Silicon Capacitor
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Silica Valley dot Com Highlights on hi-tech products Today is Monday, August 10th, 2009 • • • • •
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Audio / video Computer hardware Industrial automation Electronic components Network equipment Power electronics Signal processing
World’s smallest and thinnest wirebondable silicon capacitors May 19th, 2008 • Related • Filed Under
OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced a wire-bondable miniature silicon chip capacitor targeted for RF Microwave, Multichip Module and Hybrid Microelectronics applications. OnChip’s SiC0101 device is built on silicon with a single wire-bondable pad on the top and metallization on the backside of the chip suitable for epoxy die attach. A layer of Silicon Nitride dielectric film is sandwiched between these two metal plates to form the capacitor.
OnChip’s high quality dielectric is deposited using proprietary processes to achieve capacitance values of 4.7pF to 22pF. This dielectric material offers high stability and Q values while exhibiting low temperature and voltage coefficients and extremely stable capacitance over a wide range of frequencies from 1MHz to several GHz. Additionally, their semiconductor construction provides an ultra-high Self-Resonant Frequency (SRF) and exceptionally low Equivalent Series Resistance (ESR). Intended to save space while providing superior electrical performance, OnChip’s SiC0101 single-wire capacitor is only 250um x 250um (10mils x 10mils or 0.25mm x 0.25mm) in size and is available as thin as 100um (4mils or 0.1mm). Other thicknesses (6mils and 8mils) are also available in this foot print. The wire bondable top pad consists of either Aluminum or Gold metallization. Back metal is typically Gold. Compared to conventional RF capacitors, OnChip’s SiC0101 offers extremely stable capacitance over a wide range of frequencies from 1MHz to several GHz. Additionally, their semiconductor construction provides an ultra-high Self-Resonant Frequency (SRF) and exceptionally low Equivalent Series Resistance (ESR). This thin film top to bottom contact MNOS capacitors provide an extremely stable and precise component for a variety of hybrid microelectronic and multichip module applications. Other applications include voltage-controlled oscillators, filter networks, matching networks in modules for wireless communications including mobile phones, cordless phones, and global positioning systems. Typical applications for the SiC0101 capacitor include voltage-controlled oscillators, filter networks, matching networks in modules for wireless communications including mobile phones, cordless phones, and global positioning systems.
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I am trying to find the way to connect 4 monitors to my computer. Right now I am using 2 ... NAM KUN KWAK | 27Feb09 | More
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Dear Sir, May i know the standard IEC (or) IEEE recommendations for RFI/EMI ... pratheeskumar | 28Jan09 | More
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dear sir as we are one of the machine manufacturers for agricultural application and we need sensors to ... ravindra | 21Jan09 | More
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We are developing our 3G Power integrated solution for WCDMA,CDMA200 and TD-SCDMA wireless BTS. We are very interesting in CCI ... QInZhengliang | 14Dec08 | More
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Please send me the price list for the following items: 1. Trimble NetR5 GPS with Geodetic antenna 2. Trimble NetR8 GPS with ... R Duarah | 12Nov08 | More
© Copyright Silica Valley dot Com 2008. All rights reserved.
Home About us Site map Submit product information & news RSS
• • • • • • •
Audio / video Computer hardware Industrial automation Electronic components Network equipment Power electronics Signal processing
World’s smallest and thinnest wirebondable silicon capacitors May 19th, 2008 • Related • Filed Under
OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced a wire-bondable miniature silicon chip capacitor targeted for RF Microwave, Multichip Module and Hybrid Microelectronics applications. OnChip’s SiC0101 device is built on silicon with a single wire-bondable pad on the top and metallization on the backside of the chip suitable for epoxy die attach. A layer of Silicon Nitride dielectric film is sandwiched between these two metal plates to form the capacitor.
OnChip’s high quality dielectric is deposited using proprietary processes to achieve capacitance values of 4.7pF to 22pF. This dielectric material offers high stability and Q values while exhibiting low temperature and voltage coefficients and extremely stable capacitance over a wide range of frequencies from 1MHz to several GHz. Additionally, their semiconductor construction provides an ultra-high Self-Resonant Frequency (SRF) and exceptionally low Equivalent Series Resistance (ESR). Intended to save space while providing superior electrical performance, OnChip’s SiC0101 single-wire capacitor is only 250um x 250um (10mils x 10mils or 0.25mm x 0.25mm) in size and is available as thin as 100um (4mils or 0.1mm). Other thicknesses (6mils and 8mils) are also available in this foot print. The wire bondable top pad consists of either Aluminum or Gold metallization. Back metal is typically Gold. Compared to conventional RF capacitors, OnChip’s SiC0101 offers extremely stable capacitance over a wide range of frequencies from 1MHz to several GHz. Additionally, their semiconductor construction provides an ultra-high Self-Resonant Frequency (SRF) and exceptionally low Equivalent Series Resistance (ESR). This thin film top to bottom contact MNOS capacitors provide an extremely stable and precise component for a variety of hybrid microelectronic and multichip module applications. Other applications include voltage-controlled oscillators, filter networks, matching networks in modules for wireless communications including mobile phones, cordless phones, and global positioning systems. Typical applications for the SiC0101 capacitor include voltage-controlled oscillators, filter networks, matching networks in modules for wireless communications including mobile phones, cordless phones, and global positioning systems.
Related products •
Not found at this time
Post a Response Name (required) Mail (will not be published) (required) Website
Submit Comment
• • o o o o o
Popular Most Comments Search Tags Archives
Popular o o o o o
PC/104-Plus single board computer Multi-monitor graphics cards for stretched desktop applications Digital output temperature sensor for DDR3 memory module applications New wireless all-in-one inkjet printers from Kodak BlackBerry Bold 9000 Smartphone
Most Comments
o o o o o
Integrated light-to-voltage sensor (3) Surge suppressors for data, communication and power (2) Coherent OTDR for detecting faults in optical submarine cables (1) Self-positioning handheld 3D laser scanner for medical applications (1) Multi-monitor graphics cards for stretched desktop applications (1)
Search go
Tags
Archives
Recent Comments o
I am trying to find the way to connect 4 monitors to my computer. Right now I am using 2 ... NAM KUN KWAK | 27Feb09 | More
o
Dear Sir, May i know the standard IEC (or) IEEE recommendations for RFI/EMI ... pratheeskumar | 28Jan09 | More
o
dear sir as we are one of the machine manufacturers for agricultural application and we need sensors to ... ravindra | 21Jan09 | More
o
We are developing our 3G Power integrated solution for WCDMA,CDMA200 and TD-SCDMA wireless BTS. We are very interesting in CCI ... QInZhengliang | 14Dec08 | More
o
Please send me the price list for the following items: 1. Trimble NetR5 GPS with Geodetic antenna 2. Trimble NetR8 GPS with ... R Duarah | 12Nov08 | More
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