2117-3
This document was uploaded by user and they confirmed that they have the permission to share it. If you are author or own the copyright of this book, please report to us by using this DMCA report form. Report DMCA
Overview
Download & View 2117-3 as PDF for free.
More details
- Words: 356
- Pages: 1
SAMSUNG Semiconductor - products - DRAM - graphics memory Case 5:05-cv-00334-RMW Document 2117-3 Filed 08/29/2008
Page 1 of 1 Page 1 of 1
search
home > products > DRAM > graphics memory > GDDR5 components > K4G52324FG
DRAM
product search
DDR3 SDRAM
Graphics Memory > GDDR5 > K4G52324FG
DDR2 SDRAM DDR SDRAM
package & packing
production & availability
part no. search RoHS information
tip -
SDRAM The data sheet of this product is either in preparation or is not effective yet. For more details about product specifications or technical files, please inquire through 'Contact us'
Mobile SDRAM XDR™DRAM RDRAM®
parametric search
graphics memory
ordering code information
package & packing
GDDR5 components GDDR4 components
part number
K4G52324FG-HC05
K4G52324FG-HC06
GDDR3 components
package type
FCFBGA
FCFBGA
packing
Tray
Tray
graphics memory product guide
GDDR1 components
pins
170
170
part number decoder
EOL products
package size
12.0X14.0
12.0X14.0
UtRAM(PSRAM)
marking code
K4G52324FG-HC05
K4G52324FG-HC06
compliance with RoHS
Halogen Free
Halogen Free
related document
gDDR3 components gDDR2 components
consumer DRAM
related link DRAM application notes label & code information packing information
production & availability
package information
part number
K4G52324FG-HC05
K4G52324FG-HC06
life cycle
EMERGING
EMERGING
die revision
TRANSITIONING IN
TRANSITIONING IN
MOQ (small box)
0
0
MOQ (large box)
0
0
qual sample
Q1/2008
Q1/2008
mass production
Q2/2008
Q2/2008
last time buy
TBD/TBD
TBD/TBD
last time ship
TBD/TBD
TBD/TBD
memory brochures
replacement part number [note] Life cycle identifies the device's overall life expectancy as being either emerging, production, or EOL (life cycle is independent of and does not correspond to die version). Die revision identifies the die version's production status as being either under development, transitioning In, mass production, transitioning out, or old version. Replacement part number is a recommended SAMSUNG part number for replacing EOL or old version devices.
RoHS information For more information, please click the button next to the product name. material declaration sheet
does not contain hazardous materials defined in China RoHS
declaration letter
contains hazardous materials defined in China RoHS
K4G52324FG-HC05 is Lead-free, RoHS compliant & Halogen-free. K4G52324FG-HC06 is Lead-free, RoHS compliant & Halogen-free.
www.samsung.com
privacy
legal
sitemap
contact us
Copyright© 1995-2008 SAMSUNG. All rights reserved.
http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=675&partnum=... 8/29/2008
Page 1 of 1 Page 1 of 1
search
home > products > DRAM > graphics memory > GDDR5 components > K4G52324FG
DRAM
product search
DDR3 SDRAM
Graphics Memory > GDDR5 > K4G52324FG
DDR2 SDRAM DDR SDRAM
package & packing
production & availability
part no. search RoHS information
tip -
SDRAM The data sheet of this product is either in preparation or is not effective yet. For more details about product specifications or technical files, please inquire through 'Contact us'
Mobile SDRAM XDR™DRAM RDRAM®
parametric search
graphics memory
ordering code information
package & packing
GDDR5 components GDDR4 components
part number
K4G52324FG-HC05
K4G52324FG-HC06
GDDR3 components
package type
FCFBGA
FCFBGA
packing
Tray
Tray
graphics memory product guide
GDDR1 components
pins
170
170
part number decoder
EOL products
package size
12.0X14.0
12.0X14.0
UtRAM(PSRAM)
marking code
K4G52324FG-HC05
K4G52324FG-HC06
compliance with RoHS
Halogen Free
Halogen Free
related document
gDDR3 components gDDR2 components
consumer DRAM
related link DRAM application notes label & code information packing information
production & availability
package information
part number
K4G52324FG-HC05
K4G52324FG-HC06
life cycle
EMERGING
EMERGING
die revision
TRANSITIONING IN
TRANSITIONING IN
MOQ (small box)
0
0
MOQ (large box)
0
0
qual sample
Q1/2008
Q1/2008
mass production
Q2/2008
Q2/2008
last time buy
TBD/TBD
TBD/TBD
last time ship
TBD/TBD
TBD/TBD
memory brochures
replacement part number [note] Life cycle identifies the device's overall life expectancy as being either emerging, production, or EOL (life cycle is independent of and does not correspond to die version). Die revision identifies the die version's production status as being either under development, transitioning In, mass production, transitioning out, or old version. Replacement part number is a recommended SAMSUNG part number for replacing EOL or old version devices.
RoHS information For more information, please click the button next to the product name. material declaration sheet
does not contain hazardous materials defined in China RoHS
declaration letter
contains hazardous materials defined in China RoHS
K4G52324FG-HC05 is Lead-free, RoHS compliant & Halogen-free. K4G52324FG-HC06 is Lead-free, RoHS compliant & Halogen-free.
www.samsung.com
privacy
legal
sitemap
contact us
Copyright© 1995-2008 SAMSUNG. All rights reserved.
http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=675&partnum=... 8/29/2008
