National Taipei p University y of Technology gy
The 5th Asian Aerosol Conference Aug 26~29 2007
Department of Energy and Refrigerating Air-Conditioning Engineering.
Novell Air N Ai Distribution Di t ib ti System S t for f Cleanrooms with high heat heat-load load and high particle sources Presenter: C.K Chang1, Ad i Adviser :S S.C.Hu C H 2, Koji K ji T Toda d 3 1.Master Student of National Taipei University of Technology , Department of Energy and Refrigerating Air-Conditioning Engineering. 2.Professor of National Taipei University of Technology D Department t t off Energy E and d Refrigerating R fi ti Ai Air-Conditioning C diti i E Engineering. i i 3.General Manager of Taiwan Mika Engineering Consultant Co., Ltd. Registered Building Services Engineer of Japan 1
Contents
The 5th Asian Aerosol Conference Aug 26~29 2007
• 1.Introduction • 2.Description of existing g system y • 3.Problems in existing system • 4. Roadmap of semiconductor technology • 5.Description of proposed system • 6.Comparison • 7.Conclusions
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1. Introduction
The 5th Asian Aerosol Conference Aug 26~29 2007
Motivation and Reasons 1.Rapid Change of production Line In Taiwan IT Industries 2.Incerased Productivity in the same cleanroom space
Comments and Problems ● Fixed Location of Return Air Shaft/Wall and Dry Coiling Coil
● High heat-load demand ● Un-uniform Un uniform temperature ● Un-steady humidity in the rainy day ● Cleanness Decline
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2. Description of existing system (FFU+DCC)
The 5th Asian Aerosol Conference Aug 26~29 2007 FFU: Fan Filter Unit DCC: Dry Cooling Coil
MAU to handle outside air dew point to maintain humidity of cleanroom
RAG: Return Air Grille MAU: Make Up Units
DCC to treat sensible heat of process tools
OA
MAU
FFU to provide driving force to keep cleanroom positive pressure and recirculation i l i air i to achieve hi cleanness level in the room
FFU
DCC 30~50 Pa
DCC R
FFU Ext.Sp 100Pa
A
Heat
S RAG 15~20 Pa
Vf =0.3 ~0.5 m/s
Non-unidirectional Non unidirectional CR ISO Class: 6~8 T:23±3OC, Hu:50±5% Pressure:+15Pa
R A
Heat
S RAG
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3. Problems in existing system - 1
The 5th Asian Aerosol Conference Aug 26~29 2007
1.External 1 External static pressure of FFU to be over 100Pa to overcome pressure resistance of RAG,RAS.DCC.
Air
P i l Particle
infiltration
invasion
Heating /Coolin g invasion
Moisture
OA
invasion
MAU
FFU
-85 85 Pa DCC 30~50 Pa
DCC R
FFU Ext.Sp Ext Sp 100Pa
A
Heat
S RAG 15~20 Pa
Vf =0.3 ~0.5 m/s
Non-unidirectional CR SO Class: C ass 6 6~8 8 ISO T:23±3OC, Hu:50±5% Pressure:+15Pa
R A
Heat
S RAG
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3. Problems in existing system - 2
The 5th Asian Aerosol Conference Aug 26~29 2007
2.Downward cold supply air from FFU to encounter upward air current due to the heat-load from process tools.
OA
T:10~36OC Hu: 20%~90% MAU
ADP:14.5OC
FFU DCC
DCC
R A S
R
Heat Particle
Non-unidirectional Non unidirectional CR ISO Class: 6~8 T:23±3OC, Hu:50±5% Pressure:+15Pa
Heat Particle
A S
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3. Problems in existing system - 3
The 5th Asian Aerosol Conference Aug 26~29 2007
3.Fixed position of return air shaft and dry cooling coil
OA
MAU
FFU
DCC 30~50 Pa
DCC R
FFU Ext.Sp Ext Sp 100Pa
A
Heat
S RAG 15~20 Pa
Vf =0.3 ~0.5 m/s
Non-unidirectional CR SO Class: C ass 6 6~8 8 ISO T:23±3OC, Hu:50±5% Pressure:+15Pa
R A
Heat
S RAG
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4. Roadmap of semiconductor technology
(abstracted from ITRS2005)
The 5th Asian Aerosol Conference Aug 26~29 2007 Year
2005
2010
2015
2020
80nm 1.2nm
45nm 0.7nm
25nm 0.6nm
14nm 0.5nm
40nm
23nm
13nm
(7nm)
Acid(SO4)
1000 pptM
500 pptM
500 pptM
500 pptM
Base(NH3)
5000 pptM
2500 pptM
2500 pptM
2500 pptM
Condensable Organics
4000 pptM
2500 pptM
2500 pptM
2500 pptM
10 pptM
10 pptM
10 pptM
10 pptM
Acid(SO4, slicidation)
100 pptM (430ng/m³)
10 pptM
10 pptM
10 pptM
Base(NH3, reticle stocker)
2500 pptM (1900 / ³) (1900ng/m³)
TBD
TBD
TBD
Organics (one-day exposed surface)
2 ng/cm²
0.5 ng/cm²
0.5 ng/cm²
0.5 ng/cm²
Dopants (one-day exposed surface)
2×10¹² atom/cm²
1×10¹² atom/cm²
1×10¹² atom/cm²
1×10¹² atom/cm²
Whole clean room
ISO Class6
ISO Class6
ISO Class7
ISO Class8
Inside of minienvironment
ISO Class2
ISO Class1
ISO Class1
ISO Class1
【Devices】 minimum feature size gate oxide thickness
【Contamination control】 minimum particle size Chemical contamination (general environment)
Dopants(B,P) Chemical contamination(local environment)
Chemical contamination(wafer surface)
【Cleanness of cleanroom】
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5.Description of proposed system
The 5th Asian Aerosol Conference Aug 26~29 2007
MAU to handle outside air dew point to maintain humidity of cleanroom
FFU: Fan Filter Unit FDCU: Fan Dry Coil Units
MAU: Make Up Units
Low external p pressure of FFU to provide driving force to keep cleanroom positive pressure and recirculation air to achieve cleanness l level l l in i the th room
FDCU to treat sensible heat of process tools and overcome the p pressure drop p of coiling coil
OA MAU
FFU
FFU Ext.. Static Pressure: 30Pa
-15 Pa
FDCU
Non-unidirectional CR ISO Class: 6~8 T:23±3OC, Hu:50±5% Pressure:+15Pa 9
6.Comparison - 1
The 5th Asian Aerosol Conference Aug 26~29 2007
Supply air chamber pressure to be -85 Pa
OA
Existing system
External static pressure of FFU to be over100Pa to overcome pressure resistance of RAG,RAS.DCC.
FFU
R A S
+15Pa C/R Pressure to maintain +15Pa
RAG
Proposed system
OA
FDCU
Supply air chamber pressure down to -15 Pa FFU
External static pressure of FFU can be under 30Pa
+15Pa C/R Pressure to maintain +15Pa
Less negative pressure in the supply air chamber (from -85 Pa to -15 Pa) 10
6.Comparison - 2
The 5th Asian Aerosol Conference Aug 26~29 2007
Existing system
Air infiltration
OA
Air infiltration =3600 α A
-85 Pa
2.∆P/ρ
α=0.8, ρ=1.2kg/m3, .∆P: Pascal
IF A=10cmx10cmx10 =0.1 M2 Air infiltration =3600 x 0.8 x 0.1 x 2x85/1.2 =3428 CMH Air infiltration
-15 Pa
OA
Proposed system Air infiltration =3600 3600 x 0.8 x 0.1 x 2x15/1.2 i filt ti =1440 CMH
Reduced air infiltration 11
6.Comparison - 3
The 5th Asian Aerosol Conference Aug 26~29 2007
Existing system
Large air Infiltration Heat invasion Moisture invasion
Heat invasion =3428cmhx 1.2 x ∆h (Kcal/kg) = 3428x1.2x12 = 49,363Kcal/hr 49,363Kcal/hr≈16.3USRT 16.3USRT
-85 Pa
Moisture invasion =3428cmhx 1.2 x ∆χ (kg/kg) = 3428x1.2x0.0045 = 18.5Kg/h Smaller S ll air i IInfiltration filt ti Heat invasion Moisture invasion -15 Pa
P Proposed d system t Heat invasion=1440cmhx 1.2 x ∆h (Kcal/kg) = 1440x1.2x12 1440x1 2x12 =20,736Kcal/hr≈6.9USRT Moisture invasion =1440cmhx 1440cmhx 1 1.2 2 x ∆χ (kg/kg) i i = 1440x1.2x0.0045 = 7.8Kg/h
Reduced the energy consumption
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6.Comparison - 4
The 5th Asian Aerosol Conference Aug 26~29 2007
Better cleanness level 13
6.Comparison - 5
The 5th Asian Aerosol Conference Aug 26~29 2007 OA
Existing system FFU 0.3M/S~0.5M/S DCC 30~50 Pa
DCC R A
R
Heat
Heat
A
S
S
RAG 15~20 Pa
RAG OA
Proposed system FFU
FDCU FDCU
Uniform temperature distribution in the working area (BOF + 0.9m~1.5m) 14
6.Comparison - 6
The 5th Asian Aerosol Conference Aug 26~29 2007
Existing system
ADP 14.5OC ,10% of Supply volume
14.5x0.1+18x0.9/1=17.650C To:180C
14.50C
FFU 0.3 M/S~0.5 M/S
DCC
To:180C DCC
R
Heat
A
Ts:17.650C
R
Heat
S
A S
Proposed system FFU
FDCU
ADP:14.50C
To:20~24 0C
Ti:23.50C Ti:23.50C
14.5x0.1+20~24x0.9/1=19~23 14 5 0 1 20 24 0 9/1 19 23 0C To:20~24 0C
FDCU
Ti:26~30 300C Ts:19.45~23 T 19 45 230C Ti:26
Ti:26~30 Ti:26 300C According to heat-load of process tools to design the dry coiling coil
Accuracy and high COP to treat heat of process tools 15
6.Comparison - 7
The 5th Asian Aerosol Conference Aug 26~29 2007
Existing system DCC
Return Air Shaft
FFU
Clean Room 1k Return Air Grille
Proposed system
FFU
FDCU
Clean Room 1k
Fan Dry Cooling Unit to treat sensible heat of process tools Return air shaft cancelled to increase production area
15% increased production area 16
6.Comparison - 8
The 5th Asian Aerosol Conference Aug 26~29 2007 OA
Existing system
FFU Ext.Sp 100Pa FFU 0.35M/S~0.45M/ S
Fixed DCC location R
Fixed RAS location
A
Heat
Heat
R A
S
S
RAG 15~20 Pa
RAG
Proposed system FDCU can be relocated with the
Ball room system
process tools
FDCU can be relocated with the process tools 17
7.Conclusions
The 5th Asian Aerosol Conference Aug 26~29 2007
Green Cleanroom , Innovation , Environmental Friendly
Increased Production Area
Less negative pressure
Reduced Energy
Uniform Temperature
Reduced Initial cost
Flexible Relocation
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National Taipei University of Technology Department of Energy and Refrigerating Air-Conditioning Engineering.
The 5th Asian Aerosol Conference Aug 26~29 2007
National N i l Taipei T i i University U i i off Technology T h l Department of Energy and Refrigerating Air-conditioning Engineering Shih-Cheng Hu, Ph.D Andy Chang Toda Koji E-mail:
[email protected] E-mail:
[email protected] E-mail:
[email protected] 19