6 function and feature, 6-3 principle and signal flow, 6-4 technical specification, 6-8 valid slot, 6-7 version, 6-3 PL3 board configuration reference, 6-42 front panel, 6-39 function and feature, 6-36 principle and signal flow, 6-36 technical specification, 6-42 TPS protection, 6-40 valid slot, 6-40 version, 6-35 PL3A board configuration reference, 6-48 front panel, 6-47 function and feature, 6-44 principle and signal flow, 6-45 technical specification, 6-48 valid slot, 6-48 version, 6-43 PQ1 board configuration reference, 6-26 board feature code, 6-24 front panel, 6-22 function and feature, 6-19 principle and signal flow, 6-20 Huawei Technologies Proprietary

i-5

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Index

technical specification, 6-26 TPS protection, 6-24 valid slot, 6-23 version, 6-18 PQ3 board configuration reference, 6-64 front panel, 6-61 function and feature, 6-58 principle and signal flow, 6-58 technical specification, 6-64 TPS protection, 6-62 valid slot, 6-62 version, 6-58 PQM board configuration reference, 6-34 front panel, 6-30 function and feature, 6-27 principle and signal flow, 6-28 technical specification, 6-34 TPS protection, 6-32 valid slot, 6-31 version, 6-27

S SEP1 configuration reference, 5-40 front panel, 5-37 function and feature, 5-33 principle and signal flow, 5-34 technical specifications, 5-41 TPS Protection, 5-39 valid slot, 5-39 version, 5-33 SF16 configuration reference, 5-86 front panel, 5-85 function and feature, 5-81 principle and signal flow, 5-83 technical specifications, 5-86 valid slots, 5-86 version, 5-81 SL1 board configuration reference, 5-9 board feature code, 5-9 front panel, 5-7 function and feature, 5-4 principle and signal flow, 5-5 technical specification, 5-9 valid slot, 5-8 version, 5-3 SL16 board feature code, 5-70 configuration reference, 5-71 front panel, 5-69 function and feature, 5-66 principle and signal flow, 5-67 technical specifications, 5-71 i-6

valid slot, 5-70 version, 5-65 SL16A board feature code, 5-79 configuration reference, 5-79 front panel, 5-77 function and feature, 5-74 principle and signal flow, 5-75 technical specifications, 5-79 valid slot, 5-79 version, 5-73 SL4 board feature code, 5-47 configuration reference, 5-48 front panel, 5-45 function and feature, 5-42 principle and signal flow, 5-43 technical specifications, 5-48 valid slot, 5-47 version, 5-42 SLD4 board feature code, 5-55 configuration reference, 5-56 front panel, 5-53 function and feature, 5-50 principle and signal flow, 5-51 technical specifications, 5-56 valid slots, 5-55 version, 5-50 SLO1 board feature code, 5-24 configuration reference, 5-24 front panel, 5-22 function and feature, 5-19 principle and signal flow, 5-20 technical specifications, 5-25 valid slot, 5-24 version, 5-19 SLQ1 board configuration reference, 5-17 feature Code, 5-17 front panel, 5-15 function and feature, 5-12 principle and signal flow, 5-13 technical specification, 5-17 valid slot, 5-16 version, 5-11 SLQ4 board feature code, 5-63 configuration reference, 5-63 front panel, 5-61 function and feature, 5-58 principle and signal flow, 5-59 technical specifications, 5-63 valid slot, 5-63 version, 5-58 SLT1 configuration reference, 5-31

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Index

front panel, 5-29 function and feature, 5-26 principle and signal flow, 5-27 technical specifications, 5-31 valid slot, 5-31 version, 5-26 SPQ4 board configuration reference, 6-83 front panel, 6-80 function and feature, 6-76 principle and signal flow, 6-77 technical specification, 6-83 TPS protection, 6-82 valid slot, 6-81 version, 6-76 Subrack Structure, 3-2 subrack capacity, 3-3 technical specifications, 3-17

T TSB8 front panel, 8-44 function and feature, 8-43 principle and signal flow, 8-43 technical specification, 8-46 valid slot, 8-45 version, 8-43

U UPM function and feature, 13-2 principle and signal flow, 13-3 rear panel, 13-4 technical specifications, 13-6 valid slot, 13-6

Issue 02 (2007-09-10)

Huawei Technologies Proprietary

i-7

Optix Osn 1500 Hardware Description(v100r007_02)

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