Shyam Good

Brief Introduction to UWB, WiFi, WiMAX Shyam Shetty CTO Adamya Group of Companies

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Wireless Solutions on Chip™

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Wireless Solutions on Chip™

Agenda Introduction Market Overview Technology Overview Applications Summary

Wireless Solutions on Chip™

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Introduction

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Market Overview Wireless Solutions on Chip™

Statistics • • • • •

Over 160 million mobile phone users in US (CTIA 5/2004) Over 1.3 billion mobile phone users worldwide (IDC2004) Over 70% broadband penetration in US enterprises (Nielson NetRatings 6/2003) Over 39% broadband penetration in US SMEs and homes (Nielson NetRatings 6/2003) ALL are familiar with advantages of broadband access (Productivity, Cost reduction and Competitive advantage)

•

ALL have enjoyed the freedom and flexibility of mobile phones

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Market Overview Wireless Solutions on Chip™

Business Potential • • • • •

About 20 years ago all telephones were fixed and penetration was very high Cordless and cellular technologies added mobility to POTS In USA, mobility added over $100 billion to wired telecom revenues in 2003 Internet and datacom are today in similar state of maturity and penetration Technologies like UWB, WiFi and WiMAX are expected to provide similar growth and revenue opportunities for the Internet and datacom services

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Market Overview Wireless Solutions on Chip™

UWB Market Update -

MBOA based chipsets / solutions are expected to ship starting early Q2’05

-

Expected volumes to be in the range of 274 million units by 2007, an annual growth rate of 285% !!!

-

First products are for cable replacements (W-USB and W1394). 70% will be for PC and peripherals market.

-

Subsequent volumes expected to be driven by AV streaming applications (HDTV, DVD, etc..)

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Market Overview Wireless Solutions on Chip™

WiFi Market Update -

Estimated number of mobile PC users in US is approximately 30 million

-

Number of mobile PC users in US is expected to double in 2005

-

Nearly 2 million users are already using WiFi connections while traveling

-

Voice over WiFi is fast emerging as a new application area

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Market Overview Wireless Solutions on Chip™

WiMAX SWOT Analysis Strengths • Based on proven OFDM techniques (inherent robustness against multipath fading and narrowband interference) • Low cost to deploy and operate (~ $33 per home Vs $300-600 for DSL) • High speed (75 Mbps) and long range (50 Km) • Adaptable and self-configurable • Centralized control in MAC enables simultaneous, varied QoS flows

Opportunities • High-speed wireless infrastructure • Cellular infrastructure for converged networks • Last mile solution for broadband wireless access • CAPEX of ~$3.7 billion needed to penetrate 97.2% of US homes (InStat/MDR)

Weaknesses • Currently high power consuming (still far from penetrating portable mobile devices) • Not too many vendors today • Mobility not yet fully specified – could become complex to implement

Threats • DSL/ADSL technologies widely deployed • Cellular penetration is very high, and growing • Possible wide deployment of 3G • Wide-spread success of 802.20 standards

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Market Overview Wireless Solutions on Chip™

Brief Note on Bluetooth® • •

• • •

A short-range, low-powered wireless technology Market achieving mass-adoption through mobile phones, PC accessories, Consumer electronics and Automotive devices Major chip vendors are TI, CSR, Philips, Broadcom, Zeevo and ST-Microelectronics Adamya Computing Technologies is a major solution vendor Adamya’s range of embedded Bluetooth® products include 1.2 certified C-Blue™ (stack and profiles), Wireless Serial and Printing solutions, Wireless HiFi Solutions and several others

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Market Overview Wireless Solutions on Chip™

Brief Note on Zigbee • • • •

A short-range, very low-powered wireless technology Final stages of standardization Targeting sensor network and controller solutions for Homes, Buildings and Industries Major players are Motorola, Philips, Honeywell, Samsung, Mitsubishi, Invensys, Ember, Freescale, TI and AMD

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Technology Overview Wireless Solutions on Chip™

General 802 based Wireless Stack MAC

MLME

System Management Entity

PLCP PLME PMD

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Technology Overview Wireless Solutions on Chip™

Protocol entities MAC: Basic access mechanism, Fragmentation, encryption

MAC Layer Management Entity: Synchronization, power management, roaming, MAC-MIB

Physical Layer Convergence Protocol: Common PHY SAP, Clear Channel Assessment signal

Physical Medium Dependent sub-layer: Modulation and coding

PHY Layer Management Entity: Channel tuning, PHY-MIB

Station Management Entity: Interact and Control PLME and MLME

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Technology Overview Wireless Solutions on Chip™

Orthogonal Frequency Division Multiplexing (OFDM) • • • • •

Data is modulated on a set of Orthogonal sub-carriers and transmitted simultaneously OFDM is spectrally efficient OFDM has inherent robustness against narrowband interference OFDM has excellent robustness against multi-path fading OFDM is time tested – has existed for more than 40 years

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Technology Overview Wireless Solutions on Chip™

Ultra-wide band (UWB) - Multi-band OFDM Alliance (MBOA) • •

OFDM based Industry consortium of 100+ companies (TI, Intel, Philips, Samsung, Sony, Mitsubishi, Microsoft, Hewlett Packard, NEC, Fujitsu, Femto, Adamya, …)

• •

MBOA-SIG drives the standards First chipsets and solutions are emerging

- DS-UWB • • •

Based on precisely controlled short pulses Not as widely backed in the industry (Motorola and XtremeSpectrum are the main players) Already has chipsets and prototype solutions

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Peripheral Interconnect

NonIP (W1394)

Ultra-wide band (UWB) IP (UPnP)

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Technology Overview

Convergence Layer

W-USB

WiMedia

UWB-MAC

MBOA / IEEE UWB-PHY

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Technology Overview Wireless Solutions on Chip™

WiMedia Alliance Purpose of WiMedia Alliance is – •

Ensure interoperability of various implementations

•

Define a convergence sub-layer
Provides common / fair access to upper layers
Defines spectrum sharing rules

•

Defines IP based multi-media capable stack

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Technology Overview Wireless Solutions on Chip™

MBOA UWB PHY •

FCC approved spectrum for UWB is 3.1 – 10.6 GHz

•

Spectrum is divided into 13 bands of 528 MHz each

•

MBOA UWB PHY 1.0 spec uses first 3 bands

•

Information is transmitted using 128 OFDM subcarriers in each band

•

Information bits are interleaved across all bands to exploit frequency diversity and have robust multi-path performance

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Technology Overview Wireless Solutions on Chip™

UWB Spectrum …… 3168

3696

4224

4752

MHz

By using contiguous orthogonal carriers, transmit spectrum occupies > 500 Mhz bandwidth Total 128 tones: -100 for transmitting data (QPSK constellation) - 12 pilot tones for carrier and phase tracking - 10 user-defined pilot tones - Remaining 6 tones including DC are NULL

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Technology Overview Wireless Solutions on Chip™

MBOA UWB Transmitter Blocks: Input Data

Scrambler

Convolutional Encoder

Puncturer

Bit Interleaver

Constellation Mapping

IFFT Insert Pilots Add CP & GI

DAC

exp(j2πfct)

Time-Frequency Code

• Architecture is similar to conventional OFDM transmitters • Easily realizable fully in CMOS, hence low cost, power and form-factor • Time Frequency Code (TFC) is used to provide multiple-access • TFC is generated by the MAC layer It is a combination of Spreading, Time-Frequency Interleaving and Coding

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MBOA UWB Receiver Blocks:

Q sin(2πfct)

LPF

VGA

VGA

ADC

ADC

Descrambler

LNA

LPF

Viterbi Decoder

I

DeInterleaver

Pre-Select Filter

FEQ Remove Pilots

AGC

cos(2πfct)

Synchronization Remove CP FFT

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Technology Overview

Carrier Phase and Time Tracking

• Again, architecture is similar to conventional OFDM receivers • Easily realizable fully in CMOS, hence low cost, power and form-factor

Output Data

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Technology Overview Wireless Solutions on Chip™

PLCP Frame Format: RATE Reserved 3 bits 1 bit PLCP Preamble

LEN Scrambler Init 12 bits 2 bits

PHY MAC Tail Frame Payload HCS Hdr Hdr Bits Variable Length: 0-4095 bytes

55 Mb/s

FCS

Tail Pad Bits Bits

55, 80, 110, 160, 200, 320, 480 Mb/s

• Mode 1 (3-band): Preamble + Header length = 11.56 ms. Burst preamble + Header length = 4.69 ms. • (Mode 2 (7-band): Preamble + Header length = 14.06 ms. Burst preamble + Header length = 7.19 ms.) • Header is sent at an information data rate of 55 Mb/s. • Maximum frame payload supported is 4095 bytes.

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MBOA UWB Summary Strengths -

OFDM-based, FCC compliant, robust, scaleable architecture Ability to comply with world-wide regulations Backed by top Industry-leading companies Meant for short-range, very high speed communication

Weaknesses -

Throughput drops as range increases Not suitable for longer range mobile applications Industry failure to unanimously adopt standards

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Technology Overview Wireless Solutions on Chip™

WiFi Alliance •

Formed to promote and ensure interoperability of 802.11 based WLAN equipment

•

802.11a,g are OFDM based, 802.11b is DSSS based

•

Depending upon the standard, typical data rates are 11 Mbps to 54 Mbps

•

Maximum distance is 100 meters

•

Key players are TI, RFMD, Broadcom, Intel, Atheros, Agere, …

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Technology Overview Wireless Solutions on Chip™

WLAN Topology: Distribution System (DS) AP1

AP2

S2

GW

S3

BSS1 S1

S3

BSS2

S5

S4

• Independent, ad-hoc network configuration is called Base Service Set (BSS) - Range is limited, direct communication • Distribution system (DS) connects multiple BSS’s - Extended range, allows ST’s to access wired LAN resources and internet

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Technology Overview Wireless Solutions on Chip™

Access Points • • •

Stations select an AP and “associate” with it Supports roaming Provides - Timing synchronization, - Power management support and - Point coordinate function

• • • •

Typically (not always) traffic is through AP in a BSS Station first scans (passive or active) to detect an AP After detection it goes through the Authentication process by exchanging security keys Next the Station gets associated with AP after exchanging and negotiating capabilities

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CSMA/CA & Virtual Carrier Sense • •

• •

Before transmitting, stations check for carrier for DIFS (Distributed Inter Frame Space) period If free, they send a short RTS packet with source and destination address, and subsequent data duration Receiving end responds (if channel is free) with CTS All others wait for the duration indicated in RTS + Random Backoff period before sensing again

This mechanism saves power and reduces delays for transmissions

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WiFi Summary •

Specifically meant for wireless LAN applications

•

BSS range can be extended by Distribution Service

•

CSMA/CA and Virtual Carrier Sense are fundamental access mechanisms in WLANs

•

Meant for short-range, very high speed communication

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WiMAX (Worldwide Interoperability for Microwave Access): •

This technology caters to MAN / WAN applications. Currently, Intel is the biggest player in this technology.

•

It is based on IEEE 802.16 standards (802.16d is the latest)

•

Delivers a maximum throughput of 75 Mbps at a maximum range of 50 Km

•

Typical applications are – - Residential / SOHO broadband - DSL level service for SMBs - T1 level service for SMEs - Point-to-point link for cellular backhaul - WiFi hotspot backhauls - Public and Safety services - Private high-speed networks (Industries, Campus, …)

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WiMAX in action: Telco CO WiFi Hotspot Backhaul

Cellular Backhaul

Residential Broadband

Internet

High-speed Industrial and Enterprise n/w

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WiMAX OFDM PHY: •

Consists of 64 Downlink (DL) and 16 Uplink (UL) channels

•

Supports TDD and FDD operations

•

Mandatory to support Reed-Solomon (RS) / Convolution Coding (CC) rates 1/2, 2/3, 3/4 and 5/6

•

Optional Block Turbo Code (BTC) and Convolution Turbo Code (CTC)

•

Multiple modulation levels (BPSK, 16-QPSK & 64-QAM)

•

Optional Space Time Coding (STC), Adaptive Antenna System (AAS) & Spatial Division Multiple Access (SDMA)

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WiMAX MAC: •

Designed for Point-to-Multi-Point (PMP) and Mesh network models

•

Connection oriented – Subscriber Station (SS) creates one or more connection with Base Station (BS)

•

Handles airlink scheduling and usage, and provides QoS differentiation for various flows

•

Link adaptation and ARQ for maintaining BER

•

Acts as Convergence sub-layer for ATM and Packet based networks

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WiMAX Frame Structure: Frame

DL-PHY PDU

Contention / Initial Ranging

Contention / Initial Ranging

UL-PHY PDU from SS#1

UL-PHY PDU from SS#n

DL sub-frame Preamble Preamble

FCH

DL Burst #1

DL Burst #1 PDUs

DLFP

DL-MAP, ULMAP, DCD, UCD

MAC PDUs

UL Burst

PDUs

PAD

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SS Network Entry Process: •

DL Channel synchronization

•

Initial Ranging

•

Capabilities Negotiation

•

Authentication

•

Registration

•

IP connectivity setup

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UWB: AV SoC EEPROM

JTAG

Multimedia IO

Video Codecs

Video Buffers

CPU / DSP

Audio Codecs

P-RAM, D-RAM

UWB MAC + PHY + RF

Other Peripherals & IO

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Applications

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WiMAX: BS Front-end

Host Bus

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Applications

MAC

WiMAX

WiMAX Baseband

S/w + H/w (DSP)

RF

H/w

ASIC

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Summary Wireless Solutions on Chip™

MBOA-UWB 802.15.3a

WiFi 802.11a

WiFi 802.11b

WiFi 802.11g

WiMAX 802.16d

Peak data rate

640 Mbps

54 Mbps

11 Mbps

54 Mbps

75 Mbps

Frequency band

3.1-10.6 GHz

5 GHz

2.4 GHz

2.4 GHz

2-66 GHz

Channel BW

528 MHz

20 MHz

20 MHz

20 MHz

1.5-20 MHz

Range

3m

50 m

100 m

100 m

50 Km

Spectral efficiency

1.21 bps/ Hz

2.7 bps/ Hz

0.6 bps/ Hz

2.7 bps/ Hz

5 bps/ Hz

Modulation

OFDM

OFDM

DSSS

OFDM

OFDM

QoS

Yes

No

No

No

Yes

Applications

Roomnet, PAN

LAN

LAN

LAN

MAN/ WAN

Sub carriers

128

64

-

64

256

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Conclusive remarks Wireless Solutions on Chip™

•

TI can extend its dominance of the mobile handset market by leveraging UWB, WiFi and WiMAX technologies effectively

•

TI is well positioned to stake a strong claim to the cellular infrastructure market, based on WiMAX

•

Adamya is building the basic building blocks for these technologies

•

UWB is best suited for high-speed, short range connectivity

•

WiFi is currently dominating the WLAN market

•

WiMAX is staking a strong claim to broadband infrastructure and WLAN markets

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TI-Adamya Partnership Wireless Solutions on Chip™

•

Adamya offers several IPs and solutions (Audio, Video and DSP algorithms) based on TI’s silicon

•

Adamya and TI have partnered to deliver compelling solutions for Bluetooth and Cell phone product space

•

Adamya is in the process of creating basic IPs and Algorithms for wireless communication space, based on TI’s silicon

•

Adamya is Third Party Vendor for TI solutions

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THANK YOU ! Shyam Shetty [email protected] www.adamya.com