Max 232

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SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

D Meets or Exceeds TIA/EIA-232-F and ITU D D D D D D D D

MAX232 . . . D, DW, N, OR NS PACKAGE MAX232I . . . D, DW, OR N PACKAGE (TOP VIEW)

Recommendation V.28 Operates From a Single 5-V Power Supply With 1.0-mF Charge-Pump Capacitors Operates Up To 120 kbit/s Two Drivers and Two Receivers ±30-V Input Levels Low Supply Current . . . 8 mA Typical ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) Upgrade With Improved ESD (15-kV HBM) and 0.1-mF Charge-Pump Capacitors is Available With the MAX202 Applications − TIA/EIA-232-F, Battery-Powered Systems, Terminals, Modems, and Computers

C1+ VS+ C1− C2+ C2− VS− T2OUT R2IN

1

16

2

15

3

14

4

13

5

12

6

11

7

10

8

9

VCC GND T1OUT R1IN R1OUT T1IN T2IN R2OUT

description/ordering information The MAX232 is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/EIA-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels. These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs. Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels. The driver, receiver, and voltage-generator functions are available as cells in the Texas Instruments LinASIC library. ORDERING INFORMATION

PDIP (N)

TOP-SIDE MARKING

Tube of 25

MAX232N

Tube of 40

MAX232D

Reel of 2500

MAX232DR

Tube of 40

MAX232DW

Reel of 2000

MAX232DWR

SOP (NS)

Reel of 2000

MAX232NSR

MAX232

PDIP (N)

Tube of 25

MAX232IN

MAX232IN

Tube of 40

MAX232ID

Reel of 2500

MAX232IDR

Tube of 40

MAX232IDW

Reel of 2000

MAX232IDWR

SOIC (D) 0°C to 70°C SOIC (DW)

−40°C −40 C to 85 85°C C

ORDERABLE PART NUMBER

PACKAGE†

TA

SOIC (D) SOIC (DW)

MAX232N MAX232 MAX232

MAX232I MAX232I

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LinASIC is a trademark of Texas Instruments. Copyright  2004, Texas Instruments Incorporated

      !"#   $"%&! '#( '"! !  $#!! $# )# #  #* "# '' +,( '"! $!#- '#  #!#&, !&"'# #-  && $##(

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

1

            



SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

Function Tables EACH DRIVER INPUT TIN

OUTPUT TOUT

L

H

H

L

H = high level, L = low level EACH RECEIVER INPUT RIN

OUTPUT ROUT

L

H

H

L

H = high level, L = low level

logic diagram (positive logic) 11

14

T1IN

T1OUT 10

7

T2IN

T2OUT 12

13

R1OUT

R1IN 9

R2OUT

2

POST OFFICE BOX 655303

8 R2IN

• DALLAS, TEXAS 75265

            



SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Input supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Positive output supply voltage range, VS+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC − 0.3 V to 15 V Negative output supply voltage range, VS− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to −15 V Input voltage range, VI: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V Output voltage range, VO: T1OUT, T2OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VS− − 0.3 V to VS+ + 0.3 V R1OUT, R2OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V Short-circuit duration: T1OUT, T2OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, θJA (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions VCC VIH

Supply voltage

VIL R1IN, R2IN

Low-level input voltage (T1IN, T2IN)

TA

High-level input voltage (T1IN,T2IN)

MIN

NOM

MAX

4.5

5

5.5

2

V V

Receiver input voltage Operating free-air temperature

UNIT

0.8

V

±30

V

MAX232

0

70

MAX232I

−40

85

°C

electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER ICC

TEST CONDITIONS VCC = 5.5 V, TA = 25°C

Supply current

All outputs open,

MIN

TYP‡

MAX

8

10

UNIT mA

‡ All typical values are at VCC = 5 V and TA = 25°C. NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0.5 V.

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

3

            



SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature range (see Note 4) PARAMETER

TEST CONDITIONS

VOH

High-level output voltage

T1OUT, T2OUT

RL = 3 kΩ to GND

VOL

Low-level output voltage‡

T1OUT, T2OUT

RL = 3 kΩ to GND

MIN 5

TYP†

MAX

7 −7

UNIT V

−5

V

Output resistance T1OUT, T2OUT VS+ = VS− = 0, VO = ±2 V 300 Ω IOS§ Short-circuit output current T1OUT, T2OUT VCC = 5.5 V, VO = 0 ±10 mA IIS Short-circuit input current T1IN, T2IN VI = 0 200 µA † All typical values are at VCC = 5 V, TA = 25°C. ‡ The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only. § Not more than one output should be shorted at a time. NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0.5 V. ro

switching characteristics, VCC = 5 V, TA = 25°C (see Note 4) PARAMETER

TEST CONDITIONS

SR

Driver slew rate

RL = 3 kΩ to 7 kΩ, See Figure 2

SR(t)

Driver transition region slew rate

See Figure 3

Data rate

One TOUT switching

MIN

TYP

MAX

UNIT

30

V/µs

3

V/µs

120

kbit/s

NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0.5 V.

RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature range (see Note 4) PARAMETER

TEST CONDITIONS

VOH

High-level output voltage

R1OUT, R2OUT

IOH = −1 mA

VOL

Low-level output voltage‡

R1OUT, R2OUT

IOL = 3.2 mA

VIT+

Receiver positive-going input threshold voltage

R1IN, R2IN

VCC = 5 V,

TA = 25°C

VIT−

Receiver negative-going input threshold voltage

R1IN, R2IN

VCC = 5 V,

TA = 25°C

MIN

TYP†

MAX

3.5

V

1.7 0.8

UNIT

0.4

V

2.4

V

1.2

V

Vhys Input hysteresis voltage R1IN, R2IN VCC = 5 V 0.2 0.5 1 V ri Receiver input resistance R1IN, R2IN VCC = 5, TA = 25°C 3 5 7 kΩ † All typical values are at VCC = 5 V, TA = 25°C. ‡ The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only. NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0.5 V.

switching characteristics, VCC = 5 V, TA = 25°C (see Note 4 and Figure 1) PARAMETER tPLH(R) tPHL(R)

TYP

UNIT

Receiver propagation delay time, low- to high-level output

500

ns

Receiver propagation delay time, high- to low-level output

500

ns

NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0.5 V.

4

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

            



SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

PARAMETER MEASUREMENT INFORMATION VCC

Pulse Generator (see Note A)

RL = 1.3 kΩ

R1OUT or R2OUT

R1IN or R2IN

See Note C

CL = 50 pF (see Note B) TEST CIRCUIT ≤10 ns

≤10 ns

Input

10%

90% 50%

90% 50%

3V 10%

0V

500 ns tPLH

tPHL

VOH Output

1.5 V

1.5 V

VOL

WAVEFORMS NOTES: A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%. B. CL includes probe and jig capacitance. C. All diodes are 1N3064 or equivalent.

Figure 1. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

5

            



SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

PARAMETER MEASUREMENT INFORMATION T1IN or T2IN

Pulse Generator (see Note A)

T1OUT or T2OUT EIA-232 Output CL = 10 pF (see Note B)

RL

TEST CIRCUIT ≤10 ns

≤10 ns 90% 50%

Input 10%

3V

90% 50%

10%

0V

5 µs tPLH

tPHL 90% Output

VOH

90%

10%

10%

VOL tTLH

tTHL 0.8 (V

SR +

–V ) 0.8 (V –V ) OH OL OL OH or t t TLH THL WAVEFORMS

NOTES: A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%. B. CL includes probe and jig capacitance.

Figure 2. Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-µs Input) Pulse Generator (see Note A)

EIA-232 Output 3 kΩ

CL = 2.5 nF

TEST CIRCUIT ≤10 ns

≤10 ns

Input 90% 1.5 V

10%

90% 1.5 V

10%

20 µs tTLH

tTHL Output

3V

3V −3 V

−3 V SR +

t

THL

6V or t

VOH VOL

TLH

WAVEFORMS NOTE A:

The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%.

Figure 3. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-µs Input)

6

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

            



SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

APPLICATION INFORMATION 5V CBYPASS =1µF

+ − 16

C1

C1+

1 µF 3

From CMOS or TTL

To CMOS or TTL

8.5 V

1 µF 5

6

VS−

C2+

1 µF

2 VS+

C1−

4 C2

C3†

VCC

1

−8.5 V

C4 +

C2−

11

14

10

7

12

13 8

9 0V

1 µF

EIA-232 Output EIA-232 Output EIA-232 Input EIA-232 Input

15 GND † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. In addition to the 1-µF capacitors shown, the MAX202 can operate with 0.1-µF capacitors.

Figure 4. Typical Operating Circuit

POST OFFICE BOX 655303

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7

PACKAGE OPTION ADDENDUM www.ti.com

4-Jun-2007

PACKAGING INFORMATION Orderable Device

Status (1)

Package Type

Package Drawing

Pins Package Eco Plan (2) Qty

MAX232D

ACTIVE

SOIC

D

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DE4

ACTIVE

SOIC

D

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DG4

ACTIVE

SOIC

D

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DR

ACTIVE

SOIC

D

16

2500 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DRE4

ACTIVE

SOIC

D

16

2500 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DRG4

ACTIVE

SOIC

D

16

2500 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DW

ACTIVE

SOIC

DW

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DWE4

ACTIVE

SOIC

DW

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DWG4

ACTIVE

SOIC

DW

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DWR

ACTIVE

SOIC

DW

16

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DWRE4

ACTIVE

SOIC

DW

16

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232DWRG4

ACTIVE

SOIC

DW

16

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232ID

ACTIVE

SOIC

D

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDE4

ACTIVE

SOIC

D

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDG4

ACTIVE

SOIC

D

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDR

ACTIVE

SOIC

D

16

2500 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDRE4

ACTIVE

SOIC

D

16

2500 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDRG4

ACTIVE

SOIC

D

16

2500 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDW

ACTIVE

SOIC

DW

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDWE4

ACTIVE

SOIC

DW

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDWG4

ACTIVE

SOIC

DW

16

40

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDWR

ACTIVE

SOIC

DW

16

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDWRE4

ACTIVE

SOIC

DW

16

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IDWRG4

ACTIVE

SOIC

DW

16

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232IN

ACTIVE

PDIP

N

16

CU NIPDAU

N / A for Pkg Type

25

Addendum-Page 1

Pb-Free (RoHS)

Lead/Ball Finish

MSL Peak Temp (3)

PACKAGE OPTION ADDENDUM www.ti.com

4-Jun-2007

Orderable Device

Status (1)

Package Type

Package Drawing

Pins Package Eco Plan (2) Qty

MAX232INE4

ACTIVE

PDIP

N

16

25

Pb-Free (RoHS)

CU NIPDAU

N / A for Pkg Type

MAX232N

ACTIVE

PDIP

N

16

25

Pb-Free (RoHS)

CU NIPDAU

N / A for Pkg Type

MAX232NE4

ACTIVE

PDIP

N

16

25

Pb-Free (RoHS)

CU NIPDAU

N / A for Pkg Type

MAX232NSR

ACTIVE

SO

NS

16

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232NSRE4

ACTIVE

SO

NS

16

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

MAX232NSRG4

ACTIVE

SO

NS

16

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Lead/Ball Finish

MSL Peak Temp (3)

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com

19-Mar-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing

MAX232DR

SOIC

SPQ

Reel Reel Diameter Width (mm) W1 (mm)

D

16

2500

330.0

16.4

A0 (mm)

B0 (mm)

K0 (mm)

P1 (mm)

W Pin1 (mm) Quadrant

6.5

10.3

2.1

8.0

16.0

Q1

MAX232DR

SOIC

D

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

MAX232DWR

SOIC

DW

16

2000

330.0

16.4

10.75

10.7

2.7

12.0

16.0

Q1

MAX232IDR

SOIC

D

16

2500

330.0

16.4

6.5

10.3

2.1

8.0

16.0

Q1

MAX232IDWR

SOIC

DW

16

2000

330.0

16.4

10.75

10.7

2.7

12.0

16.0

Q1

MAX232NSR

SO

NS

16

2000

330.0

16.4

8.2

10.5

2.5

12.0

16.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com

19-Mar-2008

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

MAX232DR

SOIC

D

16

2500

346.0

346.0

33.0

MAX232DR

SOIC

D

16

2500

333.2

345.9

28.6

MAX232DWR

SOIC

DW

16

2000

346.0

346.0

33.0

MAX232IDR

SOIC

D

16

2500

333.2

345.9

28.6

MAX232IDWR

SOIC

DW

16

2000

346.0

346.0

33.0

MAX232NSR

SO

NS

16

2000

346.0

346.0

33.0

Pack Materials-Page 2

IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions

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Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless

www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

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