Aml - Radflyer
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ALIGNER WAFER BONDERS AN INDUSTRY FIRST
ACTIVATE, ALIGN & BOND IN ONE MACHINE New AML in-situ, ‘RAD’ technology for Low Temperature Bonding
Better than a plasma · ·
More stable, reliable, better bond & bond uniformity Larger more useful process window after activation & subsequent bonding
·
Activation without surface roughening! No change in AFM topographical roughness after activation
· ·
Reduced handling – higher yields
·
No exposure to energetic ions or electric fields reducing the risk of surface damage In-situ promotes higher yields due to reduced risk of hydrocarbon contamination
Only AML can: Align, Activate and Bond in One chamber, in One machine!
It’s Radical
APPLIED MICROENGINEERING LTD. (AML) Unit 8, Library Avenue, Didcot, Oxon, OX11 0SG, UK Tel: +44 (0) 1235 833934 Fax: +44 (0) 1235 833935 e-mail: [email protected] http://www.aml.co.uk
ACTIVATE, ALIGN & BOND IN ONE MACHINE New AML in-situ, ‘RAD’ technology for Low Temperature Bonding
Better than a plasma · ·
More stable, reliable, better bond & bond uniformity Larger more useful process window after activation & subsequent bonding
·
Activation without surface roughening! No change in AFM topographical roughness after activation
· ·
Reduced handling – higher yields
·
No exposure to energetic ions or electric fields reducing the risk of surface damage In-situ promotes higher yields due to reduced risk of hydrocarbon contamination
Only AML can: Align, Activate and Bond in One chamber, in One machine!
It’s Radical
APPLIED MICROENGINEERING LTD. (AML) Unit 8, Library Avenue, Didcot, Oxon, OX11 0SG, UK Tel: +44 (0) 1235 833934 Fax: +44 (0) 1235 833935 e-mail: [email protected] http://www.aml.co.uk
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