Track 2: ELECTRONICS & TELECOMMUNICATIONS
HIGHLY MINIATURIZED PASSIVE COMPONENTS EMPLOYING NOVEL π-TYPE MULTIPLE COUPLED MICROSTRIP LINES Young Bae Park, Han Nah Joh*, Se Ho Kim, Young Yun and In Ho Kang Department of Radio and Science Engineering, Korea Maritime University, Busan 606-791, Korea
ABSTRACT
In this work, using a novel π-type multiple coupled microstrip line structure (MCMLS), we fabricated highly miniaturized Wilkinson power divider and branch-line coupler. The line length of the Wilkinson power divider and branch-line coupler was reduced to about λ/44 and λ/38, respectively, and their size were 11.2 % and 14.6 % of conventional ones, respectively. The miniaturized Wilkinson power divider and branch-line coupler showed good RF performances in C band.
is
1. INTRODUCTION
shortened
by
shunt
capacitors,
which
facilitated the fabrication of the miniaturized RF In RFIC device such as PA and Mixer[4],
passive components.
combiner/divider is required for its operation. Wilkinson power divider is one of the passive
2.
components
EMPLOYING Π-TYPE MCML
widely
splitting/combining.
used
for
However,
power
NOVEL
MICROSTRIP
LINE
conventional
Wilkinson power divider employs quarter-
Fig 1-(a) and (b) show a quarter-wavelength
wavelength line, which highly increases the
line and conventional π-type single microstrip
circuit size and manufacturing cost.
line structure (SMLS) equivalent to the quarter-
In this work, in order to realize miniaturized
wavelength line, respectively.
Wilkinson power divider, we propose π-type multiple
coupled
microstrip
line
structure
(MCMLS). In this work, we present the method
λ/4
to reduce the length of quarter-wavelength line,
Z0
and concretely, Wilkinson power divider was highly miniaturized by substituting quarterwavelength line for π-type MCMLS. In the π-
Fig. 1-(a) A quarter-wavelength line
type MCMLS, the characteristic impedance of the line doesn't increase rapidly, though the line International Symposium on Electrical & Electronics Engineering 2007 - Oct 24, 25 2007 - HCM City, Vietnam -135-
Track 2: ELECTRONICS & TELECOMMUNICATIONS
the way, the Eq. (3) indicates that a reduction of shunt capacitor C results in a decrease of the
θ
characteristic impedance Z . Therefore, to solve
Z C
the above problem for the conventional π-type
C
SMLS, a novel structure with reduced shunt capacitor should be employed. For this reason, Fig. 1-(b) Conventional π-type single microstrip line structure
we propose π-type MCMLS in this work, which is shown in Fig. 2.
The following Eqs. (1) - (3) should be
θ1
satisfied in order that the conventional π-type
Coupling
SMLS may be equivalent with the quarter-
capacitance
wavelength line [3].
C1 cos θ Z
ω C1 =
Z =
Z =
(1)
C1
Z0 sin θ
(2)
Z1
Fig. 2 A π-type multiple coupled microstrip line structure The advantage of π-type MCMLS is as
Z0
(3)
2
1 − (ω cZ 0 )
follows. As shown in Fig. 2, for the π-type MCMLS,
coupling
capacitance
C P exists
between lines unlike conventional π-type SMLS, From the Eq. (1), (2), we can see that, as the
and a part of coupling capacitance C P serves as
line length of the π-type SMLS becomes shorter,
the shunt capacitor like C of the π-type SMLS,
C and
characteristic
because it is connected to ground line with via
impedance Z become larger, which makes it
holes. Therefore, a part of coupling capacitance
impossible to fabricate miniaturized passive
C P contributes to a reduction of line length like
components employing the π-type SMLS. For
shunt capacitor C of the π-type SMLS shown
example, if the line length of the π-type SMLS
in Fig. 1 (b), and the total shunt capacitor
becomes less than λ/8, the characteristic
contributing to a reduction of line length for π-
impedance Z becomes higher than 100 Ω.
type MCMLS is a summation of real shunt
However,
whose
capacitor C1 and a part of coupling capacitance
characteristic impedance is higher than 100 Ω
C P . In other words, the total shunt capacitor
can’t be realized on semiconducting or dielectric
contributing to a reduction of line length for π-
substrate due to its very thin line width[2][3]. By
type MCMLS can be expressed as C1 + C P ,
a
shunt
capacitor
the
microstrip
line
International Symposium on Electrical & Electronics Engineering 2007 - Oct 24, 25 2007 - HCM City, Vietnam -136-
Track 2: ELECTRONICS & TELECOMMUNICATIONS
where is an experimentally obtained constant, indicating a portion serving as the shunt
Figure 3 shows a photograph of the highly
capacitor. For this reason, real shunt capacitor
miniaturized
Wilkinson
C1 is reduced in comparison with C of the π-
employing
type SMLS, because C P
serves as shunt
fabricated on Teflon substrate. The line width
capacitor. Therefore, from Eq. (3), we can see
and spacing between .lines are a 0.4 mm,
that, the characteristic impedance Z1 becomes
respectively, and the resistance and shunt
lower than that of π-type SMLS due to its
capacitor are 3.04 Ω and 1.83 pF, respectively.
π-type
power
MCMLS,
divider
which
was
comparatively lower shunt capacitance C1 , which
facilitate
miniaturized
passive
components on semiconducting or dielectric
Table. 1 The size of the novel and conventional Wilkinson power divider are summarized Line Length (mm) 11.3
Size (mm2) 45
substrate. For example, in case that the quarter-
Shunt C (pF)
wave line of Fig. 1-(a) is reduced to λ/44 by
QWL
using the π-type circuit, the characteristic
SMLS
32
8.2
1
impedance Z of the π-type SMLS is increased
MCMLS
17
1
0.5
to 200 Ω, while the characteristic impedance Z1 of the π-type MCMLS becomes 60 Ω, which can
The size of the novel and conventional
be realized on semiconducting or dielectric
Wilkinson power divider are summarized in
substrate. In this work, we developed highly
Table 1.
miniaturized Wilkinson power divider by using
The size of the power divider employing πtype MCMLS are 37 and 53 % of the
the π-type MCMLS.
conventional one employing quarter-wave line 3.
A
HIGHLY
WILKINSON
MINIATURIZED
POWER
DIVIDER
EMPLOYING Π-TYPE MCMLS
and π-type SMLS, respectively. Figure 4 and 5 exhibit power and phase division characteristics for the miniaturized Wilkinson power divider employing π-type MCMLS.
0
power division (dB) -5 -10 -15
S21[dB] S31[dB] S32[dB]
-20 -25 2
3
Isolation (dB)
4
5
6
Freq. [GHz]
Fig. 3 A photograph of the highly miniaturized Wilkinson power divider employing π-type
Fig. 4 Power division and isolation
MCMLS
characteristics for the miniaturized Wilkinson
International Symposium on Electrical & Electronics Engineering 2007 - Oct 24, 25 2007 - HCM City, Vietnam -137-
Track 2: ELECTRONICS & TELECOMMUNICATIONS
power divider employing π-type MCMLS
ACKNOWLEDGEMENT
This work was supported by the Post Brain 100
Korea 21 Project, and IT R&D Project funded by Phase division (deg.)
Korean
50
Ministry
of
Information
and
Communications. 0
REFERENCES
-50
1. D. M. POZAR, Microwave engineering, 2nd -100 2
3
4 Freq. [GHz]
5
ed., Addison-Wesley, 1990, Chapter 8,
6
2.
M.
CHONHCHEAWCHAMNAM,
N.
SIRIPON and I. D. ROBERTSON, Design Fig. 5 Phase division characteristics for in-phase
and performance of improved lumped-
and out-of-phase ports of the miniaturized
distributed
Wilkinson power divider employing π-type
Electron. Lett., Vol. 37, pp. 501-503, 2001
MCMLS
3. T. Hirota, A. Minakawa and M. Muraguchi,
Wilkinson
divider
topology,
Reduced-Size Branch-Line and Rat-Race From 3 to 5.5 GHz, we can observe equal
Hybrids for Uniplanar MMIC's, IEEE MTT
power and phase characteristics. Concretely, we
Trans., Vol. 38, No. 3, pp. 270-275, March,
can observe power division higher than –5.5 dB,
1991
and isolation better than -8 dB.
4. D. R. Webster, G. Ataei and D. G. Haigh, LowDistortion MMIC Power Amplifier Using a
4. CONCLUSION
New Form of Derivative Superposition, IEEE MTT Trans., Vol. 49, No. 2, pp. 328-
In this work, we proposed π-type MCMLS,
332, 2001.
which facilitated the passive components on dielectric substrate. Using the π-type MCMLS, we fabricated highly miniaturized Wilkinson power divider on Teflon substrate, and its size was 37 and 53 % of the conventional one employing quarter-wave line and -type SMLS, respectively. The Wilkinson power divider exhibited good RF performances in the S/C band.
International Symposium on Electrical & Electronics Engineering 2007 - Oct 24, 25 2007 - HCM City, Vietnam -138-