Gigabyte Mb Naming Rule Apr-2009

Naming Rule Motherboards

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Model name

Naming Rule for Intel Solution (ATX)

GA-Power Saving+Chipset name + Specific Feature + “-” +E +UDQ6/ DS5/ DS4/ DS3/ S3 + Minor Feature

GA-

E

P45

T

-

UD3 / DS3

R

Power saving  E: Dynamic Energy Saver

Specific Features  C: Combo solution(DDR+DDR2 or DDR2+DDR3)  T: DDR3

Easy Energy Saver : E

Suffix Definition  Extreme :Durability +Overclocking + Water Cooling+ Hybrid Silent-Pipe2  DQ6: Durability + Quad Cooling+ Quad BIOS+ Quad e-SATA+ Quad-Triple Phase+ Quad Core Optimized+ Quad DDR2/DDR3 Slots  UD5 / DS5: U(2 OZ PCB)+Durability + CrossFire/SLI+ Silent Pipe+ Speed+ Smart+ Safe  UD4 / DS4: U(2 OZ PCB)+Durability + CrossFire/SLI +Silent Pipe+ Speed+ Smart+ Safe  UD3/ DS3: U(2 OZ PCB)+Durability + Speed+ Smart+ Safe  US3 / S3 : U(2 OZ PCB) +Speed+ Smart+ Safe

Minor Feature  “P”: Performance Plus  “R”: ICH10R  “L” / “C” / “E” / “G”: minor/customized spec change version

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Naming Rule for Intel Solution (mATX) Model name GA-Power Saving+ Chipset name + “M” + Specific Feature + “-” +E+ DS2/ S2 + Minor Feature

ex. GA-

E

G45

M

-

UD2

H

Power saving  E: Dynamic Energy Saver

Form Factor  M: Micro ATX

Specific Features  C: Combo solution( DDR2+DDR3)  T: DDR3

Easy Energy Saver : E

Suffix Definition  UD2/DS2: U(2 OZ PCB)+Durability+ Smart+ Safe  US2/S2: U(2 OZ PCB) + Smart+ Safe

Minor Feature    

“H”: HDMI “F”: Firewire “R”: ICH9R, ICH10R “L” / “C” / “E” / “G”: minor/customized spec change version

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Naming Rule for Intel 3rd party (ATX) Model name = GA- Chipset marketing name + Specific Feature + “-” + DQ6/ DS5/ DS4/ DS3/S3 + Minor Feature NV C72 P (Chipset Project name) nForce 750i SLI (Chipset marketing name) => 750SLI-DS4 (Model name)

Specific Features  C: Combo solution(DDR+DDR2 or DDR2+DDR3)  T: DDR3

Suffix Definition  DQ6: Durability + Quad Cooling+ Quad BIOS+ Quad e-SATA+ Quad-Triple Phase+ Quad Core Optimized+ Quad DDR2/DDR3 Slots  DS5: Durability + SLI + Silent Pipe + Speed+ Smart+ Safe  DS4: Durability + Silent Pipe+ Speed+ Smart+ Safe  DS3: Durability + Speed+ Smart+ Safe  S3: Speed+ Smart+ Safe

Minor Feature  “H”: HDMI  “L” / “C” / “E” / “G”: minor/customized spec change version

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Naming Rule for Intel 3rd party (mATX) Model name =

GA- Chipset engineer name + “M” + Specific Feature + “-” + DS2/ S2 + Minor Feature i.e., NV C73 PV (Chipset engineer name) => 73PVM-S2H (Model name); NV C73V (Chipset engineer name) => 73VM-S2 (Model name)

Form Factor

 M: Micro ATX

Specific Features

 C: Combo solution(DDR+DDR2 or DDR2+DDR3)  T: DDR3

Suffix Definition  DS2: Durability  S2:

Minor Feature

+ Smart+ Safe + Smart+ Safe

 “H”: HDMI  “L” / “C” / “E” / “G”: minor/customized spec change version

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Naming Rule for AMD AM2+ (ATX) Model name =

GA- M + A + Chipset marketing name + Specific Feature + “-” + DQ6/ DS5/ DS4/ DS3/ S3 + Minor Feature i.e., NV MCP72 P (Chipset engineer name) nForce 750a SLI (Chipset marketing name) => M750SLI-DS4 (Model name); AMD RD790 (Chipset engineer name) AMD 790X (Chipset marketing name) => MA790XT-UD5P (Model name) AMD RS780D (Chipset engineer name) AMD 790G (Chipset marketing name) => MA790GP-UD4H (Model name)

M  AMD Platform A  AMD Chipset (if NV chipset, model name will remove this letter) Specific Features  C: Combo solution(DDR+DDR2 or DDR2+DDR3)  T: DDR3  P: Sideport Memory Suffix Definition  UD5: U(2 OZ PCB)+ Durability + Silent Pipe + SLI/ CrossFire + Speed+ Smart+ Safe  UD4: U(2 OZ PCB)+ Durability + Silent Pipe + SLI/ CrossFire + Speed+ Smart+ Safe  UD3: U(2 OZ PCB)+ Durability + Speed+ Smart+ Safe  US3: U(2 OZ PCB)+ + Speed+ Smart+ Safe Minor Feature  “H”: HDMI  “P”: Performance Plus  “L” / “C” / “E” / “G”: minor/customized spec change version 6

Naming Rule for AMD AM2+ Solution (mATX) Model name =

GA- “M” + “A” + Chipset engineer name + “M” + Specific Feature + “-” + DS2/ S2 + Minor Feature i.e., NV MCP78S(renamed to 85) (Chipset engineer name) => M85M-US2H (Model name) AMD RS780G (Chipset engineer name) => MA78GM-UDS2H (Model name)

M

 AMD Platform

A

 AMD Chipset (if NV chipset, model name will remove this letter)

Form Factor

 M: Micro ATX

Specific Features

 C: Combo solution(DDR+DDR2 or DDR2+DDR3)  T: DDR3

 P: Sideport Memory

Suffix Definition  UD2/ DS2: U(2 OZ PCB) +Durability  US2/S2: U(2 OZ PCB)

+ Smart+ Safe + Smart+ Safe

Minor Feature

 “H”: HDMI  “P”: Performance Plus  “L” / “C” / “E” / “G”: Minor/customized spec change version

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