Emerging Trends In Manufactruing

EMERGING TRENDS IN MANUFACTURING P K MISHRA Emeritus Professor MECHANICAL ENGG. DEPARTMENT GOVT. COLLEGE OF ENGINEERING, PUNE

STATEGIC ISSUES INTRODUCTION India’s GDP is about USD 480 (998) billion per year. India’s exports of I.T. would be about USD 12 billion in 2003-2004, ~ 2.5% of India’s GDP.

Therefore, I.T. is NOT everything! Software & I.T (worldwide) ~ USD 530 billion/year. Manufacturing (worldwide) ~ USD 9600 billion/year. Tourism & Travel (worldwide) ~ USD 3700 billion/ year. Health Care (worldwide) ~ USD 2700 billion/ year. Education (worldwide) ~ USD 2500 billion/ year.

18 times of I.T 7 times of I.T. 5 times of I.T. 5 times of I.T.

The Business areas on Mfg, TT, HC, & Education are 18, 7, 5 & 5 times, the size of I.T., respectively. Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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THE MOST IMPORTANT SOLUTION

The only way to ensure high standards of living, which leads to a high quality of life for our nation is to develop support and maintain an active, to bring in innovations in manufacturing industries. WORLD CLASS MANUFACTURING OPERATES GLOBALLY

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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PROBLEMS to SOLVE • Population growth. • Declining natural resources. • The products possesses more functions feature with and needs fewer discrete components (Mechatronics approach). • The component parts would be of more complex in shape, utilizing improved materials and processes for higher precision and quality. • The manufacturing systems would then be more complex, are to be simplified to adopt more variables to control, with better flow and integration of information for higher accuracy, surface integrity and ecological conditions. • The processes need to be efficiently designed to meet the above requirements removing the drawbacks of the conventional practices. Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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SOME STRATEGIC TECHNOLOGICAL SOLUTIONS TO REACH THE POPULATION

¾

MINITURIZATION (Energy efficient & Reduction of material cost)

¾ NEWER MATERIAL DEVELOPMENT (Sustainable materials & higher strength/weight ratio)

¾ IMPROVED PORTABILITY (Reduction of transport cost) ¾ IMPROVED AUTOMATION & COMPUTER COMAPTIBILTY (Help the unskilled workers)

¾ INTERDISCIPLINARY & MULTISCALE DESIGN APPROACH

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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MEMS / MS COMPONENTS

MICROWAVE GUID

MICRO MILLED CHANNELS

MICRO SYSTEMS

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MICRO ANTENNAS

RATCHET

ENCODERS/GEARS/ MOTOR STAMPINGS

Tunable RF MEMS Inductor

TOP 30 MEMS MANUFACTURERS

MICRO HEATSINKS

MICRO HEAT EXCHANGERS

MEMS Market 20072012

SMART SENSORS

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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OBJECTIVE

Precision engineering Microengineering & extendable to Nanotechnologies

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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MICRO – MESSO MACHINING SCALE

Ref: John Shanahan, Trends in Micro Machining Technologies

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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ABSTRACT “The most startling advances have their origin at the boundaries of the specialties, where the techniques developed in one field are applied with fertile effect, to the subject matter of another... If this cross-fertilization dwindles, the rate of scientific advance will almost surely dwindle as well, and so any thing that encourages cross-fertilization is all to the good…”, said the great Philosopher, Isaac Asimov. Refreshers Course on MTMM At VJTI, Mumbai

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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PROCESS INACCURACY IN CONVENTIONAL MANUFACTURING OPERATIONS

• • • • • •

THERMAL DEFORMATIONS DEFLECTION DUE TO COMPLIANCE OF THE MACHINE-TOOL SYSTEM ERROR DUE TO LOCATION AND FIXTURING TOOL WEAR FORCED VIBRATION AND CHATTER CLAMPING AND SETTING ERROR

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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ACCURACY/PRECISION

ACHIEVABLE DEPENDING ON MACHINE-TOOLS KINEMATIC STRUCTURE • • • •

PERFECT KINEMATICS REFERENCE PERFECT KINEMATIC PAIRS (e.g. CONSTANT CLEARANCE) NOISE AND VIBRATION (INTERNAL & EXTERNAL) INACCURACY IN MOTION MEASUREMENTS

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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THE SOLUTIONS

BRING IN THE INNOVATIVE CHANGES TO THE EXISTING (TRADITIONAL) PRACTICES to ¾ Sustain productivity with increased strength of work material ¾ Maintain productivity with components with desired shape, accuracy and surface integrity ¾ Improve the capability of integration, automations and decreasing their sophistication

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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PROBABLE SOLUTIONS

MECHANICAL ELECTRICAL

CHEMICAL

MAGNETIC RAW MATERIAL

OPTICAL

FINISHED JOB MICROWAVE

NUCLEAR

Deformation, D = K En T Where, K = material constant E = the supply energy n = coupling coefficient

Nontraditional Energy Approach to Manufacturing Refreshers Course on MTMM At VJTI, Mumbai

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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COMPARISON BETWEEN TWO APPROACHES ENERGY LOSS DEFORMED SURFACE (MACHINED)

TOOL WORK

CUTTING VELOCITY

CONVETIONAL

UNCONVETIONAL

Solution for approach •

Micro Mechanics

•

Micro Energy Transfer

ENERGY SOURCE REFLECTION

REFLECTION

Deformation, D = K En T Where,

K = material constant E = the supply energy n = coupling coefficient

WORK DEFORMATION TRANSMITION Refreshers Course on MTMM At VJTI, Mumbai

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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MICRO IN A MACRO-MACHINE

Micro Components machined in a 4-axix CNC WEDM in Microsystems Engineering lab of Mechanical Engineering Dept., CoE, Pune

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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FOR HIGHER PRECISION AND ACCURACY

¾ Low-stress condition (clamping, deformation etc.) or complete elimination on the job

¾ Vibration free operation, and ¾ Elimination / minimization of errors in tool path motion for the generation mechanism/s with the principles of zero play between the perfect kinetic references and kinematic pairs.

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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EASE OF NONCONVENTIONAL ENERGY FORM

ƒ Non-contact type ƒ Easy application ƒ Surface Integrity energy dependent ƒ Low inertial system ƒ Remote application of energy ƒ Micro to Macro to Bulk Mfg.

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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ADVANTAGES

¾ ENERGY SAVING ¾ TAILORED SURFACE ¾ EASY HYBRIDIZATION ¾ IMPROVED SURFACE INTEGRITY ¾ LOW ENERGY CONSUMPTION ¾ PROCESSING SPEED

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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MICRO FORMING CASTING

FORMING

INJECTION

STAMPING

VACUUM CASTING

LASER FORMING ELECTROFORMING Electrohydro FORMING

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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ADDITIVE & SUBSTRACTIVE PROCESSES GENERATIVE (Addition or Creation)

MACHINING (Subtractive) PHOTOLITHOGRAPHY

Laser Assisted CVD

LIGA & SLIGA

Micro Stereolithography

Diamond Milling

Electro Deposition

MicroAJM MicroUSM

Micro Plasma Spraying

MicroECM

EB Deposition

LASER Micromachining PLASMA Micromachining

FDM using ECD

EB Micromachining DRY ETCHING

LASER/EB/ED/PLASMA for Micro Heat-treatment/alloying/cladding/welding Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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MICRO ETCHING/DEPOSTION WITH SACRIFICIAL LAYERS

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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MICRO PATTERNING Micro-patterns and casting systems Micro Electroforming, a powerful technique to produce Micro metallic parts(e.g. microchannels) as a standalone process or Hybridization (e.g. LIGA & SLIGA).

Standard Injection Refreshers Course on MTMM At VJTI, Mumbai

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With Ultrasonic Assist P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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ELECTROFORMING ¾ Precision electroforming is the process whereby a metal object is built-up, atom-by-atom, onto a contoured surface called a mandrel..

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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APPLICATONS Some examples: ¾ CD and DVD masters, and ¾ Special lens molds. ¾Reproduce contours of electroforming mandrels to tolerances exceeding ± 0.05 micron. • Solidscape, Inc., • USA PPC 3200s from Schultheiss GmbH, West Germanyhigh temperature casting unit up to 21000C, • Battenfeld Microsystem50 [8] from UK MIG, for medical and MEMS devices, • Bradford/Rondol Micromoulding In-Line Compounder, •Rondol High-Force Micro-Injection Moulding Machine, Refreshers Course on MTMM At VJTI, Mumbai

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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HOT EMBOSSING ¾ A low-cost methods ¾ For high volume production of micro-compts. and systems.

Embossing tool, reactively etched silicon

Embossed PMMA. high accuracy replica

Embossing of Microparts [Geiger M et al]

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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PHOTOLITHOGRAPHY Powerful method in MEMS/MS technology START ► WORKPIECE BLANK CLEAN WORKPIECE PHOTO RESIST COAT NEGATIVE ON BOTH SIDES & EXPOSED TO ENERGY

THROUGH ENERGY BEAM

MASK FORMATION WHEN DEVELOPED ON REMOVAL OF NEGATIVE

ON ETCHING ON MASK REMOVAL (DESTRIPPING)

FINISH ► WORKPIECE

Basic Scheme of Photolithography Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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RESOLUTION IN PATTERN GENERATION Pattern Generation: contact/projection printing or pattern-generator, Metal coated to fill the voids, Inspected and repaired. Then the Resist is stripped to leave the chromium pattern on the surface Etching (micromachining). Resolution of Pattern depends For Proximity and Contact Printing:

resolution =

λ (gap between mask and resist + resist thickness)

where, λ is the wave length of illuminating radiation. For Projection Printing:

resolution = (Ka λ) / (NA); depth of focus = (Kb λ / (NA)2 where, process constants, Ka and Kb are ~ 0.75 and ~ 0.5 respectively NA is the numerical aperture of the optical system

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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RESOLUTION INCREASE UV DUV (Excimer Lasers: 248 nm and 193 nm) Electron Beam X-ray

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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X-RAY LITHOGRAPHY

Scheme of X-ray Lithography A Gear and inclined Slots machined by X-ray (Craig F., MTU) Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LIGA (Lithographie Galvanoformung Abformung)

Micro Injection Moulding - Final stage of LIGA Increased Mask Thickens allow other micromanufacturing methods for higher aspect ratio Refreshers Course on MTMM At VJTI, Mumbai

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

Components manufactured by LIGA (Craig F., MTU) PKM- MMfg 30

SLIGA sacrificial LIGA SLIGA sacrificial LIGA for moving parts

Moving Gear from Barkley Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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A RATCHET-PAWL MICROSYSTEMS

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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MECHANICAL MICROMILLING Micro mill of components, features down to 50-100 microns, ¾ Aspect ratio 3-10 for non-ferrous materials, and 1-2 for ferrous materials Cutting tools: double or multi flute, manufactured by EB or IB machining

Micro mill (Northwestern Univ.)

Spiral milled groove (Craig F, MTU) Refreshers Course on MTMM At VJTI, Mumbai

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Flute machining

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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A MICRO MILLING SYSTEM IN OPERATION & THEIR EFFECTS ON ROUGHNESS

MILLING METALS

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MILLING PMMA

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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APPLICATION OF MICROMACHINING

• • • • • •

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Medical Components Micro Molds Electronic Tooling MEMS (Micro-Electrical-MechanicalSystem) Fluidic Circuits Micro-Valves

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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SYSTEMATIC INNOVATION and TECHNICAL CREATIVITY WOULD DEFINITELY BRING IN ECONOMIC STABILITY

THANKS

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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A FLEXIBLE CONCEPT IN MANUFACTURING TECHNOLOGY

THERMAL PROCESSING OF MATERIALS

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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FUNDAMENTALS OF LASER PROCESSING

Where,

E = K v ρ Cp (Ed τp )n

E = energy requirement to raise the material to processing temperature for volume, V

ρ = density of the material

Ed= energy density τp = pulse width or interaction time Cp= Specific heat of material K, n are constants dependent on material and energy Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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THERMAL ENERGY & MATERIAL INTERACTION

SOLID STATE PROCESSING: HEAT TREATMENT, ZONE REFINING etc

E = Vρ Cp (Tp – T) LIQUID STATE PROCESSING: MELTING, WELDING, ALLOYING, CLADDING etc

E = Vρ[ Cp (Tm – T) + L + Cp’(Tp + Tm)] VAPOUR STATE PROCESSING: MACHINING & COATING

E = Vρ[ Cp (Tm – T) + Lm + Cp’(Tp + Tm)] + Lv ]

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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THERMAL GRADIENT SURFACE PROCESSING

(a) Temperature rise with interaction time

(b) Pulse definition Refreshers Course on MTMM At VJTI, Mumbai

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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MODES OF PROCESSING MATERIALS

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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CAPABILITIES OF THERMAL PROCESSING

LAM ELM

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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FLEXIBLE THERMAL PROCESSING

Processing

Specific Energy (J/cm2)

Power Density (W/cm2)

Interaction Time (Sec)

Shock Hardening

10-102

108-109

10-8-10-6

Glazing

1-10

106-107

10-6-10-4

Machining

103-104

105-106

10-5-10-3

Welding

103-104

105-106

10-2-10-4

Trans-formation Hardening

104-105

104-105

10-1-10

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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ENERGY COUPLING COEFFICIENT

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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HOW PRECISION CAN BE ACHIEVED? FOR HIGHER PRECISION AND ACCURACY ¾

Low-stress condition (clamping, deformation etc.) or complete elimination on the job

¾ Vibration free operation, and ¾ Elimination / minimization of errors in tool path motion for the generation mechanism/s with the principles of zero play between the perfect kinetic references and kinematic pairs.

Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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THE USE OF NONCONVENTIONAL ENERGY FORM

ƒ Non-contact type ƒ Easy application ƒ Surface Integrity energy dependent ƒ Low inertial system ƒ Remote application of energy ƒ Micro to Macro to Bulk Mfg.

Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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ADVANTAGES OF NONCONVENTIONAL PROCESSING

¾ ENERGY SAVING ¾ TAILORED SURFACE ¾ EASY HYBRIDIZATION ¾ IMPROVED SURFACE INTEGRITY ¾ LOW ENERGY CONSUMPTION ¾ PROCESSING SPEED

Refreshers Course on MTMM At VJTI, Mumbai

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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COMPARISON OF MICROMACHINING PROCESSES PROCESS

RESOLUTION µm

SURFACE ROUGHNESS, µm

MECHANICAL

100

6.3 – 1.6

SIDE EFFECTS Burr require polishing

EDM

100

4.75 – 1.6

Electrode wire, rough finish, slow and unclean process

CHEMICAL ETCHING

250

6.3 – 1.6

Undercut

LIGA

5

1–2

Synchrotron source and expensive

Nd – YAG LASER

50

1

Redeposition

EXCIMER LASER

5

> 1 (nm range)

Recast layer, aspect ratios

Ti – SAPPHIRE Ultra fast LASER

<1

nm range

High power ranges, may require vacuum environment

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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REFLECTION DAMAGING TECHNIQUE

Or USE OF ABSORPTION COATINGS

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LASER PROCESSING CAPABILITIES

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LASER CUTTING

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LASER WELDING

(Courtesy: Control Vision Inc.)

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LASER SINTERING

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LASER FLEXIBLE MATERIAL PROCESSING

Laser Surface Hardening

Accelerated Laser Assisted Etching of Silicon within 12 ms

of C.I. at 15 mm/s Speed

5kW Nd-YAG PULSED LASER CNC WORKSTATION RETROFITTED AT IIT KHARAGPUR

Continuous Ni/Cr alloying of steel at 1.0 mm/s with CO2 Laser

120W CO2 CW LASER CNC WORKSTATION MICROMACHINING by CW CO2 Laser at 0.5 mm/s Speed Refreshers Course on MTMM At VJTI, Mumbai

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DEVELOPED AT IIT KHARAGPUR P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

Selective Laser Sintering for Metal Build-up Rapidly From Iron & Graphite Powers PKM- MMfg 54

LASER FORMING (Ref: Rearden et al, Laser Group, Univ Liverpool, UK)

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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BEAM FOCUSABILITY

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LASER BEAM FOCUSABILITY

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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EFFECT OF WAVELENGTH & BEAM DIAMETER ON SPOT SIZE

fλ w 2 = fθ 1 = πw1 From this approximation: w2, spot size is smaller for lower λ higher w1, laser beam diameter (Beam Expander) Where, w1 = Ds and w2 = Di

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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USE OF BEAM EXPANDER

EFFECTS OF BEAM EXPANDER ON PROPAGATION OF GAUSSIAN BEAM

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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BEAM SHAPING

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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EFFECT OF PULSE WIDTH ON MACHINING SIZE OR SPOT-DIAMETER

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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PATTERN GENERATION: Contact/projection printing or pattern-generator • Metal coated to fill the voids, • Inspected and repaired. Then the • Resist is stripped to leave the chromium pattern on the surface • Etching (micromachining). • Resolution of Pattern depends

For Proximity and Contact Printing: resolution = λ (gap between mask and resist + resist thickness) where, λ is the wave length of illuminating radiation. For Projection Printing: resolution = (Ka λ) / (NA); depth of focus = (Kb λ / (NA)2 where, process constants, Ka and Kb are ~ 0.75 and ~ 0.5 respectively

NA is the numerical aperture of the optical system

Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LASER SPECTRUM

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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EFFECT OF LASER PARAMETERS ON MACHINING PROCESS

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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A LASER MICROMACHINING SYSTEM

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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EXCIMER & CO2 LASER BASED MFG. WORKSTATION EXCIMER LASER HEAD (KrF-248nm, 650mJ/pulse, 25 ns pulse width)

BEAM DELIVERY SYSTEMS

3-AXIS GANTRY TYPE CNC TABLE

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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EXCIMER LASER MACHINING

60 x 60 micron square hole

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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EXCIMER LASER MULTIPLE MACHINING

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LASER TEXTURING (Si) (Ref: Dr. P Saha & A Das) Etch Boundary 120 µm

120 µm

300

µm

Etched Surface(Mid)

120 µm Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

120µm

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STEERABILTY OF LASER BEAM

TWO COMPUTER CONTROLLED MIRRORS CAN SWEEP THE FOCUSSED BEAM TO WRITE ON THE WORK-PIECE Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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CHARACHERISTICS OF FEMTOSECON LASER MICROMACHING

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P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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LASER CUTTING TECHNIQUES

Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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EFFECT OF ULTRASHORT PULSES

Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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AN APPLICATION

Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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STENT MATERIALS DEVELOPEMNT

Courtesy of SCHUESSLER AD MEDS Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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A FIBER LASER BASED MANUFACTURING CENTER DEVELOPED AT COE, PUNE

Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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“It’s impossible to fail totally if you dare to try” said Robert H Schuller

THANKS

Refreshers Course on MTMM At VJTI, Mumbai

2/15/2009

P K MISHRA Professor Emeritus Dept. of Mech Engg, CoE Pune

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