List Of Ics And Their Probable Location.pdf

LIST OF ICs​ ​AND THEIR PROBABLE LOCATION 1.​ ​ADCS a.​ ​DRV592VFPG4 H-bridge IC(9.20x9.20mm)---------​obc board(torquers) ------------------x 3 b.​ ​Max4624 ezt series switch IC(2.80x3.mm)---------​obc board(torquers)------------------x 3 2.​ ​POWER a.​ ​Max 4372 current sensor—(3.3x3.3mm)-----torquers​ ​(obc board )-----------------x 3 ​ solar panels (​TBD​)--------------x 4 b.​

​MIC 2514 relay magnetometer-()---​TBD

c.​

​LM5118 buck boost converter---(6.4x4.5mm)------​TBD

d.​ ​DS2778 BATTERY PROTECTION UNIT---(3x5mm)------​power board (battery) e.​ ​TPS 2553 relay----(3.05x3.00mm)------------------​obc board (payload, TTC,PA, GPS) ------x 4 f.​ ​LT3480 converter -----------(3.55x2.45mm)--------​obc board (OBC, TTC, Payload, torquers)​ ​ Magnetometer)------------------------x ​ ​5​ ​/​ ​8 3.​ ​OBC a.​

​AT91SAM7SE512 Microcontroller​ ​(22x16x1.6mm)------------​obc board

b.​

​S29GL-P (20.20x14.10x1.20mm)-----------obc board

c.​

​AT28LV010 EEPROM(20.20x8.10x1.20mm)---------------​obc board

d.​

​C414B108 NVSRAM-------​obc board

e.​

​Multiplexer-​--(5x4.5x1.2mm)-------------obc board

f.​ ​Max 232 logic converter—(10.63x10.50mm)--------obc board---------------------------x 3 4.​ ​TTC a.​

​RF5110G PA-(3x3mm)----------------------------​obc board

b.​

​CC1070 TX​ ​---(5x5mm)----------------------------​obc

board-------------------------------------x 2 c.​

​ADF7070 RX---(7x7mm)---------------------------​obc board

d.​

​PIC 16C72A-(10.33x7.90x.311mm)-​------------obc board

Other devices and location 5.​ ​Magnetometer ---------------------------------------------​ ​TBD 6.​ ​GPS-------------------------------------------------------------​TBD 7.​ Payload​ 8.​

​Battery box--------------------------------------------------​power board /​TBD

9.​ ​GPS antenna-------------------------------------------------outer aluminium panel, exact location ​TBD ​TTC antenna--------------------------------------------------outside along roll

10.​ axis

11.​ ​Solar panels---------------------------------------------------on the four sides of satellite(+/-Y, -X, +Z) ​LVI----------------------------------------------------------------- -Z

12.​

13.​ ​Torquer coils---------------------------------------------------- on the aluminium panels, (-X, +Z, +Y) 14.​ technology.

​The most vulnerable devices are those which are based on CMOS ​List of ICs containing overcurrent fault detection

15.​ a.​

​DRV592-------> 4 A

b.​

​Max4624 ezt series switch IC pg 6 data sheet

c.​

​Tps customisable

d.​

​MIC 2514--------------------- refer pg 5 ​List of ICs containing voltage fault detection

16.​ a.​

​DRV592-------under​ ​voltage------------- < 2.8V

b.​

​Tps reverse voltage

c.​

​Lt3480 ​List of ICs with temperature fault detection

17.​ a.​

​DRV592-------junction temperature------------- > 130 C

b.​

​MIC 2514--------------------- >170 C

c.​

​Tps > 135 C ​List of cable categories, their quantity and direction of signal flow

18.​ DATA POWER RF

COMPONENT DETAILS AND RELATION ​Power Component Details And Relation

1.​

1.1 Converters and output CONVERTER 1.​ ​LT3480

2.​

​LM5118

COMPONENT a.​ ​OBC board b.​ ​TTC board c.​ ​RF amplifier(in case best efficiency is not obtained at 3.3 V) d.​ ​GPS e.​ ​PAYLOAD f.​ ​MAX232 g.​ ​Multiplexer h.​ ​Thermal sensors i.​ ​Heater a.​ ​Magnetometer b.​ ​Magnetorquer 1 c.​ ​Magnetorquer 2

VOLTAGE 3.3 V 3.3 V

QUANTITY 1 1

3V

1

5V 5V 5V 5V TBD TBD 9V TBD TBD

1 1 3 1 TBD 1(min.) 1 1 1

d.​

​Magnetorquer 3

TBD

1

1.2 Converters And Relay Pair CONVERTER 1.​

​LT3480

RELAY IC a.​ b.​ c.​ d.​

​LM5118

2.​

​TPS2553 ​TPS2553 ​TPS2553 ​TPS2553

a.​ ​MIC2514

LOAD Payload TTC GPS Thermal heater(based on voltage requirement)) Magnetometer

1.3 Current Sensors LOCATION 1.​ ​Between ​Solar Panel​ ​1​ and the shunt regulator 2.​ ​Between ​Solar Panel​ ​2​ and the shunt regulator 3.​ ​Between ​Solar Panel​ ​3​ and the shunt regulator 4.​ ​Between ​Solar Panel​ ​4​ and the shunt regulator 5.​ ​Before ​ Torquer1 6.​ ​Before ​ Torquer2 7.​ ​Before ​ Torquer3

CURRENT SENSOR IC MAX4372 MAX4372 MAX4372 MAX4372 MAX4372 MAX4372 MAX4372

2. ​OBC COMPONENT DETAILS AND RELATION

MICROCONTROLLER

AT91SAM7SE512

PERIPHERALS a.​ ​AT28LV010 EEPROM b.​ ​C414B108 NVSRAM c.​ ​FLASH d.​ ​MUX

2.1 ​Interfacing with other devices

COMPONENT

SUB SYSTEM

QUANTITY TYPE OF CONNECTION

NATURE

​DRV9593

ADCS

3

b.​ ​Max4624

ADCS

3

a.​

c.​ ​MIC2514 POWER (relay) d.​ ​DS2778(BPU) POWER

1

e.​ ​TPS2553 POWER (relay) f.​ ​MAX 4372 POWER (cs) g.​ ​ADF7070 (Tx) TTC

4

h.​ ​CC1070 TTC (​the other CC1070 is

1

1

7 1

interfaced with the PIC microcontroller​)

i.​

​PIC

TTC

1

a.​ ​HIZ b.​ ​Enable a.​ ​Input Logic a.​ ​Control line a.​ ​SDO b.​ ​PIO a.​ ​FAULT b.​ ​ENABLE a. a/d converter a.​ ​SCLK b.​ ​SDI c.​ ​SOD d.​ ​PSEL a.​ ​D1 b.​ ​SOD c.​ ​SCLK d.​ ​PSEL e.​ ​D1 f.​ ​DCLK TBD

From OBC From OBC From OBC From OBC

To OBC From OBC TO OBC