Pcb_design For High Performance

PCB Design for High Performance

DesignCon 2002 TecForum HP-TF4

DesignCon 2002 TecForum

Contents

§ Materials and their impact on signal integrity § Cost-effective PCB design § Capabilities

DesignCon 2002 TecForum

D k = Dielectric Constant @ 1GHz

PCB Materials 5 4,5 4

GETEK

3,5

BT/Epoxy

PTFE/Ceramic

2,5 0

Polyimide Polyimide Thermount

FR4

Nelco-13 APPE

3

2

Rogers 4000

Cyanate Ester

Speedboard C PTFE/Glas s

0.005

0.01

0.015

0.020

D f = Dissipation Factor @ 1GHz

DesignCon 2002 TecForum

0.025

Dk vs. Resin Content

Glass

Resin

Type:

Content:

1080

61 %

2116

46 %

2165

48 %

7628

43 %

Dk

Resin Content of Laminate (Weight %) Typical values for FR4.

Filler Content in Resin (Weight %)

DesignCon 2002 TecForum

Resin Loss Due to Filling Dielectric Separation (after pressing)

Resin Loss due to = No. Prepregs Filling. (Thickness in – Table)

DesignCon 2002 TecForum

How to Measure Properties Measurement of Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material.

Contacting Electrode Systems (2” Disk) Method @ 1 MHz è (IPC-TM-650 2.5.5)

Resonator Method 8 to 12.4 GHz 1 to 14 GHz

è (IPC-TM-650 2.5.5.5) è (IPC-TM-650 2.5.5.5.1)

DesignCon 2002 TecForum

<= Dk =>

Frequency Dependency

Frequency (MHz)=> DesignCon 2002 TecForum

<= Materials =>

Relative Material Prices

Times FR4 => Note: Shown Prices are for Indication Only! DesignCon 2002 TecForum

Cost-effective Buildups

} }

Limit the use of advanced (expensive) Materials to those areas where you absolutely can’t do without them.

Here the most sensitive/demanding tracks are routed on layers 7 & 11 within High Frequency Chambers. Only on these places the Rogers RO-4000 is been used.

DesignCon 2002 TecForum

Tolerances Impact on Impedance

Process: • Track/Gap Tolerance = ± 10 mm. Material: • Core Thickness Tolerance = ± 25 mm. • Prepreg Thickness Tolerance = ± 13 mm.

Gap Trackwidth Prepreg Core

è è è è

DesignCon 2002 TecForum

Aspect Ratio Circuit Packs A.R. Focus area for Circuitpacks Area for hole size under development ASPECT RATIO TABLE (drilled hole size)

P W B T H I C K N E S S

Actual mm

Approx mils

0.10 4

0.15 6

0.20 8

0.25 10

0.30 12

0.35 14

0.40 16

0.45 18

0.50 20

0.60 24

0.70 28

0.80 31

0.90 35

1.00 39

1.15 45

0.10

4

1.0

0.7

0.5

0.4

0.3

0.3

0.3

0.2

0.2

0.2

0.1

0.1

0.1

0.1

0.1

0.15

6

1.5

1.0

0.8

0.6

0.5

0.4

0.4

0.3

0.3

0.3

0.2

0.2

0.2

0.2

0.1

0.20

8

2.0

1.3

1.0

0.8

0.7

0.6

0.5

0.4

0.4

0.3

0.3

0.3

0.2

0.2

0.2

0.30

12

3.0

2.0

1.5

1.2

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.4

0.3

0.3

0.3

0.50

20

5.0

3.3

2.5

2.0

1.7

1.4

1.3

1.1

1.0

0.8

0.7

0.6

0.6

0.5

0.4

0.75

30

7.5

5.0

3.8

3.0

2.5

2.1

1.9

1.7

1.5

1.3

1.1

0.9

0.8

0.8

0.7

1.00

39

6.7

5.0

4.0

3.3

2.9

2.5

2.2

2.0

1.7

1.4

1.3

1.1

1.0

0.9

1.20

47

8.0

6.0

4.8

4.0

3.4

3.0

2.7

2.4

2.0

1.7

1.5

1.3

1.2

1.0

1.60

63

10.7

8.0

6.4

5.3

4.6

4.0

3.6

3.2

2.7

2.3

2.0

1.8

1.6

1.4

2.00

79

10.0

8.0

6.7

5.7

5.0

4.4

4.0

3.3

2.9

2.5

2.2

2.0

1.7

2.40

94

12.0

9.6

8.0

6.9

6.0

5.3

4.8

4.0

3.4

3.0

2.7

2.4

2.1

3.00

118

15.0

12.0

10.0

8.6

7.5

6.7

6.0

5.0

4.3

3.8

3.3

3.0

2.6

3.50

138

14.0

11.7

10.0

8.8

7.8

7.0

5.8

5.0

4.4

3.9

3.5

3.0

4.00

157

16.0

13.3

11.4

10.0

8.9

8.0

6.7

5.7

5.0

4.4

4.0

3.5

4.50

177

18.0

15.0

12.9

11.3

10.0

9.0

7.5

6.4

5.6

5.0

4.5

3.9

5.00

197

16.7

14.3

12.5

11.1

10.0

8.3

7.1

6.3

5.6

5.0

4.3

5.50

217

15.7

13.8

12.2

11.0

9.2

7.9

6.9

6.1

5.5

4.8

6.00

236

15.0

13.3

12.0

10.0

8.6

7.5

6.7

6.0

5.2

6.50

256

14.4

13.0

10.8

9.3

8.1

7.2

6.5

5.7

7.00

276

14.0

11.7

10.0

8.8

7.8

7.0

6.1

7.50

295

15.0

12.5

10.7

9.4

8.3

7.5

6.5

8.00

315

13.3

11.4

10.0

8.9

8.0

7.0

8.50

335

14.2

12.1

10.6

9.4

8.5

7.4

9.00

354

15.0

12.9

11.3

10.0

9.0

7.8

9.50

374

13.6

11.9

10.6

9.5

8.3

10.00

394

14.3

12.5

11.1

10.0

8.7

DesignCon 2002 TecForum

Aspect Ratio Backplanes Viasystems Mommers holes and plating capabilities are driven by connector (pin) technology. ASPECT RATIO TABLE (drilled hole size)

P W B T H I C K N E S S

Actual mm 0.10

Approx mils 4

0.10 4 1.0

0.15 6 0.7

0.20 8 0.5

0.25 10 0.4

0.30 12 0.3

0.35 14 0.3

0.40 16 0.3

0.45 18 0.2

0.50 20 0.2

0.15 0.20

6 8

1.5 2.0

1.0 1.3

0.8 1.0

0.6 0.8

0.5 0.7

0.4 0.6

0.4 0.5

0.3 0.4

0.3 0.4

0.30 0.50

12 20

3.0 5.0

2.0 3.3

1.5 2.5

1.2 2.0

1.0 1.7

0.9 1.4

0.8 1.3

0.7 1.1

0.6 1.0

0.75 1.00 1.20 1.60

30 39 47 63

7.5

5.0 6.7 8.0 10.7

3.8 5.0 6.0 8.0

3.0 4.0 4.8 6.4

2.5 3.3 4.0 5.3

2.1 2.9 3.4 4.6

1.9 2.5 3.0 4.0

1.7 2.2 2.7 3.6

1.5 2.0 2.4 3.2

2.00 2.40 3.00 3.50 4.00 4.50 5.00 5.50

79 94 118 138 157 177 197 217

10.0 12.0 15.0

8.0 9.6 12.0 14.0 16.0 18.0

6.7 8.0 10.0 11.7 13.3 15.0 16.7

5.7 6.9 8.6 10.0 11.4 12.9 14.3 15.7

5.0 6.0 7.5 8.8 10.0 11.3 12.5 13.8

4.4 5.3 6.7 7.8 8.9 10.0 11.1 12.2

4.0 4.8 6.0 7.0 8.0 9.0 10.0 11.0

6.00 6.50

236 256

15.0

13.3 14.4

7.00 7.50 8.00 8.50

276 295 315 335

9.00

354

9.50 10.00

374 394

A.R. Driven by new connector types GBX, Metral 4000, mini pressfit. 0.60 24 0.2

0.70 28 0.1

0.80 31 0.1

0.90 35 0.1

1.00 39 0.1

1.15 45 0.1

0.3 0.3

0.2 0.3

0.2 0.3

0.2 0.2

0.2 0.2

0.1 0.2

0.5 0.8

0.4 0.7

0.4 0.6

0.3 0.6

0.3 0.5

0.3 0.4

1.3 1.7 2.0 2.7

1.1 1.4 1.7 2.3

0.9 1.3 1.5 2.0

0.8 1.1 1.3 1.8

0.8 1.0 1.2 1.6

0.7 0.9 1.0 1.4

3.3 4.0 5.0 5.8 6.7 7.5 8.3 9.2

2.9 3.4 4.3 5.0 5.7 6.4 7.1 7.9

2.5 3.0 3.8 4.4 5.0 5.6 6.3 6.9

2.2 2.7 3.3 3.9 4.4 5.0 5.6 6.1

2.0 2.4 3.0 3.5 4.0 4.5 5.0 5.5

1.7 2.1 2.6 3.0 3.5 3.9 4.3 4.8

12.0 13.0

10.0 10.8

8.6 9.3

7.5 8.1

6.7 7.2

6.0 6.5

5.2 5.7

14.0 15.0

11.7 12.5 13.3 14.2

10.0 10.7 11.4 12.1

8.8 9.4 10.0 10.6

7.8 8.3 8.9 9.4

7.0 7.5 8.0 8.5

6.1 6.5 7.0 7.4

15.0

12.9

11.3

10.0

9.0

7.8

13.6 14.3

11.9 12.5

10.6 11.1

9.5 10.0

8.3 8.7

Develop 18:1 for 0.45mm FHS in 2002 Develop 20:1 for 0.45mm FHS in 2003

DesignCon 2002 TecForum

Aspect Ratio - Drilling PCB thickness limitations for one side drilling. Drill diam. (mm): 0.1 => 0.2 => 0.25 => 0.3 => 0.6 => 0.7 => 0.8 => Max. PCB thickness (mm): 0.75 1.23 2.35 3.95 5.15 6.75 7.55

When the pin insertion depth allowes it, we could drilling fom both sides.

PCB thickness limitations for both side drilling. Drill diam. (mm): 0.1 => 0.2 => 0.25 => 0.3 => 0.6 => 0.7 => 0.8 => Max. PCB thickness (mm): 1.5 2.46 4.7 7.9 10.30 13.50 15.1 Max. based on plating: 0.75 3.0 4.5 5.0 9.00 10 >10

To do this, we need to known of every press fit component: 1.

The pin insertion side;

2.

The pin insertion depth. DesignCon 2002 TecForum

Reducing Hole Capacitance • “Back-drilling” reduces hole capacitance for Backplanes and circuit-packs. • Depth tolerance required +/- 100mm measured from drill side. (Tolerance depending on dielectric tolerances.)

DesignCon 2002 TecForum

Finishes Drivers

• Environmental concerns • Cost • Assembly characteristics • Fine pitch components • Reliability SEM of PCB surface.

Features: HASL Reflow PbSn Non-Reflow PbSn Imm. NiAu (ENIG) Electrolytic NiAu OSP Imm. Ag Imm. Pd Imm. Sn

Cost

SEM of soldered joint.

Repeated Process Thermal Avail. at Bondable Soldering Press-fit Flatness Waste Stress VSM

N.A. N.A.

DesignCon 2002 TecForum

Questions?

For more information visit our website at: http://www.viasystems.nl

DesignCon 2002 TecForum