Analytics

CE Analytics Your Surface Analysis and Materials Properties Resource

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In a shrinking universe of resources, we offer a world of analytical solutions.

CE Analytics

Qualified analytical resources are becoming harder to find. Yet your analytical requirements are no less complex. In-house services you used to turn to may no longer be available. And while merchant labs provide the data, they don't offer the expertise to analyze and solve your specific problems. In this environment, it's reassuring to know that there is one resource with the experience and capabilities to solve almost all of your application challenges. CE Analytics. While others are cutting corners, we offer you a resource at the cutting edge of technology, staffed by the most experienced engineers and analysts in their fields. More than data alone, they give you the insight you need to turn that data into a viable, cost-effective solution.

solutions, analytical services

Take a team of highly skilled scientists and application engineers. Give them the world’s most advanced analytical and diagnostic capabilities to perform expert interpretive analysis. Add high performance chemicals and materials specified and approved by the world’s leading OEMs. Then put these capabilities in one state-of-the-art-facility. This is CE Analytics. The industry’s most complete resource and knowledge base for test, analysis and technology development. At CE Analytics, you’ll team with the industry’s top specialists. They’re ready to work with you and your customers to develop the exact and logical solution to your specific challenge.

The resource for diagnostics

and application expertise

CE Analytics has the capabilities to analyze a wide range of devices, components and materials including: • • • • • • • • • •

Circuit Assemblies Connectors Decorative Accessories Functional Items Leadframes Memory Disk Surfaces Printed Wiring Boards Semiconductor Packages Wafers Wire

Our functional analysis includes: • • • • • • • • • • • • • •

Adhesion Failures Assembly & Solder Connection Contamination Corrosion Cosmetic Issues Failure Analysis Interfacial Reactions/Intermetalic Compound (IMC) Formation Morphology Porosity Solderability Failures Solder Connection Voiding Structural Integrity Surface Contaminants Thickness and Composition of Coatings

CE Analytics is part of Cookson Electronics. As a leading supplier of high performance assembly materials, semiconductor packaging, specialty

For surface sensitive analysis on conductive and non-conductive substrates, CE Analytics relies on two advanced Auger Spectrometers, covering both SIMS (Secondary Ion Mass Spectroscopy) and XPS (X-Ray Photoelectron Spectroscopy).

chemicals and coatings used in the electronics

and

surface

finishing

industries, we have a long history of achievement in electroplating, material reliability and diagnostics. Recognizing the critical need for highly specialized analytical services, Cookson Electronics now offers this resource to our global customers.

OUR COMPLETE SUPPORT Scientists at CE Analytics are committed to working with you on an extensive range of material applications to address the complex challenges posed by the electronics and surface finishing industries. To that end, we offer a unique combination of resources: • People with vast experience in electrochemistry, analytical chemistry, materials science, process and application engineering. The CE Analytics team is highly skilled in the specific disciplines of plating, reliability and failure-mode analysis. • Leading edge assembly and electroplating technologies that are both user friendly and customizable to your exact needs. All with the hands-on support of industry recognized, highly specialized technical personnel.

• Advanced diagnostic equipment, including: – Scanning Electron Microscopy with EDS – Optical Microscopy – Metallographic Sample Preparation – Auger Electron Spectroscopy SIMS XPS (ESCA) – X-ray Diffraction – X-ray Fluorescence – Mechanical Strength Testing Coating Adhesion Die Shear Force Tensile Stress/Strain – Wire Bonding Evaluations – Solderability Testing – FTIR Microscopy – Ion Chromatography – Gas Chromatography – AFM/STM – Acoustic Imaging – Corrosion Testing

All of this technology and expertise is contained in one state-of-the-art research center. CAPABILITIES BEYOND TESTING In-depth expertise in product development, process engineering, application engineering and technical service makes CE Analytics far more than just a testing facility. Our ability to interpret data, not merely provide it, enables you to quickly determine the direction of your product development, or a solution to a current problem. Our team of engineers and scientists uses an extensive arsenal of analytical instrumentation. Techniques include: • • • • • •

Elemental Analysis Metallography Microscopy Spectroscopy Surface Analysis Thermal Analysis

With the aid of this Fourier-Transform Infrared Microscope (FTIR), CE Analytics engineers can obtain an infrared spectrum on a substrate or plated article.

A FULL RANGE OF SERVICES Whether you require a simple elemental analysis or comprehensive engineering services, we put our full resources behind you. We can test to your specifications. Alternatively, we can evaluate your requirements and propose a testing program. Beyond conducting the analysis, we also provide comprehensive reports, including interpretation and a recommended course of action. CE Analytics stands ready to assist you in the following areas: Properties Characterization Analysis We have vast knowledge and experience in electronics, electroplating and reliability analysis of plated surfaces. This coupled with state-of-the-art instrumentation, provides a unique combination of skills, experience and capabilities for material as well as failure-mode analysis.

The scanning electron microscope is used for high magnification surface morphology examinations and Energy Dispersive Spectroscopy (EDS) identification of surface elements.

Surface Analysis We have expertise, resources and instrumentation to analyze surface films that may interfere with adhesion, solderability and wirebonding. In addition, we can determine composition versus depth of thin films such as oxides and vapor deposited coatings. Bulk Analysis Our capabilities include metallurgical analysis to examine the structure and failure of electrodeposited coatings and X-ray diffraction for stress and orientation measurements. Our expertise also extends to hardness, ductility, colorimetrics and gloss of finishes. Performance Measurements We have the systems and scientists to define performance characteristics for solderability, wire bonding, wire strength and corrosion/porosity. Our range of services also includes the analysis of tribological properties to determine the wear characteristics of functional and electronic coatings.

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Solder Analysis The movement to lead-free alloys world-wide will require more frequent sampling and better monitoring of solder pots to maintain process standards. CE Analytics offers expert solder analysis to help meet today’s needs. Process & Application Engineering Services Putting technology to work is the goal of our research and development effort. Through the integration of skilled scientists, state-of-the-art instrumentation, world-class scientific laboratories and information systems we can meet any technical challenge. At CE Analytics we understand how vital confidentiality is to your project. Our team will work together with you to evaluate and customize a plan to meet your objectives and proprietary needs.

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www.cooksonelectronics.com CE Analytics 600 Route 440 Jersey City, New Jersey 07304 Tel: 201-434-6778 ext: 2200 Toll Free: 800-367-5460

©2003 Cookson Electronics