ALPHA IMAGER PVT LTD
A PCB DESIGN BUREAU YOUR ELECTRONIC DESIGN SOLUTION PARTNER
OVERVIEW OF THE ORGANIZATION: ♣ Alpha Imager Pvt.Ltd., was incorporated in 1987 with the primary aim of providing the value added service in the field of Electronic System Design.
♣ In a short of time of period Alpha-Imager has been able to establish itself as a premier bureau for PCB Design and Engineering.
♣Company has expert groups identified for design, assembly and manufacturing of all types of PCBs.
QUALITY POLICY:
To Be Technology Solution Provider in Electronic Design Automation Service and Products Meeting Customers Agreed Requirements in Quality and Delivery Through Continual Improvement in Quality Management System With the Involvement of the Employees. ♣
SERVICE OFFERED: ψ PCB CAD Design Service ψ Raster Photoplotting ψ HYBRID Micro Circuits ψ System Engineering ψ Contract Manufacturing Of PCB ψ Multilayer MIL Standards ψ Panelisation with coupons ψ CAM Service, CNC and Routing. ψ Proto PCBs
SERVICE OFFERED:
Integrated Design Software Solutions for CAD Simulation, Thermal and Reliability Analysis and CAM : Ж
EDWinXP
Ж ViewMaster Ж ViewMaster PRO Ж ITEM
MULTIPLE DESIGN STATIONS USING:
EDWin
PCAD Visual Item Safety
CADSTAR Or CAD
Item Reliability
Gerbin
OUR MAJOR CUSTOMERS: HAL : Hindustan Aeronautical Limited ADE : Aeronautical Development Establishment CABS : Center for Airborne Systems TATA Power BEL : Bharat Electronics Limited DEAL : Defence Electronics Application Lab NPOL : Naval Physics Oceanography Laboratory BOSCH S WAVE Pvt Ltd.,
DESIGN CENTER:
The organization has the fully equipped design center with the well trained Design Engineers
NULINESCOPE: A PCB INSPECTION SYSTEM
7’’ multi-purpose LCD Monitor 10x to 30x Magnification Ring LED for the brightness control USB Interface Card to get some shoots of the inspection process.
NULINESCOPE: A PCB INSPECTION SYSTEM
19’’ multi-purpose LCD Monitor 10x to 200x Magnification Ring LED for the brightness control USB Interface Card to get some shoots of the inspection process.
PHOTOPLOTTER FP-8000 XL
The software along with the machine allows to do simple reverse (negative) and mirror plotting, film and drill panelization, DCode editing, output preview and print. The software allows interactive or co-ordinates image positioning on film, glue/unglue image location,automatic positioning of associated images on different layers
PHOTOPLOTTER FP-8000 XL Features:
✯ Drum Diameter : approx. 157 mm ✯ Maximum film size : 450 mm x 380 mm ✯ Maximum Photoplotting area : 430 mm x 360 mm Maximum film size recommended for Photoplotting reflects the fact that film is fixed to rotating drum by means of masking tape. Larger film size up to maximum film size is possible to use after practicing proper film taping.
PHOTOPLOTTER FP-8000 XL ✯ Plotting accuracy : approx . 0.05mm / 2 mils across the film. ✯ Plot resolution : (508, 1016, 1355, 1625, 2032, 2710, 4064, 8192) x 8600 dpi ✯ Plotting Speed : approx. 10mm of film width/minute for 1016 dpi. ✯ Light Source : Laser Diode 670nm (red). ✯ Reads in image formats: Gerber (RS 274D, RS 274X), hi-res BMP, Postscript (option). ✯ Reads in aperture files: Directly CAM 350, GC-CAM, IsoCAM, Lavenir.
CNC MACHINES FROM
COLINBUS
COLINBUS-CBR SERIES :
Colinbus Machines allow a variety work holding solutions. You can choose to work with a vacuum table, T Slots, jigs or a palletized operation, depending on your project requirements. A full selection of mounting plates for milling, drilling, engraving, measuring, illuminating or scanning heads can easily be attached.
COLINBUS-CBR SERIES : Applications For Rapid Prototyping, Modelling, Jewelry making.
For Moulding, Quality control with a camera, dispensing paste,
For cutting frames, lettering, engraving any kind of pattern and many more applications that you can think of.
COLINBUS
CBR - 40 :
Surface (bxdxh) in mm
430(x) x 530(y) x 119(z)
Maximum Working area
300(x) x 400(y) x 100(z)
Dimensions
453(b) x 583(d) x 468(h)
Ambient Temperature
5 - 40 C (41 - 104F)
Humidity
35-80%
Positioning Speed
100 mm / sec
Mechanical Resolution
0.0075 mm 0.025 mm
Software Resolution
COLINBUS
CBR - 60 :
Surface (bxdxh) in mm
530(x) x 730(y) x 119(z)
Maximum Working area
400(x) x 600(y) x 100(z)
Dimensions
553(b) x 783(d) x 468(h)
Ambient Temperature
5 - 40 C (41 - 104F)
Humidity
35-80%
Positioning Speed
100 mm / sec
Mechanical Resolution
0.0075 mm 0.025 mm
Software Resolution
COLINBUS
CBR - 80 :
Surface (bxdxh) in mm
730(x) x 930(y) x 119(z)
Maximum Working area
600(x) x 800(y) x 100(z)
Dimensions
753(b) x 983(d) x 468(h)
Ambient Temperature
5 - 40 C (41 - 104F)
Humidity
35-80%
Positioning Speed
100 mm / sec
Mechanical Resolution
0.0075 mm 0.025 mm
Software Resolution
COLINBUS-LaboFlex SERIES :
PCB Milling and 3D modeling and Quick Prototyping Zero Baclash, Unique Z axis, High-Precision Depth Adjustment Perfect dust extraction through built-in cyclone-shaped head, Colinbus User Interface: unrivalled simplicity and power Jager High Performance Spindles, Perfect dust extraction through built-in cyclone-shaped head DeskProto, the state-of-the-art software for "Rapid Prototyping"
COLINBUS
LaboFlex 30 HF :
• Dimensions (w/d/h) • Surface • Working area (x/y/z) • Step resolution • Spindle motor • Tool exchange • X/Y linear system • X/Y/Z drivers • Tool clamp • Drilling speed (amount of drills / min) • Power supply • Minimum track • Minimum isolation distance • Minimum drill diameter • Weight
440 (x) x 585 (y) x 420 (z) mm 415 (x) x 530 (y) 280 (x) x 360 (y) x 70 (z) 1µm High-frequent – 60,000 rpm Manual / simple button handling Profile rail guidings Hybrid motors 1/8" 150 220 VAC ; 50-60 Hz 100 µm 100 µm 0.15 mm 35 Kgs.
COLINBUS
LaboFlex 60 HF :
• Dimensions (w/d/h) • Surface • Working area (x/y/z) • Step resolution • Spindle motor • Tool exchange • X/Y linear system • X/Y/Z drivers • Tool clamp • Drilling speed (amount of drills / min) • Power supply • Minimum track • Minimum isolation distance • Minimum drill diameter • Weight
(x) x (y) x (z) mm (x) x (y) (x) x (y) x (z) 1µm High-frequent - 60.000 rpm Manual / simple button handling Profile rail guidings Hybrid motors 1/8" 150 220 VAC ; 50-60 Hz 100 µm 100 µm 0.15 mm 40 Kgs
EDWIN XP ELECTRONICS DESIGN FOR WINDOWS A PRODUCT OF ALPHA IMAGER PVT.LTD., BANGALORE
What is EDWIN XP? System of seamlessly integrated, task oriented modules covering all stages of the design process-from capturing the idea of a circuit in the form of a schematic diagram to generate full set of documentation for manufacturing and assembling of PCB’s
System Requirements: Pentium or a Higher System with: 32 MB memory Minimum of 160 MB hard disk Space SVGA color Monitor Windows 9x, Windows NT/ME/XP, Windows 2000,Windows VISTA Two/Three button mouse
FEATURES Dynamic changing in 8 different languages. Simultaneous Schematic and Layout Generation Complete End-to-End CAE/CAD system Automatic Front and Back annotation Real time display of Ratnest, Active Nodes, Single Line to True Trace width On-line edition of objects using the property window On-line and context sensitive help
FEATURES Intuitive Hierarchical menu structure Automatic backup of the projects and files Three different type of grids Auto calibrating ruler Integrated print manager for printing from all modules under one roof Precision of 1-micron Maximum of 99 circuits (Hierarchies) DXF output
FEATURES Metric and Imperial Units Supports upto 99 pages of maximum size of 4 x 4 m2 in capture Maximum Size of 4 x 4 m2 for PCB ANSI/IEC libraries Object distance measurement in layout editor Edit and Set Default Design Rules Semi Automatic Bus connector Spice Import Netlist Definable Connection and Bus Width
FEATURES` Edit and Set default via Padstacks Shape and Sizes Supports JEDEC/EIA and IPC stand layouts. DRC and Electrical Connectivity Checks Model Generator VHDL to Spice Mode VHDL to Mixed Mode Two Board Simulation Thermal Analysis Electro-Magnetic Analysis
FEATURES SHARED NETLIST
SCHEMATIC VIEW COMPONENTS/WIRES
PCB LAYOUR VIEW COMPONENTS/TRACES
PARTS/SPECIAL PARTS OUTLINES/SIM MODELS
PARTS/ SPECIAL PARTS OUTLINES/PADSTACKS
SHARED PART DESCRIPTION PINOUT/PACKAGE INFORMATION
PROJECT PROPERTIES
Password protected of project Option to change Bus width, wire width, symbol outline by specified value and percentage
INTERFACES
Wirelist Import and Export with other package like EEDIII, Orcad PCBII, Scicard.
Third Party Autorouter / Autoplacer interface to SPECTRA and MA`XROUTE
TOTALLY INTEGRATED PACKAGE
Individual Project Modules Schematic Editor Mixed Mode Simulator EDSpice Simulator PCB Layout Editor Thermal Analyser
Individual Project Modules List of Materials Editor Conversion Manager Symbol Library Editor Model Parameter Library Editor
Individual Project Modules Electro Magnetic Analyzer Fabrication Manager Library Explorer Library Browser Part Editor
SCHEMATIC EDITOR Supports 99 hierarchies and each hierarchy supports 99 pages of circuit sheets of 4m X 4m Size Includes 38000 parts in the library Supports the creation of graphical and textual information in the form of design notes Supports 5 techniques to call the components to the work sheet
SCHEMATIC EDITOR Real-Time dragging of components and wires Automatic bus annotation. Merging and splitting of nets, auto routing of wires with users preference. Supports - True Type Font (TTF). Automatic Packing and Pin Assignment Orthogonal and Free Mode Manual Routing
Calling the components into the work sheet
SCHEMATIC EDITOR Elementary stage in circuit design.
Simulation EDWinXP Provides: ➘ Mixed Mode Simulation: Simulation for Analog and Digital Circuits.
➘ EDSpice Simulation: Provides the Spice netlist in the “cir” format.
MIXED MODE SIMULATION Features: ✷ Simulation for hierarchical circuit is supported ✷ Temperature can be set on individual circuits ✷ Provides graphical output through the waveform viewer. ✷ Provides the output in numerical values using the voltmeters and ammeters and also supports multimeters ✷ Waveform can be created as a symbol and can be placed wherever required in capture.
MIXED MODE SIMULATION EDWinXP Mixed Mode simulator
Waveform Viewer
MIXED MODE SIMULATION Mixed Mode Simulation Supports: Bias Point Calculation Transient Analysis Parameter Analysis DC Sweep Analysis AC Sweep Analysis Sensitivity Analysis Monte Carlo Analysis
MIXED MODE SIMULATION Bias Point Calculation Calculation of all node voltages and components pin currents, assuming a steady state of the circuit. All Capacitive and Inductive elements are inactive during the Bias Point Calculation Logical Simulation of digital part of the circuit is not performed
MIXED MODE SIMULATION Transient Analysis To study the performance of the circuit in a time frame.
AC Sweep Analysis
To calculate the Small-Signal Frequency response of the circuit assuming it’s current biasing
MIXED MODE SIMULATION Parameter Analysis Parameter Analysis allows to study the effect of variation of component parameters n the circuit. The analysis may be performed with the parameter value of a single component, Sweeped through a range of values. The parameter value may also be given in steps
MIXED MODE SIMULATION Monte Carlo Analysis It is a statistical type if analysis, used to calculate accurate component parameter values for a given output of a given instant of time. Sensitivity Analysis Used to calculate component that is most sensitive to an output reference point. Output is obtained in an ASCII file.
EDSpice - SIMULATION
Improved convergence algorithms (Gmin/Source steeping) Circuit size is only limited by memory Supports Code models and User-defined Nodes Offers SPICE2G.6 polynomial source compatibility. A supply ramping function is provided as an option transient analysis to simulate the turn-ON of power supplies to a board-level circuit.
EDSpice - SIMULATION Extract SPICE MODEL lines and subcircuits from existing netlist, to be saved in special libraries. EDSpice accepts Berkeley SPICE2, SPICE3 or XSPICE netlist formats Circuit size is only limited by memory Supports Code models and user defined nodes Temperature can be set in individual circuits. Additional matrix conditioning support is provided to aid convergence.
EDSpice - SIMULATION EDWinXP EDSpice simulator
Waveform Viewer
EDSpice - SIMULATION EDSpice Simulation Supports: Small Signal AC Analysis DC Transfer Analysis Distortion Analysis Transfer Function and Noise Analysis Operating Point Analysis Pole-Zero Analysis DC/AC Sensitivity Analysis and Fourier Analysis
Truth Table to Circuit Conversion
Click
HDL to Truth Table Conversion
Click
Active Filter Designing
Click
Once the output frequency is entered, all the required parameters for the design will be calculated automatically by the Simulator -EDWinXP.
Active Filter Designing
Click on Import Diagram
PCB LAYOUT EDITOR Supports 32-layers-28 route layers, 2 silk screen layers and 2 mask layers. Control over Trace Size and Pad Size 1 micron Grid Resolution-Fine Grid 10 micron SMT Fine line support Curved traces with user specified radius Autoplacement of component and 8 different Grid types of autoplacement
PCB LAYOUT EDITOR Pin to Pin, free or 45 degree Routing Change Segment Side and Width, Trace Side and Width Design Rule Check and net Connectivity Check Supports Single net Display Copper Planes and Copper Pour Areas may be created with user definable cross-hatch or solid fill. Semi Auto Routing Functions Automatic rerouting of Components wire Connections after relocating
PCB LAYOUT EDITOR
Ratnest
PCB LAYOUT EDITOR
PCB LAYOUT EDITOR Alternative starting point of PCB design process
Auto Routers Provides 3 types of Auto Routers Arizona Auto Router MaxRoute Auto Router Specctra Auto Router User definable Strategies Supports Grid-Less Routing Single-Double and Multi-Layer Routing Possible
MAX ROUTE AND SPECCTRA TRANSLATOR MAX Route Translator An application that allows to convert the layout project to a form that is acceptable to MAX Route Auto Router and MAX Route Auto Placer. Outputs all information necessary to reconstruct system layout project in MASSTECK. SPECCTRA Translator SPECCTRA supports different options like converting project to SPECCTRS compatible format, importing results from Specctra Auto Router and Spectra Auto Placer
3D Board Viewer
3D Trace Viewer
BOARD ANALYSER
THERMAL ANALYSIS Enables Comprehensive Thermal Analysis of PCB design. Supports placement of cooling parameters Highlights HOTSPOTS in the board Result of the analysis is displayed using Isothermal Lines and Color Mapping Scheme Parameters like Board Emissive Co-efficient, Board thickness, Insulator Thermal Conductivity, Total Copper Thickness, Isotherm Density and Surface Fraction of Copper can be controlled by the user.
THERMAL ANALYSIS ISOTHERMAL LINES
THERMAL ANALYS IS
PCB LAYOUT COLORED OUPUT
ELECTRO MAGNETIC ANALYSIS Predicts the intensity of Electromagnetic Field generated by the working circuit on the PCB Measures the distribution of Electric Field Intensity on a Finished PCB Displays the ISO-LINES showing the distribution of the Field Intensity on the board.
ELECTRO MAGNETIC ANALYSIS Predicts the intensity of Electromagnetic Field generated by the working circuit on the PCB Measures the distribution of Electric Field Intensity on a Finished PCB Displays the ISO-LINES showing the distribution of the Field Intensity on the board.
ELECTRO MAGNETIC ANALYSIS Signal Integrity Simulation :Examines the distortion of High-Speed signals as they pass through traces on the PCB. Predicts how a signal deviates from the ideal behavior in the real world setting Results can be displayed using the Waveform Viewer Field Analyzer :To Study the Electro-Magnetic Field that are created when Power or/and Signal traces on the board are energized. The result of the analysis may be view as a color graph, isolines, 3D-wire mesh graph…etc.,.
ELECTRO MAGNETIC ANALYSIS
ISO LINES
Electro-Magnetic Analysis
PCB LAYOUT COLORED OUPUT
FABRICATION MANAGER Supports the creation of copper planes and copper pour area Pick and Place output : ➘
Generic Format
➘
IPC-D355 format
Converts the design(layout) into manufacturing documentary output such as: ➘
Dimension drawing
➘
layer Artworks
➘
NC Drill Templates
➘
GBR for Printer/Plotter
➘
Generic Pick and Place
FABRICATION MANAGER Bare Board Test output: ➘
Generic Format
➘
IPC-D-356A Format
Supports Superimposing of artworks Supports Connectivity check for Artwork
Supports negative plot for artwork.
FABRICATION MANAGER
Artwork
Copper Pour Area
FABRICATION MANAGER NC Drill file containing tool selection command and hole co-ordinates drilling of component pins and via holes
NC-Drill Templates
Facilities linear and angular dimensioning of components , pads and board outlines.
Dimensional Drawing
FABRICATION MANAGER
ARTWORK in Gerber Format
Super Imposing of ARTWORKS
LIBRARY MODULES
Library Editor Field Editor Library Explorer Library Browser
LIBRARIES :
EDWinXP libraries system consists Part Libraries for Electronic components as well as Libraries supporting simulation of these components. EDWinXP offers comprehensive Libraries which are Precise, Study, and also more Versatile thus enhancing the speed which allows user to set new standards of excellence for his designs.
LIBRARY EXPLORER
Easy to use with standards windows editing features
LIBRARY BROWSER
Object Oriented user defined search for Library elements (Parts / symbols / packages / Padstacks) form the libraries, Browser appends to the search list according to user preferences.
FIELD EDITOR
Special module for Editing Parameter of selected Parts. Creates Fields for new Parts and maintains existing Libraries with all new Fields in EDWinXP
CONVERSION MANAGER
This feature provides user to work with 16-bit Database and Libraries
SUBCIRCUIT ADAPTOR
Converts the manufacturer given subcircuits t EDSpice format.
MODEL PARAMETER EDITOR
CREATES AND MANAGES THE MODEL LIBRARIES
LIBRARY EDITOR
Parts, Symbols, Packages and Padstacks can be created/edited with easy navigability between each module which are all arranged as different tabs.
LIST OF THE MATERIALS EDITOR
Creates the list of the materials (Bill Of Materials) containing all components in the current project.
PRINT MANAGER
An integrated module for printing various files generated from different modules in EDWinXP under one roof