Reliability Modeling And Optimization Of Mems Elements In

Reliability Modeling and Optimization of MEMS Elements in Various Devices Using Multi-Scale Concepts Rohit Pathak Satyadhar Joshi

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Introduction and Importance of this Work • The classical approaches play an important role in Micro Electro Mechanical Systems (MEMS) technology where the analysis is based on abstraction level theories and no comprehensive explanation of nano scale phenomenon are proposed. • It is proposed that High Performance Computing (HPC) if used with multi scale optimization library then the reliability calculation can be accelerated and also research in reliability of MEMS • In this work we have developed library where we can select the various physics at different level and then calculated reliability for better accuracy. In the proposed work, Modeling and Computation is performed using MATLAB distributed computing

RELIABILITY ANALYSIS OF MEMS DEVICES AND MULTISCALE MODELING • ABSTRACTION LAYERS IN MULTI-SCALE SETUP • Abstraction Scale / Properties • Nano CMOS 30-100nm Capacitance in CMOS • RF MEMS 100-500nm Properties of antenna • CNT 10-30 nm Conductance • Mechanical modeling 100-500nm, Electrical Modeling, Macro level

MEMS based system and identification for Reliability analysis Outputs V Inputs (Fuel)

Support

MEMS Fuel Cells

MEMS anodes

Boundary Condition s

Intermitte nt Failure

MEMS membra ne

Complete Failure

Other System

Sudden Failure

Outputs (V)

External Threats

Catastrop hic Failure

Extended Failure

Partial Failure

Gradual Failure

Sudden Failure

Gradual Failure

Degraded Failure

Modeling of Redundant array • CODE FROM THE DEVELOPED LIBRARY FOR REDUNDANT MEMS ARRAY FOR IMPROVING RELIABILITY

use("mumps.net") use("stdlib.net") beamLength = 80u ancw=9u ancl=9u gap=9u prbl=4u junc = { node{} } for i=0,5 do junc[1] = node{0, i*gap, 0} junc[2] = node{} junc[3] = node{} anchor { junc[1] ; material=p1, l=ancl, w=ancw, h=ancw } beam3d { junc[1], junc[2] ; material=p1, l=beamLength, w=2u } f3d { junc[2] ; F=20u, oz=90 } beam3d { junc[2], junc[3] ; material=p1, l=prbl, w=2u, oz=90 } end

RELIABILITY CALCULATIONS PERFORMED IN THIS ANALYSIS  λ e− λ t fo r>t 0 , 0> λ f ( t )=   0 o th e rw ise z (t ) = e

−9 t 11

Diagram for speed-up vs. configuration.

Conclusion • Novel way to approach reliability calculations and shown how properties at different levels and types needs to be linked up in a multi scale analysis where HPC can benefit reliability calculations for MEMS devices. • We have used basic program in from SUGAR which can be expanded as per the needs. • We have assumed some of the parameters in a multi scale setup hence the reliability and calculated results on an HPC setup. • Merging of multi scale properties to calculate the exact failure phenomenon and then with MATLAB remains a major area to work on