Dye Penetration Ev
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- Words: 511
- Pages: 13
WLBG-MPBQA/Jeffrey Chen
Dye Penetration Study & Evaluation
Page:2
Study and evaluate the dye penetration technology for CSP/ BGA cracked or open inspection.
Purpose
Confidential
Page:3
What’s the Dye penetration testing ? Evaluation results Conclusion
Thinking of Dye Penetration
Confidential
Page:4
Advantage: The distribution of opens can be found for the entire package in less time than is required to cross-section all rows of solder joints.
Method: Red die is allowed to wet into the cracks and then dry. The stained areas indicate cracks that existed prior to component removal.
Purpose: To identify solder joints that have cracked during reliability testing or field exposure.
Dye Penetration Testing
Confidential
Page:5
Open Joint Red indicated joint was cracked prior to component removal
Conductive Joint Yellow regions indicate where the solder was still connected prior to component removal
Destructive detection of both process opens and field failures such as cracked joints.
Thermal Cycled BGA Joints
Confidential
Page:6
Component
PWB
Confidential
Partially cracked but still conductive prior to testing
Cracked/open prior to testing
Thermal Cycled BGA Joints
Page:7
Dry dye at 100 C for 30 minutes
Immerse in dye
Remove component by twisting section of PWB with pliers Confidential
Place in vacuum (>/= 9 in Hg) for 1 minute then allow to soak for 1 hour
Dye Penetration Test – Method
Page:8
The component is removed from the dye and dried 30 minutes in a 100 C oven.
Confidential
The dye bath is placed in a vacuum of 9 in Hg for 1 minute to eliminate air from under BGA/CSP. The liquid is allowed to penetrate for 1hour.
The assembly is immersed in red dye to stain all exterior surfaces.
Clean the assembly with isopropyl alcohol (IPA) in an ultrasonic cleaner.
Dye Penetration Test - Method
Page:9
Confidential
CSPs CSPs have a relatively thin and fragile substrate and cannot be pried off the PWB but rather the PWB section must be twisted in alternating directions until the CSP can be removed with light pulling.
BGAs BGAs are pried off the PWB using a screwdriver to reveal red fracture surfaces which cracked prior to prying.
Part Removal for Inspection
Page:10
Confidential
The dye penetration test process is similar to X-section process. Component removal from board was difficult, it easily broken the board’s structure by screwdriver used. The dye, we used this experiment, is very common dye for other field. Not specific material for the PCBA dye stain used. But it got the similar property for dye penetration test. The dye penetration testing process cycle time is less than Xsection. It could not see the solder joint interface to analysis the crack by micro-view, but could figure out the crack/ open area for component. This technology can support the X-section analysis, giving the macro-view for the component.
Evaluation results
Page:11
Sample-1
Confidential
Page:12
Sample- 2
Confidential
Page:13
Confidential
Finish study and build up the dye penetration testing technology. We will use the dye penetration technology support the Xsection, if it needs. For BGA/CSP component destructive analysis, we still use the X-section to be the major method.
Conclusion
Dye Penetration Study & Evaluation
Page:2
Study and evaluate the dye penetration technology for CSP/ BGA cracked or open inspection.
Purpose
Confidential
Page:3
What’s the Dye penetration testing ? Evaluation results Conclusion
Thinking of Dye Penetration
Confidential
Page:4
Advantage: The distribution of opens can be found for the entire package in less time than is required to cross-section all rows of solder joints.
Method: Red die is allowed to wet into the cracks and then dry. The stained areas indicate cracks that existed prior to component removal.
Purpose: To identify solder joints that have cracked during reliability testing or field exposure.
Dye Penetration Testing
Confidential
Page:5
Open Joint Red indicated joint was cracked prior to component removal
Conductive Joint Yellow regions indicate where the solder was still connected prior to component removal
Destructive detection of both process opens and field failures such as cracked joints.
Thermal Cycled BGA Joints
Confidential
Page:6
Component
PWB
Confidential
Partially cracked but still conductive prior to testing
Cracked/open prior to testing
Thermal Cycled BGA Joints
Page:7
Dry dye at 100 C for 30 minutes
Immerse in dye
Remove component by twisting section of PWB with pliers Confidential
Place in vacuum (>/= 9 in Hg) for 1 minute then allow to soak for 1 hour
Dye Penetration Test – Method
Page:8
The component is removed from the dye and dried 30 minutes in a 100 C oven.
Confidential
The dye bath is placed in a vacuum of 9 in Hg for 1 minute to eliminate air from under BGA/CSP. The liquid is allowed to penetrate for 1hour.
The assembly is immersed in red dye to stain all exterior surfaces.
Clean the assembly with isopropyl alcohol (IPA) in an ultrasonic cleaner.
Dye Penetration Test - Method
Page:9
Confidential
CSPs CSPs have a relatively thin and fragile substrate and cannot be pried off the PWB but rather the PWB section must be twisted in alternating directions until the CSP can be removed with light pulling.
BGAs BGAs are pried off the PWB using a screwdriver to reveal red fracture surfaces which cracked prior to prying.
Part Removal for Inspection
Page:10
Confidential
The dye penetration test process is similar to X-section process. Component removal from board was difficult, it easily broken the board’s structure by screwdriver used. The dye, we used this experiment, is very common dye for other field. Not specific material for the PCBA dye stain used. But it got the similar property for dye penetration test. The dye penetration testing process cycle time is less than Xsection. It could not see the solder joint interface to analysis the crack by micro-view, but could figure out the crack/ open area for component. This technology can support the X-section analysis, giving the macro-view for the component.
Evaluation results
Page:11
Sample-1
Confidential
Page:12
Sample- 2
Confidential
Page:13
Confidential
Finish study and build up the dye penetration testing technology. We will use the dye penetration technology support the Xsection, if it needs. For BGA/CSP component destructive analysis, we still use the X-section to be the major method.
Conclusion
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