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Inspiration to Innovation At Lawter, a Harima Chemicals Group Company, innovation is not only what we do, it is who we are. It is the essence of our company culture. And where there is innovation, there will be evolution. In no other market is evolution more influential than in the multi-billion dollar printed electronics industry. No other companies are more influential in the printed electronics industry than Lawter and Harima. We are proud that our nanoparticle ink technology is truly one of the most remarkable innovations the market has ever seen. We believe it will be one of the fundamental technology innovations that enables the rapid advancement of printed electronics and are thrilled to be leading the way with LH Nano47.

Learn more at Lawter.com

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table of contents

Fall 2016 • Vol. 4, No. 2 Cover: Tyler Natale Cover photos courtesy of CSEM SA, TactoTek, Jabil and PragmatIC

The Growth of the Flexible Hybrid Electronics Market • David Savastano

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Led by NextFlex, industry, researchers and universities are teaming up on projects with the potential to change the way we live.

Latest Developments in Flexible and Printed Electronics • David Savastano

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Connecting to the Internet of Things • David Savastano

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Research Institutions in Flexible and Printed Electronics • David Savastano

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features

Sensors, wearables and smart packaging are among the growth opportunities for the field.

Printed electronics and RFID are providing solutions for the IoT.

Researchers are developing new capabilities, which are leading to new applications.

Printed Electronics Now’s Suppliers’ Directory Printed Electronics Now’s Suppliers Directory provides comprehensive data on printed electronics systems, materials, equipment, services and more, as well as important information on suppliers, researchers, universities and organizations.

departments

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www.printedelectronicsnow .com

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Editor’s Page

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PE News

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Research

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Personnel

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New Products

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Meeting Calendar

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Advertisers’ Index

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editor’s desk

Changing Markets, Changing Expectations

EDITOR

David Savastano, [email protected]

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n talking with numerous leaders throughout the supply chain for articles for this issue, one of the interesting observations I heard frequently was how the flexible and printed electronics industry has evolved through the years. These changes were centered on two areas: changing markets and changing expectations. The potential markets have indeed changed in the decade that Printed Electronics Now has covered the industry. In our earliest days, we all heard how organic photovoltaics was going to be the breakthrough app, and lots of investors put significant sums of money into companies that no longer exist. Other markets would also come up, such as displays, but one idea remained a constant: the devices would be completely printed. The second observation was around changing expectations in terms of manufacturing. Many people believed that the product would indeed be entirely printed, eliminating silicon. There were predictions on market size that set the bar so unrealistically high that the industry was destined to underperform, setting in a cycle of disappointment. What we are seeing today is a new reality, and with it, new opportunities.To begin with, sensors, wearables and smart packaging have become realistic applications for commercialization, and are reaching the market. In-mold electronics, or structural electronics, are promising, as are curved displays.What is becoming even clearer is that hybrid electronics, combining traditional silicon with printed elements, is a more feasible way to go; it never was that realistic to think that silicon was going to go away. Further, expectations have finally been brought closer to reality. The hockey stick graph, where the stick’s shaft kept extending into the future, has been put aside. Instead, companies are finding their niches and going from there. The simple truth is that no one really knows what the market size will be. Estimating the market based on what could be if everything eventually is printed is just not a fair starting point.What is really needed is for brand owners, retailers and consumers to see successful products in the market that the customer will use, from glucose sensor strips and conductive inks to temperature loggers and NFC-enabled tags that allow consumers to communicate with the brands themselves, and so much more.That will be the true sign that the industry is hitting its stride, and with products now on the shelf, that day is here.

VP/EDITORIAL DIRECTOR

Tom Branna, [email protected] ASSOCIATE EDITOR

Catherine Diamond, [email protected] ART DEPARTMENT

Michael Del Purgatorio, [email protected] Tyler Natale, [email protected]

RODMAN MEDIA CORP PRESIDENT

­­Rodman J. Zilenziger Jr., [email protected] EXECUTIVE VICE  PRESIDENT

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PRINTED ELECTRONICS NOW

A Rodman Media Publication 70 Hilltop Road • Ramsey, NJ 07446 USA Tel: (201) 825-2552 • Fax: (201) 825-0553 www.inkworldmagazine.com

Printed Electronics Now (ISSN 1093-328X) is published bi-annually by Rodman Media, 70 Hilltop Road, Ramsey, NJ 07446-0555 USA. Phone (201) 825-2552. Fax (201) 825-0553.

Send address changes to: [email protected] Phone: 201 825 2552 x356 • ­Fax: 201 825 6582

David Savastano Printed Electronics Now Editor [email protected] 6

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Authorization to photocopy items in Printed Electronics Now for internal or personal use, or the internal or personal use of specific clients is granted by Rodman Media, provided base fee of US $1 per page is paid directly to: Copyright Clearance Center, 27 Congress St., Salem, MA 01970 USA.

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Emerson Expands Global Capabilities in Fresh Food Monitoring by Acquiring PakSense, Locus Traxx

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merson is extending its longtime presence in “cold chain” management with the acquisitions of Locus Traxx and PakSense. These investments in cargo solutions allow Emerson to provide consistent, safe control of food and other temperature-sensitive goods. Terms of the acquisitions were not disclosed. “The addition of Locus Traxx and PakSense to our portfolio strongly positions Emerson to address the high-stakes challenges faced by endusers in the agriculture, transport and retail industries to keep their products fresh, while helping them drive incremental growth,” said Bob Sharp, EVP and commercial and residential solutions business leader, Emerson. PakSense, headquartered in Boise, ID, offers a full complement of temperature monitoring solutions fitting a wide range of shipments and cost/benefit scenarios that monitor the condition of perishable goods through the supply chain, so that only the freshest and safest products reach consumers. Locus Traxx, based in Jupiter, FL, offers real-time temperature loggers, which can be monitored using cloudbased analytics.

CCL INDUSTRIES COMPLETES CHECKPOINT SYSTEMS ACQUISITION CCL Industries Inc. completed the acquisition of Checkpoint Systems, Inc., for an all-cash transaction valued at approximately $532.3 million, including estimated net cash of $43.4 million. The boards of directors of both companies unanimously recommended the transaction. On May 11, 2016 a significant majority of Checkpoint shareholders voted in favor of the acquisition. 8

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THINFILM BUILDS FACILITY TO HOUSE NEW HIGH-VOLUME, ROLL-TO-ROLL MANUFACTURING

SUN CHEMICAL, DIC CORPORATION ACQUIRE GWENT ELECTRONIC MATERIALS LTD.

Thin Film Electronics ASA (Thinfilm) has leased a former Qualcomm-owned manufacturing facility in Silicon Valley and will relocate its current US headquarters and NFC Innovation Center in the first quarter of 2017. The new location will house Thinfilm’s new high-volume roll-to-roll manufacturing line. Roll-based production will increase Thinfilm’s front-end production capacity to five billion NFC OpenSense and NFC SpeedTap tags per year – the equivalent of up to $680 million in annual revenue. Thinfilm intends to begin ordering line-related equipment immediately. In the near term, the facility upgrade enables Thinfilm to scale existing sheetbased manufacturing of its NFC (Near Field Communication), EAS (Electronic Article Surveillance), and Sensor Label products. Roll-to-roll production is expected to be operational for EAS by year-end 2017 and for transistor-based products in 2018. The building was formerly an operational display fab run by Qualcomm MEMS Technologies, Inc., and was in production until the spring 2016. More than $80 million has been invested previously in the 93,000 square-foot facility, which sits on 5.4 acres and features a 22,000 square foot, Class 10-10,000 cleanroom. “Given the growing market demand for NFC smart packaging, it was vital that we secure a facility that enables us to ramp capacity to ultra-high volumes through roll-to-roll production,” said Davor Sutija, Thinfilm’s CEO. “As the digital marketing arena becomes more fragmented, brands see NFC as a way to eliminate intermediaries and connect directly with their customers.”

Sun Chemical and its parent company, DIC, have acquired Gwent Electronic Materials Ltd., a leading manufacturer of conductive inks, pastes and powders for the printed electronic market. With the acquisition of the UK-based company, Sun Chemical will expand its leading global position in the printed electronics marketplace by combining Gwent’s complementary portfolio of products with Sun Chemical. Gwent’s European-based production sites will also enhance Sun Chemical’s global conductive ink, paste and powder manufacturing capabilities while allowing further penetration into developing markets. “The addition of Gwent’s diverse advanced electronic materials and tailormade technologies will further expand Sun Chemical and DIC’s solutions portfolio for printed electronics globally,” said Mehran Yazdani, president of Sun Chemical Advanced Materials. “Sun Chemical has experienced tremendous growth in the global printed electronics market and this acquisition will help us expand into this strategic market and enable us to better serve our customers.”

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HELIATEK RAISES €80 MILLION FOR MANUFACTURING CAPACITY EXPANSION Heliatek has put together an €80 million ($88 million) round to finance the expansion of its HeliaFilm manufacturing capacity by one million square meters per year. This round comprises €42 million in equity, €20 million in debt and about €18 million in subsidies. “We are very excited to have successfully completed this financing round,” said Thibaud Le Séguillon, Heliatek CEO. “We will follow our strategy by Fall 2016

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PE news

expanding the BIOPV – building integrated organic photovoltaic - market through supplying large quantities of our HeliaFilms to our customers in the building and construction material field.” Heliatek plans to install its new manufacturing roll-to-roll facility on its site in Dresden over the next 18 months. The company will continue in parallel its worldwide roll out of its HeliaFilm products to the building material and the automotive industry.

KATEEVA PICKS UP $88 MILLION IN SERIES E FINANCING FOR OLED PRODUCTION EQUIPMENT Kateeva announced that it has closed its Series E funding round with $88 million in new financing. Kateeva’s YIELDjet platform leverages inkjet printing with innovations to perform critical steps in the OLED manufacturing process. YIELDjet tools

are helping to accelerate the adoption of OLED technology. The company has raised $200 million since it was founded in 2008. The funds will accelerate new product development. The money will also help Kateeva expand manufacturing capacity at its Silicon Valley headquarters, where production systems are being built. Flexible OLED is the first major application for Kateeva’s YIELDjet platform, according to Conor Madigan, president and co-founder, Ph.D. “Next up is OLED TV,” he said. “Having mastered the technical challenges of massproducing thin film encapsulation (TFE) – the layer that gives thinness and flexibility to the OLED device – we’re now applying YIELDjet technology to help display manufacturers mass-produce the OLED RGB layer, which enables OLED TVs.”

PRAGMATIC ADDS INVESTMENT FROM AVERY DENNISON, OTHER PARTNERS PragmatIC has secured £18 million of funding, including a strategic investment from Avery Dennison, a Fortune 500 company with leading global positions in labeling and packaging materials as well as RFID. Avery Dennison joins existing shareholders Cambridge Innovation Capital (CIC) and ARM, who also participated in the round. This investment in PragmatIC is expected to accelerate the mass deployment of intelligent packaging, with Avery Dennison leveraging the potential of PragmatIC’s flexible integrated circuits (flexICs) in its inlays portfolio. The funding round also supports PragmatIC’s development and commercialization of its FlexLogIC “fab-in-a-box” equipment. “Avery Dennison works with more than 10,000 converters, brand owners

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XENON Corporation 37 Upton Drive Wilmington, MA 01887 U.S.A. www.xenoncorp.com 1-800-936-6695

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and retailers worldwide, making them an ideal supply chain partner to deliver solutions based on our unique technology,” said Scott White, CEO, PragmatIC.

MICROCHEM SUBSIDIARY ACQUIRES ASSETS OF CONDUCTIVE COMPOUNDS Argential, a wholly owned subsidiary of MicroChem Corp., has announced that it has purchased the assets of Conductive Compounds, Inc., Hudson, NH. The new company will operate under the name of Applied Ink Solutions and will relocate to MicroChem’s new 76,000 sq. ft. Westborough, MA facility later this year. Since 1994, Conductive Compounds has been a supplier of engineered materials for the global electronics assembly market. In addition to standard product lines of conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks, and potting compounds, Conductive Compounds specializes in custom formulations for new applications in the printed electronics industry. The Conductive Compounds asset purchase is part of a broad, ongoing search by MicroChem for opportunities to augment its existing materials technologies. Conductive Compounds functional inks, coatings and compounds provide a complementary enhancement to a number of MicroChem products, while MicroChem’s facility enables future expansion for manufacturing capacity of Conductive Compounds products.

AIR PRODUCTS COMPLETES SPIN-OFF OF VERSUM MATERIALS Air Products has completed the separation of its Electronics Materials Division through the spin-off of Versum Materials, Inc. Versum began “regular way” trading on the New York Stock Exchange (NYSE) under the symbol VSM. Guillermo Novo is president and CEO of Versum. 10

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UNIVERSAL DISPLAY ACQUIRES BASF’S OLED IP ASSETS Universal Display announced that through its wholly-owned subsidiary UDC Ireland Limited, it has acquired the OLED intellectual property (IP) assets of BASF SE. Representing 15 years of R&D, the assets include more than 500 issued and pending patents around the world, in 86 patent families. Largely consisting of phosphorescent materials and technologies, BASF’s OLED portfolio has an average lifetime of 10 years. The purchase price for the acquisition is approximately €87 million. “We are pleased to enhance our extensive key patents in phosphorescent materials with BASF’s complementary OLED IP portfolio,” said Steven V. Abramson, president and CEO of Universal Display. “One of our key objectives is to develop and deliver an all-phosphorescent emissive stack.We believe that this acquisition will help further these research efforts, principally in the development of commercial blue emissive systems.” BASF ceased its OLED research activities at the end of 2015 after a careful strategic examination. With the sale of the OLED IP assets, the withdrawal is finalized.

CHAMP GREAT RESTARTS CAMBRIOS ADVANCED MATERIALS’ BUSINESS Champ Great Int’l Corporation has purchased the assets of the former Cambrios Technologies Corporation, a Sunnyvale, CA-based specialist in silver nanowire technology. Champ Great has formed a new company, Cambrios Advanced Materials Corporation, that will continue research, development and sales of silver nanowire inks.

UNIVERSAL DISPLAY ACQUIRES ADESIS Universal Display has entered into an agreement to acquire Adesis, Inc., a privately held contract research organization (CRO) with 43 employees specializing in organic and organometallic www.printedelectronicsnow .com

synthetic research, development and commercialization. Adesis is a critical technology vendor to companies in the pharmaceutical, fine chemical, biomaterials and catalyst industries, and has worked with Universal Display over the last few years to help advance and accelerate a number of Universal Display’s product offerings. Under the terms of the agreement, Universal Display will acquire all outstanding shares of Adesis, Inc. in a merger for approximately $36 million in cash. The transaction is expected to close in the third quarter of 2016, subject to customary closing conditions. Following the closing, Adesis will operate as a wholly owned subsidiary of Universal Display Corporation.

NANOCO, MERCK SIGN AGREEMENT ON QUANTUM MATERIALS FOR DISPLAYS Nanoco Group plc and Merck announced the signing of a worldwide material supply and licensing agreement. The licence allows Merck to immediately start marketing Nanoco’s cadmiumfree quantum dots and to establish its own production facility to meet growing market demand. The financial details of the agreement are not being disclosed, but Nanoco will receive a licence fee and royalties on Merck’s sales of the Nanoco cadmiumfree quantum dots Merck manufactures.

ARMOR LAUNCHES PRODUCTION OF FLEXIBLE PV FILMS ARMOR is ready to launch industrial production of a new generation of photovoltaic material. Called ASCA, this “low-carbon” product is part of the Beautiful Light Project. It will be custom made by ARMOR’s teams in La Chevrolière, near Nantes. ARMOR has favored wet roll-toroll production processes. ARMOR’s production capacity for ASCA is one million square meters per year. The first ASCA films are ready to be released and their applications will be unveiled in 2017.n Fall 2016

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PE research

NextFlex Names First Four Recipients of Contract Awards

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extFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Innovation Institute, announced the first four recipients out of eight contracts awarded from the institute’s inaugural project call. Each project was selected for its potential to contribute to the goal of the industry-led, collaboration-based NextFlex: advancing the manufacturing ecosystem for FHE in the US. The value of all eight contracts is $14.8 million, with $8.6 million of that being cost-shared by the recipients. This is part of $75 million in funding over the next five years that was from the DoD’s initial award last fall. NextFlex officially opened its San Jose headquarters and manufacturing pilot line on Aug. 31. FHE gives everyday products the power of silicon ICs by combining them with new and unique printing processes and new materials. The result is lightweight, low-cost, flexible, comfortable, stretchable and highly efficient smart products. The first four contracts among this initial wave of eight PC 1.0 awards go to the following: • Purdue University with industrial partner Integra Life Sciences, along with Western Michigan University and Indiana University School of Medicine. • California Polytechnic State University (Cal Poly) together with its industry partners, Jabil Circuit, DuPont and NovaCentrix. • Palo Alto Research Center (PARC) and their partner University of California at San Diego. • Binghamton University (BU), who is partnering with GE Global Research, i3 Electronics, Infinite Corridor Technologies, Rochester Institute of Technology, Analog Devices and Corning Inc. The Purdue project’s goal is to create a printed FHE smart wound dressing that can sense oxygen levels in a wound bed and deliver topical oxygen to arrest further deterioration of the wound. The Cal Poly project proposes development of an assembly method for attaching ultra-thin chips onto printed flexible substrates that can provide better performance and comfort for wearable medical/human monitoring systems. Jointly submitted by PARC and the University of California at San Diego, the third project proposes to create a mouthguard biosensor label that will serve as a platform for chemical biosensing and wireless communications via the Bluetooth Low Energy (BLE) standard. For the fourth project selected, BU and GE will work to develop and mature the FHE manufacturing technologies needed to fabricate wireless pervasive/ubiquitous integrated sensor systems. 12

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VTT’S FUNCTIONAL INKS BRING ADDITIONAL INFORMATION, ENTERTAINMENT TO PRODUCTS Traceable consumer products and entertaining solutions are about to become part of everyday lives, particularly in food packaging, textiles and household appliances. Through the TagItSmart project, VTT Technical Research Centre of Finland is developing functional inks that can be used to add variable codes to products. For example, using such a code, a mug can notify a consumer of the temperature of a drink, or packaging can notify of the “best before” date and the product origin and country of production. Functional inks are used for the printing of 2D codes on various products. Practical IoT applications are being developed under the TagItSmart project over a period of three years.

NREL DISCOVERS HOW TO MAKE PEROVSKITE SOLAR CELLS OUT OF QUANTUM DOTS Scientists with the Energy Department’s National Renewable Energy Laboratory (NREL) for the first time discovered how to make perovskite solar cells out of quantum dots and used the new material to convert sunlight to electricity with 10.77% efficiency. The research, Quantum dot-induced phase stabilization of a-CsPbI3 perovskite for high-efficiency photovoltaics, appears in the journal Science.The authors are Abhishek Swarnkar, Ashley Marshall, Erin Sanehira, Boris Chernomordik, David Moore, Jeffrey Christians, and Joseph Luther from NREL. Tamoghna Chakrabarti from the Colorado School of Mines also is a co-author. In addition to developing quantum dot perovskite solar cells, the researchers discovered a method to stabilize a crystal structure in an all-inorganic perovskite material at room temperature that was previously only favorable at high temperatures. The crystal phase of the inorganic material is more stable in quantum dots. Most research into perovskites has centered on a hybrid organic-inorganic structure. Since research into perovskites for photovoltaics began in 2009, their efficiency of converting sunlight into electricity has climbed steadily and now shows greater than 22% power conversion efficiency. However, the organic component hasn’t been durable enough for the longterm use of perovskites as a solar cell. NREL scientists turned to quantum dots, which are essentially nanocrystals of cesium lead iodide (CsPbI3), to remove the unstable organic component and open the door to high-efficiency quantum dot optoelectronics that can be used in LED lights and photovoltaics. n

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Photo courtesy of Jabil.

The Growth of the Flexible Hybrid Electronics Market Led by NextFlex, industry, researchers and universities are teaming up on projects with the potential to change the way we live. BY DAVID SAVASTANO EDITOR [email protected]

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he field of flexible and printed electronics has been seen as having the potential to change the world we live in, but the challenge has been to actually print the product in its entirety. Industry and researchers realize that flexible hybrid electronics have the ability to be a game changer by using a combination of traditional silicon-based electronics and printed systems. This has opened a door to new processes and projects. The formation of NextFlex has been a benefit to the rapidly expanding field. Formed in 2015 through a cooperative agreement between the US Department of Defense (DoD) and FlexTech Alliance, NextFlex is a consortium of companies, academic institutions, nonprofits and governments with the goal of advancing US manufacturing of flexible hybrid electronics. NextFlex executive director Malcolm Thompson said that the mission of NextFlex is to develop and help make a robust manufacturing supply chain and ecosystem for flexible hybrid electronics (FHE). Since its beginnings last November, NextFlex is growing rapidly. “Our first member signed up in November, and our membership is now up to 58, with approximately 25 more organizations in the pipeline,”Thompson reported.“We have companies that are very interested in a narrow aspect of developing a

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particular material or piece of equipment, as well as manufacturing companies like Flex and Jabil. We have a whole range of different kinds of companies, from big companies from Boeing, Lockheed, GE and DuPont to very small companies and startups.” Dan Gamota,VP of the Hardware Innovation Group at Jabil Circuits, said that unlimited product form factor freedom and the ability to deform (bend, twist, and stretch) the product are key differentiators for flexible hybrid electronics. “Electronics had historically been rigid and put into a rigid housing, but many advanced FHE systems can take infinite shapes by being deformed (twisting and stretching) and ultimately taking the shape of the housing, “ Gamota said. “These FHE systems can conform to the human body or onto 3D structures while providing ancillary functionality, which is a major benefit.” Gamota said that the hybrid nature of FHE opens up many more product design and functionality opportunities. “In the early 1990s, printed electronics came on as a 5-cent solution for RFID, but it was never achieved,” Gamota recalled. “A few years later companies were going to print flexible displays, and it never happened. With FHE, we can take a product that already exists or one that is an idea and design a novel

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Flexible hybrid electronics

wearable product that provides unique functionality that previously was not realized.” Gamota discussed the example of feeding tubes that are on the market today that were improved through the use of flexible hybrid electronics. “Objects are being improved because of added functionality by adding FHE,” he said. “One product is a feeding tube, which has been around for 30 years. Its function is to help deliver nutrients into a person’s body more efficiently. It was improved using FHE by integrating a tiny camera at the end of the tube, plus two LEDs that can provide lighting so the healthcare provider can visually inspect the inside of their patient’s stomach.

Photo courtesy of PARC.

A flexible substrate is needed because it must pass through the patients nose during insertion. That is a product that is commercial today that was realized with the advancement in FHE.” Stan Farnsworth, VP of marketing for NovaCentrix, said that hybrid printing combines the positive attributes of each technology type. “For the flexible/printed technologies, which have been in development for decades and are now at a fairly advanced state, direct benefits often include simplified manufacturing methods, more efficient use of materials and allowance for novel form factors,” Farnsworth said. “Benefits achieved by utilizing elements of more traditional electronics technologies include higher electrical performance, reduced cost of components and ability to utilize existing industrial know-how and infrastructure. By combining the right attributes of each technology set, business value can be created through novel product concepts as well as through next-step product iterations.”

PROJECTS FOR NEXTFLEX Recently, NextFlex announced its first round of projects utilizing flexible hybrid electronics. “We put out project calls, which ask for people to address these issues, and the working groups use a selection process,” 14

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Thompson added. “Our first range of project calls was fairly broadly based, and we received 71 responses, which was pretty impressive. These projects are really good.” “Our second project call was narrowed to eight different disciplines and we got very good, specific responses,” Thompson noted. “We are in the process of signing development agreements with the organizations involved.” PARC, a Xerox Company, and University of California at San Diego have a project ongoing for NextFlex that is creating a mouth-guard biosensor label that can be worn by members of the military and others in high-stress positions. This project, which began under the NanoBio Manufacturing Consortium, monitors lactate concentration, a key indicator of fatigue. The sensors will be printed, and can be adapted to other biomarkers such as sweat. “We are developing electrochemical enzyme-based sensors using saliva to monitor glucose and lactate, and this is also relevant to other biomarkers like sweat,” Janos Veres, the leader of PARC’s Novel and Printed Electronics Program, said. “There are 180-plus biomarkers in sweat. UC-San Diego is very strong in this field, as they understand the physiology behind biomarkers, and we can make these sensors more amenable to production. We want to make it look like a plastic mouthguard.” Purdue University, Integra Life Sciences, Western Michigan University and Indiana University School of Medicine are collaborating on a project that can deliver topical oxygen to chronic/non-healing wounds such as diabetic foot and bed sores through a patch. It can be loosely described as a Band-Aid that would be able to convert hydrogen peroxide to oxygen and deliver it specifically to the wound. “Our project is designed for oxygen-deprived wounds,” said Babak Ziaie, professor of Electrical and Computer Engineering and Biomedical Engineering at Purdue University.“It is a smart wound dressing that delivers oxygen in situ. We are working with Integra to see if we can integrate this into their collagenbased system to improve the healing process. This would provide more functionality if these could be married together.” Ziaie noted that the project’s focus is on the delivery side. “We convert hydrogen peroxide to oxygen, which would be good for chronic wound care such as diabetes wounds,” he said. “It is low cost, very accurate and delivers to a very specific location. The challenges are manufacturing to scale and to integrate biomaterial with paper and other sensing materials, and how to go all the way to market with FDA approval.” Ziaie noted that Integra’s expertise in artificial skin is a key to this project. “Integra is prominent in the artificial skin market,” said Ziaie. “We have a lot of experience in sensors and delivery systems, and we are working on delivering oxygen for chronic wounds using paper and flexible platforms. We have done a lot of work on small scale. Western Michigan is helping us to develop the processes to scale this up, and Indiana University is working on the bio-compatibility of the materials and functionality.”

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Flexible hybrid electronics

“We have been working in the field of flexible hybrid electronics for the past three or four years,” Ali Shakouri, Mary Jo and Robert L. Kirk Director, professor of Electrical and Computer Engineering at Purdue University, noted. “The effort at Purdue is focused on applications related to healthcare, ag, food and pharmacy. With the advent of flexible and large area electronics and low cost sensors, it is possible to bring some of the functionality of electronics for applications in food sensors, precision agriculture and smart pharmaceuticals.” California Polytechnic State University (Cal Poly), together with Jabil Circuit, DuPont and NovaCentrix, are developing digital tattoos. Dr. Jianbiao John Pan, professor and graduate coordinator in the Department of Industrial and Manufacturing Engineering at Cal Poly, noted that the university has worked extensively on printed electronics. “We are leading a project about developing assembly process and reliability evaluation for attaching ultra-thin silicon ICs onto printed flexible substrates for human monitoring systems,” said Dr. Pan. “One objective is to develop and quantify assembly processes for integrating flexible ICs and sensors onto textiles.We are developing processes that can be transitioned to volume manufacturing quickly. “We hope to complete our project by the third quarter of 2017, and we believe our assembly process could make many more application-oriented flexible hybrid electronics projects feasible,” Dr. Pan concluded. “These products could change people’s lives, and make human life much better from infants to elderly people.” “I’m enjoying working with the team at Cal Poly for their creativity and their ability to just get things done, plus I really think the students play a crucial role in the near-term and long-term success of these efforts in a big-picture kind of way,” said Farnsworth. “Jabil brings an incredibly deep history of electronics innovation and manufacturing, and certainly provides an essential voice of reason and pragmatism to the project. DuPont is well-known for materials innovation. At NovaCentrix, we have been focused on developing enabling manufacturing tooling, especially around our PulseForge photonic curing tools, as well as with innovative materials. We’ve also worked hard to develop an integration competency, for how the involved technologies can come together and be made to form a product solution.” “Our NextFlex project will lead to the design and assembly of FHE-based digital tattoos,” Gamota said. “These tattoos could monitor a variety of biophysical markers, each tattoo having a different sensor for a specific physiological marker. Our partners have come together to establish processes, designs and equipment platforms to develop novel digital tattoos. DuPont is providing the substrate and NovaCentrix the conductive materials, equipment and processing equipment. Cal Poly is conducting the theoretical work and characterization studies, and Jabil is providing the design for manufacturing discipline necessary for industrialization of the product.” Fall 2016

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OPPORTUNITIES FOR FLEXIBLE HYBRID ELECTRONICS The hybrid flexible and printed electronics field has evolved through the years as markets have emerged. “For a while, the industry was very excited about making flexible displays, but it is not happening as there is an established infrastructure is in place,” said Veres. “A bunch of companies were excited about printable RFID, but it was against an incumbent technology and people realized the limitations of organic semiconductor materials. It didn’t make sense to compete with silicon to make microchips. “This led to initiatives in simpler areas like touch displays and smart labels, and with the rise or wearables, we are realizing that you can bring silicon into the infrastructure,” Veres added. “We are very interested in the smart label space due to its simplicity. Printing gives the ability to configure different variations. These smart labels can be simple, with one communication chip, one sensor and an antenna.Wearables are coming, and we will grow our understanding and develop more and more dedicated chips and high quality inks and material sets and choose the form factor of the wearables. “The future deployment of IoT will be very much changing, with intelligence built all around you, from surfaces of cars to the coffee mug in your kitchen,”Veres concluded. “We will need lots of different deployments, some short-lived like smart labels, which may only be needed for a couple of hours.” Dr. Pan of Cal Poly noted that the flexible electronics industry is still at an early stage. “We have a lot of knowledge and skills from microelectronics packaging to learn from,” Dr. Pan added. “There are a lot of promising markets, such as human performance monitoring systems, in which we can monitor a patient’s health from a young baby to a patient who has suffered a heart attack. We can eliminate many wires with traces printed on fabric, which allows the patient to be more comfortable. Another big market is athletics, as the coach can monitor athletes for dehydration or exhaustion.” “Materials science is now spurring growth into brand new categories of products,” said Gamota. “These might be digital tattoos, where we can make a product that is intimately in contact with your skin using truly stretchable materials.This material allows you to have electronic sensors that maintain contact with your body during deformation and motion to measure physiological conditions. “I’m most excited about the stretchable part,” Gamota added. “Our imagination can go wild. Sensors on your body could monitor electrolytes, and you can have a specially formulated drink to replenish your electrolytes. Individuals requiring medical oversight can receive point of care service continually with a FHE-based product that provides real-time monitoring.” For more information on flexible hybrid, see the online version at www. printedelectronicsnow.com. n

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Latest developments

LATEST DEVELOPMENTS IN Flexible and Printed Electronics Sensors, wearables and smart packaging are among the growth opportunities for the field. BY DAVID SAVASTANO EDITOR [email protected]

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he flexible and printed electronics field is grow- flexible electronics is no longer seen as a completely disruptive ing up. Products are moving into commercialization, technology that will replace traditional electronics, but instead with more items in the pipeline. Leading companies as a disruptive technology within the electronics space which throughout the supply chain are reporting they are seeing gains complements existing tools and materials to offer a better solubeing made in many markets. tion. Printed temperature sensors are a good example of this.” Roy Bjorlin, commercial and strategic initiatives director, PragmatIC CEO Scott White said that one of PragmatIC’s printed electronics at Sun Chemical, reports that Sun Chemical major target application areas is smart packaging, in which the is seeing many opportunities for packaging incorporates electronic flexible and printed electronics in intelligence to communicate with the marketplace. the supply chain or the end con“The interest is increasingly high sumer, either directly via on-pack in adding electronics to everyday displays or indirectly via wireless items including the wearables space, protocols (e.g. RFID and NFC). smart packaging and smart labels,” “Even in its simplest form, this said Bjorlin. “This is creating deprovides significant added value,” mand to develop materials that can White added. “The addition of senrequire flexibility and can also be sors into the packaging allows a processed in high speed using more much wider range of useful funcnon-traditional printing methods tionality. This allows supply chain such as flexographic printing.” controls to be extended to moniBill Cummings, SVP, corpotor temperature, moisture or other rate communications, Thin Film variables that might affect product Electronics, said that Thinfilm has quality. And it allows rich interacbeen successful in using its technolPhoto courtesy of PST Sensors. tion with the consumer at both the ogy to help make products smart – point of purchase and point of use.” from medical devices to luxury handbags to craft beer. Thomas Kolbusch, VP for Coatema Coating Machinery “We are particularly excited about conversations we’re hav- GmbH, said he is seeing new companies entering the market. ing with leaders in the pharmaceuticals space,” Cummings “The players change, so we see not only start-ups asking added. “The potential for smart packaging on prescription and for equipment, but also bigger players out of the packaging/ OTC products is tremendous, particularly as it relates to im- converting business are much more interested,” said Kolbusch. proving patient adherence and related outcomes.” “We are also seeing a bigger pull from user exhibitions like The initial forecasts for flexible and printed electronics did sportswear for wearables and medical applications. The increasthe industry no favors, as overhyped expectations set goals that ing impact of the IoT and Industry 4.0 also has an impact. One were not attained, diminishing the field in the eyes of many. breakthrough has be the integration of hybrids.” “There is a lot less hype than when we started the com“Initially, there was a belief printed electronics would pany in 2010,” said David Britton of PST Sensors. “Printed and move quickly to offer better, cheaper solutions to the more

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Latest developments

traditional means of manufacturing in many markets,” XENON Corporation CEO Lou Panico said. “At this time, we have a better understanding the path for successful commercialization will extend longer.” TactoTek specializes in the field of 3D injection molded structural electronics, integrating printed electronics and discrete electronic components such as LEDs and ICs into a 3D injection molded structure while adding functionalities like lighting, printed sensors and antennas. “Brands and OEMs are constantly seeking differentiation,” said Dave Rice, SVP marketing for TactoTek. “3D smart surfaces enable form factor and functional innovation.”

PROMISING MARKETS FOR FLEXIBLE AND PRINTED ELECTRONICS New applications are being developed daily for flexible and printed electronics. Panico pointed to sensors in automotive and aerospace industries as growing markets, while Kolbusch noted that sensors, energy harvesting, flexible display electrochromic films and wearables are promising markets. “At Sun Chemical, we believe the drive towards the consumer at the item level, particularly when it comes to smart packaging and smart labels, will become increasingly evident over the next few years,” said Bjorlin. “Much of our focus in R&D is geared towards the development of advanced materials able to be processed in high speed and that can be processed equally in the non-traditional convertor space that supports the consumer brands.” Britton said that unique form factors are helping to drive new business. “Long term, those markets where the new form factor enables a product which can’t be met by traditional electronics or non-electronics solutions are growing,” Britton said. “Obvious examples are IoE logistics (supply chain monitoring and management from producer to end consumer) and wearable technology, mainly health and fitness. “Short term, the growth markets are where the new form factor offers a significant advantage in terms of performance over traditional technologies,” Britton added. “Most examples for us at the moment are for advanced temperature sensing in the traditional IoT – manufacturing, process and instrument monitoring, but we are getting some traction in healthcare, logistics, and environmental monitoring.” “TactoTek’s strongest market pull is from automotive, home appliances and wearable technology,” Rice said. “We also have strong interest for home automation, industrial controls, medical devices and other markets.”

INTERESTING APPLICATIONS There are numerous products being developed, although many are covered by non-disclosure agreements (NDAs).Throughout the supply chain, manufacturers are seeing interesting projects. Panico said that XENON is developing low cost, benchtop R&D photonic sintering equipment. “Driving this work is the Fall 2016

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Photo courtesy of Sun Chemical

requirement for improved tools to assist researchers, scientists and engineers in determining the precise parameters to control sintering of new copper nano inks,” Panico said. Bjorlin said that Sun Chemical is working on several strategic projects, including in mold electronics, 3D antennas and sensors. “Our focus is in supporting a range of materials and process technologies that are driven towards enabling next generation applications,” said Bjorlin. “For example, we believe a robust nano materials portfolio will be an enabling materials technology and open pathways to producing material alternatives to a range of applications including display, switch technology, EMI/RFI shielding and lighting.” Britton said that almost all of PST Sensors’ work these days is under NDA, but the most interesting projects are those that use temperature sensing to do something else. “One project is with a consumer goods company to develop a high frequency temperature logger to monitor and control the manufacturing process in one of their major products produced internationally,” Britton added. “The demands for this tag are very unusual, but it is based around a credit card format generic passive UHF tag, which we now call the Kushushu Card. It has no battery, a large area temperature sensor for sensitivity, and early versions have a read range of 3m, which compares favorably with an NFC tag. It is also the base of a system we are developing with a Scandinavian partner for fish and other fresh produce monitoring.” n For more information, see the online version of this story at www. printedelectronicsnow.com.

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SMARTRAC’s Accessory and Bling UHF tags.

CONNECTING to the INTERNET of THINGS Printed electronics, RFID are providing solutions for the IoT. BY DAVID SAVASTANO EDITOR [email protected]

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here is tremendous interest in the Internet of Things (IoT). The potential to connect to literally trillions of items could provide consumers, retailers and brand owners alike with vast amounts of information. The ability to connect to the item level is one of the challenges that manufacturers are facing, and printed electronics, RFID and near field communication (NFC) enabled devices provide a solution that is already being implemented in the marketplace. Bill Cummings, SVP, corporate communications for Thin Film Electronics (Thinfilm), said that the IoT market really has unlimited potential. “Certainly it’s a matter of execution, but it’s also about making people’s lives easier … as opposed to implementing technology for technology’s sake,” Cummings added. “We see Thinfilm’s role as being a key IoT enabler by bringing intelligence to everyday items, extending the traditional machine-to-machine boundaries, to include those traditionally unconnected items like wine, spirits, food, medicine, cosmetics, apparel, packaged goods, etc. The smartphone serves as the intermediary or ‘smart agent.’ It turns the Internet of Things into the Internet of Everything.”

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RFID is a key enabler of the IoT. Craig Cotton, Impinj’s VP of marketing and product management, said that according to IDTechEx, RAIN tag IC volumes reached 5.3 billion in 2015 and are expected to grow to over 20 billion in 2020. “If you’ve purchased apparel from a major retailer like Macy’s or Zara, run a race like the New York City Marathon, enjoyed a drink from a Coca-Cola Freestyle soda fountain, hit a ball at Topgolf or checked bags at airports worldwide like Las Vegas McCarran, then you’ve probably interacted with the Impinj platform,” said Cotton. “We’ve seen several exciting developments this year driving growth across verticals. One great example of the technology’s impact was seen in Delta’s announced use of RAIN RFID for baggage tagging resulting in improved service, substantial cost reductions or savings, and increased customer satisfaction.” Michael Fein, senior product manager, RFID at Zebra Technologies, said that Zebra has seen great growth in passive RFID during the past year, particularly in the retail space. “There is further penetration in retail applications,” Fein said. “We are seeing major retailers like Macy’s, Decathlon, Target and Kohl’s developing new ways to implement RFID technology.”

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Connecting to the Internet of Things

Carl Rysdon, VP of inventory control solutions for Checkpoint Systems, reported that RFID adoption is gaining significant momentum, particularly in retail and apparel. “At the June GS1Connect conference in Washington DC, GS1 US CEO Bob Carpenter mentioned that over 40% of US apparel brands are now source tagging with RFID,” Rysdon noted. “As retailers adopt RFID, they are asking their brands to do the same, to provide greater inventory visibility in store and in fulfillment nodes in the supply chain.” Rysdon said that RFID is the cost effective means with which to place a sensor at item level that provides meaningful, actionable data to enhance the retail experience and drive sales. “We’re seeing more and more retailers leverage RFID and other IoT sensors to connect multiple touch points in the shopping journey, from providing real-time inventory status in mobile apps, streamlining omnichannel fulfillment and personalizing promotions in loyalty apps and for digital signage,” Rysdon added. “Today, RFID sensors provide the majority of inventory management and logistics data in the IoT ecosystem, which is essential for omnichannel retailing.” “The RFID market has continued to grow to our satisfaction,” said Ted Danhauser, VP of sales, head of pharma and healthcare, SMARTRAC Technology Group. “Though we do not disclose detailed business figures, we can say that 2015 exceeded our outlook and was one of the strongest years in our history. That trend has fortunately continued in 2016 to date.” “It is obvious that the IoT market offers vast potential for great opportunities, value creation and virtually unlimited use cases for companies, governments and consumers,” Danhauser added. “Market experts predict that the economic impact created by the Industrial Internet alone (aka “Industry 4.0”) will increase to between US$1 trillion to US$4 trillion per year by 2025.That is only one example, and other vertical markets such as healthcare, pharma, retail and fashion are equally promising. RFID technology is a key to tapping into these markets due to its pivotal role as the most functional and economical solution to connect simple objects to the digital world.”

OPPORTUNITIES FOR THE IOT The ability to connect the consumer to the items they buy and use is one of the major advantages of the IoT. “We believe using NFC to help connect everyday items via a smartphone or device is an ideal scenario,” Cummings noted. “We’re manufacturing NFC chips using a non-conventional form of silicon, and we’re able to produce the chips in high volumes and at relatively low cost points. This scale enables us to diffuse this intelligence at the disposables level. As a communications protocol, we also feel NFC will continue to rise in popularity. It’s fast and seamless. It’s much less invasive than Bluetooth or beacons, and requires that the end-user or consumer opt in and make a conscious decision to engage with a particular product.” “Today, the IoT comprises billions of connected machines Fall 2016

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and devices. However, there are still trillions of simple, everyday things, which are not yet connected.There’s significant value in providing these things with a digital identity by using RFID,” said Danhauser. “Once these things have a digital identity, they can provide brand owners and retailers with information regarding post-sales use, opening up totally new perspectives in terms of customer loyalty. If you think that marketing expenditures reach US$500 billion annually, that alone is a huge market.This also holds true in regard to product authentication and counterfeit protection.” “The IoT will impact almost all industries, as the need to track items and monitor things like temperature remotely continue to grow,” Cotton said.“The Impinj platform and products are deployed across many industries, including retail, healthcare, logistics/supply chain, food service, and hospitality.” Rysdon said that the low cost and small form factor of passive RFID labels makes them ideal for high-volume, high velocity applications, such as shipping, receiving, inventory management and order fulfillment. RFID as EAS hardware and Dual RF-RFID EAS tags are also well-suited for loss prevention in retail stores “Retailers already use EAS tags in store to protect highrisk and high-value items; dual RFID-EAS tags enable them to leverage existing processes and budgets to improve inventory management for these items as well,” Rysdon said. While RFID is ideally suited for inventory, it is also gaining traction in manufacturing. “RFID allows retailers to gain tremendous insights into their inventory levels,” Fein noted. “There is a lot more appreciation among manufacturers about how RFID can create productivity gains as well. “Passive RFID tags have the ability to be the last node of visibility into everyday items, whether it is in a retail store or a critical component of your car, or for food safety or a skier at Vail,” Fein added. “In healthcare, we are seeing lots of inventory challenges, such as high-value items like medicines, patient ID and asset ID.” Adebayo Onigbanjo, director of marketing for Zebra Technologies, cited healthcare as an area where RFID is making a difference. “In the IoT space, one use case uses RFID to enable asset tracking,” said Onigbanjo. “RFID provides visibility. It helps the hospital to understand how its assets move through the hospital, where they are and how they are being used. It tracks the time in use, idle time and transition times. IoT allows them to analyze the data and find the bottlenecks. “Hospitals are a chaotic environment,” Onigbanjo added. “IoT and RFID give the healthcare provider an accurate system and accurate timing. Without RFID, the hospital would never be able to track that data manually.” For more information on PE, RFID and the IoT, see the online version at www.printedelectronicsnow.com. n

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Photo courtesy of PragmatIC Printing.

Research Institutions in Flexible and Printed Electronics Researchers are developing new capabilities, which are leading to new applications. BY DAVID SAVASTANO EDITOR [email protected]

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n emerging high-technology industries, research institutions often play an important role in coming up new developments. Researchers worldwide are coming up with new approaches for flexible and printed electronics. Dr. Giovanni Nisato, senior manager, business and technology development for CSEM, noted that printing has been a part of the electronics industry for a long time, but fully printed electronics have not become mainstream yet. “In the past five years, a number of different things happened in printed electronics and organic electronics,” Dr. Nisato said. “People came to terms with a lot of reality checks. Very high expectations were raised and not always met, but there has been a tremendous amount of work and a maturing of the industry. “There are now several companies that learned from those experiences, and we are now at the point where a lot of devices are now technologically possible,” Dr. Nisato added. “OLED became very clearly a mainstream technology. We see movement toward flexible OLEDs, which are not printed in the beginning, and devices for human machine interfaces in general. Touch screens and wearables are human-centric and are important areas for printed electronics.” “If we look to the field of flexible and printed electronics, a lot of start-ups vanished from the market, but there are also other companies that really established themselves in this market,” said Dr. Andreas Willert of the Fraunhofer Institute for Electronic Nano Systems ENAS.“There has been some interest 20

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from printing shops, but most of them, especially settled in the graphics arts industry, are not aware that besides new inks, a new workflow is also needed. I think it’s easy to add conductive traces to a printing product, but that isn’t the whole story. This gap some start-ups and other companies are filling in, bringing a whole set of competencies like electronics, circuit design and device design. It seems to be easier for them to add the printing competence than the other way round. Additionally we see new material being developed to enable OLED or other functionalities. Looking at printed electronics, the lack of materials that is the real barrier for further adoption.” Paul Heremans, director of imec’s large area electronics department, said that flexible electronics products have already made considerable headway in the market, thanks to mobile phones. “The Galaxy Smartphone series displays are the first products where we see electronics made on plastic that have come out,” said Heremans. “We realize that this is really manufacturable. The display is not printed nor is it flexible, but it is fabricated on a plastic substrate. It announces the field, if you wish, and it is a high end product. This shows that low cost and low margins should not be emphasized.” Dr. Stephan Kirchmeyer, COPT Center, University of Koln, noted that the field has become more mature. “‘Flexible’ displays have appeared on the market. Unfortunately the term ‘flexible’ at present is used in a

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Research institutions

misleading way,” Dr. Kirchmeyer obComputer Engineering, who serves as served. “First it has been used for the director of the Printed Electronics curved TV and smart phones. Curved Research Collaborative (PERC). TV are now more or less standard “The feature sizes of such printed dedevices. All Samsung Edge models vices are large enough that traditional require a flexible OLED display inscreen- or gravure printing can be cluding a flexible backplane. Other used. During the last five years, there companies in Taiwan are working on has been interest in more demanding flexible OLED. One of the next mileapplications, many involving wireless stones is believed to be foldable smart technologies requiring higher frephones with a display which will be quency operation as well as the intebent during use. It is the overall opingration of active electronics. As a result ion that such devices will take some of these increasing demands, there is a more time to appear on the market. Photo courtesy of UMass Lowell. need for finer printed features and the Apparently existing barrier layers/ integration of RF/microwave elecfilms seem not to be not sufficiently robust at present. I have tronic integrated circuits (ICs).” heard voices saying this might need additional two to three PARC sees flexible and printed electronics as an important years to become mature. The trend from smart phones via ac- opportunity. “At the highest level, our goal is to figure out the tivity trackers to textiles with integrated biosensor is ongoing.” future of R&D,” Janos Veres, the leader of PARC’s Novel and “Printed, flexible electronics have historically been used in Printed Electronics Program, said. “Our goal is to figure out applications with modest performance requirements involv- the future of electronics.” ing passive assemblies (e.g., wiring harnesses),” said Prof. Craig Dr. Ye Tao, team leader, Organic Materials and Devices, Armiento of UMass Lowell’s Department of Electrical and Information and Communications Technologies for the

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Research institutions

CSEM printed sensor system for salivary diagnostics. (Photo courtesy of CSEM SA)

National Research Council of Canada (NRC), observed that printed electronics area a good supplement but not an alternative to traditional electronics devices. “In the past few years, the field is becoming much more realistic,” said Dr.Tao.“We went through the hype a few years ago where everyone thought PE could do everything, and now we realize the limitations and advantages and have become more realistic. Now there is more emphasis on hybrid electronics, combining printed and silicon electronics.” “Printable electronics is, of course, not an end in itself, but an enabling technology that compliments traditional siliconbased electronics,” said Steven Bagshaw, business development manager, CPI. “Over the last five years the printed electronics landscape has changed significantly in terms of where demand for the application of the technology is coming from. Whereas previously the emphasis was very much on flexible displays, at CPI we have noticed that market traction is now geared toward the Internet of Things (IoT) and the development of the printed sensors and antennas, which are required to realize this.”

PROMISING MARKETS FOR FLEXIBLE AND PRINTED ELECTRONICS Interestingly, these institutions are finding opportunities in many different fields. “The IoT promises to be one of the most revolutionary technological transformations since the beginning of the Internet, with predictions indicating that more than 50 billion objects will be connected by 2020. This opens up an almost endless list of potential markets,” said Bagshaw. “Printable electronics will help make the IoT a reality and facilitate the 22

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addition of electronics to everyday items such as packaging, wall paper, flooring and buildings, to name just a few examples. “Here at CPI we are also receiving a lot of enquiries from end users to develop printed electronics applications in the healthcare and pharmaceutical sector by embedding low cost printed sensors, or NFC antennas into the box or packet,” Bagshaw added. “Smart packaging can provide important information about and monitor the conditions a product has been exposed to during its journey through the supply chain. It is also possible to use smart packaging to identify and guard against counterfeiting and third party interference. CPI is working in a project alongside GSK, AstraZeneca and the University of Cambridge to bring smart packaging technologies to market that have the potential to improve medicine manufacturing and supply, offer more personalized, faster and cheaper drug delivery, and drive advances in product quality, affordability and volume flexibility.” “Our research at the Raytheon-UMass Lowell Research Institute (RURI) and PERC is directed at embedding RF/microwave electronics into 3-D objects or on flexible, nonplanar substrates,” Prof. Armiento said. “We integrate printed, wireless components such as antennas with active ICs.” Dr. Willert noted that advertising is a promising market, as are the commodity chains in general. “Having some further functionalities in counterfeiting, detecting products and aspects of the IoT are very promising,” Dr. Willert added, “We think good markets are large area devices like printed solar cells or photodetector arrays for sensors,” Dr. Tao said. “The energy you can harvest is proportional to the surface area. Sensor arrays can help avoid false alarms, as sensitivity is proportional to the surface area.” Dr. Nisato added that there are unique opportunities in organic and printed photovoltaics that are device-based. “At CSEM, we have a varied pipeline of projects,” said Dr. Nisato. “We are working on hybrid electronics, and were recently recognized by ESA for technical work. We are developing printed sensors for consumer health applications, such as monitoring sweat and pH. We have been working on printed PV with the Sunflower EU project.” Researchers believe that the best is yet to come for flexible and printed electronics. “The future of flexible and printed electronics is the multimillion (or billion) dollar question,” Dr. Nisato concluded. “One of the things that I am seeing is that there is an increasing number of industries outside of printed electronics that are waiting to see what products will be available, such as in automotive or consumer electronics, and then they begin to integrate printed electronics into their products. What we can do today is more that what we could do in the past, but we also have to manage expectations to succeed.” n For more information on research institutions, see the online version at www.printedelectronicsnow.com.

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The INTERNATIONAL Suppliers’ Directory

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SUPPLIERS’ DIRECTORY – Cross Reference Index

PRINTED ELECTRONICS SYSTEMS Batteries..........................................................25 Displays, EL.....................................................25 Displays, Flexible..............................................25 Displays, Glass..................................................25 Displays, LCD..................................................25 Displays, LED..................................................25 Displays, OLED...............................................25 Drug Delivery Systems....................................25 Electro-Conductive Textiles.............................25 Electronic Paper..............................................25 Electronics.......................................................25 EPassports........................................................25 EReaders.........................................................25 High-Security ID............................................25 Keypads, EL.....................................................25 Labels..............................................................25 Labels, Food.....................................................25 Lighting, Electroluminescent (EL)....................25 Lighting, LED..................................................25 Lighting, OLED..............................................25 Membrane Switches........................................26 Organic Transistors..........................................26 Packaging........................................................26 Paper Electronics.............................................26 Paper, Electronic..............................................26 Photoresists......................................................26 Photovoltaics...................................................26 Photovoltaics, CdTe (Cadmium Telluride)........26 Photovoltaics, CIGS/CIS.................................26 Photovoltaics, Dye/Pigment.............................26 Photovoltaics, Flexible......................................26 Photovoltaics, Organic.....................................26 Photovoltaics, Silicon.......................................26 Photovoltaics, Thin Film..................................26 Printed Circuit Boards.....................................26 Printed Electronics..........................................26 Printed Memory..............................................27 Printing...........................................................27 Printing, Displays.............................................27 Printing, Flexo.................................................27 Printing, Gravure.............................................27 Printing, Inkjet And Aerosol Jet........................27 Printing, Lithography.......................................27 Printing, Offset................................................27 Printing, Screen ..............................................27 RFID, Antennas...............................................27 RFID, Chips And Inlays...................................27 RFID, Food.....................................................27 RFID, Livestock...............................................27 RFID, Readers................................................27 RFID, Skin Patches..........................................27 RFID, Systems.................................................27 RFID, Tags And Labels.....................................27 RFID, Tolls......................................................27 RFID, Tracking Systems...................................27 RFID, Wristbands............................................27 Sensor Networks.............................................27 Sensors............................................................28 Sensors, Bio.....................................................28 Sensors, Energy Harvesting..............................28 Sensors, Food...................................................28 Smart Cards.....................................................28 Systems, Brand Security...................................28 Thin Film Batteries..........................................28 Wearable Electronics........................................28

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MATERIALS Adhesives And Tapes........................................28 Adhesives, Conductive.....................................28 Anti-Static Compounds...................................28 Barrier Materials..............................................28 Carbon Nanotubes..........................................28 Chemicals........................................................28 Chemicals, OLED............................................28 Chemicals, Printing.........................................28 Coatings..........................................................28 Coatings, Conductive.......................................28 Conductive Film..............................................29 Dielectrics.......................................................29 Dyes................................................................29 Electronic Materials.........................................29 EMI/RFI Shielding.........................................29 Encapsulants....................................................29 Energy Curable Materials................................29 Fibers..............................................................29 Films...............................................................29 Foils................................................................29 Gases...............................................................29 Glass................................................................29 Graphene.........................................................29 Ink Systems.....................................................29 Inks.................................................................29 Inks, Carbon Nanotube...................................29 Inks, Conductive..............................................29 Inks, Flexo.......................................................30 Inks, Graphene................................................30 Inks, Inkjet And Aerosol Jet..............................30 Inks, LED-Curable .........................................30 Inks, Nanoparticles..........................................30 Inks, Photocured..............................................30 Inks, Screen.....................................................30 Inks, UV Inkjet................................................30 Insulation........................................................30 Label Stocks.....................................................30 Materials, Electrochromic.................................30 Materials, LCD................................................30 Materials, LED.................................................30 Materials, OLED.............................................30 Materials, OPV................................................30 Materials, P-OLED..........................................30 Materials, Radiation Curable............................30 Materials, Semiconductors...............................30 Materials, Solar Cells........................................30 MEMS............................................................30 Metal Powders.................................................31 Metals..............................................................31 Nanoparticle Dispersions.................................31 Nanoparticles..................................................31 Nanopowders, Silver........................................31 Nanotechnology..............................................31 Organic Metals................................................31 Papers..............................................................31 Papers, Flexible Packaging................................31 Pastes, Conductive...........................................31 Pigments..........................................................31 Polymers..........................................................31 Polymers, Microelectronic................................31 Powders, Ceramic............................................31 Resins.............................................................31 Screen Printing Materials.................................31 Semiconductors...............................................31 Semiconductors, Carbon Nanotube.................31 Semiconductors, Organic.................................31

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Semiconductors, Printed.................................. 32 Semiconductors, Quantum Dot.......................32 Semiconductors, Silicon...................................32 Static Control..................................................32 Substrates, Flexible...........................................32 Transfer Ribbons.............................................32 Wire................................................................32 EQUIPMENT 3D Printers......................................................32 Equipment, Coatings.......................................32 Equipment, Compounders...............................32 Equipment, Converting...................................32 Equipment, Extrusion......................................32 Equipment, Material Handling.........................32 Equipment, Radiation Curable........................32 Equipment, RFID...........................................32 Equipment, Semiconductor..............................32 Equipment, Solar Cells.....................................32 Equipment, Thin Film PV................................32 Filters..............................................................33 Getters.............................................................33 Gloveboxes......................................................33 Gravure Cylinders...........................................33 Identification Systems, RFID And Barcode......33 Inkjet And Aerosol Jet Printers, Functional Materials..........................................................33 Inkjet Printers..................................................33 Inspection Systems...........................................33 Lab Equipment................................................33 Laminating Equipment....................................33 Laser Systems...................................................33 Lasers..............................................................33 Measurement Systems......................................33 Nonwovens.....................................................33 Printers, Inkjet And Toner................................33 Printheads.......................................................33 Printing Equipment, Flexo...............................33 Printing Equipment, Offset..............................33 Printing Equipment, Screen.............................33 Printing Presses................................................33 Printing, Equipment........................................33 QC Equipment...............................................34 Roll/Web Management Systems......................34 Rollers, Printing..............................................34 Software..........................................................34 Software, Simulation........................................34 Sputtering Equipment.....................................34 Surface Treatment Systems...............................34 Testing Equipment...........................................34 Vacuum Equipment.........................................34 Welding Equipment.........................................34 Winders/Unwinders/Rewinders.....................34 RESEARCH AND SERVICES Analysts...........................................................34 Associations.....................................................34 Conferences.....................................................34 Consultants......................................................34 Contract Manufacturing Services.....................34 Design, Printed Electronics..............................34 Product Design................................................34 Product Development......................................34 Research..........................................................35 Research, Nanotechnology..............................35 Research, Polymers..........................................35 Research, Solar................................................35 Testing.............................................................35 Universities......................................................35

Fall 2016

11/2/16 10:33 AM

SUPPLIERS’ DIRECTORY

PRINTED ELECTRONICS BATTERIES Babcock & Wilcox MEGTEC Blue Spark Technologies Brightvolt Buhler Inc. Enfucell Oy Epec Engineered Technologies FlexEl, LLC Imprint Energy Paper Battery Company VARTA Microbattery Inc.

DISPLAYS, EL Printed Electronics Ltd. Schreiner Group GmbH & Co.KG

DISPLAYS, FLEXIBLE Acreo Swedish ICT AB E Ink Corporation Elcoflex Ltd. FlexEnable Ltd Genes’ Ink Holst Centre Kateeva, Inc. Kent Displays, Inc. LunaLEC Merck KGaA, PM-AE Electronic Materials Plastic Logic Germany Polyera Corporation Si-Cal Technologies Inc. Sumitomo Chemical Co., Ltd. Synaptics Team NEO Visualplanet

DISPLAYS, GLASS Toddco 3 Visualplanet

DISPLAYS, LCD FlexEnable Ltd Kent Displays, Inc. Samsung Cheil Industries Toddco 3

Fall 2016

25-35BG Categories 1016.indd 25

DISPLAYS, LED MSWtech OSRAM PrintoCent Toddco 3 Wilson-Hurd Manufacturing Co., Inc.

DISPLAYS, OLED Cambridge Display Technology Ltd CYNORA GmbH eMagin Corporation FlexEnable Ltd Kateeva, Inc. OSRAM Samsung Cheil Industries Si-Cal Technologies Inc. Sumitomo Chemical Co., Ltd. TSE Troller Universal Display Corp.

DRUG DELIVERY SYSTEMS Feeligreen

ELECTRO-CONDUCTIVE TEXTILES CETEMMSA Technological Centre NIKKOIA

ELECTRONIC PAPER E Ink Corporation Kent Displays, Inc. MpicoSys Embedded Pico Systems Sp. z o. o. Plastic Logic Germany T+Ink, Inc.

ELECTRONICS Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com

Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com

XENON Corporation 978-661-9033 [email protected] www.xenoncorp.com See ad on page 9 Advantech U.S., Inc. Bosch Rexroth AG Cal Poly ~ Printed Electronics & Functional Imaging Canadian Printable Electronics Industry Association (CPEIA) Changzhou Institute of Printed Electronics Industry Coruna Printed Electronics GmbH Georgia Tech - Center for Organic Photonics and Electronics MC10, Inc. Methode Electronics, Inc. MpicoSys Embedded Pico Systems Sp. z o. o. OE-A (Organic and Printed Electronics Association) OrelTech Organic Electronics PolyIC GmbH & Co. KG Printed Electronics Consulting Printed Electronics Ltd. Renesas Electronics Corporation STMicroelectronics Suzhou Institute of Nanotech, Printable Electronics Research Center Tangio Printed Electronics Thin Film Electronics ASA

EPASSPORTS SMARTRAC Technology Group Toppan Printing (UK) Ltd.

EREADERS Accel Graphic System Sdn Bhd

HIGH-SECURITY ID Evolution Design Systems, Inc. Zebra Technologies

KEYPADS, EL Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com

www.printedelectronicsnow .com

Epec Engineered Technologies GGI International Wilson-Hurd Manufacturing Co., Inc.

LABELS CymMetrik Enterprise Co., Ltd. General Label GM Nameplate Schreiner Group GmbH & Co.KG

LABELS, FOOD PakSense

LIGHTING, ELECTROLUMINESCENT (EL) Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com CETEMMSA Technological Centre EURECAT Technology Centre of Catalonia Light Tape Schreiner Group GmbH & Co.KG

LIGHTING, LED Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com AIXTRON SE Flexbright OY Flextronics Hamamatsu Corporation Molex OSRAM

LIGHTING, OLED Cambrios Technologies Corp. CPI MSWtech Nth Degree Technologies Worldwide Inc. PolyPhotonix Ltd. SAM North America, LLC Universal Display Corp.

25

11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

MEMBRANE SWITCHES Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com DuraTech Industries, Inc. Elcoflex Ltd. Engineered Materials Systems, Inc. Epec Engineered Technologies General Label GM Nameplate Molex Tangio Printed Electronics Techprint Inc. THIEME GmbH & Co. KG Wilson-Hurd Manufacturing Co., Inc. Xymox Technologies

ORGANIC TRANSISTORS JAPERA Polyera Corporation

PACKAGING Access Creative Group Canadian Printable Electronics Industry Association (CPEIA) Graphic Packaging

PAPER ELECTRONICS Cal Poly ~ Printed Electronics & Functional Imaging Holst Centre Tangio Printed Electronics Ynvisible

PAPER, ELECTRONIC Arjowiggins Creative Papers E Ink Corporation Kent Displays, Inc. Nth Degree Technologies Worldwide Inc. Plastic Logic GermanyPHY

PHOTORESISTS Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

Alta Devices Armor Group Babcock & Wilcox MEGTEC Coveme Crystalsol GmbH Eight19 First Solar, Inc. G24i Power Ltd. Heliatek GmbH Oxford PV SEMI SolarWindow SunaTech Inc.

PHOTOVOLTAICS, CDTE (CADMIUM TELLURIDE) Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 26

25-35BG Categories 1016.indd 26

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

PHOTOVOLTAICS, THIN FILM Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 Babcock & Wilcox MEGTEC CSEM SA Nth Degree Technologies Worldwide Inc. Oxford PV

PRINTED CIRCUIT BOARDS

First Solar, Inc.

PHOTOVOLTAICS, CIGS/CIS Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

PHOTOVOLTAICS, DYE/ PIGMENT

Epec Engineered Technologies Flexible Circuit Technologies, Inc. GGI International GM Nameplate GSI Technologies, LLC Insulectro Molex Murakami Screen USA, Inc. PolyIC GmbH & Co. KG

PRINTED ELECTRONICS Adphos North America, Inc.

G24i Power Ltd.

PHOTOVOLTAICS, FLEXIBLE

513-277-0464 [email protected] www.adphos.com

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

Eastprint Incorporated Babcock & Wilcox MEGTEC Crystalsol GmbH Eight19 EURECAT Technology Centre of Catalonia Heliatek GmbH

PHOTOVOLTAICS, ORGANIC

MicroChem Corp.

PHOTOVOLTAICS

PHOTOVOLTAICS, SILICON

Armor Group CETEMMSA Technological Centre Crystalsol GmbH CSEM SA Eight19 Genes’ Ink Heliatek GmbH Mekoprint A/S TSE Troller

978-975-5255 [email protected] www.eastprint.com

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

www.printedelectronicsnow .com

XENON Corporation 978-661-9033 [email protected] www.xenoncorp.com See ad on page 9 Accel Graphic System Sdn Bhd Acreo Swedish ICT AB Adhesives Research, Inc. Advantech U.S., Inc. AFELIM American Semiconductor, Inc. ARDEJE Babcock & Wilcox MEGTEC Blue Spark Technologies Brewer Science, Inc. Cal Poly ~ Printed Electronics & Functional Imaging Changzhou Institute of Printed Electronics Industry Coruna Printed Electronics GmbH CPI CSEM SA CymMetrik Enterprise Co., Ltd. Digimarc DuPont Teijin Films DuraTech Industries, Inc. Eastman Kodak Industrial Materials Epec Engineered Technologies Evonik Resource Efficiency GmbH FlexEnable Ltd Flexible Circuit Technologies, Inc. Flextronics Fraunhofer ENAS Fraunhofer IAP Genes’ Ink GGI International GM Nameplate GSI Technologies, LLC IIMAK In-Core Systemes InkTec Co., Ltd. Insulectro JAPERA Mekoprint A/S Molex MSWtech Murakami Screen USA, Inc. Nano Dimension NIKKOIA Nissha USA, Inc. Novalia OE-A (Organic and Printed Electronics Association) Optomec Peratech Holdco Ltd Plastic Logic Germany PolyIC GmbH & Co. KG PragmatIC Printed Electronics Consulting Printed Electronics Ltd. PST Sensors PV Nano Cell Ltd. Schreiner Group GmbH & Co.KG SEMI Si-Cal Technologies Inc.

Fall 2016

11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

Sonoplot, Inc. T+Ink, Inc. Tangio Printed Electronics Team NEO Techprint Inc. Thin Film Electronics ASA Topflight Corporation Trelleborg Applied Technologies VTT Technical Research Centre of Finland Xymox Technologies

PRINTED MEMORY PragmatIC Thin Film Electronics ASA Xerox

PRINTING Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com

Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com Access Creative Group Graphic Packaging ID Labels Pte Ltd Sonoplot, Inc. Wilson-Hurd Manufacturing Co., Inc.

PRINTING, DISPLAYS Trelleborg Applied Technologies

PRINTING, FLEXO Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Access Creative Group Clemson University Graphic Packaging GT+W GmbH Mark Andy, Inc. Printed Electronics Consulting Topflight Corporation

Fall 2016

25-35BG Categories 1016.indd 27

PRINTING, GRAVURE Clemson University Coatema Coating Machinery GmbH Graphic Packaging GT+W GmbH Paru Co., Ltd. Printed Electronics Consulting

PRINTING, INKJET AND AEROSOL JET Ceradrop

Techprint Inc. Topflight Corporation Trelleborg Applied Technologies

RFID, ANTENNAS

NovaCentrix

Sun Chemical Corporation

512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

Accel Graphic System Sdn Bhd Access Creative Group Graphic Packaging

PRINTING, SCREEN Eastprint Incorporated

Avery Dennison Elcoflex Ltd. Fraunhofer ENAS Genes’ Ink Impinj MSWtech Schreiner Group GmbH & Co.KG Si-Cal Technologies Inc. SMARTRAC Technology Group Topflight Corporation

RFID, CHIPS AND INLAYS Alien Technology ASSA ABLOY AB Avery Dennison Confidex Ltd. Gentag Impinj PragmatIC SMARTRAC Technology Group Zebra Technologies

978-975-5255 [email protected] www.eastprint.com

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Clemson University Conductive Technologies Inc. DuraTech Industries, Inc. ESMA General Label Haiku Tech, Inc. Murakami Screen USA, Inc. Nissha USA, Inc. Si-Cal Technologies Inc. T+Ink, Inc.

Feeligreen Gentag

RFID, SYSTEMS

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

PRINTING, OFFSET

Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com

Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com

+33 55538 2696 [email protected] www.ceradrop.fr

CPI ESMA Fraunhofer ENAS FUJIFILM Dimatix , Inc. Georg Simon Ohm University of Applied Sciences ImTech Technologies Neotech AMT GmbH Optomec Prototype & Production Systems, Inc. Sonoplot, Inc. Trelleborg Applied Technologies

RFID, SKIN PATCHES

RFID, FOOD Confidex Ltd. PakSense

RFID, LIVESTOCK PDC Corp.

RFID, READERS

Alien Technology ASSA ABLOY AB Checkpoint Systems, Inc. Confidex Ltd. Gentag Impinj MpicoSys Embedded Pico Systems Sp. z o. o. PDC Corp. Schreiner Group GmbH & Co.KG

RFID, TAGS AND LABELS Alien Technology Altierre American Semiconductor, Inc. ASSA ABLOY AB Avery Dennison Checkpoint Systems, Inc. Conductive Technologies Inc. Confidex Ltd. DuraTech Industries, Inc. ID Labels Pte Ltd Impinj PakSense RR Donnelley Schreiner Group GmbH & Co.KG Secure RF SMARTRAC Technology Group Thin Film Electronics ASA Zebra Technologies

RFID, TOLLS Confidex Ltd.

RFID, TRACKING SYSTEMS Alien Technology ASSA ABLOY AB Beigel Technology Corporation Gentag

RFID, WRISTBANDS PDC Corp.

Alien Technology ASSA ABLOY AB Gentag Impinj

www.printedelectronicsnow .com

SENSOR NETWORKS Altierre Sensiron

27

11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

SENSORS Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com Altierre BeBop Sensors Brewer Science, Inc. CETEMMSA Technological Centre CPI Eastman Kodak Industrial Materials Ercon Inc. EURECAT Technology Centre of Catalonia FlexEnable Ltd General Atomics Aeronautical Systems, Inc. Gentag GGI International GM Nameplate Hamamatsu Corporation isorg Magneto Innovations Molex NIKKOIA Nissha USA, Inc. Ohmatex ApS PakSense Peratech Holdco Ltd PolyIC GmbH & Co. KG PragmatIC PrintoCent PST Sensors Schreiner Group GmbH & Co.KG STMicroelectronics Synaptics Tactonic Technologies Tangio Printed Electronics Thin Film Electronics ASA Topflight Corporation Visualplanet

SENSORS, BIO Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com Acreo Swedish ICT AB Conductive Technologies Inc. Ercon Inc. Feeligreen Gentag GSI Technologies, LLC NIKKOIA North Carolina State University - ASSIST Center OMsignal Schreiner Group GmbH & Co.KG Techprint Inc.

28

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SENSORS ENERGY HARVESTING Beigel Technology Corporation MpicoSys Embedded Pico Systems Sp. z o. o.

SENSORS, FOOD Feeligreen PakSense

SMART CARDS Evolution Design Systems, Inc. SMARTRAC Technology Group Toppan Printing (UK) Ltd.

SYSTEMS, BRAND SECURITY Schreiner Group GmbH & Co.KG

THIN FILM BATTERIES Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com Blue Spark Technologies Brightvolt Conductive Technologies Inc. Enfucell Oy Fraunhofer ENAS GGI International Imprint Energy STMicroelectronics Xymox Technologies

WEARABLE ELECTRONICS Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com American Semiconductor, Inc. Architects of Intelligent Applications (A.I.A.) Argil BeBop Sensors Blue Spark Technologies Canadian Printable Electronics Industry Association (CPEIA) CETEMMSA Technological Centre eMagin Corporation Enfucell Oy Engineered Materials Systems, Inc. EURECAT Technology Centre of Catalonia Firstbeat Technologies Ltd Flextronics GSI Technologies, LLC Holst Centre HZO Inc. NIKKOIA Nissha USA, Inc.

Ohmatex ApS OMsignal Printed Electronics Ltd. Sensoria Team NEO Techprint Inc. Toyobo Co., Ltd. Xymox Technologies

MATERIALS ADHESIVES AND TAPES ACTEGA GmbH Adhesives Research, Inc. Conductive Technologies Inc. Dow Corning Corporation General Label Henkel Electronic Materials ID Labels Pte Ltd Lamart Corporation Protavic America, Inc. Saati Americas SAES Getters S.p.A. Tekra, A Division of EIS, Inc. Toyobo Co., Ltd.

ADHESIVES, CONDUCTIVE Adhesives Research, Inc. Creative Materials, Inc. Dow Corning Corporation Engineered Materials Systems, Inc. Henkel Electronic Materials Johnson Matthey Kane International Corporation Lamart Corporation Protavic America, Inc. Tactile Components, Inc. Toddco 3 Toyo Ink SC Holdings Co., Ltd.

ANTI-STATIC COMPOUNDS NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com DKSH North America Inc. Polyonics Inc. Shepherd Technologies

BARRIER MATERIALS ENrG Inc. SAES Getters S.p.A. Toppan Printing (UK) Ltd. Vinci Technologies

CARBON NANOTUBES Nantero, Inc. Orbital Composites Perpetuus Carbon Technologies Limited

www.printedelectronicsnow .com

Raymor Industries Inc. Thomas Swan & Co. Ltd. Wisepower Co., Ltd.

CHEMICALS Ames Goldsmith Brewer Science, Inc. Clariant Colloidal Ink Co., Ltd. DKSH North America Inc. Dymax Oligomers & Coatings Kane International Corporation PCAS RAHN AG Rieke Metals, LLC Samsung Cheil Industries Sartomer Americas Shamrock Technologies Solvay Specialty Polymers Thomas Swan & Co. Ltd.

CHEMICALS, OLED Merck Group, OLED Business Unit Samsung Cheil Industries Sartomer Americas SunaTech Inc.

CHEMICALS, PRINTING Colloidal Ink Co., Ltd. Dymax Oligomers & Coatings Merck KGaA, PM-AE Electronic Materials RAHN AG RheoSense, Inc. Sartomer Americas

COATINGS Ercon Inc. Polyonics Inc. Schoeller Technocell GmbH & Co. KG

COATINGS, CONDUCTIVE NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com Agfa-Gevaert Babcock & Wilcox MEGTEC Caledon Controls Ltd. Carestream Tollcoating Colloidal Ink Co., Ltd. Eastman Kodak Industrial Materials ESL ElectroScience Group NanoXplore Inc. Henkel Electronic Materials Heraeus Precious Metals GmbH & Co KG Liquid X Printed Metals, Inc. Metamaterial Technologies Inc. (MTI) Polyonics Inc. Sensor Films Inc.

Fall 2016

11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

Shepherd Technologies Smartkem Ltd. T+Ink, Inc.

CONDUCTIVE FILM

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Adhesives Research, Inc. Caledon Controls Ltd. Cima NanoTech Creative Materials, Inc. Eastman Kodak Industrial Materials Heraeus Precious Metals GmbH & Co KG Metamaterial Technologies Inc. (MTI) Paru Co., Ltd. PolyIC GmbH & Co. KG Polyonics Inc. Sensor Films Inc. Toddco 3 Wisepower Co., Ltd.

DIELECTRICS Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 Caledon Controls Ltd. ELANTAS Europe GmbH ENrG Inc. ESL ElectroScience Inkron Merck KGaA, PM-AE Electronic Materials MicroChem Corp. Nano Dimension Piezotech, an Arkema Group Company Tactile Components, Inc. Taiyo Ink Mfg. Co. Ltd.

DYES SunaTech Inc.

ELECTRONIC MATERIALS

Advantech U.S., Inc. BASF Buhler Inc. Clariant DuPont Microcircuit Materials ELANTAS Europe GmbH Ercon Inc. Evonik Resource Efficiency GmbH Henkel Electronic Materials Intrinsiq Materials Ltd Johnson Matthey Merck KGaA, PM-AE Electronic Materials MicroChem Corp. Paru Co., Ltd. Tactile Components, Inc. Taiyo Ink Mfg. Co. Ltd.

EMI/RFI SHIELDING

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Fall 2016

25-35BG Categories 1016.indd 29

FOILS Babcock & Wilcox MEGTEC Coveme ENrG Inc. Lamart Corporation Visualplanet

415-519-8166 [email protected] www.nanogap-usa.com Lamart Corporation

ENCAPSULANTS Babcock & Wilcox MEGTEC Creative Materials, Inc. Inkron Protavic America, Inc. SAES Getters S.p.A. Toppan Printing (UK) Ltd.

ENERGY CURABLE MATERIALS DKSH North America Inc. Miwon North America Inc.

FIBERS NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com Orbital Composites Sefar AG Shamrock Technologies

FILMS Babcock & Wilcox MEGTEC Caledon Controls Ltd. Cima NanoTech Coveme DuPont Teijin Films

INKS, CARBON NANOTUBE Brewer Science, Inc. Toyo Ink SC Holdings Co., Ltd.

INKS, CONDUCTIVE Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com

GASES

NovaCentrix

GLASS

512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Praxair, Inc.

Eastprint Incorporated

Sun Chemical Corporation

978-975-5255 [email protected] www.eastprint.com

973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

NANOGAP, Inc.

Lawter Inc. 312-662-5700 [email protected] www.lawter.com See ad on page 3

General Label HiFi Industrial Film Lamart Corporation PPG Industries Pruftechnik Machinery Service Sensor Films Inc. Tekra, A Division of EIS, Inc. Toyobo Co., Ltd.

SCHOTT North America, Inc.

GRAPHENE Bluestone Global Tech Graphenea Group NanoXplore Inc. Perpetuus Carbon Technologies Limited Thomas Swan & Co. Ltd.

INK SYSTEMS NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 ECKART GmbH Evonik Resource Efficiency GmbH Imprint Energy LunaLEC Prototype & Production Systems, Inc.

INKS Encres Dubuit Piezotech, an Arkema Group Company

www.printedelectronicsnow .com

Agfa-Gevaert Cambrios Technologies Corp. Colloidal Ink Co., Ltd. Creative Materials, Inc. DuPont Microcircuit Materials ECKART GmbH ELANTAS Europe GmbH Engineered Materials Systems, Inc. Ercon Inc. Group NanoXplore Inc. Henkel Electronic Materials Heraeus Precious Metals GmbH & Co KG Hewlett-Packard IIMAK Inkron InkTec Co., Ltd. Intrinsiq Materials Ltd Johnson Matthey Liquid X Printed Metals, Inc. Methode Electronics, Inc. Nano Dimension Novalia OrelTech Organic Electronics Paru Co., Ltd. Poly-Ink PPG Industries Printed Electronics Ltd. Promethean Particles Ltd. PV Nano Cell Ltd. Sensor Films Inc. Smartkem Ltd. T+Ink, Inc. Tactile Components, Inc. Vorbeck Materials Corp. Xerox Research Centre of Canada Xymox Technologies

29

11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

INKS, FLEXO

INKS, LED-CURABLE

NANOGAP, Inc.

Sun Chemical Corporation

415-519-8166 [email protected] www.nanogap-usa.com

973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 Colloidal Ink Co., Ltd. Creative Materials, Inc. IIMAK Liquid X Printed Metals, Inc.

INKS, GRAPHENE Graphenea Perpetuus Carbon Technologies Limited Vorbeck Materials Corp.

INKS, INKJET AND AEROSOL JET Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 ARDEJE Chromaline Screen Print Products Colloidal Ink Co., Ltd. ImTech Technologies Liquid X Printed Metals, Inc. Methode Electronics, Inc. MicroChem Corp. Poly-Ink Promethean Particles Ltd. PV Nano Cell Ltd. Shepherd Technologies Taiyo Ink Mfg. Co. Ltd. Universal Display Corp.

30

25-35BG Categories 1016.indd 30

ECKART GmbH Encres Dubuit Toyo Ink SC Holdings Co., Ltd.

INKS, NANOPARTICLES Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Colloidal Ink Co., Ltd. Genes’ Ink Intrinsiq Materials Ltd Methode Electronics, Inc. Paru Co., Ltd. Poly-Ink Promethean Particles Ltd. PV Nano Cell Ltd.

INKS, PHOTOCURED NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 Intrinsiq Materials Ltd Taiyo Ink Mfg. Co. Ltd.

INKS, SCREEN NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 Chromaline Screen Print Products DuPont Microcircuit Materials Encres Dubuit ESL ElectroScience IIMAK Johnson Matthey Methode Electronics, Inc.

1-Material BASF Cambrios Technologies Corp. CYNORA GmbH EMD Performance Materials Holst Centre Merck Group, OLED Business Unit Merck KGaA, PM-AE Electronic Materials Novaled AG PCAS SunaTech Inc.

MATERIALS, OPV NANOGAP, Inc.

INKS, UV INKJET

415-519-8166 [email protected] www.nanogap-usa.com

Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 Encres Dubuit IIMAK RAHN AG

INSULATION DuPont Teijin Films ELANTAS Europe GmbH

LABEL STOCKS Avery Dennison Green Bay Packaging

MATERIALS, ELECTROCHROMIC Acreo Swedish ICT AB Ynvisible

MATERIALS, LCD EMD Performance Materials

MATERIALS, LED EMD Performance Materials Nanosys, Inc. OSRAM

MATERIALS, OLED NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com

www.printedelectronicsnow .com

1-Material Cambrios Technologies Corp. EMD Performance Materials InkTec Co., Ltd. PCAS Polyera Corporation Rieke Metals, LLC SAM North America, LLC

MATERIALS, P-OLED 1-Material LunaLEC SunaTech Inc.

MATERIALS, RADIATION CURABLE LTI Coating Technologies, LLC Sartomer Americas

MATERIALS, SEMICONDUCTORS Applied Materials, Inc. BASF Dow Corning Corporation Evonik Resource Efficiency GmbH Merck KGaA, PM-AE Electronic Materials Rieke Metals, LLC Solvay Specialty Polymers

MATERIALS, SOLAR CELLS Applied Materials, Inc. BASF Cambrios Technologies Corp. Chromaline Screen Print Products EMD Performance Materials SunaTech Inc.

MEMS CSEM SA Piezotech, an Arkema Group Company Sensiron

Fall 2016

11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

METAL POWDERS NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Ames Goldsmith ECKART GmbH Mozaik Technology Ventures Ltd

METALS

Applied Materials, Inc. Blue Nano, North America Colloidal Ink Co., Ltd. HG Nanomaterials Micro Powders, Inc. Nanosys, Inc. Tekna

NANOPOWDERS, SILVER NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Lawter Inc. 312-662-5700 [email protected] www.lawter.com See ad on page 3 Colloidal Ink Co., Ltd. Heraeus Precious Metals GmbH & Co KG Liquid X Printed Metals, Inc. Pruftechnik Machinery Service Rieke Metals, LLC

NANOPARTICLE DISPERSIONS

Ames Goldsmith Colloidal Ink Co., Ltd. Inkron InkTec Co., Ltd. Tekna Tokusen USA Inc.

NANOTECHNOLOGY NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com

NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 HG Nanomaterials Micro Powders, Inc. Promethean Particles Ltd. Shamrock Technologies Toyo Ink SC Holdings Co., Ltd.

NANOPARTICLES Lawter Inc.
312-662-5700 [email protected] www.lawter.com See ad on page 3

NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Fall 2016

25-35BG Categories 1016.indd 31

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

XENON Corporation 978-661-9033 [email protected] www.xenoncorp.com See ad on page 9 Applied Materials, Inc. Babcock & Wilcox MEGTEC Blue Nano, North America Centre for Nanotechnology and Smart Materials (CeNTI) Cima NanoTech Colloidal Ink Co., Ltd. CSEM SA Fischer Technology Graphenea HG Nanomaterials Nano Dimension Nanosys, Inc. Nantero, Inc. QD Vision Inc. Tokusen USA Inc. University of Massachusetts Amherst

ORGANIC METALS SunaTech Inc.

PAPERS Arjowiggins Creative Papers Schoeller Technocell GmbH & Co. KG

PAPERS, FLEXIBLE PACKAGING Arjowiggins Creative Papers Babcock & Wilcox MEGTEC ebeam Technologies (formerly PCT Engineered Systems) Pruftechnik Machinery Service Schoeller Technocell GmbH & Co. KG

PASTES, CONDUCTIVE

Shamrock Technologies Solvay Specialty Polymers

POLYMERS, MICROELECTRONIC 1-Material MicroChem Corp. PCAS Piezotech, an Arkema Group Company

POWDERS, CERAMIC Group NanoXplore Inc. Shepherd Technologies

RESINS

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

Lawter Inc. 312-662-5700 [email protected] www.lawter.com See ad on page 3

Sun Chemical Corporation 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 Agfa-Gevaert DuPont Microcircuit Materials ELANTAS Europe GmbH ESL ElectroScience Heraeus Precious Metals GmbH & Co KG InkTec Co., Ltd. Intrinsiq Materials Ltd Johnson Matthey Mozaik Technology Ventures Ltd Promethean Particles Ltd. Tactile Components, Inc. Taiyo Ink Mfg. Co. Ltd. Toyo Ink SC Holdings Co., Ltd.

DKSH North America Inc. Dymax Oligomers & Coatings Kane International Corporation Miwon North America Inc. RAHN AG Sartomer Americas

SCREEN PRINTING MATERIALS NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Agfa-Gevaert Hans Frintrup GmbH Murakami Screen USA, Inc. Sefar AG

PIGMENTS

SEMICONDUCTORS

Sun Chemical Corporation

American Semiconductor, Inc. Applied Materials, Inc. Evonik Resource Efficiency GmbH Integrated Device Technology, Inc. MC10, Inc. Nth Degree Technologies Worldwide Inc. Renesas Electronics Corporation SEMI

973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com See ad on Cover 2 ECKART GmbH Shepherd Technologies

POLYMERS Chromaline Screen Print Products DKSH North America Inc. DuPont Teijin Films Fraunhofer IAP Kane International Corporation Orbital Composites Piezotech, an Arkema Group Company RAHN AG Rieke Metals, LLC

www.printedelectronicsnow .com

SEMICONDUCTORS, CARBON NANOTUBE AIXTRON SE Nantero, Inc.

SEMICONDUCTORS, ORGANIC AIXTRON SE BASF Merck KGaA, PM-AE Electronic Materials

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11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

OSRAM Polyera Corporation Rieke Metals, LLC Samsung Cheil Industries

SEMICONDUCTORS, PRINTED Advantech U.S., Inc. MC10, Inc. Merck KGaA, PM-AE Electronic Materials Nth Degree Technologies Worldwide Inc. Polyera Corporation

SEMICONDUCTORS, QUANTUM SEMICONDUCTORS, QUANTUM DOT

EQUIPMENT 3D PRINTERS Luxexcel Nano Dimension Neotech AMT GmbH Orbital Composites

EQUIPMENT, COATINGS Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com

NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com Nanosys, Inc. QD Vision Inc. Quantum Materials

SEMICONDUCTORS, SILICON AIXTRON SE Applied Materials, Inc. STMicroelectronics

STATIC CONTROL Agfa-Gevaert

SUBSTRATES, FLEXIBLE Arjowiggins Creative Papers Chromaline Screen Print Products Coveme DuPont Teijin Films Eastman Kodak Industrial Materials ENrG Inc. Heliatek GmbH Polyonics Inc. Schoeller Technocell GmbH & Co. KG Sefar AG

TRANSFER RIBBONS ID Labels Pte Ltd

WIRE NANOGAP, Inc. 415-519-8166 [email protected] www.nanogap-usa.com Tokusen USA Inc. Visualplanet

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XENON Corporation 978-661-9033 [email protected] www.xenoncorp.com See ad on page 9 Babcock & Wilcox MEGTEC BeBop Sensors Brunel University London Buhler Inc. Circuit Engineering Marketing Co. Ltd. (CEMCO) Coatema Coating Machinery GmbH ConQuip, Inc. CVD Equipment Corporation EMImills - Engineered Mills, Inc. Enjet Inc. EURECAT Technology Centre of Catalonia Faustel Haiku Tech, Inc. HNP Mikrosysteme GmbH Intellivation LLC KROENERT GmbH & Co KG Kummer Semiconductor Technology Meyer Burger (Netherlands) B.V. (PiXDRO) MIRWEC Film, Inc./ Yasui Seiki USA nTact Optomec Praxair, Inc. RK PrintCoat Instruments Ltd SAM North America, LLC SCHMID Technology GmbH SPGPrints BV Sung An Machinery Co., Ltd. TSE Troller Werner Mathis AG

EQUIPMENT, CONVERTING ConQuip, Inc. ebeam Technologies (formerly PCT Engineered Systems) Faustel IMS Deltamatic KROENERT GmbH & Co KG Martin Automatic Inc

MIRWEC Film, Inc./ Yasui Seiki USA Preco Inc. RK PrintCoat Instruments Ltd Schober USA

EQUIPMENT, EXTRUSION Buhler Inc. nTact SAM North America, LLC Sung An Machinery Co., Ltd.

EQUIPMENT, MATERIAL HANDLING BST eltromat International GmbH CVD Equipment Corporation DP Patterning AB EMImills - Engineered Mills, Inc. HNP Mikrosysteme GmbH KROENERT GmbH & Co KG Mozaik Technology Ventures Ltd New Way Air Bearings Prototype & Production Systems, Inc. SCHMID Technology GmbH

EQUIPMENT, RADIATION CURABLE Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

XENON Corporation 978-661-9033 [email protected] www.xenoncorp.com See ad on page 9 Dymax Oligomers & Coatings ebeam Technologies (formerly PCT Engineered Systems) Hamamatsu Corporation Heraeus Noblelight America LLC IST METZ GmbH Phoseon Technology

EQUIPMENT, RFID Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4

www.printedelectronicsnow .com

3D-Micromac AG Circuit Engineering Marketing Co. Ltd. (CEMCO) Mark Andy, Inc. Muhlbauer, Inc. SCHMID Technology GmbH Schober USA SPGPrints BV Sung An Machinery Co., Ltd.

EQUIPMENT, SEMICONDUCTOR NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 3D-Micromac AG AIXTRON SE Applied Materials, Inc. Circuit Engineering Marketing Co. Ltd. (CEMCO) CVD Equipment Corporation Fraunhofer ISIT Kummer Semiconductor Technology Meyer Burger (Netherlands) B.V. (PiXDRO) Muhlbauer, Inc. Optomec SCHMID Technology GmbH SEMI

EQUIPMENT, SOLAR CELLS Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr 3D-Micromac AG Haiku Tech, Inc. Meyer Burger (Netherlands) B.V. (PiXDRO) Muhlbauer, Inc. Northfield Automation Systems, Inc. SCHMID Technology GmbH SPGPrints BV

EQUIPMENT, THIN FILM PV Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr 3D-Micromac AG Circuit Engineering Marketing Co. Ltd. (CEMCO) ConQuip, Inc. CVD Equipment Corporation Martin Automatic Inc Muhlbauer, Inc.

Fall 2016

11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

New Way Air Bearings Northfield Automation Systems, Inc. SPGPrints BV Sung An Machinery Co., Ltd. Vinci Technologies

FILTERS Sefar AG

GETTERS SAES Getters S.p.A.

GLOVEBOXES MBraun

GRAVURE CYLINDERS GRT GmbH & Co KG Praxair, Inc.

IDENTIFICATION SYSTEMS, RFID AND BARCODE Accel Graphic System Sdn Bhd Avery Dennison BST eltromat International GmbH Evolution Design Systems, Inc. Schreiner Group GmbH & Co.KG Tactonic Technologies Thin Film Electronics ASA Zebra Technologies

NJET AND AEROSOL JET TERS, FUNCTIONAL MATERIALS Ceradrop
+33 55538 2696 [email protected] www.ceradrop.fr ARDEJE Colloidal Ink Co., Ltd. EMImills - Engineered Mills, Inc. Enjet Inc. Fraunhofer IAP FUJIFILM Dimatix , Inc. Henkel Electronic Materials ImTech Technologies LunaLEC Meyer Burger (Netherlands) B.V. (PiXDRO) Neotech AMT GmbH Optomec Printed Electronics Ltd. Scrona Sonoplot, Inc. THIEME GmbH & Co. KG Thomas Swan & Co. Ltd. Unijet Co., Ltd.

INKJET PRINTERS Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com

Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr ARDEJE FUJIFILM Dimatix , Inc. ImTech Technologies Kateeva, Inc. Meyer Burger (Netherlands) B.V. (PiXDRO) Prototype & Production Systems, Inc. Scrona THIEME GmbH & Co. KG Unijet Co., Ltd.

INSPECTION SYSTEMS BST eltromat International GmbH In-Core Systemes ISRA Vision AG Kummer Semiconductor Technology MOCON, Inc. Muhlbauer, Inc.

LAB EQUIPMENT Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com

KROENERT GmbH & Co KG Preco Inc. RK PrintCoat Instruments Ltd Werner Mathis AG

LASER SYSTEMS 3D-Micromac AG 4JET Technologies GmbH Coherent GmbH General Atomics Aeronautical Systems, Inc. LUNOVU GmbH M-Solv Ltd.

LASERS Coherent GmbH LUNOVU GmbH Preco Inc.

MEASUREMENT SYSTEMS BST eltromat International GmbH cyberTECHNOLOGIES GmbH Fischer Technology Fraunhofer ISIT Heraeus Noblelight America LLC In-Core Systemes Kummer Semiconductor Technology MOCON, Inc. New Way Air Bearings PST Sensors RheoSense, Inc. Semilab USA Sensiron Tactonic Technologies Vinci Technologies Web Handling Research Center

NONWOVENS

Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 ebeam Technologies (formerly PCT Engineered Systems) EMImills - Engineered Mills, Inc. EXAKT Advanced Technologies GmbH Fischer Technology Heraeus Noblelight America LLC HNP Mikrosysteme GmbH IST METZ GmbH RheoSense, Inc. Schober USA

LAMINATING EQUIPMENT

Martin Automatic Inc Pruftechnik Machinery Service Web Handling Research Center

PRINTERS, INKJET AND TONER Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr Accel Graphic System Sdn Bhd FUJIFILM Dimatix , Inc. Hewlett-Packard M-Solv Ltd. Methode Electronics, Inc. Micro Powders, Inc. Mycronic AB Prototype & Production Systems, Inc. THIEME GmbH & Co. KG Xerox Zebra Technologies

Coatema Coating Machinery GmbH ConQuip, Inc. Faustel

Fall 2016

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www.printedelectronicsnow .com

PRINTHEADS Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr FUJIFILM Dimatix , Inc. Orbital Composites

XEROXPRINTING EQUIPMENT, PRINTING EQUIPMENT, FLEXO Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com

Flint Group Mark Andy, Inc.

PRINTING EQUIPMENT, OFFSET Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com ebeam Technologies (formerly PCT Engineered Systems) Micro Powders, Inc. Sakurai USA, Inc.

PRINTING EQUIPMENT, SCREEN Coruna Printed Electronics GmbH Engineered Materials Systems, Inc. ESMA Haiku Tech, Inc. Micro Powders, Inc. RK PrintCoat Instruments Ltd Sakurai USA, Inc. SPGPrints BV Sung An Machinery Co., Ltd. THIEME GmbH & Co. KG

PRINTING PRESSES GT+W GmbH Haiku Tech, Inc. Mark Andy, Inc. Sakurai USA, Inc.

PRINTING, EQUIPMENT Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com

Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

33

11/2/16 10:48 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

Coatema Coating Machinery GmbH Enjet Inc. Fraunhofer ISIT GT+W GmbH Kateeva, Inc. Neotech AMT GmbH RK PrintCoat Instruments Ltd Sakurai USA, Inc. Scrona Sensor Films Inc. Sonoplot, Inc. Xerox

QC EQUIPMENT BST eltromat International GmbH Fischer Technology In-Core Systemes RheoSense, Inc. SDI, LLC

ROLL/WEB MANAGEMENT SYSTEMS Babcock & Wilcox MEGTEC Martin Automatic Inc New Way Air Bearings

ROLLERS, PRINTING Harper Corporation of America Praxair, Inc.

SOFTWARE Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr Bosch Rexroth AG CST AG QuantumWise A/S Tactonic Technologies

SOFTWARE, SIMULATION Ceradrop +33 55538 2696 [email protected] www.ceradrop.fr

SPUTTERING EQUIPMENT Vinci Technologies

SURFACE TREATMENT SYSTEMS Circuit Engineering Marketing Co. Ltd. (CEMCO) Enercon Industries, Inc. Hamamatsu Corporation

TESTING EQUIPMENT Botest Systems GmbH Fischer Technology Fraunhofer ISIT Harper Corporation of America ImTech Technologies In-Core Systemes ISRA Vision AG IST METZ GmbH MIRWEC Film, Inc./ Yasui Seiki USA MOCON, Inc. New Way Air Bearings RheoSense, Inc. TSE Troller Web Handling Research Center

VACUUM EQUIPMENT CVD Equipment Corporation Heraeus Noblelight America LLC Vinci Technologies

WELDING EQUIPMENT Fraunhofer ISIT Preco Inc.

WINDERS/UNWINDERS/ REWINDERS Babcock & Wilcox MEGTEC Coatema Coating Machinery GmbH ConQuip, Inc. Faustel IMS Deltamatic KROENERT GmbH & Co KG Mark Andy, Inc. Martin Automatic Inc Preco Inc.

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Bosch Rexroth AG QuantumWise A/S Tactonic Technologies Web Handling Research Center

RESEARCH AND SERVICES ANALYSTS FlexTech Alliance IDTechEx Lux Research Inc. Printed Electronics Consulting

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ASSOCIATIONS AFELIM Canadian Printable Electronics Industry Association (CPEIA) Changzhou Institute of Printed Electronics Industry ESMA FlexTech Alliance JAPERA OE-A (Organic and Printed Electronics Association) SEMI Society for Imaging Science & Technology

CONFERENCES Canadian Printable Electronics Industry Association (CPEIA) ESMA FlexTech Alliance IDTechEx Northeastern University OE-A (Organic and Printed Electronics Association) Society for Imaging Science & Technology Western Michigan University

CONSULTANTS Access Creative Group Beigel Technology Corporation Evans Analytical Group IDTechEx Lux Research Inc. MOCON, Inc. MSWtech Printability and Graphic Communications Institute Printed Electronics Consulting Team NEO

CONTRACT MANUFACTURING SERVICES Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com

DESIGN, PRINTED ELECTRONICS Eastprint Incorporated 978-975-5255 [email protected] www.eastprint.com Advantech U.S., Inc. Allion USA Enfucell Oy Georgia Tech - Center for Organic Photonics and Electronics Jones Packaging Mekoprint A/S MpicoSys Embedded Pico Systems Sp. z o. o. National Research Council Canada Novalia PARC (Palo Alto Research Center), a Xerox company Plastic Logic Germany PragmatIC Printed Electronics Ltd. PrintoCent PST Sensors SAM North America, LLC Schreiner Group GmbH & Co.KG Scrona Wilson-Hurd Manufacturing Co., Inc. Ynvisible

PRODUCT DESIGN NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Allion USA Beigel Technology Corporation Mekoprint A/S VTT Technical Research Centre of Finland Ynvisible

PRODUCT DEVELOPMENT Eastprint Incorporated

NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 American Semiconductor, Inc. Brewer Science, Inc. CymMetrik Enterprise Co., Ltd. Dymax Oligomers & Coatings GSI Technologies, LLC Jones Packaging Kent Displays, Inc. MIRWEC Film, Inc./ Yasui Seiki USA PCAS

www.printedelectronicsnow .com

978-975-5255 [email protected] www.eastprint.com Acreo Swedish ICT AB Allion USA Babcock & Wilcox MEGTEC Blue Spark Technologies Brno University of Technology CPI eMagin Corporation EMImills - Engineered Mills, Inc. Enfucell Oy Evans Analytical Group Faustel Feeligreen

Fall 2016

11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY – Printed Electronics

LunaLEC Mekoprint A/S Nissha USA, Inc. Northeastern University Novalia Peratech Holdco Ltd PolyPhotonix Ltd. PST Sensors Schoeller Technocell GmbH & Co. KG Scrona VTT Technical Research Centre of Finland Western Michigan University Ynvisible

RESEARCH NovaCentrix 512-491-9500 [email protected] www.novacentrix.com See ad on Cover 4 Aristotle University of Thessaloniki (AUTh) Beigel Technology Corporation Berkeley Sensor & Actuator Center (BSAC) Brunel University London Cal Poly ~ Printed Electronics & Functional Imaging CEA-LITEN Centre for Nanotechnology and Smart Materials (CeNTI) Changzhou Institute of Printed Electronics Industry Clemson University COPT.CENTRE, University of Cologne eMagin Corporation Enjet Inc. Evans Analytical Group Fraunhofer ENAS Fraunhofer FEP Fraunhofer IFAM Fraunhofer Institute for Solar Energy Systems ISE General Atomics Aeronautical Systems, Inc. Georg Simon Ohm University of Applied Sciences Georgia Tech - Center for Organic Photonics and Electronics Hebrew University of Jerusalem Holst Centre IDTechEx Imperial College London Incubation Alliance, Inc. InnovationLab GmbH ITRI (Industrial Technology Research Institute) Joanneum Research Forschungsgesellschaft mbH Johannes Kepler University Karlsruhe Institute of Technology Kent State University Lux Research Inc.

Fall 2016

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Massachusetts Institute of Technology National Renewable Energy Laboratory (NREL) National Research Council Canada North Carolina State University - ASSIST Center Okayama University PARC (Palo Alto Research Center), a Xerox company PolyPhotonix Ltd. Printed Electronics Consulting PrintoCent Sefar AG Society for Imaging Science & Technology Sunchon National University Suzhou Institute of Nanotech, Printable Electronics Research Center Tampere University of Technology Team NEO Technical University of Darmstadt Technion - Israel Institute of Technology TKK Finland (Helsinki University of Technology) TNO University of California – Berkeley University of California Los Angeles (UCLA) University of Massachusetts Amherst University of Sheffield University of the West of England Universty of Massachusetts Lowell VTT Technical Research Centre of Finland Welsh Centre for Printing and Coating (WCPC) Western Michigan University Xerox Xerox Research Centre of Canada

RESEARCH, NANOTECHNOLOGY XENON Corporation 978-661-9033 [email protected] www.xenoncorp.com See ad on page 9 Brno University of Technology Centre for Nanotechnology and Smart Materials (CeNTI) Evans Analytical Group Fraunhofer Institute for Solar Energy Systems ISE Georg Simon Ohm University of Applied Sciences InnovationLab GmbH ITRI (Industrial Technology Research Institute) Lux Research Inc. Nanosys, Inc. Northeastern University PARC (Palo Alto Research Center), a Xerox company

QD Vision Inc. QuantumWise A/S University of Massachusetts Amherst Xerox Research Centre of Canada

RESEARCH, POLYMERS Fraunhofer IAP Fraunhofer IFAM Georgia Tech - Center for Organic Photonics and Electronics National Research Council Canada PolyPhotonix Ltd. University of Massachusetts Amherst

RESEARCH, SOLAR Brno University of Technology Fraunhofer IAP Fraunhofer Institute for Solar Energy Systems ISE Georgia Tech - Center for Organic Photonics and Electronics Lux Research Inc. National Renewable Energy Laboratory (NREL) National Research Council Canada PARC (Palo Alto Research Center), a Xerox company PrintoCent

TESTING

COPT.CENTRE, University of Cologne Enjet Inc. Georgia Tech - Center for Organic Photonics and Electronics Hebrew University of Jerusalem Imperial College London Johannes Kepler University Karlsruhe Institute of Technology Kent State University Konkuk University Lamar University Massachusetts Institute of Technology North Carolina State University - ASSIST Center Northeastern University Northumbria University Okayama University Sunchon National University Tampere University of Technology Technical University of Darmstadt Technion - Israel Institute of Technology TKK Finland (Helsinki University of Technology) University of California – Berkeley University of California Los Angeles (UCLA) University of Massachusetts Amherst University of Sheffield University of the West of England Universty of Massachusetts Lowell Welsh Centre for Printing and Coating (WCPC) Western Michigan University

Adphos North America, Inc. 513-277-0464 [email protected] www.adphos.com Brno University of Technology COPT.CENTRE, University of Cologne Evans Analytical Group MIRWEC Film, Inc./ Yasui Seiki USA MOCON, Inc. National Research Council Canada Northeastern University PARC (Palo Alto Research Center), a Xerox company PolyPhotonix Ltd. Printability and Graphic Communications Institute Schreiner Group GmbH & Co.KG Western Michigan University

If you would like to add your company to our International Suppliers’ Directory, please contact

UNIVERSITIES Aristotle University of Thessaloniki (AUTh) Berkeley Sensor & Actuator Center (BSAC) Brno University of Technology Brunel University London Cal Poly ~ Printed Electronics & Functional Imaging Clemson University

www.printedelectronicsnow .com

David Savastano at dsavastano@ rodmanmedia.com

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11/2/16 10:39 AM

SUPPLIERS’ DIRECTORY

COMPANY DIRECTORY 1-Material 2290 Chemin St-Francois Montreal, QC, H9P 1K2 Canada 514-684-6969 [email protected] www.1-material.com 3D-Micromac AG Technologie-Campus 8 Chemnitz, 09126 Germany +49 0371 400430 [email protected] www.3d-micromac.com 4JET Technologies GmbH Konrad-Zuse-Strasse 1 Alsdorf, 52477 Germany +49 02404 552300 [email protected] www.4jet.de/en Accel Graphic System Sdn Bhd Lot1310 Jalan Sg. Pelubung 32/144, Section 32, 40460 Shah Alam Shah Alam, 40400 Malaysia +603 51314288 [email protected] www.accel.com.my Access Creative Group 81 Walnut Street Reading, MA, 01867 US 781-942-7872 tomfitzgerald@ accesscreativegroup.com www.accesscreativegroup.com Acreo Swedish ICT AB Electrum 236 Kista, SE-164 40 Sweden +46 0705 822904 [email protected] www.acreo.se ACTEGA GmbH Abelstraße 43 Wesel, 46483 Germany +49 281 6708 [email protected] www.actega.com

36

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Adhesives Research, Inc. 400 Seaks Run Road Glen Rock, PA, 17327 US 717-235-7979 [email protected] www.adhesivesresearch.com

Adphos North America, Inc. 3490 N. 127th Street Brookfield, WI, 53005 US 513-277-0464 [email protected] www.adphos.com The adphos Group is a family of companies focused on the development of adphosNIR® technology, which dramatically reduces the time and space required for thermal processes providing quantum leaps forward in efficiencies. adphos designs, manufactures and services solutions for customers including Printed Electronics, Graphic Arts, and Industrial. Advantech U.S., Inc. 160 Industry Dr. RIDC Park West Pittsburgh, PA, 15275 US 412-706-5416 [email protected] www.advantechus.com AFELIM 8 Avenue Duva lle Camus Saint Cloud, 92210 France +33 01491 15169 [email protected] www.afelim.fr Agfa-Gevaert Septestraat 27 Mortsel, 2640 Belgium +32 3444 7924 [email protected] www.agfa.com/orgacon

AIXTRON SE Dornkaulstr. 2 Herzogenrath, 52134 Germany +49 2407 90300 [email protected] www.aixtron.com

Applied Materials, Inc. 3050 Bowers Avenue P.O. Box 58039 Santa Clara, CA, 95054 US 408-727-5555 www.appliedmaterials.com

Alien Technology 18220 Butterfield Blvd. Morgan Hill, CA, 95037 US 408-782-3900 www.alientechnology.com

Architects of Intelligent Applications (A.I.A.) 100 Ronson Drive Etobicoke, ON, M9W 1B6 Canada 416-423-7906 [email protected] www.aialabs.ca

Allion USA 1365 NW Amberglen Parkway Beaverton, OR, 97006 US 503-906-8150 [email protected] www.allionusa.com AlSentis 1261 S. Waverly Road Holland, MI, 49423 US 616-582-3160 www.alsentis.com Alta Devices 545 Oakmead Parkway Sunnyvale, CA, 94085 US 408-988-8600 www.altadevices.com Altierre 1980 Concourse Drive San Jose, CA, 95131 US 408-435-7343 [email protected] www.altierre.com American Semiconductor, Inc. 6987 W. Targee St. Boise, ID, 83709 US 208-336-2773 [email protected] www.americansemi.com Ames Goldsmith 50 Harrison Ave. South Glens Falls, NY, 12803 US 518-792-5808 www.amesgoldsmith.com

www.printedelectronicsnow .com

ARDEJE 4, rue Georges Auric Valence, 26000 France +33 47578 2660 www.ardeje.com Argil 5941 Optical Court San Jose, CA, 95138 US 408-960-7453 [email protected] www.argilinc.com Aristotle University of Thessaloniki (AUTh) Laboratory for Thin Films - Nanosystems & Nanometrology (LTFN) Physics Department Thessaloniki, 54124 Greece +30 23109 98174 [email protected] ltfn.physics.auth.gr Arjowiggins Creative Papers 32, avenue Pierre Grenier Boulogne-Billancourt, 92517 France +33 01577 59100 [email protected] www.powercoatpaper.com Armor Group 20 rue Chevreul Nantes, 44105 France +33 2403 84000 [email protected] www.armor-group.com/en/ Fall 2016

11/2/16 11:03 AM

SUPPLIERS’ DIRECTORY – Company Directory

ASSA ABLOY AB Klarabergsviadukten 90 Stockholm, SE-107 23 Sweden +468-50648500 www.assaabloy.com Avery Dennison 150 North Orange Grove Blvd. Pasadena, CA, 91103 US 626-304-2000 www.averydennison.com Babcock & Wilcox MEGTEC 830 Prosper Road P.O. Box 5030 DePere, WI, 54115 US 920-336-5715 [email protected] www.megtec.com BASF Global Business Unit Electronic Materials G-CAE/WO Ludwigshafen, 67056 Germany +49 62160 48502 www.basic-electronic-chemicals. basf.com

Bluestone Global Tech 169 Myers Corner Road, Suite 210 Wappinger Falls, NY, 12590 US 845-632-6326ext.103 [email protected] www.bluestonegt.com

Cal Poly ~ Printed Electronics & Functional Imaging GrC Department, 1 Grand Ave. San Luis Obispo, CA, 93407 US 805-756-2500 [email protected] printedelectronics.calpoly.edu

Bosch Rexroth AG Bgm.-Dr.-Nebel-Str. 2 Lohr am Main, 97816 Germany +49 935218-4290 www.boschrexroth.com/

Caledon Controls Ltd. 3200 Ridgeway Drive, Unit 13 Mississauga, ON, L5L 5Y6 Canada 905-569-1917 [email protected] www.caledoncontrols.com

Botest Systems GmbH Reichenecker 11 Wertheim, 97877 Germany +49 93429 3551-0 [email protected] www.botest.com Brewer Science, Inc. 2401 Brewer Drive Rolla, MO, 65401 US 573-364-0444 [email protected] www.brewerscience.com

BeBop Sensors 970 Miller Ave. Berkeley, CA, 94708 US 510-502-5310 www.bebopsensors.com

Brightvolt 2700 Interstate Drive Lakeland, FL, 33805 US 863-603-7640 www.brightvolt.com

Beigel Technology Corporation 261 Ocean View Ave. Encinitas, CA, 92024 US 760-633-3868 [email protected] www.beigeltech.com

Brno University of Technology Purkynova 118 Brno, 61200 Czech Republic +420 541149301 [email protected] www.materials-research.cz/en/

Berkeley Sensor & Actuator Center (BSAC) University of California – Berkeley Berkeley, CA, 94720 US 510-643-6690 bsac.berkeley.edu Blue Nano, North America 17325 Connor Quay Court Cornelius, NC, 28031 US 980-225-1657 www.bluenanoinc.com Blue Spark Technologies 806 Sharon Drive, Suite G Westlake, OH, 44145 US 440-249-5400 www.bluesparktechnologies. com/index.php/contact www.bluesparktechnologies.com

Fall 2016

36-47BG Companies 1016.indd 37

Brunel University London Uxbridge London, UB8 3PH United Kingdom +44 01895 274000 [email protected] www.brunel.ac.uk BST eltromat International GmbH Heidsieker Heide 53 Bielefeld, 33739 Germany +49 5206 9990 [email protected] www.bst-international.com Buhler Inc. 40 Whitney Road Mahwah, NJ, 07430 US 201-847-0600 gdnorthamerica @buhlergroup.com www.buhlergroup.com

Cambridge Display Technology Ltd Building 2020 Cambourne Business Park Cambridgeshire, CB23 6DW United Kingdom +44 1954 713600 www.cdtltd.co.uk Cambrios Technologies Corp. 930 East Arques Ave. Sunnyvale, CA, 94085 US 408-738-7400 www.cambrios.com Canadian Printable Electronics Industry Association (CPEIA) 170 Cheyenne Way Ottawa, ON, K2J 5S6 Canada 613-795-8181 [email protected] www.cpeia-acei.ca Carestream Tollcoating 8124 Pacific Ave. White City, OR, 97503 US 800-234-8069 www.tollcoating.com CEA-LITEN 17 rue de Martyrs Grenoble Cedex 9, 38054 France +33 04387 83981 www.cea.fr Centre for Nanotechnology and Smart Materials (CeNTI) Rua Fernando Mesquita 2785 Vila Nova de Famaliceo, 4760-034 Portugal +35 12521 04152 www.centi.pt

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Ceradrop ESTER Technopole 32, rue de Soyouz Limoges, 87068 France +33 5553 82696 [email protected] www.ceradrop.fr CERADROP, MGI subsidiary, designs and markets integrated digital Printers exclusively for Printed Electronics and Smart3D Printing. We are embedding all types of inkjet printheads and AerosolJet technologies with the latest generation of integrated curing modules for multimaterials deposition technologies feasibility, RPT, and new products launch. CETEMMSA Technological Centre Av. Ernest Lluch 36 Parc Cientific TecnoCampus Mataro Barcelona, 08301 Spain +34 9374 19100 [email protected] www.cetemmsa.com Changzhou Institute of Printed Electronics Industry No. 9-4, Taihu Donglu Road Changzhou, 213000 China +865 19-6988-5592 [email protected] www.czipei.com Checkpoint Systems, Inc. 101 Wolf Drive Thorofare, NJ, 08086 US 800-257-5540 www.checkpointsystems.com Chromaline Screen Print Products 4832 Grand Ave. Duluth, MN, 55807 US 218-628-2217 [email protected] www.chromaline.com Cima NanoTech 471 Hayward Avenue North St. Paul, MN, 55128 US 651-646-6266 [email protected] www.cimananotech.com
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SUPPLIERS’ DIRECTORY – Company Directory

Circuit Engineering Marketing Co. Ltd. (CEMCO) Relay Road, Waterlooville Portsmouth, PO7 7XA United Kingdom +44 02392 262120 [email protected] www.cemco.com Clariant Clariant Produkte (Deutschland) GmbH Industriepark Höchst, G 860, C012 Frankfurt, 65926 Germany +49 69305 83161 www.clariant.com Clemson University Sonoco Institute of Packaging Design & Graphics 311 Harris A. Smith Building, Clemson University Clemson, SC, 29634 US 864-656-4690 [email protected] sonocoinstitute.com Coatema Coating Machinery GmbH Roseller Str. 4 Dormagen, 41539 Germany +49 2133 97840 [email protected] www.coatema.de Coherent GmbH Hans-Böckler-Str. 12 Göttingen, 37079 Germany +49 55169390 www.coherent.com Colloidal Ink Co., Ltd. 550 Akahama, Soja Okayama, 719-1121 Japan +81 0866-92-5111 [email protected] cink.jp/ Conductive Technologies Inc. 935 Borom Road York, PA, 17404 US 800-706-0618 [email protected] www.conductivetech.com

COPT.CENTRE, University of Cologne Luxemburger Str. 90 Koeln, 50939 Germany +49 02219 3371003 [email protected] www.copt-zentrum.de Coruna Printed Electronics GmbH Lindenbergstr. 5 Bettwil, 5618 Switzerland +41 566672131 www.coruna.ch Coveme Via Emilia Levante, 288 San Lazzaro di Savena (BO), 40068 Italia +39 05162 26111 www.coveme.com CPI NETPark,Thomas Wright Way,Sedgefield Durham, TS21 3FG United Kingdom +44 01740625700 [email protected] www.uk-cpi.com

CymMetrik Enterprise Co., Ltd. 9F., No. 52, Sec. 3, Nan-Kang Road Taipei, 115 Taiwan +886 0227855600#12288 [email protected] www.cymmetrik.com CYNORA GmbH Werner-von-Siemens-Strasse 2-6 Karlsruhe, 76646 Germany +49 072519196711 [email protected] www.cynora.com Digimarc 9405 SW Gemini Drive Beaverton, OR, 97008 US 503-469-4800 [email protected] www.digimarc.com

Crystalsol GmbH Simmeringer Hauptstrasse 24 Wien, 1110 Austria +43 189018790 [email protected] www.crystalsol.com

DKSH North America Inc. 100 Stierli Court Suite 102 Mount Arlington, NJ, 07856 US 973-810-5511 [email protected] www.dksh.com

CSEM SA Jaquet-Droz 1 Neuchatel, CH-2002 Switzerland +41 0327205411 [email protected] www.csem.ch

Confidex Ltd. Haarlankatu 1B Tampere, 33230 Finland +3580-104244100 www.confidex.com ConQuip, Inc. 11255 Pyrites Way Rancho Cordova, CA, 95670 US 916-379-8200 [email protected] www.conquipinc.com

CST AG Bad Nauheimer Str. 19 Darmstadt, 64289 Germany +49 61517303-0 [email protected] iwww.cst.com

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cyberTECHNOLOGIES GmbH Bei der Hollerstaude 19 Ingolstadt, D-85049 Germany +49 84188533-0 www.cybertechnologies.com

Creative Materials, Inc. 12 Willow Road Ayer, MA, 01432 US 978-391-4700 [email protected] www.creativematerials.com

CSIRO Gate 3 Normanby Road Clayton VIC Melbourne,VI, 3168 Australia +61 0395457822 [email protected] www.csiro.au

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CVD Equipment Corporation 355 South Technology Drive Central Islip, NY, 11722 US 631-981-7081 [email protected] www.cvdequipment.com

Dow Corning Corporation Corporate Center P.O. Box 994 Midland, MI, 48686 US 989-496-4839 [email protected] www.dowcorning.com DP Patterning AB Bredgatan 34 Norrköping, 601 17 Sweden +46 705515040 [email protected] www.dppatterning.com DuPont Microcircuit Materials 14 TW Alexander Drive Durham, NC, 27709 US 800-284-3382 [email protected] mcm.dupont.com

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DuPont Teijin Films 3600 Discovery Drive Chester,VA, 23836 US 800-635-4639 Tech-Service.Hopewell @usa.dupont.com dupontteijinfilms.com DuraTech Industries, Inc. 3216 Commerce Street La Crosse, WI, 54603 US 608-781-2570 [email protected] www.duratech.com Dymax Oligomers & Coatings 318 Industrial Lane Torrington, CT, 06790 US 860-626-7006 [email protected] www.dymax-oc.com E Ink Corporation 733 Concord Ave. Cambridge, MA, 02138 US 617-499-6000 www.eink.com Eastman Kodak Industrial Materials 343 State St. Rochester, NY, 14650-0505 US 800-242-2424 [email protected] kodak.com/corp/industrial-materials/pet-films/default.htm

Eastprint Incorporated 350 Willow St. South North Andover, MA, 01845 US 978-975-5255 [email protected] www.eastprint.com Eastprint Incorporated is a leader in Printed Electronics, HMI and Wearable Technologies contract manufacturing. In Mold Electronics (IME), PCAP switch assemblies, medical and healthcare wearable devices, E-Textile / smart clothing functional screen printing, user interface ECM/EMS services and Membrane Switch manufacturing is engineered in the USA while production requirements are supported by Eastprint Mexico.

Fall 2016

11/2/16 11:03 AM

SUPPLIERS’ DIRECTORY – Company Directory

ebeam Technologies (formerly PCT Engineered Systems) 8700 Hillandale Road Davenport, IA, 52806 US 563-285-7411 [email protected] www.teampct.com ECKART GmbH Guntersthal 4 Hartenstein, DE91235 Germany +49 09152776500 [email protected] www.eckart.net Eight19 9A Cambridge Science Park Milton Road, Cambridge CB4 0FE United Kingdom +44 1223437437 www.eight19.com ELANTAS Europe GmbH Grossmanstrasse 105 Hamburg, 20539 Germany +49 04078946231 [email protected] www.altana.com Elcoflex Ltd. Vihikari 10 Kempele, 90440 Finland +358 0207418011 [email protected] www.elcoflex.com eMagin Corporation 2070 Route 52, Building 334 Hopewell Junction, NY, 12533 US 845-838-7900 [email protected] www.emagin.com EMD Performance Materials One International Plaza, Ste 300 Philadelphia, PA, 19113 US 888-367-3275 www.emd-pm.com EMImills - Engineered Mills, Inc. 888 East Belvidere Road – U214 Grayslake, IL, 60030 US 847-548-0044 [email protected] www.EMImills.com Encres Dubuit ZI Mitry Compans 1 rue Isaac Newton Mitry Mory, 77292 France +33 164674160 [email protected] www.encresdubuit.com Fall 2016

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Enercon Industries, Inc. W140 N9572 Fountain Blvd. Menomonee Falls, WI, 50351 US 262-255-6070 www.enerconind.com/treating Enfucell Oy Petikontie 10 Vantaa, FI-01720 Finland +358 0451206030 [email protected] www.enfucell.com Engineered Materials Systems, Inc. 100 Innovation Court Delaware, OH, 43015 US 740-362-4444 [email protected] www.conductives.com Enjet Inc. 501, Seonsin Technopark, Yeongtongro 323-38 Yeongtonggu, Suwon, Gyeonggi Suwon, 443-803 South Korea +82 070-4892-8100 [email protected] www.enjet.co.kr ENrG Inc. 155 Rano St. Suite 300 Buffalo, NY, 14207 US 716-873-2939 [email protected] www.enrg-inc.com Epec Engineered Technologies 174 Duchaine Blvd. New Bedford, MA, 02745 US 508-995-5171 [email protected] www.epectec.com Ercon Inc. 7 Kendrick Rd Wareham, MA, 02571 US 508-291-1400 [email protected] erconinc.com ESL ElectroScience 416 East Church Road King of Prussia, PA, 19406 US 610-272-8000 [email protected] www.electroscience.com ESMA Sint-Jorisveld 44 Leuven, 3390 Belgium +32 016894353 [email protected] www.esma.com

EURECAT Technology Centre of Catalonia Av. Ernest Lluch 36. Parc cientific TecnoCampus Barcelona, 08302 Spain +34 937419100 [email protected] www.eurecat.org Evans Analytical Group 810 Kifer Road Sunnyvale, CA, 94086 US 800-366-3867 [email protected] www.eag.com/mc Evolution Design Systems, Inc. 9521 N. Kedvale Ave. Skokie, IL, 60076 US 800-850-2929 [email protected] https://www.eidbadges.com Evonik Resource Efficiency GmbH Paul-Baumann-Straße 1 Marl, D-45764 Germany +49 02365495288 [email protected] www.ixsenic.com EXAKT Advanced Technologies GmbH Robert-Koch-Strasse 5 Norderstedt, 22851 Germany +49 405295600 www.exakt.de Faustel W1194 N11301 McCormick Drive Germantown, WI, 53022 US 262-253-3333 [email protected] www.faustel.com Feeligreen 635 route des lucides Sophia-Antipolis, 06560 France +33 0659470857 [email protected] www.feeligreen.net First Solar, Inc. 350 West Washington St., Suite 600 Tempe, AZ, 85281 US 602-414-9300 www.firstsolar.com Firstbeat Technologies Ltd Yliopistonkatu 28A Second Floor Jyväskylä, FI-40100 Finland +358 207631660 www.firstbeat.com

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Fischer Technology 750 Marshall Phelps Road Windsor, CT, 06095 US 860-683-0781 [email protected] www.fischer-technology.com Flexbright OY Lentolantie 23 Kangasala, 36220 Finland +358 505239481
pekka. [email protected] www.flexbright.fi FlexEl, LLC 387 Technology Drive Suite 2101 College Park, MD, 20742 US 301-405-2471 www.flexelinc.com FlexEnable Ltd 34 Cambridge Science Park Cambridge, CB4 0FX United Kingdom +44 1223 706000 [email protected] www.flexenable.com Flexible Circuit Technologies, Inc. 9850 51st Ave. N., Suite 110 Minneapolis, MN, 55442 US 888-921-6167 [email protected] www.flexiblecircuit.com FlexTech Alliance 3081 Zanker Road San Jose, CA, 95134 US 408-577-1300 [email protected] www.flextech.org Flextronics 6201 America Center Drive San Jose, CA, 95002 US 408-576-7000 [email protected] www.flextronics.com Flint Group 25 Old Shoals Road Arden, NC, 28704 US 828-687-4213 www.flintgrp.com Fraunhofer ENAS Technologie-Campus 3 Chemnitz, 09126 Germany +49 037145 001440 [email protected] www.enas.fraunhofer.de/ en.html

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SUPPLIERS’ DIRECTORY – Company Directory

Fraunhofer FEP Winterbergstrasse 28 Dresden, 01277 Germany +49 35125860 www.fep.fraunhofer.de/en.html Fraunhofer IAP Wissenschaftspark Golm Geiselbergstr. 69 Potsdam, 14476 Germany +49 033156810 [email protected] www.iap.fraunhofer.de

Genes’ Ink 39, avenue Gaston Imbert 13106 Rousset Aix-en-Provence, 13106 France +33 442370580 [email protected] www.genesink.com Gentag 3299 K Street NW, Suite 100 Washington, DC, 20007 US 240-994-2236 www.gentag.com

Fraunhofer IFAM Wiener Strasse 12 Bremen, 28359 Germany +49 42122460 [email protected] www.ifam.fraunhofer.de

Georg Simon Ohm University of Applied Sciences Keulerplatz12 Nurnberg, 90489 Germany +49 9115880-0 www.ohm-hochschule.de

Fraunhofer Institute for Solar Energy Systems ISE Heidenhofstrasse 5 Freiburg, 79110 Germany +49 07614588-0 www.ise.fraunhofer.de

Georgia Tech - Center for Organic Photonics and Electronics 901 Atlantic Dr., Suite 4100C Atlanta, GA, 30332 US 404-526-6155 [email protected] cope.gatech.edu

Fraunhofer ISIT Fraunhoferstrasse 1 25524 Itzehoe Hamburg, 25524 Germany +49 04821174605 [email protected] www.isit.fraunhofer.de FUJIFILM Dimatix , Inc. 2250 Martin Ave. Santa Clara, CA, 95050 US 408-565-9150 [email protected] www.dimatix.com G24i Power Ltd. Wentloog Environmental Centre Wentloog Cardiff, CF3 2EE United Kingdom +442920837340 www.gcell.com General Atomics Aeronautical Systems, Inc. 14200 Kirkham Way Poway, CA, 92064 US 858-312-2810 [email protected] www.ga-asi.com General Label 675 Rhode Island Ave. S. Minneapolis, MN, 55426 US 763-541-1851 [email protected] general-label.com 40

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GGI International 1455, 32 avenue Lachine, QC, H8T 3J1 Canada 514-631-6662 [email protected] www.ggi-international.com Global High Tech Connections Inc. 1386 Shore Drive San Jose, CA, 95131 US 408-489-9596 [email protected] www.ghtconnections.com GM Nameplate 2040 15th Avenue West West Seattle, WA, 98119 US 206-284-2200 www.gmnameplate.com Graphenea Avenida de Tolosa, 76 San Sebastian, 20018 Spain +34 943598962 [email protected] www.graphenea.com Graphic Packaging 1795 Dogwood Street Suite 100 Louisville, CO, 80027 US 303-334-9690 [email protected] graphicpkg.com

Green Bay Packaging 3250 South Ridge Road Green Bay, WI, 54304 US 920-337-1800 [email protected] gbp.com/coated

Heliatek GmbH Treidlerstrasse 3 Dresden, 01139 Germany +49 35121303430 [email protected] www.heliatek.com

Group NanoXplore Inc. 25 Rue Montpellier Montreal, QC, H3J 1R4 Canada 514-935-1377 [email protected] www.nanoxplore.ca

Henkel Electronic Materials 14000 Jamboree Road Irvine, CA, 92606 US 714-368-8000 [email protected] www.henkel.com/electronics

GRT GmbH & Co KG Goorweg 14 Hamm, 59075 Germany +49 238198766-0 www.goerz-gravurtechnik.de

Heraeus Noblelight America LLC 910 Clopper Road Gaithersburg, MD, 20878 US 301-527-2660 [email protected] www.heraeus-noblelight.com

GSI Technologies, LLC 311 Shore Drive Willowbrook, IL, 60527 US 630-325-8181 [email protected] www.gsitech.com GT+W GmbH Bad Nauheimer Str. 4 Darmstadt, 64289 Germany +49 615173475973 [email protected] www.GTandW.com Haiku Tech, Inc. 1669 NW 79th Ave. Miami, FL, 33126 US 305-463-9304 [email protected] www.haikutech-printed electronics.com Hamamatsu Corporation 360 Foothill Road Bridgewater, NJ, 08807 US 908-231-0960 [email protected] www.hamamatsu.com Hans Frintrup GmbH Rohfeldstr. 20 Bonn, 53227 Germany +49 228403997-0 www.frintrup.de Harper Corporation of America 11625 Steele Creek Road Charlotte , NC, 28273 US 704-588-3371 www.harperimage.com Hebrew University of Jerusalem Casali Center, Institute of Chemistry Jerusalem, 91904 Israel +972 2-6584967 new.huji.ac.il/en

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Heraeus Precious Metals GmbH & Co KG 24 Union Hill Road West Conshohocken, PA, 19428 US 978-342-1133 www.heraeus-clevios.com Hewlett-Packard 3000 Hanover St. Palo Alto, CA, 94304 US 650-857-1501 www.hp.com HG Nanomaterials - US 406-414-6508 [email protected] www.hgnano.com HiFi Industrial Film Wedgwood Way Stevenage, SG1 4SX United Kingdom +44 01438 314354 [email protected] www.hififilm.com HNP Mikrosysteme GmbH Bleicherufer 25 Schwerin, 19053 Germany +49 38552 190300 www.hnp-mikrosysteme.de Holst Centre High Tech Campus 31 Eindhoven, 5656AE The Netherlands +31 404020400 www.holstcentre.com

Fall 2016

11/2/16 11:03 AM

SUPPLIERS’ DIRECTORY – Company Directory

HZO Inc. 12637 South 265 West Draper, UT, 84020 US 801-268-1900 [email protected] www.hzo.com ID Labels Pte Ltd 15 Defu Lane 7 Singapore, 539338 Singapore +65 62801681 [email protected] www.idlabels-sg.com IDTechEx Downing Park Swaffham Bulbeck Cambridge, CB25 0NW United Kingdom +44 01223 812300 [email protected] www.IDTechEx.com See our ad on page 7! IIMAK 310 Commerce Drive Buffalo, NY, 14228 US 888-464-4625 [email protected] www.iimak.com Imperial College London South Kensington Campus London, SW7 2AZ United Kingdom +44 02075895111 www.imperial.ac.uk Impinj 701 N. 34th St., Suite 300 Seattle, WA, 98103 US 206-517-5300 www.impinj.com Imprint Energy 1320 Harbor Bay Parkway Suite 110 Alameda, CA, 94502 US 510-748-0233 www.imprintenergy.com IMS Deltamatic via Beretta, 25 Calcinate, 24050 Italia +39 0358355111 [email protected] www.goebel-ims.com ImTech Technologies 4100A SW Research Way Corvallis, OR, 97333 US 541-757-2047 [email protected] www.imtech-or.com Fall 2016

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In-Core Systemes Chemin du Lortaret Lyon, 69800 France +33 469841666 mathilde.ristovski @incore-systemes.com www.incore-systemes.com Incubation Alliance, Inc. 1-2-25-D-307, Wadayamadori Hyogo-Ku, Kobe, 652-0884 Japan +81 78-651-1332 www.incu-alliance.co.jp Inkron Teknikvägen 2 Espoo, 02150 Finland +358 105812650 [email protected] www.inkron.com InkTec Co., Ltd. 98-12, Neungan-ro, Danwongu, Ansan-si, Gyenoggi-do Seoul, 425-839 South Korea +82 031-496-5457 [email protected] www.inktec.com/product/pe.do InnovationLab GmbH Speyerer Strasse 4 Heidelberg, 69115 Germany +49 062215 419100 [email protected] www.innovationlab.de Insulectro 20362 Windrow Drive Lake Forest, CA, 92630 US 949-587-3200 [email protected] www.insulectro.com Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA, 95138 US 408-284-8200 www.idt.com Intellivation LLC 1230 Blue Spruce Drive, Suite 3 Fort Collins, CO, 80524 US 970-692-2335 [email protected] www.intelli-vation.com Intrinsiq Materials Ltd Building Y25 Cody Technology Park, Ively Road Farnborough GU14 0LX United Kingdom +44 07776457255 [email protected] www.intrinsiqmaterials.com

isorg 17 Rue des Martyrs Grenoble Cedex 9, 38054 France +33 0-609457370 www.isorg.fr ISRA Vision AG Industriestr. 14 Darmstadt, 64297 Germany +49 6151948-0 www.isravision.com IST METZ GmbH Lauterstrasse 14-18 Nuertingen, 72622 Germany +49 702260020 www.ist-uv.com ITRI (Industrial Technology Research Institute) 195 Chung Hsing Road, Sec. 4 Chu Tung Hsin Chu, 310 Taiwan +886 3-582-0100 www.itri.org.tw/eng JAPERA AIST Tsukuba Central 5-1, 1-11 Higashi Tsukuba, 305-8565 Japan +81 29-869-9320 [email protected] japera.or.jp/

Kane International Corporation 411 Theodore Fremd Ave. Suite 106 Rye, NY, 10580 US 914-921-3100 [email protected] www.KaneInternational.com Karlsruhe Institute of Technology Kaiserstraße 12 Karlsruhe, 76131 Germany +49 721608-0 www.kit.edu Kateeva, Inc. 7015 Gateway Blvd. Newark, CA, 94560 US 800-385-7802 [email protected] www.kateeva.com Kent Displays, Inc. 343 Portage Blvd. Kent, OH, 44240 US 330-673-8784 [email protected] www.kentdisplays.com Kent State University 800 E. Summit St. Kent, OH, 4240 US 330-672-3000 www.kent.edu

Joanneum Research Forschungsgesellschaft mbH Steyrergasse 17-19 Graz, 8010 Austria +43 316876-0 www.joanneum.at

Kisco Conformal Coating, LLC 6292 San Ignacio Ave. San Jose, CA, 95119 US 408-224-6533 [email protected] www.kiscoparylene.com

Johannes Kepler University Altenberger Straße 69 Linz, 4040 Austria +43 73224680 [email protected] www.jku.at/content

Konkuk University Engineering Bldg. C, Room 425-1, 1 Hwayang-dong, Kwangin-gu Seoul, 143-701 South Korea +82 24504195 www.konkuk.ac.kr/eng

Johnson Matthey Orchard Road, Royston Herfordshire Stevenage, SG8 5HE United Kingdom +44 1763253393 [email protected] www.glassmatthey.com Jones Packaging 3000 Page St. London, ON, N5V 5H3 Canada 519-4512100 www.jonespackaging.com

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KROENERT GmbH & Co KG Schuetzenstrasse 105 Hamburg, 22761 Germany +49 408539301 [email protected] www.kroenert.de See our ad on page 21! Kummer Semiconductor Technology Steinerne Furt 78 Augsburg, 86167 Germany +49 0821748720 [email protected] www.jpkummer.com 41

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SUPPLIERS’ DIRECTORY – Company Directory

KWJ Engineering Inc. 8440 Central Ave. Newark, CA, 94560 US 510-794-4296 www.kwjengineering.com Lamar University P. O. Box 10603 Beaumont, TX, 77710 US 409-880-8750 [email protected] www.lamar.edu Lamart Corporation 16 Richmond St. Clifton, NJ, 07011 US 973-772-6262 [email protected] www.lamartcorp.com

Lawter Inc. 200 N. LaSalle St. Suite 2600 Chicago, IL, 60601 US 312-662-5700 [email protected] www.lawter.com See our ad on page 3! Light Tape 1320 N. Boulevard Richmond,VA, 23230 US 804-355-1692 [email protected] www.lighttape.com Linear Technology 1630 McCarthy Blvd. Milpitas, CA, 95035 US 408-432-1900 [email protected] www.linear.com Liquid X Printed Metals, Inc. 515 William Pitt Way Pittsburgh, PA, 15238 US 412-426-3521 [email protected] www.liquid-x.com LTI Coating Technologies, LLC 45 Parker, Suite 100 Irvine, CA, 92618 US 714-690-6470 [email protected] www.ltitech.com

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LunaLEC PO Box 7970 Umea, SE-907 19 Sweden +46 706883655 [email protected] www.lunalec.com

MBraun Braun Inertgas-Systeme GmbH Dieselstr. 31 Garching, D-85748 Germany +49 8932669-0 www.mbraun.de

Micro Powders, Inc. 580 White Plains Road Tarrytown, NY, 10591 US 914-793-4058 [email protected] www.micropowders.com

LUNOVU GmbH Kaiserstrasse 100 Herzogenrath, D-52134 Germany +49 02407 555050 [email protected] www.lunovu.com

MC10, Inc. 36 Cameron Ave. Cambridge, MA, 02140 US 617-234-4448 www.mc10inc.com

MicroChem Corp. 200 Flanders Road Westborough, MA, 01581 US 617-965-5511 [email protected] www.microchem.com

Lux Research Inc. 100 Franklin St., 8th Floor Boston, MA, 02110 US 617-502-5314 [email protected] www.luxresearchinc.com Luxexcel Weihoek, 10A Kruiningen, 4416 PX The Netherlands +310-113-22-44-00 [email protected] www.luxexcel.com M-Solv Ltd. Oxonian Park, Langford Locks, Kidlington Oxford, OX5 1FP UK +44 1865 844070 [email protected] www.m-solv.com Magneto Innovations 830 Grandee Cir. Marion, AR, 72364 US 901-338-5805 [email protected] www.magnetoinnovations.com Mark Andy, Inc. 18081 Chesterfield Airport Road St. Louis, MO, 63005 US 636-532-4433 [email protected] www.markandy.com Martin Automatic Inc 1661 Northrock Court Rockford, IL, 61103 US 815-654-4800 [email protected] www.martinautomatic.com Massachusetts Institute of Technology The Media Laboratory 77 Mass. Ave. Cambridge, MA, 02139 US 617-253-5960 www.media.mit.edu

Mekoprint A/S Hermesvej 2 Aalborg, DK-9530 Denmark +45 99365600 [email protected] www.mekoprint.dk Merck Group, OLED Business Unit Frankfurter Str. 250 Darmstadt, 64923 Germany +49 615172-0 [email protected] www.merckgroup.com Merck KGaA, PM-AE Electronic Materials Frankfurter Str. 250 Darmstadt, 64923 Germany +49 61517221901 [email protected] www.merckgroup.com MesoScribe Technologies 100 North Country Road E. Setauket, NY, 11733 US 631-686-5710 www.mesoscribe.com Metamaterial Technologies Inc. (MTI) 1 Research Drive Dartmouth, NS, B2Y 4M9 Canada 902-482-5729 [email protected] www.metamaterial.com Methode Electronics, Inc. 7401 W. Wilson Ave. Chicago, IL, 60706 US 708-867-6777 www.methode.com/inks Meyer Burger (Netherlands) B.V. (PiXDRO) Luchthavenweg 10 Eindhoven, 5657EB The Netherlands +31 0402581581 [email protected] www.meyerburger.com

www.printedelectronicsnow .com

MIRWEC Film, Inc./ Yasui Seiki USA 601 S. Liberty Drive Bloomington, IN, 47403 US 812-331-7194 [email protected] mirwecfilm.com Miwon North America Inc. The Commons @ Oaklands 696 W. Lincoln Highway Exton, PA, 19341 US 484-872-8711 www.miwonus.com MOCON, Inc. 7500 Mendelssohn Ave. N. Minneapolis, MN, 54428 US 763-493-6370 [email protected] www.mocon.com Molex 2222 Wellington Court Lisle, IL, 60532 US 800-786-6539 [email protected] www.molex.com Mozaik Technology Ventures Ltd Suites 34-35 The Hop Exchange 24 Southwark St. London, SE1 1TY UK +44 2073 577376 [email protected] www.mozaik.co.uk MpicoSys Embedded Pico Systems Sp. z o. o. Pomeranian Science and Technology Park, Al. Zwyciestwa 96/98 Gdynia, 81-451 Poland +48 587664990 [email protected] www.mpicosys.com MSWtech Feuerweg 13c Stein, 90547 Germany +49 016096300657 [email protected] www.mswtech.de Fall 2016

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SUPPLIERS’ DIRECTORY – Company Directory

Muhlbauer, Inc. 226 Pickett’s Line Newport News,VA, 23603-1366 US 757-947-2820 [email protected] www.muhlbauer.com Murakami Screen USA, Inc. 745 Monterey Pass Road Monterey Park, CA, 91754 US 323-980-0662 [email protected] murakamiscreen.com Mycronic AB Nytorpsvägen 9 Täby, 183 03 Sweden +46 86385200 www.mycronic.com Nano Dimension Ilan Ramon 2 Ness Ziona, 7403635 Israel +972 054-253-9495 [email protected] www.nano-di.com

Nantero, Inc. 25-E Olympia Ave. Woburn, MA, 01801 US 781-932-5338 www.nantero.com National Renewable Energy Laboratory (NREL) 1617 Cole Blvd. Golden, CO, 80401 US 303-275-3000 www.nrel.gov National Research Council Canada 1200, Montreal Road Ottawa, ON, K1A0R6 Canada 613-291-3989 Mohammad.Salahuddin @nrc-cnrc.gc.ca www.nrc-cnrc.gc.ca Neotech AMT GmbH Petzoltstr. 3 Nurnberg, 90443 Germany +49 09112745501 [email protected] www.neotech-amt.com New Way Air Bearings 50 McDonald Blvd. Aston, PA, 19014 US 610-494-6700 bfarrell @newwayairbearings.com www.NewWayAirBearings.com

NANOGAP, Inc. 750 National Court Suite 100 Richmond, CA, 94804 US 415-519-8166 [email protected] www.nanogap-usa.com

NIKKOIA 196C rue du Rocher de Lorzier Centr’Alp Moirans Grenoble, 38430 France +33 0476357795 [email protected] www.nikkoia.com

NANOGAP develops and manufactures novel nanomaterials for printed electronics. Conductive materials include ultra-stable, high performance silver nanoparticle and silver nanofiber dispersions for ink formulators. Our nanomaterials can be customized for particle size/distribution, concentration and carrier solvent to best suit the application.

Nissha USA, Inc. 1051 Perimeter Drive, Suite 525 Schaumburg, IL, 60173 US 617-515-5886 www.nissha.com/english/

Nanosys, Inc. 233 S. Hillview Drive Milpitas, CA, 95035 US 408-240-6700 [email protected] www.nanosysinc.com

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North Carolina State University - ASSIST Center 2410 Campus Shore Dr. Raleigh, NC, 27695 US 919-515-7356 assist.ncsu.edu Northeastern University NSF Center for High-rate Nanomanufacturing 360 Huntington Ave Boston, MA, 02115 US 617-373-6012 [email protected] www.nanomanufacturing.us

Northfield Automation Systems, Inc. 1325 Armstrong Road Northfield, MN, 55057 US 507-645-5501 www.northfieledautomation. com Northumbria University City Campus East, Ellison Place Newcastle upon Tyne, NE1 8ST United Kingdom +44 1912 326002 www.northumbria.ac.uk

NovaCentrix 400 Parker Drive, Suite 1110 Austin, TX, 78728 US 512-491-9500 elise.alkhafaji @novacentrix.com www.novacentrix.com NovaCentrix offers industry leading photonic curing tools, material and expertise enabling development and production of next generation printed electronic devices – some already on the market. PulseForge® tools utilize photonic curing which is a cutting edge technology that dries, sinters, and anneals functional inks in milliseconds. See our ad on Cover 4! Novaled AG Tatzberg 49 Dresden, 013007 Germany +49 3517 96580 www.novaled.com Novalia 133 Station Road, Impington Cambridge, CB24 9NP UK +44 1223 234426 www.novalia.co.uk nTact 10480 Markson Road Dallas, TX, 75237 US 214-343-5300 www.ntact.com Nth Degree Technologies Worldwide Inc. 1320 W. Auto Drive Tempe, AZ, 85284 US 480-374-7500 www.nthdegreetech.com

www.PRINTEDELECTRONICSNOW .com

OE-A (Organic and Printed Electronics Association) Lyoner Strasse 18 Frankfurt, 60528 Germany +49 06966031336 [email protected] www.oe-a.org Ohmatex ApS Skanderborgvej 234 Viby J, DK-8260 Denmark +45 79304150 [email protected] www.ohmatex.dk Okayama University 1-1-1 Tsushimanaka, Kita Ward Okayama, 700-0082 Japan +81 862521111 www.okayama-u.ac.jp OMsignal 17 St-Pierre St., Suite 800 Montreal, QB, H2Y 2M4 Canada 514-880-6799 businessdevelopment @omsignal.com www.omsignal.com Optomec 3911 Singer N.E. Albuquerque, NM, 87109 US 505-761-8250 [email protected] www.optomec.com Orbital Composites 1314 Weathersfield Way San Jose, CA, 95118 US 650-669-0529 [email protected] www.orbitalcomposites.com OrelTech Organic Electronics Rehovot, 76100 Israel +972 54-4559429 [email protected] www.orel-tech.com OSRAM Hellabrunner Strasse 1 Munchen, 81543 Germany +49 8962130 www.osram.info Oxford PV Begbroke CIE Begbroke Science Park Begbroke Hill Begbroke, Oxfordshire, OX51PF United Kingdom +44 1865 309618 www.oxfordpv.com

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SUPPLIERS’ DIRECTORY – Company Directory

PakSense 6223 N. Discovery Way Suite 120 Boise, ID, 83713 US 208-489-9010 [email protected] www.paksense.com Paper Battery Company 45 Ferry St. Troy, NY, 12180 US 518-331-8078 www.paperbatteryco.com PARC (Palo Alto Research Center), a Xerox company 3333 Coyote Hill Road Palo Alto, CA, 94304 US 650-812-4000 [email protected] www.parc.com Paru Co., Ltd. 42-2 Sunchun Industrial Complex Seoul, 540813 South Korea +82 617534852 [email protected] www.paru.co.kr PCAS 725 Trotter Saint Jean sur Richelieu, QC, J3B8J8 Canada 450-348-0901 francis.belanger @pcascanada.com www.pcas.com PDC Corp. 13880 Del Sur St. San Fernando, CA, 91340 US 818-897-1111 www.pdcorp.com Peratech Holdco Ltd Old Repeater Station Brompton on Swale Richmond, DL10 7JH United Kingdom +44 01748 813670 [email protected] www.peratech.com Perpetuus Carbon Technologies Limited Unit 7 Parc Amanwy, Ammanford, Carmarthenshire Ammanford, SA18 3EZ United Kingdom +44 01269 598400 [email protected] perpetuusam.com

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Phoseon Technology 7425 NW Evergreen Parkway Hillsboro, OR, 97124 US 503-439-6446 www.phoseon.com Piezotech, an Arkema Group Company Arkema-CRRA Rue Henri Moissan Pierre-Benite, 69493 France +33 0472398703 [email protected] www.piezotech.eu Plastic Logic Germany An der Bartlake 5 Dresden, 01099 Germany +49 0351 883440 [email protected] www.plasticlogic.com Poly-Ink 27, Boulevard Louise Michel Gennevilliers, 92230 France +33 141114510 Polyera Corporation 8025 Lamon Ave., Suite 140 Skokie, IL, 60077 US 847-677-7517 www.polyera.com PolyIC GmbH & Co. KG Tucherstrasse 2 Fuerth, 90763 Germany +49 0911 202490 [email protected] www.polyic.com Polyonics Inc. 28 Industrial Park Drive Westmoreland, NH, 03467 US 603-352-1415 [email protected] www.polyonics.com PolyPhotonix Ltd. Netpark Discovery 1, William Armstrong Way, Sedgefield Durham, TS21 3FH United Kingdom +44 01740669151 [email protected] www.polyphotonix.com PPG Industries 125 Colfax St. Springdale, PA, 15144 US 888-774-2774 www.ppg.com

PragmatIC Unit 322 Cambridge Science Park Milton Road Cambridge, CB4 0WG United Kingdom +44 01223 855010 [email protected] www.pragmaticprinting.com Praxair, Inc. 39 Old Ridgebury Road Danbury, CT, 06810 US 716-879-4077 [email protected] www.praxair.com Preco Inc. 9705 Commerce Parkway Lenexa, KS, 66219 US 913-541-0066 www.precoinc.com Prelonic Technologies Lannergasse 7 Linz, 4040 Austria +43 06647 686246 [email protected] www.prelonic.com Printability and Graphic Communications Institute 999 Émile-Journault Ave East Montrea, QC, H2M 2E2 Canada 514-389-5061 [email protected] www.i-ci.ca Printed Electronics Consulting 265 Viennawood Drive Rochester, NY, 14618 US 585-271-2391 [email protected] www.ElectronicsPrinting.com Printed Electronics Ltd. Invotec Building Hedging Lane Birmingham, B77 5HH UK +44 01827 263338 [email protected] www.printedelectronics.com PrintoCent Kaitoväylä 1 Oulu, 90571 Finland +358 401494006 [email protected] www.printocent.net Promethean Particles Ltd. Unit 1-3 Genesis Park Midland Way Nottingham, NG7 3EF UK +44 1159 678119 [email protected] www.prometheanparticles.co.uk

www.printedelectronicsnow .com

Protavic America, Inc. 8 Ricker Ave. Londonderry, NH, 03053 US 603-623-8626 www.protavicamerica.com Prototype & Production Systems, Inc. 13860 Industrial Park Blvd. Plymouth, MN, 55411 US 763-557-9348 www.prototypesys.com Pruftechnik Machinery Service 22 West Church St. Blackwood, NJ, 08012 US 856-401-3095 www.pruftechnik-service.com PST Sensors 102 Gateway Park, Berkley Road Ndabeni Cape Town, 8405 South Africa +27 0213000037 [email protected] www.pstsensors.com PV Nano Cell Ltd. 8 Hamasger St. Migdal Ha’Emek, 2310102 Israel +972 04-654-6881 [email protected] www.pvnanocell.com QD Vision Inc. 29 Hartwell Ave. Lexington, MA, 02421 US 781-652-7400 [email protected] www.qdvision.com Quantum Materials STAR Park 3055 Hunter Road San Marcos, TX, 78666 US 858-456-7300 [email protected] www.qmcdots.com QuantumWise A/S Fruebjergvej 3 Copenhagen , DK-2100 Denmark +45 69901888 [email protected] www.quantumwise.com RAHN AG Dorflistrasse 120 Zurich, 8050 Switzerland +41 0443154200 [email protected] www.rahn-group.com

Fall 2016

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SUPPLIERS’ DIRECTORY – Company Directory

Raymor Industries Inc. 3765 La Vérendrye Boisbriand, QB, J7H 1RB Canada 450-434-6266 [email protected] www.raymor.com

SAM North America, LLC 31 County Route 59 Phoenix, NY, 13135 US 315-934-4287 [email protected] www.sam-na.com

Renesas Electronics Corporation 2801 Scott Boulevard Santa Clara, CA, 95050 US 408-588-6000 www.renesas.com

Samsung Cheil Industries 332-2 Gocheon-dong, Uiwang-si Gyeonggi-do South Korea +82 31-596-3114 www.samsungchemical.com

RheoSense, Inc. 2420 Camino Ramon, Suite 240 San Ramon, CA, 94583 US 925-866-3801 [email protected] www.rheosense.com

Sartomer Americas 502 Thomas Jones Way Exton, PA, 19341 US 610-363-4100 [email protected] www.sartomer.com

Rieke Metals, LLC 1001 Kingbird Road Lincoln, NE, 68521 US 402-434-2775 [email protected] www.riekemetals.com

SCHMID Technology GmbH Robert-Bosch-Str. 32-36 Freudenstadt , 72250 Germany +49 7441538-8816 www.schmid-group.com

RK PrintCoat Instruments Ltd Litlington Royston, Hertfordshire Cambridge, SG8 0QZ United Kingdom +44 01763852187 [email protected] www.rkprint.com RR Donnelley 35 West Wacker Drive Chicago, IL, 60601 US 800-742-4455 www.rrdonnelley.com Saati Americas 201 Fairview St. Fountain Inn, SC, 29644 US 864-862-4488 [email protected] www.saati.com SAES Getters S.p.A. Viale Italia, 77 Lainate, 20020 Italia +39 0293 178285 [email protected] www.saes-group.com Sakurai USA, Inc. 1700 N. Basswood Drive Schaumburg, IL, 60173 US 847-490-9400 [email protected] sakurai.com

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Schober USA 4690 Industry Drive Fairfield, OH, 45014 US 513-489-7393 www.schoberusa.com SchoellerTechnocell GmbH & Co.KG Burg Gretesch Osnabruck, 49086 Germany +49 054138000 [email protected] www.felix-schoeller.com SCHOTT North America, Inc. 2260 Lava Ridge Court, Suite 102 Roseville, CA, 95661 US 916-7743000 www.us.schott.com Schreiner Group GmbH & Co.KG Bruckmannring 22 Oberschleissheim, 85746 Germany +49 8931584-5634 www.schreiner-group.com Scrona Sonneggstrasse 3 Zurich, 8092 Switzerland +41 446322010 [email protected] www.scrona.com SDI, LLC 21 Morgan Irvine, CA, 92618 US 949-583-1001 [email protected] www.sdinetwork.com

Secure RF 100 Beard Sawmill Road Suite 350 Shelton, CT, 06484 US 203-227-3151 [email protected] www.securerf.com Sefar AG Hinterbissaustrasse 12 Heiden, 9410 Switzerland +41 0718985700 [email protected] www.sefar.com SEMI 3081 Zanker Road San Jose, CA, 95134 US 408-943-6900 www.semi.org Semilab USA 101 Billerica Ave., Building 5, Suite 105 North Billerica, MA, 01821 US 508-647-8420 [email protected] www.semilab.com Sensing Tex, S.L. Fabra i Puig 474, Local 2 Barcelona, 08042 Spain +34 9342 81856 [email protected] www.sensingtex.com Sensiron Laubisruetistrasse 50 Zurich, 8712 Switzerland +44 3064000 [email protected] www.sensirion.com Sensor Films Inc. 687 Rowley Road Victor, NY, 14564 US 585-738-3500 peter.hessney @sensorfilmsinc.com www.sensorfilmsinc.com Sensoria 16225 NE 87th St. Suite A-10 Redmond, WA, 98052 US 425-533-2928 [email protected] www.sensoriafitness.com Shamrock Technologies Foot of Pacific Street Newark, NJ, 07114 US 973-242-2999 OPE@ Shamrocktechnologies.com www.shamrocktechnologies.com

www.printedelectronicsnow .com

Shepherd Technologies 4539 Dues Drive West Chester, OH, 45246 US 513-454-1261 [email protected] www.shepherdtechnologies.com Si-Cal Technologies Inc. 11 Walkup Drive Westborough, MA, 01581 US 508-898-1800 [email protected] www.si-cal.com SIJTechnology, Inc. 5-9-5 Tokodai, Tsukuba Ibaraki, 300-8656 Japan +81 29-896-5110 [email protected] www.sijtechnology.com/en Smartkem Ltd. Optic Technium Fford William Morgan St. Asaph Business Park St. Asaph, LL17 OJD United Kingdom +44 01745 535190 [email protected] www.smartkem.com SMARTRAC Technology Group Strawinskylaan 851 Amsterdam, 1077 XX The Netherlands +31 0203050150 [email protected] www.smartrac-group.com Society for Imaging Science & Technology 7003 Kilworth Lane Springfield,VA, 22151 US 703-642-9090 [email protected] www.imaging.org SolarWindow 1050 Connecticut Avenue NW 10th Floor Washington, DC, 20036 US 800-213-0689 www.solarwindow.com Solvay Specialty Polymers Viale Lombardia, 20 Bollate, 20021 Italia +39 02290921 www.solvay.com Sonoplot, Inc. 3030 Laura Lane, Suite 120 Middleton, WI, 53562 US 608-824-9311 [email protected] www.sonoplot.com 45

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SUPPLIERS’ DIRECTORY – Company Directory

SPGPrints BV Raamstraat 1-3 Boxmeer, 5831 AT The Netherlands +31 485599550 www.spgprints.com STMicroelectronics 30 Corporate Drive Suite 300 Burlington, MA, 02492 US 781-861-2650 AME_BO_West_Inquiries @list.st.com www.st.com Sumitomo Chemical Co., Ltd. 27-1, Shinkawa 2-chome, Chuo-ku Tokyo, 104-8260 Japan +81 355435156 www.sumitomo-chem.co.jp/ english

Sun Chemical Corporation 35 Waterview Blvd. Parsippany, NJ, 07054-1285 US 973-404-6000 advancedmaterials@ sunchemical.com www.sunchemical.com Sun Chemical Advanced Materials is a proven and trusted supplier of conductive inks and coatings, dielectrics, resists, barrier coatings and other specialty materials. See our ad on Cover 2! SunaTech Inc. 398 Ruoshui Road bioBAY, Suzhou Industrial Park Suzhou, Jiangsu Province, 215125 China +86 51262872180 www.sunatech.com Sunchon National University 315 Maegok, Suncheon Jeonnam, 540-742 South Korea +82 61-750-5434 www.sunchon.ac.kr

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Sung An Machinery Co., Ltd. 33, Madogongdan-ro 6gil, Mado-myeon Hwaseong-si, Gyeonggi-do, 445-862 South Korea +82 314919741 [email protected] www.sungan.net Suzhou Institute of Nanotech, Printable Electronics Research Center 398 Ruo Shui Road, Dushu Lake High Suzhou, 215123 China +86 51262872705 www.perc-sinano.com Synaptics 1251 McKay Drive San Jose, CA, 95131 US 408-904-1100 [email protected] www.synaptics.com T+Ink, Inc. 244 W. 54th St., Ninth Floor New York, NY, 10019 US 212-957-2700 [email protected] www.t-ink.com Tactile Components, Inc. 5623 Coronet Street #100 Kalamazoo, MI, 49009 US 269-870-7231 [email protected] www.tactilecomponents.com Tactonic Technologies 45–50 30th St., 7th Floor, Suite 15 Long Island City, NY, 11101 US 917-714-8698 [email protected] www.tactonic.com TactoTek Takatie 6 Kempele, 90440 Finland +358 0504621212 [email protected] www.tactotek.com/ Taiyo Ink Mfg. Co. Ltd. 2675 Antler Drive Carson City, NV, 89701 US 775-461-8432 [email protected] www.taiyo-america.com Tampere University of Technology Korkeakoulunkatu 10 Tampere, FI-33720 Finland +358 3311511 www.tut.fi/en

Tangio Printed Electronics 100-55 Gostick Place BC,V7M 3N2 Canada 604-988-1125 [email protected] www.tangio.co Team NEO 737 Bolivar Road, Suite 2000 Cleveland, OH, 44115 US 216-363-5400 www.teamneo.org Technical University of Darmstadt Karolinenplatz 5 64289 Darmstadt Germany +49 615116-01 www.tu-darmstadt.de Technion - Israel Institute of Technology Technion City Haifa, 32000 Israel +972 4-8292111 www.technion.ac.il Techprint Inc. 137 Marston St. Lawrence, MA, 01841 US 978-975-1245 [email protected] www.techprintinc.com

Thomas Swan & Co. Ltd. Rotary Way Durham, DH8 7ND United Kingdom +44 01207599380 [email protected] www.thomas-swan.co.uk TKK Finland (Helsinki University of Technology) Otakaari Espoo, FI-02150 Finland +358 9 47001 www.tkk.fi/en/ TNO Schoemakerstraat 97, Building A Delft, 2628 VK The Netherlands +31 152696900 www.tno.nl Toddco 3 28661 Sand Island Way Menifee, CA, 92584 US 619-286-3326 [email protected] www.toddco.com Tokusen USA Inc. 1500 Amity Road Conway, AR, 72033 US 501-327-6800 www.tokusenusa.com

Tekna 2935, Industriel Blvd. Sherbrooke, QC, J1L 2T9 Canada 819-820-2204 www.tekna.com

Topflight Corporation 277 Commerce Drive Glen Rock, PA, 17327 US 717-227-5400 [email protected] www.topflight.com

Tekra, A Division of EIS, Inc. 16700 West Lincoln Ave. New Berlin, WI, 53151 US 800-448-3572 [email protected] www.tekra.com

Toppan Printing (UK) Ltd. 128 Queen Victoria Street London, EC4V4BJ United Kingdom +44 2072 130500 www.toppan.co.uk

THIEME GmbH & Co. KG Robert-Bosch-Strasse 1 Teningen, D-79331 Germany +49 076415830 [email protected] www.thieme.eu/en/home

Toyo Ink SC Holdings Co., Ltd. 7-1, Kyobashi 3-chome, Chuo-ku Tokyo, 104-8377 Japan +81 03-3272-5720 [email protected] www.toyoinkgroup.com/en/

Thin Film Electronics ASA Henrik Ibsens gate 100 Oslo, NO-0230 Norway +47 23 27 51 59 [email protected] www.thinfilm.no See our ad on Cover 3!

www.printedelectronicsnow .com

Toyobo Co., Ltd. 2-2-8, Dojimahama, Kita-ku Osaka, 530-8230 Japan +81 663483567 www.toyobo-global.com

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SUPPLIERS’ DIRECTORY – Company Directory

Trelleborg Applied Technologies Halfpenny Lane Knaresborough Leeds, HG5 OPP United Kingdom +44 01423862677 paul.habberfield @trelleborg.com www.trelleborg.com/ applied-technologies

University of Sheffield Laboratory of Applied Inkjet Printing, D 03 Royal Exchange Manufacturing Building, 64 Garden St. Sheffield, S1 4BJ United Kingdom
+44 01142 227738 [email protected] www.adamcentre.co.uk/

TSE Troller Aareweg 6 Murgenthal, 4853 Switzerland +41 0629174010 [email protected] www.tse-coating.ch

University of the West of England Frenchay Campus Coldharbour Lane Bristol, BS16 1QY United Kingdom +44 01173 282147 [email protected] www.uwe.ac.uk

Unijet Co., Ltd. Delice Bldg. A, 1st Floor 164 Sagimakgol-ro, Jungwon-gu Songgnam-si, Songnam, 463-010 South Korea +82 31-743-7732 [email protected] www.unijet.co.kr Universal Display Corp. 375 Phillips Blvd. Ewing, NJ, 08618 US 609-671-0980 www.udcoled.com University of California – Berkeley 571 Cory Hall MC 1770 Berkeley, CA, 94720 US 510-643-4535 www.eecs.berkeley.edu University of California Los Angeles (UCLA) Department of Physics and Astronomy 475 Portola Plaza Los Angeles, CA, 90095 US 310-825-4321 www.ucla.edu University of Massachusetts Amherst 710 N. Pleasant St 374 LGRT Amherst, MA, 01003 US 413-545-5264 [email protected] chm.pse.umass.edu

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Universty of Massachusetts Lowell 220 Pawtucket St. Lowell, MA, 01854 US 978-934-4000 uml.edu VARTA Microbattery Inc. Daimlerstrasse 1 Ellwangen, 73479 Germany +49 7961921-0 www.varta-microbattery.com Vinci Technologies 27b rue du portParc de l’ile Nanterre, 92000 France +33 01412 79668 [email protected] www.vinci-technologies.com Visualplanet Camboro Business Park, Oakington Road Girton Cambridge, CB3 0QH United Kingdom +44 01223 202949 [email protected] www.visualplanet.biz Vitriflex 2350 Zanker Road San Jose, CA, 95131-1115 US 408-468-6775 [email protected] www.vitriflex.com

Vorbeck Materials Corp. 8306 Patuxent Range Road, Suite 105 Jessup, MD, 20794 US 301-497-9000 www.vorbeck.com VTT Technical Research Centre of Finland Vuorimiehentie 5 Espoo, FI-02044 Finland +358 20722111 www.vtt.fi Web Handling Research Center Oklahoma State University 218 Engineering North Stillwater, OK, 74078 US 405-744-5900 [email protected] webhandling.okstate.edu/ Welsh Centre for Printing and Coating (WCPC) Swansea University Singleton Park Swansea, SA2 8PP Wales +44 01792 295091 www.swan.ac.uk/printing/ Werner Mathis AG Ruetisbergstrasse 3 Zurich, 8156 Switzerland +41 0448525050 [email protected] mathisag.com Western Michigan University 4601 Campus Dr. Room A217 Chemical and Paper Engineering Department Kalamazoo, MI, 49008-5462 US 269-276-3514 [email protected] www.wmich.edu/pci Wilson-Hurd Manufacturing Co., Inc. 311 Winton St. Wausau, WI, 54403 US 715-845-9221 [email protected] www.wilsonhurd.com Wisepower Co., Ltd. 1430 O’Brien Drive, Suite G Menlo Park, CA, 94025 US 650-462-1935 eng.wisepower.co.kr/

www.printedelectronicsnow .com

XENON Corporation 37 Upton Dr. Wilmington, MA, 01887 US 978-661-9033 [email protected] www.xenoncorp.com XENON is the world leader in Pulsed Light technology used in a variety of industrial, medical and research environments. XENON works closely with clients to discover and perfect new applications of Pulsed Light. The company’s high-performance systems are used for wide range of printed electronics sintering, sterilization, curing, and food enhancement applications. With 50 years of experience in Pulsed Light technology, XENON has thousands of systems operating on industrial production lines worldwide. See our ad on page 9! Xerox 45 Glover Ave. Norwalk, CT, 06856 US 203-968-3000 [email protected] www.xerox.com Xerox Research Centre of Canada Mississauga, ON, L5K 2L1 Canada 905-823-7091 xrcc.external.xerox.com Xymox Technologies 9099 West Dean Road Milwaukee, WI, 53224 US 414-362-9000 www.xymox.com Ynvisible Rua Mouzinho de Albuquerque Cartaxo, 2070-104 Portugal +35 1243103174 www.ynvisible.com Zebra Technologies 3 Overlook Point Lincolnshire, IL, 60069 US 847-634-6700 [email protected] www.zebra.com

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personnel

Melissa Grupen-Shemansky Appointed SEMI’s CTO for Flexible Electronics and Advanced Packaging

S

EMI announced the appointment of Melissa GrupenShemansky, Ph.D., as CTO for the FlexTech Group and for SEMI’s Advanced Packaging program. She will oversee FlexTech’s flexible hybrid electronics (FHE) and Nano-Bio Manufacturing Consortium (NBMC) R&D programs and technology advisory councils. Grupen-Shemansky will also serve as technical advisor to SEMI’s Advanced Packaging initiative and as technical liaison to NextFlex. Starting her career at Motorola in semiconductor research and development, Grupen-Shemansky held various management positions for more than 10 years in silicon and gallium arsenide device fabrication, packaging, interconnect and system integration. Following Motorola, she was the director of interconnect technology and design engineering at Lucent, Bell Labs (Agere Systems), VP of packaging and design at Spansion, and SVP of engineering in Advanced Nanotechnology Solutions, a startup in 3D and cybersecurity.

ZEBRA TECHNOLOGIES APPOINTS TOM BIANCULLI AS CTO Zebra Technologies named Tom Bianculli to its newly created chief technology officer (CTO) position to advance its leadership in the growing market of Enterprise Asset Intelligence (EAI). The appointment of Bianculli to CTO is a strategic move to address increasing demand for visibility solutions and expand the impact of Zebra’s innovation across industries. Bianculli most recently served as VP of Tom Bianculli Zebra’s Emerging Technology Office.

TAUSEEF BASHIR JOINS THINFILM AS EVP GLOBAL SALES Thin Film Electronics ASA (Thinfilm) announced changes to its management team. Tauseef Bashir has been named EVP global sales. Bashir joins Thinfilm from Amazon.com, where he served as chief sales officer. Prior to Amazon.com, he held executive and senior sales positions with a number of leading firms, including FAST (Microsoft), Autonomy, Inc. (HP), and Ramp, Inc. (Cxense). Bashir will be based out of Thinfilm’s Silicon Valley office in San Jose, CA. Erwan Le Roy was promoted to the role of EVP business development and GM, NFC Solutions and Smart Sensor Products. Le Roy previously served as the company’s SVP strategic marketing and GM Sensor Platforms. 48

48 PE Personnel 1016.indd 48

BRIGHTVOLT NAMES JAMES POPE VP - POWER SOLUTIONS BrightVolt announced the appointment of James Pope as VP Power Solutions. In his new post, Pope will manage the growth and development of BrightVolt’s battery sales and channel distribution as BrightVolt gears up for substantial growth in IoT, focusing on the medical, sensors, labels, wearables and smart card markets. BrightVolt has 75 patents with more on the way, and has sold more than 10 million batteries across the globe. Pope brings with him 28 years of experience in the battery and power industry, where he has generated significant revenue growth for both domestic and international sales throughout his career. Pope joins BrightVolt from VARTA, where he led national business development.

MIDIAGNOSTICS NAMES DR. HILJA IBERT AS CEO miDIAGNOSTICS announced the appointment of Dr. Hilja Ibert as CEO. Dr. Ibert brings decades of expertise in managing medical diagnostics companies to this venture, which combines the expertise of imec and Johns Hopkins University. miDIAGNOSTICS aims to develop diagnostic tests integrated in silicon chips. With a small volume of blood, this will allow point-of-need on-chip detection of cells, proteins, nucleic acids and/or small molecules. Within minutes, the data resulting from these complex tests will be sent to smartphones or other mobile devices, where they will be processed and displayed. This will bring complex diagnostic tests to the local point of need at an affordable cost, with a high level of comfort and confidence for both patients and caregivers. Before joining miDIAGNOSTICS, Dr. Ibert was VP and GM of Hologic Diagnostics Solutions International. Previously, she held various positions at Becton Dickinson and bioMerieux.

KATEEVA PROMOTES TWO EXECUTIVES Kateeva announced two executive promotions: Dr. Conor Madigan adds COO to his current role of president, and Eli Vronsky becomes chief product officer. Madigan adds global customer satisfaction to his new responsibilities as president and COO. This includes field operations in Korea, China, Taiwan and Japan. He will continue to manage global marketing and manufacturing, as well as Kateeva’s R&D organization. Also, he’ll lead Kateeva’s expanding Intellectual Property department. As chief product officer,Vronsky leads the company’s engineering team.Vronsky is chief architect of the YIELDjet printing system architecture. n

www.printedelectronicsnow .com

Fall 2016

11/2/16 10:52 AM

PE products

PragmatIC Creates FlexLogIC System

P

ragmatIC has been awarded €1.6 million funding under the European Union’s Horizon 2020 SME Instrument program, for development of its FlexLogIC equipment announced in April. FlexLogIC transfers PragmatIC’s proven end-to-end flexIC production process into a self-contained, fully automated, modular “fab-in-a-box” for high throughput manufacturing. FlexLogIC offers capacity for billions of flexICs at a capital cost between 100 and 1000 times lower than a silicon fab. The FlexLogIC design study was supported by the European Union’s Horizon 2020 SME Instrument Phase 1 (grant agreement number 696266). PragmatIC has now been awarded further funding under the SME Instrument Phase 2 (grant agreement number 726029).

SMARTRAC INTRODUCES INTRACE CANNULA READY-TO-USE ANIMAL ID IMPLANTING KIT SMARTRAC announced the market launch of InTrace Cannula, the first member of the new InTrace product family. The Animal ID product solution is an enhanced transponder implanting system for easy and efficient RFID tagging of most animal species including pets, cattle, sheep, horses, fish, birds or reptiles. The thin, stainless-steel cannula features a facet cut that ensures a fast and easy injection. The cannula package comes with a luer lock connector, a mandrin and a protective cap at the needle tip. The system complies with international ISO standards 11784/11785 and is available globally with three different sizes of transponder, which is made from biocompatible glass. Optionally, transponders can be delivered with a parylene coating, which stabilizes the tag’s position under the animal’s skin. In addition, the data contained in the animal transponder is suitable for full integration into SMARTRAC’s cloud services platform SMART COSMOS. Fall 2016

49 New Products 1116.indd 49

EMERSON CARGO SOLUTIONS ANNOUNCES ULTRANFC TEMPERATURE MONITORING LABEL Emerson launched its UltraNFC temperature monitoring label. Provided via the recent acquisition of PakSense, these labels monitor time and temperature of perishable items during transportation and storage, and then transfers this data via short-range near field communications (NFC) to supported Android devices. “These provide quick and easy data downloads for anyone monitoring the cold chain,” said Frank Landwehr,VP and GM, cargo solutions, Emerson Commercial & Residential Solutions. “We’ve eliminated the need for proprietary readers and cradles and have leveraged Android devices.” Labels sample temperature every minute for highly accurate temperature reads and are encased in a waterproof, plastic pouch. The labels can be placed at the pallet or carton level, or directly on the perishable product.

SFI ANNOUNCES ROLL-TO-ROLL PRINTING CAPABILITY IN STARLIGHT PLATFORM Sensor Films Incorporated (SFI) announced a new, high speed roll-to-roll configuration of its Starlight digital manufacturing and printing system, enabling high volume digital deposition of decorative graphic and functional inks on flexible substrates. The new Spitfire Digital Manufacturing and Printing Platform is a roll-to-roll inkjet deposition system that uses industrial inkjet technology to pattern materials such as UV inks, resists, conductors and dielectrics serving the digital display, specialty graphics and printable electronics industries. Utilizing stainless steel construction, Spitfire’s printheads are compatible with virtually any type of ink chemistry, including solvent, aqueous and UV inks.

IMPINJ LAUNCHES NEW MONZA RAIN RFID TAG CHIP FOR AUTOMOTIVE Impinj announced enhancements to its ItemSense software to ease the deployment, management and monitoring of RAIN RFID solutions. It also unveiled the Monza 4i tag chip, targeted at automotive applications. ItemSense software enables businesses to quickly and easily integrate ItemIntelligence, the identity, location and authenticity of everyday items, into enterprise applications. Impinj’s new Monza 4i chip offers 256-bit EPC memory and 480-bit user memory for applications that require extended serial numbers, such as Vehicle Identification Numbers (VINs), coupled with large user memory. n

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49

11/2/16 10:52 AM

meetings

November 2016 Nov. 16-17: Printed Electronics USA 2016, Santa Clara, CA.

More info: IDTechEx, +44 (0)1223 810270; email: c.clare@IDTechEx. com; web: www.idtechex.com

December 2016 Dec. 12-14: SEMICON Japan 2016, Tokyo.

More info: SEMI Japan, +81 3-32225988; email: jcustomer@semi. org; web: www.semiconjapan.org

January 2017 Jan. 5-8: CES 2017, Las Vegas, NV.

More info: Consumer Technology Association. 866-233-7968; email: [email protected]; web: [email protected] Jan. 6: Printed Electronics: Key Enabling Technology for IoT, Las Vegas, NV.

More info: OE-A, +49 69 66031856; +81-3-3219-3568; email: [email protected]; web: www.oe-a.org

More info: Converting Technical Institute, +81 3-3219-3568; email: [email protected]; web: www.convertechexpo.com/?ref=c3

March 2017 March 27: 13th Annual OE-A General Assembly/40th OE-A Working Group, Munich, Germany.

More info: OE-A, +49-69 6603 1336; email: klaus.hecker@oe-a. org; web: www.oe-a.org March 28-30: LOPEC 2017, Messe München, Munich, Germany.

More info: OE-A, +49-69 6603 1336; email: klaus.hecker@oe-a. org; web: www.lopec.com.

May 2017 May 9-11: RFID Journal Live! 2017, Phoenix, AZ.

More info: RFID Journal, 212584-9400 ext. 515; email: LiveReg@rfidjournal. com; web: www.rfidjournal.com

February 2017

May 10-11: Printed Electronics Europe 2017, Berlin, Germany.

Feb 15-17: Printable Electronics, Tokyo, Japan.

More info: IDTechEx, +44 (0)1223 810270;

email: c.clare@IDTechEx. com; web: www.idtechex.com May 21-26: SID Display Week 2017, Los Angeles, CA.

More info: Society for Information Display (SID), +1 212 460-8090 ext. 202; email: [email protected]; web: www.displayweek.org

June 2017 June 19-22: 2017FLEX Conference, Monterey, CA.

More info: FlexTech Alliance, 408 577-1300; email: [email protected]; web: www.flextech.org

July 2017 July 3-6: 10th International Symposium on Flexible Organic Electronics (ISFOE17), Thessaloniki, Greece.

More info: Professor S. Logothetidis, +30 2310 998174; email: [email protected]; web: www.nanotexnology.com July 11-13: SEMICON West 2017, Moscone Center, San Francisco, CA.

More info: SEMI, 408 943-6900; email: [email protected]; web: www.semiconwest.org

ad index Advertiser

Page No.

IDTechEx Kroenert Lawter Inc. LOPEC Novacentrix Sun Chemical Thin Film Electronics XENON Corporation

7 www.PrintedElectronicsEurope.com 21 www.kroenert.de 3 www.lawter.com 11 lopec.com Cover 4 www.novacentrix.com Cover 2 www.sunchemical.com Cover 3 www.excellentelectronics4sale.com 9 www.xenoncorp.com

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www.printedelectronicsnow .com

Website

Fall 2016

11/2/16 11:45 AM

Using Printed Electronics for Affordable, Item-Level Intelligence

Thinfilm Analytics

NFC Solutions Revolutionary wireless tags that combine the instant interactivity of Near Field Communication (NFC) with the advantages of printed electronics technology.

SpeedTapTM tags give physical products a digital identity. OpenSenseTM labels help fight product diversion, counterfeiting, and unauthorized refills.

Cloud-based Marketing Platform Thinfilm’s NFC tags and cloud-based marketing platform helps brands connect to their customers.

www.thinfilm.no Thin Film Electronics, Inc. 2865 Zanker Road, San Jose, California 95134

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