Special Semiconductor Devices Tunnel Diode Varactor Diode PIN Diode
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Tunnel Diode
high impurity concentration • Ordinary diode concentration-1part in 10^8 parts • Tunnel diode concentration-1part in 10^3 parts • negative resistance region that allows very fast switching speeds, up to 5 GHz • Materials used-Ga and GaAs
Tunneling phenomenon
Width of the junction barrier varies inversely as the square root of impurity concentration Quantum mechanism-Electron penetrate through the barriertunneling
V-I Characteristics of Tunnel
diode
Very good conductor in forward bias Huge current for small applied voltage Negative resistance region Low resistance device
Varactor Diode
voltage-controlled capacitor
w inversely proportional to C Forward bias –space charge width decreases and C increases Reverse bias- space charge width increases and C decreases Voltage-variable capacitance of p-n junction in reverse bias condition – useful in number of application Application based on Voltage-variable capacitance-varactors, varicaps or volacaps
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T
Characteristics of Varactor Diode
PIN Diode Intrinsic layer sandwitched between P and N regions Intrinsic layer offers high resistance Increase voltage- resistance reduces Intrinsic layer-advantages
• Decrease in capacitance between p & N region –(w inversely proportional to C) • Allows faster time response P
I
N
Characteristics of PIN Diode Forward
Reverse
Silicon Controlled Rectifier conventional rectifier controlled by a gate signal The main circuit is a rectifier, however the application of a forward voltage is not enough for conduction gate signal controls the rectifier conduction
construction
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SCR working Apply +ve voltage to anode w.r.t cathode J & J –forward biased J –reverse biased reverse Voltage appears across J Current through the device – reverse saturation current
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When I <0,Applied voltage increases – J reverse bias voltage increases current increases slowly until the breakover voltage (V ) increased At this point diode switches from OFF to ON state I >0, forward bias voltage applied to gate -V decreased; current increased SCR Switch ON controlled by I Once the SCR turned on- gate loses the control
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BO
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SCR Characteristics
Two Transistor Analogy
The general transistor equations are, I C = β I B + ( 1 + β ) ICBO I C = α I E + I CBO I E = IC + I B
I B = I E ( 1 − α ) − ICBO
C o n s id e rin g P N P tra n s is to r o f th e e q u iv a le n t c irc u it, I E 1 = I, A I C α =I,C1 IC B O = ∴
I B1
I C1 ,B O I B
I( A1 α =1 )
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α
I = 1 B
I C −B O(1
, =
)
C o n s id e r in g N P N t r a n s is t o f th e e q u iv a le n t c ir c u it, IC = 2I,C I B 2I,B = 2I E IK I C2 = α 2
I C2 = α 2 (
Ik IA)
I+C B O2 IG+
I(C2B) O2 +
From the equivalent circuit, we see that ∴ I C2 =I B1 ⇒ IA
α 2 I g + I CBO 1 + I CBO 2 = 1 − ( α 1 + α2)
If α + α =1;then I =∞ Anode suddenly reaches high value Device triggered from OFF state to ON state Regenerative characteristics α + α =1 and proper I I =I cause a flow of I T -ON state I = I ; T - switched ON Due to regenerative action if the gate signal removed the device keep on conducting
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C2
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B2
C2
B1
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Thyristor Ratings Latching current – minimum current required to latch or trigger device from OFF to ON state Holding current - minimum value of current to hold the device ON state gate current –current applied to the gate for control purpose Voltage safety factor=PIV/√ 2 x RMS value of operating voltage
SCR-Most important type of power semiconductor device. Highest power handling capability. Rating of 1200V / 1500A with switching frequencies ranging from 1KHz to 20KHz.
DIAC Construction
Bidirectional avalanche diode No control terminal Identical characteristics for both forward and reverse half Positive half cycle –MT1 +ve w.r.t MT2 Negative half cycle –MT2 +ve w.r.t MT1
characteristics of DIAC
At voltage less than the breakover voltage- small amount of leakage current flows through the deviceOFF state When voltage level reaches breakover voltage device starts conducting Exhibits –ve resistance characteristics
Unijunction Transistor(UJT)
The unijunction transistor(UJT) is a three terminal device with characteristics very different from the conventional 2 junction, bipolar transistor. bar of N type semiconductor material into which P type material has been diffused somewhere along its length
R is known as the interbase resistance, and is the sum of RB1 and RB2 RBB = RB1 + R (1) VRB1 is the voltage developed across RB1; this is given by the voltage divider rule: VRB1 = RB1 / RB1 + R x V (2)
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B2
B2
BB
VRB1 = RB1 / RBB x V The ratio RB1 / RBB is referred to as the intrinsic standoff ratio (η )
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