Aml Overview
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Overview
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AML Overview
AML – Wafer Bonding Machines & Services
AML- Company History • Company founded 1992 • MEMS Design, Manufacture & Process Development background • Founders made first in-situ aligner-wafer bonder in 1985 • AML focus on & Provide Wafer Bonding equipment & Wafer bonding services (BONDCENTRE) •Worldwide installed base of machines
From MEMS background not Mask Aligner for IC AML – Wafer Bonding Machines & Services
Basic features of AML bonders
AML – Wafer Bonding Machines & Services
AML AWB04 Aligner Bonder
AML – Wafer Bonding Machines & Services
Schematic of Unique in-situ Activation, Alignment & Bond
T <560 C
• Heat + Pump + Align • Independent platen T • Flexible • 2 to 8 inch wafers
AML – Wafer Bonding Machines & Services
• Fast cycles times
HV <2500V
AML Wafer Bonders Wafer bonding capabilities:• • • • • • •
Anodic Bonding Si-Glass Direct Bonding e.g. Si-Si Glass Frit Bonding Eutectic Bonding Thermo-compression Adhesive Bonding Aligned Embossing
In bond chamber alignment & bonding in one machine = higher throughput AML – Wafer Bonding Machines & Services
AML Advantages • In-bond chamber alignment at bond temperature • No alignment shiftage between align & bond • No mask aligner required • NOTE:-You are free to choose the best mask aligner for your ‘mask aligning’- not tied to one needed by the wafer bonder system • Small footprint • No alignment jig required (smaller mass) * • Simultaneous alignment and vac pump-down * • No flags in contact with bond surfaces • In chamber RAD activation option • Forced cooling * * = faster throughput
AML – Wafer Bonding Machines & Services
Commercial benefits of the In-situ AML Wafer bonders •Lowest cost per bond & ownership •Easy to install, (2-3 days) use/ maintain/ service – minimal training needed. •Very high reliability. •Small footprint •No time required on customer’s mask aligner •Standard machines & custom options to suit customer needs •Excellent technical process support – fast response •System is complete – no other equipment required •Extensive machine & bonding process experience. •Worldwide Machine base UK, Europe, USA , India & Far East.
AML – Wafer Bonding Machines & Services
New system features, now and planned
AML – Wafer Bonding Machines & Services
New Processes on AML Wafer Bonders • Hot Embossing – Characterisation has just started
New Developments on AML Wafer Bonders • Inclusion of RAD in-situ surface activation for low temperature bonding (available for new orders) see pages 19-24
• Addition of Pattern recognition software • Improvements for sub-micron alignment accuracy • Upgrading of manipulators from manual to stepper motor control • Motorised Z Drive
Development pipeline:- System Automation AML – Wafer Bonding Machines & Services
New Polymer Micro Hot Embossing & Nano Print tool
•
Applications: e.g. Bio-sensors & Microfluidic devices
•
Polymers: SU8, PDMS, PMMA..
•
Tool fits AML bonder platform or stand alone machine
Outline Specification Force up to 5000N Stroke up to 750 microns T up to 500 C (cooling) up to 6” wafers 2 micron alignment between Operation in Vacuum stamp & substrate
AML – Wafer Bonding Machines & Services
Radical Activation Tool
Experimental set-up using glass vacuum chamber – showing electrical discharge confined between the ring electrodes AML – Wafer Bonding Machines & Services
IR transmission Image 150mm RAD activated bond
Void free in situ activated bond – annealed at 200C for 1 hr
AML – Wafer Bonding Machines & Services
Radical Activation Benefits ¾Produces less roughening of the surface than plasma activation ¾Uniform activation (no edge effects as typically seen for plasmas) ¾Wider process time window for activation ¾In situ process eliminates variation in activation strength with time ¾No exposure of wafers to energetic ions ¾Bond can be heated and contacted at bonding temperature = significant advantage for dissimilar substrates or “hard to bond” substrates
AML – Wafer Bonding Machines & Services
AML Wafer Bonding Machines One System does it all!
AML – Wafer Bonding Machines & Services
BONDCENTRE Wafer Bonding Services
AML – Wafer Bonding Machines & Services
AML’s Strengths • Very strong MEMS design & process background – especially with respect to Wafer Bonding • Relevant customer base • Strong network of partners built up over many years • Equipment supplier – transfer the process onto a machine • Selected by UK government to be best to provide the service
AML – Wafer Bonding Machines & Services
BONDCENTRE SERVICES OFFERED •
Wafer Bonding Process Development e.g. for many novel materials; silicon, glass, sapphire, strained silicon, InP, GaAs,…
•
Wafer Bonding process selection & design for your application
•
Commercial Wafer Bonding Service prototype to production
•
Wafer Bonding Technology Transfer (inc Equipment) & Training
•
Associated Processes (Pre & Post Bond)
•
Applications knowledge for: MEMS Advanced Substrates 3D integration Temporary Bonding LEDs
Smart cut layer transfer Wafer Level Packaging Vacuum Encapsulation
AML – Wafer Bonding Machines & Services
Associated Pre & Post Bond Services: • Wafer Cleaning & Activation • Wafer Characterisation e.g. Profiling & Surface Roughness • Wafer Structuring: e.g. Channels, Holes & Conducting Vias • Wafer Processing: e.g. Deposition, Electroplating • Wafer Preparation: Thin to required Thickness & Surface Finish - Planarisation (CMP) • Inspection of bonded assemblies - SAM & IR AML – Wafer Bonding Machines & Services
Equipment Set Available: • • • • • • • • • •
WAFER ALIGNER BONDERS 4 machines in Class 10 METROLOGY; AFM, Ra, PROFILE, TTV MEGASONIC WAFER CLEANING NEW ‘RAD’ ACTIVATION INSPECTION: ACOUSTIC MICROSCOPE (SAM) & IR ELECTROPLATING SCREEN PRINT - GLASS FRIT/ADHESIVE POWDER BLASTING E.G. GLASS MACHINING WAFER THINNING CMP
• • • • •
Also access via long term collaboration with CMF @ Rutherford to: PHOTOLITHOGRAPHY DEPOSITION- PVD & CVD & FURNACES ETCHING – DRY & WET WAFER SAW WIRE & BUMP BONDING METROLOGY: THIN FILM, LINE WIDTH, SEM AML – Wafer Bonding Machines & Services
AML Wafer Bonding Machines & Services One Company does it all!
AML – Wafer Bonding Machines & Services
AML – Wafer Bonding Machines & Services
AML- Company History • Company founded 1992 • MEMS Design, Manufacture & Process Development background • Founders made first in-situ aligner-wafer bonder in 1985 • AML focus on & Provide Wafer Bonding equipment & Wafer bonding services (BONDCENTRE) •Worldwide installed base of machines
From MEMS background not Mask Aligner for IC AML – Wafer Bonding Machines & Services
Basic features of AML bonders
AML – Wafer Bonding Machines & Services
AML AWB04 Aligner Bonder
AML – Wafer Bonding Machines & Services
Schematic of Unique in-situ Activation, Alignment & Bond
T <560 C
• Heat + Pump + Align • Independent platen T • Flexible • 2 to 8 inch wafers
AML – Wafer Bonding Machines & Services
• Fast cycles times
HV <2500V
AML Wafer Bonders Wafer bonding capabilities:• • • • • • •
Anodic Bonding Si-Glass Direct Bonding e.g. Si-Si Glass Frit Bonding Eutectic Bonding Thermo-compression Adhesive Bonding Aligned Embossing
In bond chamber alignment & bonding in one machine = higher throughput AML – Wafer Bonding Machines & Services
AML Advantages • In-bond chamber alignment at bond temperature • No alignment shiftage between align & bond • No mask aligner required • NOTE:-You are free to choose the best mask aligner for your ‘mask aligning’- not tied to one needed by the wafer bonder system • Small footprint • No alignment jig required (smaller mass) * • Simultaneous alignment and vac pump-down * • No flags in contact with bond surfaces • In chamber RAD activation option • Forced cooling * * = faster throughput
AML – Wafer Bonding Machines & Services
Commercial benefits of the In-situ AML Wafer bonders •Lowest cost per bond & ownership •Easy to install, (2-3 days) use/ maintain/ service – minimal training needed. •Very high reliability. •Small footprint •No time required on customer’s mask aligner •Standard machines & custom options to suit customer needs •Excellent technical process support – fast response •System is complete – no other equipment required •Extensive machine & bonding process experience. •Worldwide Machine base UK, Europe, USA , India & Far East.
AML – Wafer Bonding Machines & Services
New system features, now and planned
AML – Wafer Bonding Machines & Services
New Processes on AML Wafer Bonders • Hot Embossing – Characterisation has just started
New Developments on AML Wafer Bonders • Inclusion of RAD in-situ surface activation for low temperature bonding (available for new orders) see pages 19-24
• Addition of Pattern recognition software • Improvements for sub-micron alignment accuracy • Upgrading of manipulators from manual to stepper motor control • Motorised Z Drive
Development pipeline:- System Automation AML – Wafer Bonding Machines & Services
New Polymer Micro Hot Embossing & Nano Print tool
•
Applications: e.g. Bio-sensors & Microfluidic devices
•
Polymers: SU8, PDMS, PMMA..
•
Tool fits AML bonder platform or stand alone machine
Outline Specification Force up to 5000N Stroke up to 750 microns T up to 500 C (cooling) up to 6” wafers 2 micron alignment between Operation in Vacuum stamp & substrate
AML – Wafer Bonding Machines & Services
Radical Activation Tool
Experimental set-up using glass vacuum chamber – showing electrical discharge confined between the ring electrodes AML – Wafer Bonding Machines & Services
IR transmission Image 150mm RAD activated bond
Void free in situ activated bond – annealed at 200C for 1 hr
AML – Wafer Bonding Machines & Services
Radical Activation Benefits ¾Produces less roughening of the surface than plasma activation ¾Uniform activation (no edge effects as typically seen for plasmas) ¾Wider process time window for activation ¾In situ process eliminates variation in activation strength with time ¾No exposure of wafers to energetic ions ¾Bond can be heated and contacted at bonding temperature = significant advantage for dissimilar substrates or “hard to bond” substrates
AML – Wafer Bonding Machines & Services
AML Wafer Bonding Machines One System does it all!
AML – Wafer Bonding Machines & Services
BONDCENTRE Wafer Bonding Services
AML – Wafer Bonding Machines & Services
AML’s Strengths • Very strong MEMS design & process background – especially with respect to Wafer Bonding • Relevant customer base • Strong network of partners built up over many years • Equipment supplier – transfer the process onto a machine • Selected by UK government to be best to provide the service
AML – Wafer Bonding Machines & Services
BONDCENTRE SERVICES OFFERED •
Wafer Bonding Process Development e.g. for many novel materials; silicon, glass, sapphire, strained silicon, InP, GaAs,…
•
Wafer Bonding process selection & design for your application
•
Commercial Wafer Bonding Service prototype to production
•
Wafer Bonding Technology Transfer (inc Equipment) & Training
•
Associated Processes (Pre & Post Bond)
•
Applications knowledge for: MEMS Advanced Substrates 3D integration Temporary Bonding LEDs
Smart cut layer transfer Wafer Level Packaging Vacuum Encapsulation
AML – Wafer Bonding Machines & Services
Associated Pre & Post Bond Services: • Wafer Cleaning & Activation • Wafer Characterisation e.g. Profiling & Surface Roughness • Wafer Structuring: e.g. Channels, Holes & Conducting Vias • Wafer Processing: e.g. Deposition, Electroplating • Wafer Preparation: Thin to required Thickness & Surface Finish - Planarisation (CMP) • Inspection of bonded assemblies - SAM & IR AML – Wafer Bonding Machines & Services
Equipment Set Available: • • • • • • • • • •
WAFER ALIGNER BONDERS 4 machines in Class 10 METROLOGY; AFM, Ra, PROFILE, TTV MEGASONIC WAFER CLEANING NEW ‘RAD’ ACTIVATION INSPECTION: ACOUSTIC MICROSCOPE (SAM) & IR ELECTROPLATING SCREEN PRINT - GLASS FRIT/ADHESIVE POWDER BLASTING E.G. GLASS MACHINING WAFER THINNING CMP
• • • • •
Also access via long term collaboration with CMF @ Rutherford to: PHOTOLITHOGRAPHY DEPOSITION- PVD & CVD & FURNACES ETCHING – DRY & WET WAFER SAW WIRE & BUMP BONDING METROLOGY: THIN FILM, LINE WIDTH, SEM AML – Wafer Bonding Machines & Services
AML Wafer Bonding Machines & Services One Company does it all!
AML – Wafer Bonding Machines & Services
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